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Part Manufacturer Description Datasheet Download Buy Part
282807-5 TE Connectivity (282807-5) 3P TERMI-BLOK PLUG,MARKED
7-1571986-2 TE Connectivity (7-1571986-2) A101J1AV2Q004AM marking O -
91592-1 TE Connectivity (91592-1) CERTICRIMP 2 22-18 MIC MARK II
5-2023347-3 TE Connectivity (5-2023347-3) LCEDI UPPER SHELL WITH DATUM MARK PLATED
2-1546857-7 TE Connectivity (2-1546857-7) 3P VERT PLUG,GRAY,MARKED
2238156-1 TE Connectivity (2238156-1) MARK II POSITIVE LOCK 22-18

MARKING C SOD882 Datasheets Context Search

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2006 - PESDXS1UL

Abstract: smd diode code g3 smd diode g5 PESD15VS1UL PESD24VS1UL PESD12VS1UL MARKING C SOD882
Text: ESD protection diodes in a SOD882 package Table 8. Characteristics .continued Tamb = 25 ° C , Semiconductors ESD protection diodes in a SOD882 package I 001aaa729 10 IRM IRM(25° C ) (1) -VCL , PESDxS1UL series ESD protection diodes in a SOD882 package Rev. 01 - 31 March 2006 Product , ) protection diodes in a SOD882 leadless ultra small Surface Mounted Device (SMD) plastic package designed to , series Philips Semiconductors ESD protection diodes in a SOD882 package 2. Pinning information


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PDF OD882 PESDXS1UL smd diode code g3 smd diode g5 PESD15VS1UL PESD24VS1UL PESD12VS1UL MARKING C SOD882
2009 - smd diode code g3

Abstract: smd diode g5 PESD12VS1UL PESD15VS1UL PESD24VS1UL
Text: diodes in a SOD882 package 001aaa726 104 001aaa193 1.2 PPP PPP (W) PPP(25° C ) 103 , PESDxS1UL series ESD protection diodes in a SOD882 package Rev. 02 - 20 August 2009 Product , ) protection diodes in a SOD882 leadless ultra small Surface Mounted Device (SMD) plastic package designed to , series NXP Semiconductors ESD protection diodes in a SOD882 package 2. Pinning information , ] anode 1 1 2 2 sym035 Transparent top view [1] The marking bar indicates the cathode


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PDF OD882 smd diode code g3 smd diode g5 PESD12VS1UL PESD15VS1UL PESD24VS1UL
2013 - Not Available

Abstract: No abstract text available
Text: Part Number C Product ID Cathode Identifier Product ID Package Marking Min. Order Qty. SP1003-01DTG SOD723 C 8000 SP1003-01ETG C SOD882 C 3000 Cathode , 2 SOD882 (AEC-Q101 qualified) • Fits solder footprint of industry standard 0402 (1005) devices • Low leakage current of 100nA (MAX) at 5V 1 SOD723 • Tiny SOD723/ SOD882 (JEDEC MO-236) package saves board space •  EC-Q101 qualified A ( SOD882 package) Applications â


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PDF SP1003 IEC61000-4-5) IEC61000-4-2, IEC61071 OD882
2013 - Not Available

Abstract: No abstract text available
Text: Molded Epoxy Flammability UL 94 V-0 Part Number SP3021-01ETG _ • Package Marking SOD882 Min. Order Qty. 12000 Notes : 1. All dimensions are in millimeters 2. Dimensions include , ) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3° C /second max TS(max) to TL - Ramp-up Rate - Temperature (TL) (Liquidus) 217° C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) tL Ramp-do


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PDF SP3021 IEC61000-4-2 15nches OD882
2012 - Not Available

Abstract: No abstract text available
Text: footprint in mm (inches) Figure 18. SOD882 marking 0.55 (0.022) 0.55 (0.022) 0.50 0.020 0.40 (0.016 , information Marking (1) G H Package SOD882 SOD882T Weight 0.92 mg 0.76 mg Base qty 12000 12000 Delivery mode , capacitance (26 pF typ at 0 V) Low leakage current < 60 nA @ 5 V Very small PCB area: 0.6 mm² SOD882 ESDALC5 , maximum ratings (Tamb = 25 ° C ) Parameter Peak pulse voltage IEC 61000-4-2 contact discharge Tj initial = Tamb Value ±30 150 9 -55 to +150 -65 to +150 260 Unit kV W A ° C ° C ° C Peak pulse power dissipation


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PDF OD882 OD882T
AOZ8131DI-05L

Abstract: AOZ8131 AOZ8131D AOZ8131NI-05L 019 dfn alpha date code System MARKING C SOD882
Text: contact discharge). The AOZ8131 comes in an RoHS compliant SOD882 package and is rated over a -40° C to +85° C ambient temperature range. The ultra-small 1.0 x 0.6 x 0.5mm SOD882 leadless DFN package makes , conditions and ESD. This device incorporates one TVS diode in an ultra-small SOD882 leadless DFN , Number Ambient Temperature Range Package Environmental AOZ8131DI-05L -40° C to +85° C SOD882 (DFN 1.0 x 0.6 2L) RoHS Compliant Green Product AOS Green Products use reduced levels of


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PDF AOZ8131 AOZ8131 OD882 OD882 AOZ8131DI-05L AOZ8131D AOZ8131NI-05L 019 dfn alpha date code System MARKING C SOD882
2013 - Not Available

Abstract: No abstract text available
Text: VDI 11-13. Part Marking System Ordering Information SOD882 SOD723 0.0004 inches , ID Package Marking Min. Order Qty. SP1003-01DTG SOD723 C 8000 SP1003-01ETG C SOD882 C 3000 Cathode Identifier Package Dimensions — SOD723 SOD723 1.10 , of 100nA (MAX) at 5V 2 2 • Tiny SOD723/ SOD882 (JEDEC MO-236) package saves board space SOD882 Functional Block Diagram Applications • Mobile phones 1 • Digital cameras â


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PDF SP1003 IEC61000-4-5) IEC61000-4-2, OD882
2013 - Not Available

Abstract: No abstract text available
Text: SOD882 SOD723 Silicon Part Number X Cathode Identifier Product ID C uct ID Package SP1003-01DTG SOD723 SP1003-01ETG C SOD882 Marking c c Number of Channels , 2 SOD882 (AEC-Q101 qualified) • Fits solder footprint of industry standard 0402 (1005) devices • Low leakage current of 100nA (MAX) at 5V 1 SOD723 • Tiny SOD723/ SOD882 (JEDEC MO-236) package saves board space •  EC-Q101 qualified A ( SOD882 package) Applications â


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PDF SP1003 IEC61000-4-5) IEC61000-4-2, IEC61071 OD882
2013 - Not Available

Abstract: No abstract text available
Text: =0V •  mall SOD882 packaging S helps save board space •  EC-Q101 qualified A •  ightning , 0.1μA at 5V ( SOD882 package) Applications Functional Block Diagram • Tablets • MP3/ PMP , Temperature Min (Ts(min) - Temperature Max (Ts(max) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3° C /second max TS , Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat 3° C /second max - Temperature (TL


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PDF SP3030 IEC61000-4-2 OD882 MO-236
2012 - Not Available

Abstract: No abstract text available
Text: footprint in mm (inches) 0.55 0.022 0.020 0.55 0.022 Figure 18. SOD882 marking 0.50 I , -1BT2 Very low reverse current < 50 nA I SOD882 ESDAVLC8-1BM2 High reliability offered by , reverse voltage applied (typical values, direct and reverse) C (pF) 5 F = 1 MHz VOSC= 30 mVRMS , (reverse) IR [Tj] /IR [Tj = 25° C ] 1000 IR [Tj] /IR [Tj = 25° C ] (typical values – reverse , Directional B = Bidirectional Package M2 = SOD882 T2 = Thin SOD882 Doc ID 16937 Rev 2 5/14


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PDF OD882T OD882
2011 - SP1003-01

Abstract: IEC61000-4-4 SP1003 SP1003-01DTG SOD882 SP1003-01ETG
Text: Series Number of Channels UL 94 V-0 Ordering Information SOD882 Part Number C Product , Identifier Product ID Marking Min. Order Qty. SOD723 C 8000 SP1003-01ETG Cathode Identifier Package SP1003-01DTG C SOD882 C 8000 Embossed Carrier Tape & Reel , 100nA (MAX) at 5V 2 2 · Tiny SOD723/ SOD882 package saves board space SOD882 , Temperature Range TOP Operating Temperature -40 to 85 ° C TSTOR Storage Temperature -60 to


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PDF SP1003 IEC61000-4-5) IEC61000-4-2, IEC61000-4mbossed OD882 SP1003-01 IEC61000-4-4 SP1003-01DTG SOD882 SP1003-01ETG
2013 - Not Available

Abstract: No abstract text available
Text: Series Package D: SOD723 E: SOD882 Number of Channels -01 = 1 Channel Part Marking System , Product ID Cathode Identifier Package Marking Min. Order Qty. SP1003-01DTG C SOD723 C 8000 SP1003-01ETG SOD882 C 3000 Embossed Carrier Tape & Reel Specification â , of 100nA (MAX) at 5V 2 2 • Tiny SOD723/ SOD882 (JEDEC MO-236) package saves board space SOD882 Functional Block Diagram Applications • Mobile phones 1 • Digital cameras â


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PDF SP1003 IEC61000-4-5) IEC61000-4-2, OD882
2010 - J-STD-004

Abstract: case MARKING A1 esdalc5-1bm2 marking code B2 marking code C2 diode
Text: footprint in mm (inches) 0.55 0.022 0.020 0.55 0.022 Figure 18. SOD882 marking 0.50 G , V Very small PCB area: 0.6 mm² SOD882 ESDALC5-1BM2 Benefits High ESD protection , = 25 ° C ) Symbol VPP PPP (1) Parameter Peak pulse voltage Value Unit ± 30 kV , initial = Tamb IPP Peak pulse current (8/20 µs) Tj Junction temperature - 55 to + 150 ° C Storage temperature range - 65 to + 150 ° C 260 ° C Tstg TL Maximum lead temperature for


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PDF OD882 OD882T J-STD-004 case MARKING A1 esdalc5-1bm2 marking code B2 marking code C2 diode
2013 - Not Available

Abstract: No abstract text available
Text: SOD882 SOD723 Silicon Part Number X Cathode Identifier Product ID C uct ID Package SP1003-01DTG SOD723 SP1003-01ETG C SOD882 Marking c c Number of Channels , 2 SOD882 (AEC-Q101 qualified) • Fits solder footprint of industry standard 0402 (1005) devices • Low leakage current of 100nA (MAX) at 5V 1 SOD723 • Tiny SOD723/ SOD882 (JEDEC MO-236) package saves board space •  EC-Q101 qualified A ( SOD882 package


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PDF SP1003 IEC61000-4-5) IEC61000-4-2, IEC671 OD882
2013 - Not Available

Abstract: No abstract text available
Text: -1BM2, ESDALC5-1BT2 Figure 16. SOD882 footprint in mm (inches) Figure 17. SOD882 marking 0.55 (0.022 , -1BM2 ESDALC5-1BT2 Marking (1) G H Package SOD882 SOD882T Weight 0.92 mg 0.76 mg Base qty 12000 12000 Delivery , pF typ at 0 V) Low leakage current < 60 nA @ 5 V Very small PCB area: 0.6 mm² SOD882 ESDALC5 , 25 ° C ) Symbol VPP PPP (1) Parameter Peak pulse voltage IEC 61000-4-2 contact discharge Tj initial = Tamb Value ±30 150 9 -55 to +150 -65 to +150 260 Unit kV W A ° C ° C ° C Peak pulse power


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PDF OD882 OD882T DocID16936
2013 - Not Available

Abstract: No abstract text available
Text: . Do not exceed 260° C Part Numbering System Part Marking System SP 3031 – 01 E T G TVS , Material Molded Epoxy Flammability UL 94 V-0 Part Number Package Marking Min. Order Qty. SP3031-01ETG SOD882 •f 12000 Notes : 1. All dimensions are in millimeters 2 , Temperature Max (Ts(max) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3° C /second max TS(max) to TL - Ramp-up Rate -


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PDF SP3031 IEC61000-4-2 IEC61000-4-2) OD882 MO-236
2013 - Not Available

Abstract: No abstract text available
Text: Flammability UL 94 V-0 Part Number SP3021-01ETG _ • Package Marking SOD882 Min. Order , Numbering System Part Marking System SP 3021 – 01 E T G TVS Diode Arrays (SPA® Diodes) SOD882 , – Free assembly - Temperature Min (Ts(min) - Temperature Max (Ts(max) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3° C /second max TS(max) to TL - Ramp-up Rate - Temperature (TL) (Liquidus) 217° C


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PDF SP3021 IEC61000-4-2 OD882
2009 - Not Available

Abstract: No abstract text available
Text: PCMCIA cards. Fig.1 Simplified outline ( SOD882 ) and symbol. MARKING TYPE NUMBER MARKING CODE TYPE NUMBER MARKING CODE TYPE NUMBER MARKING CODE TYPE NUMBER MARKING CODE Marking codes for BZX884-B2V4 to BZX884-B75 BZX884-B2V4 A1 BZX884-B6V2 AB BZX884-B16 C1 , series: ±2% and ±5% Low-power voltage regulator diodes encapsulated in SOD882 leadless ultra small , • General regulation functions • ESD ultra high-speed switching The marking bar indicates the


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PDF M3D891 BZX884 OD882 MAM472 R76/02/pp10
2011 - Not Available

Abstract: No abstract text available
Text: surface matte inish VDI 11-13. Part Marking System Ordering Information SOD882 SOD723 , Lead Plating Part Number C Product ID Cathode Identifier Product ID Package Marking Min. Order Qty. SP1003-01DTG SOD723 C 8000 SP1003-01ETG C SOD882 C 3000 , (MAX) at 5V 2 2 SOD723 • Tiny SOD723/ SOD882 package saves board space SOD882 , (max) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up


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PDF SP1003 IEC61000-4-5) IEC61000-4-2, IEC610d OD882
2003 - S3 DIODE schottky

Abstract: SOD882 S3 marking DIODE BAT54L Marking s3 Schottky barrier Marking "s3" Schottky barrier MARKING C SOD882
Text: diode encapsulated in a SOD882 leadless ultra small plastic package. · Leadless ultra small plastic , Voltage clamping MDB391 Marking code: S3. The marking bar indicates the cathode. · Protection , outline ( SOD882 ) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System , < 10 ms - 600 mA Ptot total power dissipation Tamb 25 ° C ; note 1 - 250 mW Tstg storage temperature -65 +150 ° C Tj junction temperature - 150 ° C


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PDF M3D891 BAT54L OD882 MDB391 SCA75 613514/01/pp8 S3 DIODE schottky SOD882 S3 marking DIODE BAT54L Marking s3 Schottky barrier Marking "s3" Schottky barrier MARKING C SOD882
2013 - Not Available

Abstract: No abstract text available
Text: Package Marking Min. Order Qty. SP3031-01ETG SOD882 •f 12000 Notes : 1. All , ) 8 minutes Max. Do not exceed 260° C Part Numbering System Part Marking System SP 3031 , Temperature Min (Ts(min) - Temperature Max (Ts(max) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3° C /second max TS(max) to TL - Ramp-up Rate - Temperature (TL) (Liquidus) 217° C - Temperature (tL) 60 – 150


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PDF SP3031 IEC61000-4-2 IEC61000-4-2) OD882 MO-236
2012 - MO-236

Abstract: No abstract text available
Text: Number Package SOD723 SOD882 Marking C C Min. Order Qty. 8000 3000 C C SP1003-01DTG SP1003 , (Inches) c D E HE L Package Dimensions - SOD882 D c L A L1 b Package JEDEC , Number of Channels -01 = 1 Channel Package D: SOD723 E: SOD882 Flammability Part Marking System , SOD882 t%JHJUBMDBNFSBT t1PSUBCMFNFEJDBMEFWJDFT t4NBSUQIPOFT t1%"T t1PSUBCMFOBWJHBUJPO devices , Temperature Storage Temperature Value 7 .0 -40 to 85 -60 to 150 Units A ° C ° C Thermal Information


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PDF SP1003 t5JOZ40 MO-236) 5/50ns) 8/20s) 100nA OD723 OD882 SP1003-01 MO-236
2014 - Not Available

Abstract: No abstract text available
Text: =0V •  mall SOD882 packaging S helps save board space •  EC-Q101 qualified A •  ightning , 0.1μA at 5V ( SOD882 package) Applications Functional Block Diagram • Tablets • MP3/ PMP , Parameters Pb – Free assembly - Temperature Min (Ts(min) - Temperature Max (Ts(max) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3° C /second max TS(max) to TL - Ramp-up Rate tP TP Temperature Reflow


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PDF SP3030 IEC61000-4-2
2003 - "MARKING CODE S1"

Abstract: 1PS10SB62
Text: capacitance An epitaxial Schottky barrier diode encapsulated in a SOD882 leadless ultra small plastic , Ultra high-speed switching Marking code: S1. The marking bar indicates the cathode. · High , .1 Simplified outline ( SOD882 ) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating , +150 ° C Tj junction temperature - 150 ° C ELECTRICAL CHARACTERISTICS Tamb = 25 ° C , CONDITIONS thermal resistance from junction to ambient note 1 Note 1. Refer to SOD882 standard


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PDF M3D891 1PS10SB62 OD882 MDB391 SCA75 613514/01/pp8 "MARKING CODE S1" 1PS10SB62
2013 - Not Available

Abstract: No abstract text available
Text: footprint SOD882 Applications • Mobile Phones • Smart Phones • Portable Navigation Devices , (S21) I/O to GND Product Characteristics of SOD-882 Package Lead Plating Attenuation (dB) -25 , ) 200° C - Time (min to max) (ts) Pre Heat 150° C 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3° C /second max TS(max) to TL - Ramp-up Rate - Temperature (TL) (Liquidus) 217° C - Temperature (tL) 60 – 150 seconds 260 °C Time within 5° C of actual


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PDF SP1007 IEC61000-4-2 IEC61000-4-ification OD882
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