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    M27C1024-12B1 Search Results

    M27C1024-12B1 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    RYZ012B100FZ00#HD0 Renesas Electronics Corporation Bluetooth LE Module Visit Renesas Electronics Corporation
    RYZ012B100FZ00#BD0 Renesas Electronics Corporation Bluetooth LE Module Visit Renesas Electronics Corporation
    RJE4E18812B1 Amphenol Communications Solutions Modular Jacks, Input Output Connectors, 8P8C, With Shield, With LEDs. Visit Amphenol Communications Solutions
    133-812B-12D Amphenol Communications Solutions Paladin Plus 8-Pair, 6 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, NiS Visit Amphenol Communications Solutions
    133-712B-11H Amphenol Communications Solutions Paladin 7-Pair, 6 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, APP Visit Amphenol Communications Solutions
    144-812B-11H Amphenol Communications Solutions Paladin RPO, DO, 8-Pair, 6 Column, 1.5mm Wipe, APP Visit Amphenol Communications Solutions

    M27C1024-12B1 Datasheets (5)

    Part ECAD Model Manufacturer Description Curated Type PDF
    M27C1024-12B1 SGS-Thomson 1-Mbit (64Kb x16) OTP EPROM, 120ns Original PDF
    M27C1024-12B1TR STMicroelectronics 1 MBit (64 kBit x 16) OTP EPROM Original PDF
    M27C1024-12B1TR STMicroelectronics 1 Mbit 64Kb x16 UV EPROM and OTP EPROM Original PDF
    M27C1024-12B1X STMicroelectronics 1 MBit (64 kBit x 16) OTP EPROM Original PDF
    M27C1024-12B1X STMicroelectronics 1 Mbit 64Kb x16 UV EPROM and OTP EPROM Original PDF