The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC2226HLX#TRPBF Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP48, 7 X 7 MM, LEAD FREE, MS-026, PLASTIC, LQFP-48, Analog to Digital Converter
LT1030CS#TR Linear Technology IC LINE DRIVER QUAD LP 14SOIC
LT1236BILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LT1236AILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LTC2246HLX#PBF Linear Technology LTC2246H - 14-Bit, 25Msps 125°C ADC In LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C
LTC2226HLX#PBF Linear Technology LTC2226H - 12-Bit, 25Msps 125°C ADC in LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C

Lead Free reflow soldering profile BGA Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2009 - JEDEC J-STD-020d.1

Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
Text: for eutectic soldering can be used for lead free soldering . f Altera's reflow soldering guidelines , significant impact on reflow soldering of the electronic component, there is one notable exception, lead . The , solder pastes. This can lead to exposed pad finish material after reflow soldering . You can rectify this , used in eutectic soldering . The lead-free reflow profile recommendations are listed in Table 1. Table , AN 353: Reflow Soldering Guidelines for Lead-Free Packages © February 2009 AN


Original
PDF AN-353-2 JEDEC J-STD-020d.1 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
2002 - XAPP427

Abstract: FGG256 FSG48 Lead Free reflow soldering profile BGA BFG95 FFG896 FFG1152 reflow profile 245 SOG20 reflow soldering profile BGA
Text: Competitive Institute, "Initiatives in Lead Free Soldering ," www.aciusa.org. 2. Bath, Jasbir, Handerwer , matte Sn lead finish for lead-frame packages and SnAgCu solder balls for BGA packages. In addition , additional "G" in the package designator portion of the part number. For reflow soldering applications , document contains guidelines on reflow soldering , inspection, and rework process for Pbfree packages , both Pb-free soldering alloys and Sn/Pb soldering alloy. BGA packages (CPG, FTG, FGG, BGG, etc


Original
PDF XAPP427 XAPP427 FGG256 FSG48 Lead Free reflow soldering profile BGA BFG95 FFG896 FFG1152 reflow profile 245 SOG20 reflow soldering profile BGA
SnPb36Ag2

Abstract: J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
Text: good solder joint Source Infineon BGA Reliability Lead Free solder balls shear test Source , but shear values remain more stable during ageing BGA Reliability Lead Free solder balls pull , actual reflow soldering and are used in order to assess the Moisture Sensitivity Level (MSL) of devices , in MSL classification may be observed Technology Consolidated lead free solutions: For lead , . Reliability: o.k. Reliability: o.k. L/F packages Processability Reflow solder joints Lead


Original
PDF 2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
2004 - Lead Free reflow soldering profile BGA

Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
Text: Reflow Profile Example .3 Soldering Guidelines for Lead-Free Packages .4 , , lead-free sphere BGA packages require a higher reflow temperature during soldering than lead-bearing sphere , Two options are available for reflow soldering of lead-free sphere BGA packaged components to printed , Board Assembly Reflow Profile Lead-Free BGA Solder Joint Assembly Evaluation, Rev. 2 Freescale , packages versus lead-bearing sphere packages and provides general guidelines for reflow soldering using


Original
PDF EB635 Lead Free reflow soldering profile BGA Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
2002 - Lead Free reflow soldering profile BGA

Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile
Text: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages , BGA components. Reflow Ovens Full convection ovens are preferred method for BGA assembly , following phases as shown in Figure 1. Figure 1: Reflow Soldering Phases As the components go through , Optimizing Solder Reflow Process for Xilinx BGA Packages settings for key parameters is shown in Table 1. A , the PCB. Reflow Profiling An optimized profile is paramount in achieving successful reflow


Original
PDF XAPP425 Lead Free reflow soldering profile BGA XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile
SnPb36Ag2

Abstract: Lead Free reflow soldering profile BGA semiconductors cross reference Infineon diffusion solder FeNi42 BGA Ball Crack philips pb-free products STD-020C BGA and QFP Package freescale 020C
Text: ) Status · Main Japanese consumer market converted to lead-free soldering · Major conversion to lead free , Freescale BGA Reliability Lead Free solder balls pull Test 0.40mm solder ball; Pull Test on 0.35mm pad , degradation of MSL classification may be observed Technology Consolidated lead free solutions: For lead , Lead-Frame Packages Processability Processability in lead containing vs. lead-free process · For reflow , Automotive The dates indicate the completion of the volume conversion to lead free 1 FSL's dates indicate


Original
PDF 2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA semiconductors cross reference Infineon diffusion solder FeNi42 BGA Ball Crack philips pb-free products STD-020C BGA and QFP Package freescale 020C
2002 - CSG484

Abstract: BGA reflow guide XAPP427 FFG676 Lead Free reflow soldering profile BGA CPG196 PQG240 ipc 610D pcb warpage in ipc standard IPC-A-610D
Text: Pb-free soldering is different and higher reflow temperatures are required. The optimal profile must , , "Initiatives in Lead Free Soldering ," www.aciusa.org. 4. Bath, Jasbir, Handerwer, Carol, and Bradley, Edwin , and has selected matte Sn lead finish for lead-frame packages and SnAgCu solder balls for BGA , reliability. This document contains guidelines on reflow soldering , inspection, and rework process for , , which is compatible with both Pb-free soldering alloys and Sn/Pb soldering alloy. BGA packages (CPG


Original
PDF XAPP427 CSG484 BGA reflow guide XAPP427 FFG676 Lead Free reflow soldering profile BGA CPG196 PQG240 ipc 610D pcb warpage in ipc standard IPC-A-610D
2004 - pcb warpage in ipc standard

Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE Lead Free reflow soldering profile BGA pcb warpage* in smt reflow Altera lead free AN-081 BGA PROFILING leaded reflow soldering profile BGA
Text: used for lead free soldering . Altera's reflow soldering guidelines for standard surface mount , lead to exposed pad finish material after reflow soldering . This can be rectified by modifying to , Reflow Soldering Guidelines for Lead-Free Packages Application Note 353 July 2004, ver. 1.0 Introduction Reflow Soldering Process Considerations The recent directives and legislations by nations , balls for ball-grid array ( BGA ) packages. Altera has proactively researched alternatives for lead


Original
PDF
2002 - reballing

Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA reball Alpha WS609 BGA Ball Crack JEDEC bga 63 tray
Text: reflow oven. Soaking beaker (recommended for cleaning fixtures) Soldering iron (or other tool for BGA , Make sure the BGA fixture is clean before you start. · Preset temperature profile for reflow equipment , Reflow Temperature Profile As with all soldering processes, the temperature profile is the key element , optional Reflow temperature profile Frequently asked questions Glossary Safety precautions Warranty page , when performing cleaning, soldering and desoldering activities. Lead Warning: The USEPA Carcinogen


Original
PDF
2002 - Lead Free reflow soldering profile BGA

Abstract: BGA reflow guide XAPP427 FFG668 TQG144 BFG95 VOG48 BGA PROFILING PQG208 IPC-A610D
Text: Pb-free soldering is different and higher reflow temperatures are required. The optimal profile must , , "Initiatives in Lead Free Soldering ," www.aciusa.org. 4. Bath, Jasbir, Handerwer, Carol, and Bradley, Edwin , and has selected matte Sn lead finish for lead-frame packages and SnAgCu solder balls for BGA , reliability. This document contains guidelines on reflow soldering , inspection, and rework process for , , which is compatible with both Pb-free soldering alloys and Sn/Pb soldering alloy. BGA packages (CPG


Original
PDF XAPP427 Lead Free reflow soldering profile BGA BGA reflow guide XAPP427 FFG668 TQG144 BFG95 VOG48 BGA PROFILING PQG208 IPC-A610D
SEM 2006

Abstract: paste profile reflow profile 245 J-STD-020B 62Sn36Pb2Ag PQFN 8 leads
Text: classified as lead (Pb) free the component will have a Pb free finish and be high temp reflow capable. The , Cycle Profile Board level solder joint reliability is performed by reflow soldering surface mount , spheres supplied on Pb free BGA 's will typically require extensive changes to the board assembly reflow , reliable interconnect. When soldering SnPb based BGAs at Pb free reflow temperatures it is especially , Products: Development of Lead (Pb)- Free and Bromine (Br)- Free Solutions Index Overview 1


Original
PDF
2004 - spst reed relay

Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
Text: BGA SERIES MEDER electronic BGA SERIES Table of content I. Soldering Approaches for MEDERs BGA Series · · · Introduction Soldering Challenges The CR Relay and its Characteristics II. The BGA Soldering Approach · · Page 7 Eutectic BGAs Coplanarity III. The Reflow Profile · , BGA SERIES MEDER electronic BGA SERIES III. The Reflow Profile Important to any surface mount soldering approach is the solder reflow oven and its corresponding temperature profile . A typical


Original
PDF CH-8197 F-91971 CZ-10400 spst reed relay Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
2000 - Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 ceramic rework bga rework CSP-085-102
Text: profile : Preheat, Soak, Reflow and Cooling. The board temperature can be monitored using the integrated , profile is running. Metcal Soldering System To assist with pad cleaning and preparation, all units are , printing. The vision system can also be used for solder-paste print inspection. BGA REFLOW NOZZLES , °F) 200°C (572°F) BGA reflow head 400°C (752°F) 400°C (752°F) Airflow 3-20l/min 3-20l , 86 10 6588 3360 Fax: + 86 10 6588 3359 an OK International Company BG A CSP BGA & CSP


Original
PDF 8833he 485mm) 241mm) Lead Free reflow soldering profile BGA BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 ceramic rework bga rework CSP-085-102
2002 - WS609

Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING Alpha WS609 solder XAPP426 Alpha WS609 XAPP427 reballing bga
Text: components, flip-chip BGA assembly involves the following process: screen printing, solder reflow , post , www.xilinx.com 3 R Reflow Profiling Implementing Xilinx Flip-Chip BGA Packages An optimized profile is paramount in achieving successful reflow result. A good starting point is to refer to the solder paste manufacturer's suggested reflow profile . However, solder paste manufacturers only supply , the profile should be checked at different locations on the board to ensure that the minimum reflow


Original
PDF XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING Alpha WS609 solder XAPP426 Alpha WS609 XAPP427 reballing bga
1999 - FBGA-484

Abstract: BGA313 reflow soldering profile BGA
Text: the BGA package. Figure 4 Sample Temperature Profile for I/R or Convection Reflow 250 Maximum , temperature profile that can be used to reflow prototype sockets as well as QFP packages. The socket , (Vapor Phase Soldering ): 220 °C for a maximum of 60 seconds. b. Infrared reflow : 200 °C to 250 °C for a , method. Note: It is recommended that the standard surface mount solder reflow temperature profile be used , material is FR4, which is the same material as the BGA substrate package. Therefore, the same reflow


Original
PDF
2010 - LGA 2011 Socket diagram

Abstract: water dispenser block diagram senju laser solder wire senju jet printer national semiconductor catalog national marking code microfocus x-ray LGA+2011+Socket+diagram HLQFP 176 Package drawing FeNi42
Text: . 69 3.3.3 Notes on BGA Package Reflow Soldering , Semiconductor Reflow Soldering of SMD Lead type SMD Ball type SMD Solder inspection camera , ( BGA ) Lead type SMD Mounting of component Heat Heat Convection heating (air/N2 reflow , . 127 6.1 Influence of Reflow Soldering Temperature , of soldering methods: 1. Infrared reflow 2. Convection reflow 3. Infrared convection combined 4


Original
PDF propert8175-9600, R50ZZ0003EJ0101 REJ11K0001-0900) LGA 2011 Socket diagram water dispenser block diagram senju laser solder wire senju jet printer national semiconductor catalog national marking code microfocus x-ray LGA+2011+Socket+diagram HLQFP 176 Package drawing FeNi42
2012 - SMD 8PIN IC MARKING CODE 251

Abstract: No abstract text available
Text: . 63 3.3.3 Notes on BGA Package Reflow Soldering , Overview of Soldering Technology (3) Reflow Soldering of SMD Renesas Semiconductor Lead type SMD , . 125 6.1 Influence of Reflow Soldering Temperature , . [Types] There are two types of soldering methods: 1. Infrared reflow 2. Convection reflow 3. Infrared , ) Thermal stress: high Processing times: somewhat longer than those for IR reflow soldering Component


Original
PDF R50ZZ0003EJ0200 REJ11K0001-0900) SMD 8PIN IC MARKING CODE 251
2002 - BGA and QFP Altera Package mounting profile

Abstract: BGA PROFILING infrared heating gun JEP113-B JESD22-A113-B GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE J-STD-033 J-STD-020A Reliability Data Plastic Packages QFP altera board
Text: profile attributes are maintained. Altera Corporation 3 AN 81: Reflow Soldering Guidelines for , Reflow Soldering Guidelines ® for Surface-Mount Devices June 2002, ver. 4 Application , soldering methods exist for these devices, but a combination of forced-air convection and infrared reflow , Corporation AN-081-04 1 AN 81: Reflow Soldering Guidelines for Surface-Mount Devices Temperature , , reflow ovens, and circuit boards, no single temperature profile works for all possible combinations


Original
PDF
2011 - sn63pb37 solder SPHERES

Abstract: JEDEC J-STD-020d.1 J-STD-020 SAC305 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire pcb warpage in ipc standard sn63pb37 solder wire shelf life J-STD-033
Text: SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing , Connections Package Type Lead frame Ball-grid array ( BGA ) 1 Wire Bond (Eutectic) Wire Bond (RoHS , significant impact on reflow soldering of the electronic component, there is one notable exception-lead. The elimination of lead from solders requires special consideration in soldering of the Pb-free components on to , between conventional tin-lead reflow soldering and Pb-free soldering . The reflow soldering process for


Original
PDF AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES JEDEC J-STD-020d.1 J-STD-020 SAC305 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire pcb warpage in ipc standard sn63pb37 solder wire shelf life J-STD-033
1997 - IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: J-STD-003 BGA reflow guide SIZE OF 4V7& PADS FOR REFLOW teBGA J-STD-015 PMC-951041 JESD22-A113 IPC-D-275 PMC-970951
Text: process control, defect free soldering of BGA packages does provide high yielding board assemblies. The , reflow that do come into play with BGA packages, the first is process control. While the profile does not need to be custom for BGA packages, the control of the reflow does. It is not possible to inspect , using nitrogen. The profile and other reflow parameters are determined by the choice of solder paste , a single board, it is recommended to check the profile of all of the BGA sites. Differences in


Original
PDF PMC-970951 PMC-970951R1 IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies J-STD-003 BGA reflow guide SIZE OF 4V7& PADS FOR REFLOW teBGA J-STD-015 PMC-951041 JESD22-A113 IPC-D-275
Lead Free reflow soldering profile BGA

Abstract: toshiba new label 03SAP0037
Text: manufactured overseas. 2. Content of Lead (Pb) Free For the outer leads of semiconductor products, SnPb (tinlead) has been used conventionally. A shift to Lead (Pb) free products is to be implemented on a package type basis. (1) Definition of Lead (Pb) free part The "LeadFree Soldering Roadmap: Ver. 2.1 , to withstand Pb free Lead (Pb) free soldering soldering . Phase2 Parts with Lead (Pb) No Pb , . As a part of such efforts, we intend to implement the following plan for Lead (Pb) Free


Original
PDF 03SAP0037 Lead Free reflow soldering profile BGA toshiba new label 03SAP0037
2004 - AN2034

Abstract: Infineon power diffusion process AN2036 Infineon diffusion solder an2034 st bga thermal cycling reliability AN-2034 TQFP100 reflow temperature bga solder joint reliability
Text: Recommended Profiles For Convection Reflow Soldering Convection Reflow Profile Minimum Peak Temperature , thermal point of view and for the solder joint's metallurgical uniformity, the SnPb soldering profile may , soldering resistance of components. For reflow soldering : paste application and component placement do , profiles for the soldering of components on board. The aim of the soldering resistance profile is to , ). The preheating and the length of the typical convection reflow profile result in no major


Original
PDF AN2034 AN2034 Infineon power diffusion process AN2036 Infineon diffusion solder an2034 st bga thermal cycling reliability AN-2034 TQFP100 reflow temperature bga solder joint reliability
2009 - TAIYO PSR 4000

Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
Text: should be noted that the profile is considered lead free or 260°C capable. What that means is the part can go through the oven which is using a lead free profile , but due to its mass, the Module will not , lead free on the external interconnect termination. 300 REFLOW TEMPERATURE (°C) MAX OVEN TEMP , solderable interface. Both lead and lead free interfaces can be formed using the Linear Technology LGA , 7 AN114 F04 REFLOW TIME (SECONDS) Figure 4. Temperature Reflow Profile for an LTM4600 Module


Original
PDF an114fa AN114-8 TAIYO PSR 4000 TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
2010 - AUS308

Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Text: which the components can be mounted. The reflow profile used for surface mount of 780 pin flip-chip BGA , Packages Page 7 Figure 7. Reflow Profile Used for Surface Mount of 780-Pin Flip-Chip BGA Package , peak reflow temperatures of 240°C to 260°C. Reflow soldering at these extreme temperatures, especially , . 1 While lead-frame and wire-bond packages can be provided as lead free , currently Altera , to increase package warpage. Higher warpage for large BGA components at Pb-free reflow temperatures


Original
PDF
2007 - LTM46XX

Abstract: bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance
Text: Module device reflow profile is shown in Figure 4. This profile was developed after several runs through the IR furnace. It should be noted that the profile is considered lead free or 260°C capable. What that means is the part can go through the oven which is using a lead free profile , but due to its , compliant and are lead free on the external interconnect termination. 300 REFLOW TEMPERATURE (°C , known solderable interface. Both lead and lead free interfaces can be formed using the Linear


Original
PDF an114f AN114-8 LTM46XX bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance
Supplyframe Tracking Pixel