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Part Manufacturer Description Datasheet Download Buy Part
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C

LQFP-100 footprint Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2015 - LQFP-48 footprint

Abstract: 16 bit adc AD7908 16-Lead LFCSP footprint 4 bit adc 4-bit adc AD7665
Text: 1250 1000 800 570 500 400 250 100 100 10,000 6000 5000 3000 2500 2000 1333 1333 1000 1000 1000 1000 1000 600 570 570 500 500 500 500 500 500 500 500 250 250 250 100 100 100 100 100 100 Differential Differential Differential Differential Differential , -bit, 100 kSPS PulSAR ADC 18-bit, 100 kSPS PulSAR ADC 16-bit, 10 MSPS, PulSAR differential ADC 16-bit, 6 , 16-bit, 100 kSPS PulSAR unipolar ADC with reference 16-bit, 100 kSPS PulSAR unipolar CMOS ADC 16


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PDF 64-lead 28-lead 16-lead LQFP-48 footprint 16 bit adc AD7908 16-Lead LFCSP footprint 4 bit adc 4-bit adc AD7665
2007 - 9S08DZ32

Abstract: 9S08DZ16 LQFP-64 footprint
Text: ; MSB-first or LSB-first shifting I2C—Up to 100 kbps with maximum bus loading; multi-master operation , 32-pin LQFP—7 x 7 mm Small 64-pin footprint for applications Small 48-pin footprint for applications Small 32-pin footprint for applications Miscellaneous EMC performance Wide operating voltage , -/ 100 -pin DN48 32-/48-/64-pin DN32 DN16 2006 2007 Development Tools .65 mm pitch


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PDF MC9S08D 16-bit 9S08D 9S08DZ60/48/32/16, 9S08DV60/48/32/16 9S08DN60/48/32/16, fromS-H08-STDED-CX, CWS-H08-PROED-CX PAS08QF5264â 9S08DZ32 9S08DZ16 LQFP-64 footprint
2003 - C-16

Abstract: F2MC-16 FPT-64P-M09 MB2147-01 NQPACK064SB Socket IC 80 pin LQFP LQFP PACKAGE footprint
Text: 1 Header board dimensions 2 35 mm * 100 Approximately 100 99 13 mm * Approximately 99 2 FLAT CABLE CN B1 CN3 FLAT CABLE CN B2 CN1 35 mm 1 s MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board , this footprint as well as to the mass production MCU. For more information, contact Tokyo Eletech Corporation. 15.6 mm 1.8 mm 15.6 mm 0.4 mm Figure 2 Recommended dimensions of the footprint for


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PDF SS01-71032-1E LQFP-64P MB2147-540 LQFP-64P MB2147-540) F2MC-16/16LX MB2147-01, F2MC-16 C-16 FPT-64P-M09 MB2147-01 NQPACK064SB Socket IC 80 pin LQFP LQFP PACKAGE footprint
2003 - LQFP-48P

Abstract: MB2147 LQFP48P
Text: restriction (Figure 1). 56.5 mm 80 mm 2 FLAT CABLE CN B1 CN2 1 100 13 mm * * : The , 35 mm * 100 99 Approximately 99 Approximately 2 CN3 FLAT CABLE CN B2 CN1 1 s MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint , consideration given to this footprint as well as to the mass production MCU. For more information, contact , 2 Recommended dimensions of the footprint for mounting the NQPACK 3 4. Procedure for


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PDF SS01-71033-1E LQFP-48P MB2147-520 LQFP-48P MB2147-520) F2MC-16/16LX MB2147-01, F2MC-16 MB2147 LQFP48P
CRM1076DJ

Abstract: CRM-1076DJ-G crm1076 SUMITOMO g600f ABLEBONd 84-1 LQFP-100 footprint CRM*1076 100LQFP 3717p sumitomo CRM-1076NS
Text: 44-Lead Quad Flat Pack (QFP) Footprint & Package Change Product Change Notice Overview This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of , and FORM as indicated below: Assembly Site Package Type JEDEC Package Body Footprint Lead Count Mold , Ablebond 84-1 LMISR4 Gold 1.20 mils Cu w/Ag spot Solder Plate: 80/20 Sn/Pb 100 % matte Sn (RoHS compliant , : 80/20 Sn/Pb 100 % matte Sn (RoHS compliant) UL94 V-0 and IEC Standard 695-2-2 Level 3 260 oC The 44


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PDF 44-Lead PCN1102 QR-1003 100-Lead QR-1131 CRM1076DJ CRM-1076DJ-G crm1076 SUMITOMO g600f ABLEBONd 84-1 LQFP-100 footprint CRM*1076 100LQFP 3717p sumitomo CRM-1076NS
2006 - AD5390

Abstract: ADR462 ADR421 AD7476 AD5535 AD5382 AD5371 AD5370 AD5362 AD5360
Text: -bit resolution. Key Features · High density of D/A channels · Uncompromised performance in a small footprint , calibration . . . . . . . . . . . . . · Flexible output range · Small footprint . . . . . . . . . . . . . , to +8 V typ AD5371 Optical Communications VOA 32 DACs in 100 -lead LQFP 10 ppm/°C max (1.25 V , , in a compact footprint , packed with a range of new integrated programmable features. AD5535 · , LFCSP footprint . Additional features include SPI with readback and PEC, temperature sensor, toggle mode


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PDF 12-bit 16-bit AD5362 BR05230-5-2/06 AD5390 ADR462 ADR421 AD7476 AD5535 AD5382 AD5371 AD5370 AD5362 AD5360
2004 - NQPACK080SB-SL

Abstract: F2MC-16 MB2147-01 MB90820 LQFP-80
Text: 99 100 99 80.0 mm FLAT CABLE CN B1 CN3 2 FLAT CABLE CN B2 37.0 mm CN1 1 100 Approximately 35.0 mm * Approximately 13.0 mm * * : The height differs slightly depending on how the socket are engaged. Figure 1 Header board dimensions 2 s MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the , footprint as well as to the mass production MCU. For more information, contact the Tokyo Eletech


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PDF SS01-71038-1E F2MC-16 LQFP-80P MB2147-562 MB2147-562) F2MC-16L/16LX MB2147-01, NQPACK080SB-SL MB2147-01 MB90820 LQFP-80
2003 - Eletech

Abstract: MB2147-01 LQFP-100P NQPACK100SD
Text: the user system must be designed with due consideration given to this restriction. 100 99 2 80 mm 100 68 mm Approximately 32 mm* Approximately13 mm* *: The height differs , footprint design notes Figure 5 shows the recommended dimensions of the NQPACK footprint mounted on the PC , to this footprint as well as to the mass production MCU. For more information, contact Tokyo Eletech Corporation. 17 mm 2 mm 17 mm 0.25 mm Figure 5 Recommended dimensions of the footprint for


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PDF LQFP-100P MB2147-581) 2-16L/16LX MB2147-01) F2MC-16L/LX MB2147-581. FPT-100P-M05) F2MC-16L/16LX Eletech MB2147-01 NQPACK100SD
2006 - AD5668

Abstract: ADG731 AD7476 AD5535 AD5382 AD5371 AD5370 AD5362 AD5360 AD5390
Text: density of D/A channels · Uncompromised performance in a small footprint · User-programmable flexible , . · Flexible output range . . . . . . . . . . . · Small footprint . . . . . . . . . . . . . . , typ AD5371 Optical Communications VOA 32 DACs in 100 -lead LQFP 10 ppm/°C max (1.25 V/2.5 V , compact footprint , packed with a range of new integrated programmable features. AD5535 · High , LFCSP footprint . Additional features include SPI with readback and PEC, temperature sensor, toggle mode


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PDF 12-bit 16-bit AD5362 BR05230-5-3/06 AD5668 ADG731 AD7476 AD5535 AD5382 AD5371 AD5370 AD5362 AD5360 AD5390
2004 - F2MC-16

Abstract: MB2147-01 Socket IC 80 pin LQFP MB90820
Text: depending on how the socket are engaged. Figure 1 Header board dimensions 2 s MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the , footprint as well as to the mass production MCU. For more information, contact the Tokyo Eletech , of the footprint for mounting the NQPACK 3 4. Procedure for Connecting the User System Before , Pin Numbers 100 98 96 94 92 90 88 86 84 82 80 78 76 74 72 70 68 66 64 62 60 58


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PDF SS01-71037-1E F2MC-16 LQFP-80P MB2147-561 MB2147-561) F2MC-16L/16LX MB2147-01, MB2147-01 Socket IC 80 pin LQFP MB90820
2008 - 9S08DN32

Abstract: 9S08DZ32 LQFP-32 footprint 9S08DZ60 PAS08QF324448 9S08DZ48 REAL TIME CLOCK lqfp-48 MC9S08DV16MLF LQFP 48 Package Box LQFP PACKAGE footprint
Text: 1 1 1 1 1 1 1 Up to 8-ch. + 4-ch 100 , 64, 48 100 , 64, 48 64, 48, 32 Up to 6-ch. + 2 , , BDM, POR, KBI, Temp Sensor Up to 8-ch. + 4-ch 100 , 64, 48 MCG (PLL, FLL, OSC) 100 , 64, 48 64, 48 , ; MSB-first or LSB-first shifting I2C-Up to 100 kbps with maximum bus loading; multi-master operation , Small 64-pin footprint for applications Small 48-pin footprint for applications Small 32-pin footprint , 100 LQFP 14 x 14 mm 64-pin low-profile quad flat pack (LQFP)-10 x 10 mm 48-pin LQFP-7 x 7 mm 32


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PDF MC9S08D 16-bit 9S08D 9S08DZ128/96/60/48/32/16, 9S08DV128/96/60/48/32/16 9S08DN60/48/32/16, upwardH08-PROED-CX, PAS08QF5264--64LQFP; PAS08QF324448--32/48 9S08DN32 9S08DZ32 LQFP-32 footprint 9S08DZ60 PAS08QF324448 9S08DZ48 REAL TIME CLOCK lqfp-48 MC9S08DV16MLF LQFP 48 Package Box LQFP PACKAGE footprint
LQFP-144 footprint

Abstract: LQFP 144 footprint LQFP PACKAGE footprint cluster stepper motor 80 LQFP footprint S12XE S12X S12C QFP-112 instrument cluster
Text: Controller, 6 ch motor control modules with Stepper Stall Detect Small Footprint Small Footprint 2-8


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PDF 50MHz 128KB-1MB 12KB-64KB 40MHz 64KB-256KB 4KB-12KB 32KB-128KB 8-16MHz S12XE LQFP-144 footprint LQFP 144 footprint LQFP PACKAGE footprint cluster stepper motor 80 LQFP footprint S12XE S12X S12C QFP-112 instrument cluster
2001 - JESD51-8

Abstract: JESD51-2 JEDEC JESD51-8 surface mount package dimensions qfn 44 PACKAGE footprint 9mm FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
Text: . With the correct pad footprint geometry, the packages will self align to the PCB board when subjected , 100 °C/W RJA 10°C/W - 40°C/W RJL 1°C/W - 2°C/W RJC* *SOICW-Exposed Pad Test Condition JESD51 , . With the correct pad footprint geometry, the packages will self align to the PCB board when subjected , to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will , 14.00 0.65 0.10 1.40 16.00 16.00 0.60 0.30 0.15 100 LQFP 14.00 14.00


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PDF BR1568/D JESD51-8 JESD51-2 JEDEC JESD51-8 surface mount package dimensions qfn 44 PACKAGE footprint 9mm FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
2004 - NQPACK100SD-ND

Abstract: SS01-71039-1E NQPACK100SD-ND-SL
Text: depending on how the socket are engaged. Figure 1 Header board dimensions 2 s MCU footprint design , footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU. For more , Recommended dimensions of the footprint for mounting the NQPACK 3 4. Procedure for Connecting the User , 97 B38 *6 B39 100 B40 2 B41 4 B42 6 B43 7 B44 9 B45 11 B46 13 B47 18 B48 20


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PDF SS01-71039-1E LQFP-100P MB2198-126 MB2198-126) MB2198-01, MB91260 LQFP-100P NQPACK100SD-ND SS01-71039-1E NQPACK100SD-ND-SL
2003 - LQFP-120P

Abstract: MB91230 PGA-401P
Text: footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC , to this footprint as well as to the mass production MCU. For more information, contact the Tokyo , footprint for mounting the NQPACK 3 4. Procedure for connecting the user system s Connection


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PDF SS01-71025-1E LQFP-120P MB2198-121 MB2198-121) MB2198-01) MB91230 LQFP-120P PGA-401P
2003 - MB91F011

Abstract: MB91F0 LQFP-120P
Text: footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC , to this footprint as well as to the mass production MCU. For more information, contact the Tokyo , footprint for mounting the NQPACK 3 4. Procedure for connecting the user system s Connection


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PDF SS01-71029-1E LQFP-120P MB2198-124 MB2198-124) MB2198-01) MB91F011 LQFP-120P MB91F011 MB91F0
2004 - MB91016

Abstract: No abstract text available
Text: how the socket are engaged. Figure 1 Header board dimensions 2 s MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint , footprint for mounting the NQPACK 3 4. Procedure for Connecting the User System s Connection Before


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PDF SS01-71036-1E LQFP-144P MB2198-127 MB2198-127) MB2198-01, PGA-401P MB2198-130, MB91016
2006 - 9S08DZ32

Abstract: No abstract text available
Text: receive; master or slave mode; MSB-first or LSB-first shifting IIC (I2C)—Up to 100 kbps with maximum , controlling rate outputs change state, thereby increasing performance Small 64-pin footprint for applications Small 48-pin footprint for applications Small 32-pin footprint for applications Low EMC , DV16 DN60 DN48 DN32 DN16 Indicates a differentiating feature Coming Soon 64-/80-/ 100


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PDF MC9S08 com/S08D. BRS08DFAMILY 9S08DZ32
2003 - NQPACK176SD

Abstract: HQPack176SD lqfp-176 socket LQFP-176 footprint BGA-420P
Text: the NQPACK176SD are engaged. 5 I MCU footprint design notes Figure 4.2 shows the recommended dimensions of the NQPACK176SD footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the , footprint for mounting the LQFP-176 IC socket 6 SS01-71022-1E FUJITSU SEMICONDUCTOR · SUPPORT


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PDF LQFP-176P MB2198-111) BGA-420P MB2198-110) MB2198-01) MB91F355 MB91355 LQFP-176 FPT-176P-M02) NQPACK176SD HQPack176SD lqfp-176 socket LQFP-176 footprint
2004 - PGA-401P

Abstract: FPT-144P-M08 Package FPT-144P-M08 401-P NQPACK144SD-ND
Text: . Figure 1 Header board dimensions 2 MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the mass production , mm 23.0 mm No.1 pin Figure 2 Recommended dimensions of the footprint for mounting the NQPACK


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PDF SS01-71036-2E LQFP-144P MB2198-127 MB2198-127) MB2198-01, PGA-401P MB2198-130, LQFP-144P FPT-144P-M08 Package FPT-144P-M08 401-P NQPACK144SD-ND
2003 - Package FPT-144P-M08

Abstract: Socket IC 80 pin LQFP SS01-71031-2E FPT-144P-M08 PGA-401P LQFP 144 footprint mb91240
Text: dimensions 4 MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU. For more information , dimensions of the footprint for mounting the NQPACK 5 4. Procedure for Connecting the User System


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PDF SS01-71031-2E LQFP-144P MB2198-123 MB2198-123) MB2198-01) MB91240 Package FPT-144P-M08 Socket IC 80 pin LQFP SS01-71031-2E FPT-144P-M08 PGA-401P LQFP 144 footprint
2003 - FPT-144P-M08

Abstract: MB91150 HEADER 2.0MM guide 2.0mm header schematic DSU-FR20 Package FPT-144P-M08
Text: dimensions 2 MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the printed circuit board of the user system. The printed circuit board of the user system must be designed with due consideration given to this footprint as well as to the mass production , Figure 2 Recommended dimensions of the footprint for mounting the NQPACK 3 4. Procedure for


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PDF SS01-71023-2E LQFP-144P MB2197-155 MB2197-155) DSU-FR20/30 MB2197-01) MB2198-01) MB91150 FPT-144P-M08 HEADER 2.0MM guide 2.0mm header schematic DSU-FR20 Package FPT-144P-M08
2003 - LQFP 144 footprint

Abstract: No abstract text available
Text: Header board dimensions 4 MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU , Figure 2 Recommended dimensions of the footprint for mounting the NQPACK 5 4. Procedure for


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PDF LQFP-144P MB2198-123) MB2198-01) MB91240 FPT-144P-M08) SS01-71031-1E LQFP 144 footprint
2003 - LQFP-120P

Abstract: C-16 F2MC-16 MB2147-01 FPT-120P-M21 MB2147
Text: Probe cable dimensions s MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU. For more , dimensions of the footprint for mounting the NQPACK 2 4. Procedure for Connecting the User System s


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PDF SS01-44009-1E LQFP-120P MB2132-492 LQFP-120P MB2132-492) F2MC-16/16LX MB2147-01, F2MC-16 C-16 MB2147-01 FPT-120P-M21 MB2147
2003 - Not Available

Abstract: No abstract text available
Text: depending on how the socket are engaged. Figure 1 Header board dimensions 2 MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the , footprint as well as to the mass production MCU. For more information, contact the Tokyo Eletech Corporation. 23 mm 2 mm 0.25 mm 23 mm s Figure 2 Recommended dimensions of the footprint for


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PDF LQFP-144P MB2198-125) MB2198-01) MB91F253 LQFP-144P MB2198-125, FPT-144P-M08) SS01-71030-1E
Supplyframe Tracking Pixel