The Datasheet Archive

Top Results (6)

Part ECAD Model Manufacturer Description Datasheet Download Buy Part
BM2P016-Z BM2P016-Z ECAD Model ROHM Semiconductor Switching Regulator, Current-mode, 10.4A, 65kHz Switching Freq-Max, PDIP7, DIP-7
BD9P155MUF-C BD9P155MUF-C ECAD Model ROHM Semiconductor 3.5V to 40V Input, 5.5V Output, 1A Single 2.2MHz Buck DC/DC Converter For Automotive, VQFN20FV4040 Package
BD9P255MUF-C BD9P255MUF-C ECAD Model ROHM Semiconductor 3.5V to 40V Input, 5.5V Output, 2A Single 2.2MHz Buck DC/DC Converter For Automotive, VQFN20FV4040 Package
BD9P135MUF-C BD9P135MUF-C ECAD Model ROHM Semiconductor 3.5V to 40V Input, 3.3V Output, 1A Single 2.2MHz Buck DC/DC Converter For Automotive, VQFN20FV4040 Package
BD9P135EFV-C BD9P135EFV-C ECAD Model ROHM Semiconductor 3.5V to 40V Input, 3.3V Output, 1A Single 2.2MHz Buck DC/DC Converter For Automotive, HTSSOP-B20 Package
BD9P255EFV-C BD9P255EFV-C ECAD Model ROHM Semiconductor 3.5V to 40V Input, 5.5V Output, 2A Single 2.2MHz Buck DC/DC Converter For Automotive, HTSSOP-B20 Package

LQFP Package tray Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2010 - QFN tray

Abstract: 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray
Text: 14 x1.4 LQFP 144L 20 x 20 x 1.4 250/ TRAY 160/ TRAY 160/ TRAY 90/ TRAY 90/ TRAY 60/ TRAY 2000 , . 15 Marketing Outline, 32-Lead LQFP . 16 Marketing Outline, 44-Lead LQFP . 17 Marketing Outline, 64-Lead LQFP . 18 Marketing Outline, 64-Lead LQFP


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PDF PS007229-1010 2000/REEL 1000/REEL 160/TRAY 1600/BAG 490/TRAY 260/TRAY QFN tray 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray
2011 - FT232HQ

Abstract: FT2232HL QFN-48 pin 49 ft232hl FT245BL FT4232HQ FT4232HL FTDI FT232RL FT2232HQ ft-232hl
Text: -64 Carrier Tape Dimensions. 44 37 VNC2 ­ LQFP -32 and LQFP -48 Tray Dimensions . 45 38 VNC2 ­ LQFP -32 and LQFP -48 Tray Dimensions ­ Side View . 46 39 VNC2 ­ LQFP -64 Tray Dimensions . 50 40 VNC2 ­ LQFP -64 Tray , Package Quantities (pieces) FT232BL, FT245BL ­ R LQFP 1000 FT232BQ, FT245BQ ­ R QFN , 1000 FT4232HQ ­ R QFN 4000 VINC1L ­ A ­ R LQFP 2000 Package Quantities (pieces


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PDF FT232BL, FT245BL, FT232BQ, FT245BQ, FT232RL, FT245RL, FT232RQ, FT245RQ, FT2232D, FT2232HL, FT232HQ FT2232HL QFN-48 pin 49 ft232hl FT245BL FT4232HQ FT4232HL FTDI FT232RL FT2232HQ ft-232hl
2014 - tray lqfp

Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Text: 2 Kbytes 2 Kbytes 2 Kbytes - - Package TFBGA 100 LQFP 100 VFBGA 100 Number of , Devices" for the overview of devices available in 100-lead packages. 4.1.1 100-lead LQFP Package Outline Figure 4-1. Orientation of the 100-lead LQFP Package 75 51 76 50 100 26 1 , of devices available in 64-lead packages. 4.2.1 64-lead LQFP Package Outline Figure 4-4. Orientation of the 64-lead LQFP Package 33 48 49 32 64 17 16 1 4.2.2 64-lead QFN


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PDF 32-bit tray lqfp JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
2009 - FT2232HL

Abstract: VNC2-32 FT232RL ft4232hl ft2232hq FTDI 32 FT232BL FT245BL ftdi FT232RQ
Text: 2000 Package Quantities (pieces) Box of Trays/Tube (pieces) FT232BL, FT245BL ­ Tray LQFP , / Tray Package Quantities (pieces) Quantities (pieces) Reel TRAY VNC2-32LQFP LQFP , -64 Carrier Tape Dimensions. 26 23 VNC2 ­ LQFP -32 and LQFP -48 Tray Dimensions . 27 24 VNC2 ­ LQFP -32 and LQFP -48 Tray Dimensions ­ Side View , .: FTDI# 98 25 VNC2 ­ LQFP -64 Tray Dimensions . 32 26 VNC2 ­ LQFP


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PDF FT232BL, FT245BL, FT232BQ, FT245BQ, FT232RL, FT245RL, FT232RQ, FT245RQ, FT2232D, FT2232HL, FT2232HL VNC2-32 FT232RL ft4232hl ft2232hq FTDI 32 FT232BL FT245BL ftdi FT232RQ
2012 - FTDI Devices T&R Dimensions

Abstract: FT232R LQFP Package tray SSOP-28 FTDI FT232RL
Text: €“ LQFP -32 VNC2 – LQFP -48 and FT311D QFN Tray Dimensions . 47 36 VNC2 – LQFP -32, VNC2 – LQFP -48 and FT311D LQFP Tray Dimensions – Side View . 48 37 VNC2 – LQFP -64 Tray Dimensions . 52 38 VNC2 – LQFP , -64 Tray Dimensions – Side View 59 42 VNC2 – LQFP -32, LQFP -48, LQFP -64, QFN-32, QFN-48, QFN-64 and , Tray /Tube Packaging IC – Tray /Tube Package Quantities (pieces) Box of Trays/Tube (pieces


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PDF FT232BL, FT245BL, FT232BQ, FT245BQ, FT232RL, FT245RL, FT232RQ, FT245RQ, FT2232D, FT2232HL, FTDI Devices T&R Dimensions FT232R LQFP Package tray SSOP-28 FTDI FT232RL
antistatic epe foam

Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
Text: tray . Table 2Specifications of Chip's Packing Material Packing materials for package (refer to , Packing Materials. SCOPE Related all packing materials in warehouse. DESCRIPTION Package , electricity paper in tray Tyvek in tray Aluminum foil paper in tray All Figures refer to Appendix A , tray . Anti-stastic electricity paper in tray . Tyvek in tray . Tyvek in tray . Aluminum foil paper in tray . Packing materials for Chip Mtalized static shielding bag. R<10E+10 Static


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PDF 200mm 150mm 118MIL 150MIL 300MIL antistatic epe foam mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
2013 - LQFP100 tray dimension

Abstract: JESD97 Classification E3
Text: 144 TFBGA 100 Package LQFP 144 LQFP 100 Number of PIOs 117 79 External Bus , Package and Pinout 4.3.1 100-lead LQFP Package Outline The 100-lead LQFP package has a 0.5 mm ball pitch and respects Green Standards. Table 4-9. Device and LQFP Package Maximum Weight (Preliminary) SAM4E 740 mg Table 4-10. LQFP Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification e3 Table 4-11. LQFP Package Characteristics Moisture Sensitivity Level 3


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PDF SAM4E16E SAM4E16C 32-bit LQFP100 tray dimension JESD97 Classification E3
2009 - ft232rl

Abstract: FT245RL ft4232hl FT2232HL FT232RQ FT4232HQ FT245RQ FT2232HQ FT232RL FTDI IC FTDI FT232BL
Text: R LQFP 2000 Package Quantities (pieces) Box of Trays/Tube (pieces) FT232BL, FT245BL ­ Tray LQFP 250 2500 FT232BQ, FT245BQ QFN 250 - FT232RQ, FT245RQ ­ Tray QFN 490 4900 FT2232D ­ Tray LQFP 250 2500 FT2232HL ­ Tray LQFP 160 - FT2232HQ ­ Tray QFN 260 - FT4232HL ­ Tray LQFP 160 - FT4232HQ ­ Tray QFN 260 - VINC1L ­ A ­ Tray LQFP 250 2500 FT232RL, FT245RL ­ Tube SSOP 47 2820 IC


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PDF FT232BL, FT245BL, FT232BQ, FT245BQ, FT232RL, FT245RL, FT232RQ, FT245RQ, FT2232D, FT2232HL, ft232rl FT245RL ft4232hl FT2232HL FT232RQ FT4232HQ FT245RQ FT2232HQ FT232RL FTDI IC FTDI FT232BL
2012 - JEDEC qfn tray

Abstract: JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
Text: . 15 Marketing Outline, 32-Lead LQFP . 16 Marketing Outline, 44-Lead LQFP . 17 Marketing Outline, 64-Lead LQFP . 18 Marketing Outline, 64-Lead LQFP . 19 Marketing Outline, 100-Lead LQFP


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PDF PS007230-0812 2500/BAG 1600/BAG 900/BAG 600/BAG 2000/REEL 1500/REEL JEDEC qfn tray JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
MS-026 lqfp 80

Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: % reduction in package self-inductance · 50% improvement in Ja over standard LQFP · 32 to 144 lead counts · , semiconductor manufacturers and packaging engineers have chosen LQFP PQ2 as the IC package of choice for power , LEADFRAME data sheet LQFP PowerQuad® 2 Features: LQFP PowerQuad® 2 Packages: LQFP , applied to Low Profile 1.4 mm QFPs ( LQFP ). This breakthrough in IC packaging provides extraordinary , dissipates generated heat. To enhance the thermal conduction from the IC to the mounting surface, the LQFP


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MS-026

Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Text: LQFP PQ4 heatsink has integrated mechanical "locking" features to ensure total package integrity and , packaging engineers have chosen LQFP PQ4 as the IC package of choice for power microprocessors , tray (JEDEC Outline CS-007) Inverted Configuration Options: LOW PROFILE POWERQUAD® 4 PACKAGE , LEADFRAME data sheet LQFP PowerQuad® 4 Features: LQFP PowerQuad® 4 Packages: LQFP , applied to Low Profile 1.4 mm QFPs ( LQFP ). Improved power dissipation is achieved by using an exposed


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TQFP 100 pin ic

Abstract: 208ld
Text: outline CS-007 low profile tray Configuration Options: ExposedPad LQFP / TQFP Nominal Package , LEADFRAME data sheet ExposedPad LQFP / TQFP Features: (ExposedPad LQFP /TQFP) Packages , power constrained standard LQFP and TQFP packages. The ExposedPad LQFP / TQFP can increase heat dissipation by as much as 110% over a standard LQFP / TQFP, thereby expanding the margin of operating , thermal and electrical benefits. 3D packaging with die stack process are also provided in this package


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LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: Shipping · JEDEC outline CS-007 low profile tray Configuration Options: ExposedPad LQFP / TQFP , data sheet Features LEADFRAME ExposedPad LQFP / TQFP Amkor's ExposedPad LQFP , for TQFP 1.4 mm body thickness for LQFP · Custom leadframe design available · ExposedPad is easily , soldered to PCB ExposedPad LQFP /TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The


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2013 - Not Available

Abstract: No abstract text available
Text: Overview of the 100-lead LQFP Package Figure 4-1. Orientation of the 100-lead LQFP Package 75 51 , [SUMMARY DATASHEET] 11158AS–ATARM–06-Jun-13 14 4.5 Overview of the 64-lead LQFP Package Figure 4-4. Orientation of the 64-lead LQFP Package 33 48 49 32 64 17 16 1 4.6 , Overview of the 48-lead LQFP Package Figure 4-6. Orientation of the 48-lead LQFP Package 25 36 37 , €“ATARM–06-Jun-13 18 5. SAM4N Mechanical Characteristics Figure 5-1. 100-lead LQFP Package Mechanical Drawing


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PDF SAM4N8/16 32-bit 16-bit 10-bit 12-bit
2006 - E131

Abstract: MC100EP131 MC10EP131 QFN32
Text: MC10EP131FA LQFP -32 250 Units / Tray MC10EP131FAG LQFP -32 (Pb-Free) 250 Units / Tray , MC100EP131FA LQFP -32 250 Units / Tray MC100EP131FAG LQFP -32 (Pb-Free) 250 Units / Tray , MC10EP131, MC100EP131 PACKAGE DIMENSIONS 32 A1 A -T-, -U-, -Z- 32 LEAD LQFP CASE 873A-02 , temperature compensation. Features · · · · · · · · · · · MCxxx EP131 AWLYYWWG LQFP -32 FA , Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer


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PDF MC10EP131, MC100EP131 MC10/100EP131 EP131 E131 MC100EP131 MC10EP131 QFN32
2009 - mpc5604

Abstract: Password based door locking system file down MPC560 MPC5603 MPC5604BMLQ6 immobilizer bosch mpc5604b MPC5602B Password based door locking system embedded Password based door locking system
Text: Debug Package 37 1 32 kHz oscillator GPIO8 37 6 79 123 79 JTAG 100 LQFP 144 LQFP 100 LQFP 100 LQFP 144 LQFP 123 Nexus2+ 100 LQFP 100 LQFP 144 LQFP 100 LQFP 208 MAP BGA9 MPC5604B/C Microcontroller Product Brief, Rev. 4 Freescale , package for Nexus2+. 3.3 · · · · · · Feature list Operating parameters - Fully static , operations: 79 in 100 LQFP and 123 in 144 LQFP Nexus development interface (NDI) per IEEE-ISTO 5001-2003


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PDF MPC560XBCPB MPC5604B/C 32-bit mpc5604 Password based door locking system file down MPC560 MPC5603 MPC5604BMLQ6 immobilizer bosch mpc5604b MPC5602B Password based door locking system embedded Password based door locking system
lqfp 7x7 tray

Abstract: MS-026 7X748LD amkor
Text: Configuration Options: LQFP Nominal Package Dimensions (units in mm) Body Size Body Tkns Lead Form , LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack ( LQFP ) Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging , ld 144 ld 176 ld 208 ld* Applications: Amkor's LQFPs are an ideal IC package for most IC , acquisition, office equipment, disc-drives and communication boards. Amkor's LQFP packaging portfolio


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PDF MS-026 lqfp 7x7 tray MS-026 7X748LD amkor
JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: profile tray Configuration Options: LQFP Nominal Package Dimensions (units in mm) Body Size , LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack ( LQFP ) Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging , 's LQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers , . Amkor's LQFP packaging portfolio provides: · 7 x 7 mm to 28 x 28 mm body size · 32 to 256 lead counts


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PDF MS-026 JEDEC MS-026 MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
LPCC-8

Abstract: DRAM BGA TRAY qfn 6 x 6 TRAY
Text: : FLASH CORE 12. Package Type 1 : TEBGA 3 : QFN 5 : ELP2 7 : LPCC 9 : PBGA B : BGA D : DIP F , 4~7. Serial No 14. Packing B : Tube U : Bulk R : Tray T : Tape & Reel S : Tape & Reel Reverse C : Chip Biz D : Chip Biz (3 Inch tray ) E : Chip Biz (4 Inch tray ) F : Chip Biz (Reverse) W : WF Biz Draft Wafer X : WF Biz Full Cutting 3 : Tape & Reel (Halogen-Free PKG) 4 : Tray (Halogen-Free PKG) 5 : Tube (Halogen-Free PKG) 7 : Tape & Reel (Lead-Free PKG) 8 : Tray (Lead-Free PKG) 9


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PDF AG01000 LPCC-8 DRAM BGA TRAY qfn 6 x 6 TRAY
2006 - J 3305

Abstract: Marking D1c MC100EP101 MC10EP101 QFN32
Text: MC10EP101, MC100EP101 ORDERING INFORMATION Package Shipping MC10EP101FA LQFP -32 250 Units / Tray MC10EP101FAG LQFP -32 (Pb-Free) 250 Units / Tray MC10EP101FAR2 LQFP -32 2000 , -32 250 Units / Tray MC100EP101FAG LQFP -32 (Pb-Free) 250 Units / Tray MC100EP101FAR2 LQFP , MC10EP101, MC100EP101 PACKAGE DIMENSIONS A 32 A1 -T-, -U-, -Z- 32 LEAD LQFP CASE 873A-02 , Range: VCC = 3.0 V to 5.5 V · · · MCxxx EP101 AWLYYWWG LQFP -32 FA SUFFIX CASE 873A with


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PDF MC10EP101, MC100EP101 MC10/100EP101 EP101 EP101 LQFP-32 MC10EP101/D J 3305 Marking D1c MC100EP101 MC10EP101 QFN32
2006 - MC100EP451

Abstract: MC10EP451 QFN32 QFN-32 footprint LQFP-32 footprint
Text: Package Shipping MC10EP451FA LQFP -32 250 Units / Tray MC10EP451FAG LQFP -32 (Pb-Free) 250 Units / Tray MC10EP451FAR2 LQFP -32 2000 / Tape & Reel MC10EP451FAR2G LQFP -32 (Pb-Free) 2000 / Tape & Reel MC100EP451FA LQFP -32 250 Units / Tray MC100EP451FAG LQFP -32 (Pb-Free) 250 Units / Tray MC100EP451FAR2 LQFP -32 2000 / Tape & Reel MC100EP451FAR2G LQFP , Inputs Pb-Free Packages are Available* MCxxx EP451 AWLYYWWG LQFP -32 FA SUFFIX CASE 873A 32


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PDF MC10EP451, MC100EP451 MC10/100EP451 MC10EP451/D MC100EP451 MC10EP451 QFN32 QFN-32 footprint LQFP-32 footprint
2010 - LQFP-32 footprint

Abstract: QFN tray 5x5 QFN 5x5 tray QFN-32 footprint tray QFN 5x5 LQFP-32 MC100EP451 MC10EP451 QFN32
Text: Shipping MC10EP451FA LQFP -32 250 Units / Tray MC10EP451FAG LQFP -32 (Pb-Free) 250 Units / Tray MC10EP451FAR2 LQFP -32 2000 / Tape & Reel MC10EP451FAR2G LQFP -32 (Pb-Free) 2000 / Tape & Reel MC100EP451FA LQFP -32 250 Units / Tray MC100EP451FAG LQFP -32 (Pb-Free) 250 Units / Tray MC100EP451FAR2 LQFP -32 2000 / Tape & Reel MC100EP451FAR2G LQFP , Inputs Pb-Free Packages are Available* MCxxx EP451 AWLYYWWG LQFP -32 FA SUFFIX CASE 873A 32


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PDF MC10EP451, MC100EP451 MC10/100EP451 MC10EP451/D LQFP-32 footprint QFN tray 5x5 QFN 5x5 tray QFN-32 footprint tray QFN 5x5 LQFP-32 MC100EP451 MC10EP451 QFN32
tray datasheet bga

Abstract: fujitsu ic trays sol
Text: , LQFP Trays Tray Product Tray Binding band or tape Cushioning material Filled tray + one , , LQFP , TQFP, BGA, T-BGA, FBGA, SCSP, FLGA, JEDEC Size Trays Product Tray Tray Humidity , Shipment Fig. 5 Packing Form for Ceramic QFP, LQFP JEDEC Size Tray Product Tray Binding band or , of a package on the tray Package type Tray size and index mark direction orientation 135.9 F , for Shipment Package type Tray size and index mark direction orientation 135.9 260 315


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PDF DB81-10008-2E DB81-10005-1E tray datasheet bga fujitsu ic trays sol
2007 - ZHX1203

Abstract: ZHX1223 ZHX1403 ZHX1423 ZHX1810 ZHX1820 ZHX2022 52855 za9l MC 1200 Motor Control Board
Text: 3.42 24/ TRAY LQFP 32L 7 x 7 x 1.4 PS007225-0607 Tape and Reel 250/ TRAY 240/BAG , Tape and Reel Dry Pack LQFP 44L 10 x 10 x 1.4 160/ TRAY 1500/REEL 1600/BAG LQFP 64L 10 x 10x 1.4 160/ TRAY 1500/REEL 1600/BAG LQFP 64L 14 x 14 x 1.4 90/ TRAY 1500/REEL 900/BAG LQFP 100L 14 x 14 x1.4 90/ TRAY 1500/REEL 900/BAG LQFP 144L 20 x 20 x 1.4 60 , . . . . . . . . . . . . . . . . . . . Package Designators . . . . . . . . . . . . . . . . . . . . .


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PDF PS007225-0607 componeMKT71C1191-00 MKT71C1187-00 MKT71C1153-00 MKT71C1188-00 MKT71C1190-00 MKT71C1189-00 MKT71C0002-00 MKT71C1172-00 ZHX1203 ZHX1223 ZHX1403 ZHX1423 ZHX1810 ZHX1820 ZHX2022 52855 za9l MC 1200 Motor Control Board
1999 - LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: * SON QFP LQFP *3 LCC* 3 Leadless Chip Carrier QFN Quad Flat Non-Leaded Package (EIAJ , LSI are rapidly increasing. Given this environment, package technology is rapidly increasing in , packages in the design of their products, and therefore focuses on the package outline drawings , Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case , mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel


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Supplyframe Tracking Pixel