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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
XOMAP3503CCBB Texas Instruments Applications Processor 515-POP-FCBGA
XOMAP3515CCBC Texas Instruments Applications Processor 515-POP-FCBGA
XOMAP3515CCBB Texas Instruments Applications Processor 515-POP-FCBGA
XOMAP3503CCBC Texas Instruments Applications Processor 515-POP-FCBGA
OMAP3530ECBBAR Texas Instruments Applications Processor 515-POP-FCBGA
XDM3730ACBP Texas Instruments Digital Media Processor 515-POP-FCBGA

LPDDR2 PoP Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2009 - LPDDR2 PoP

Abstract: LPDDR2 micron lpddr2 lpddr2 datasheet lpddr2 nand mcp 216-ball LPDDR Micron 512MB nand FLASH 136-Ball Micron NAND 168-ball LPDDR
Text: ­40°C to +85°C ­40°C to +85°C Mobile LPDDR2 PoP Density Bus Width RoHS Voltage Clock , 1.2V 1.2V 1.2V 1.2V 333­400 MHz 333­533 MHz 333­400 MHz 333­400 MHz 136-ball PoP 168-ball PoP 168-, 200-, 216-ball PoP 216-ball PoP ­40°C to +85°C ­40°C to +85°C ­40°C to +85°C ­40°C to +85°C Mobile LPDDR PoP Density Bus Width RoHS Voltage Clock Rate Package , MHz 167­200 MHz 152-ball PoP 152-, 168-ball PoP 152-, 168-ball PoP ­0°C to +70°C, ­40°C to


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2012 - Micron Technology

Abstract: No abstract text available
Text: low power, mobile or wireless DRAM (LPDDR, LPDDR2 , LPDDR3). Also defined by JEDEC standard , Feature Comparison Type LPDDR(1) LPDDR2 LPDDR3 DDR2 DDR3/DDR3L DDR4 Die Density , /ODT Package Options No/No POP , MCP, discrete No/No POP , MCP, discrete No/Yes POP , MCP , 128-512Mb 45-50ns 150-230mW LPDDR2 333-400 X16, x32 2.1 GB/s 667-1066Mb/s 2-8Gb , . | 19 Block Diagram Comparison DDR2, DDR3, LPDDR2 , LPDDR3 August 27, 2013 ©2012 Micron


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PDF 20Note/DRAM/TN4102 TN-41-04: TN-41-13: TN-46-02: TN-46-06: TN-46-11: TN-46-14: TN-47-19: TN-47-20: Micron Technology
W25R128FV

Abstract: W25Q128JV W25R128F W25Q128FV W25Q128F USON-8 W25Q80DL W978H6KB W25Q80BVSSIG
Text: PoP (SAC305) 333 / 400 MHz -40~85c / -40~105c 134 BGA (SAC305) 512Mb LPDDR2 (PKG) Part No , LPDDR 128Mb - 1Gb LPDDR2 256Mb - 2Gb X16 / X32 PSRAM 64Mb- 256Mb X16 Type , 60 BGA 8x9 JEDEC standard X32 90 BGA 8x13 JEDEC standard 168 PoP , _54BGA DDRx16_60BGA SDR/DDRx32_90BGA 9 mm 13 mm 8 mm 8 mm 9 mm 8 mm LPDDR2 _168WFBGA LPDDR2 _134 VFBGA 11.5 mm 10 mm 12 mm 12 mm Remark 擔當 創新 群效


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2012 - Marvell PXA2128

Abstract: ARMv7 MIPI Marvell h.264 Marvell android
Text: independent memory controllers ( LPDDR2 or DDR3/DDR3L). • Multiple power islands, dynamic voltage/frequency , supports a full complement of peripherals in discrete and PoP packages, including standard items such as , DIAGRAM Dual-channel 2x 32b LPDDR2 or DDR3 HDMI+PHY 1.3c+3D HDCP 2x MIPI DSI Gen 2 EPD , Peripherals Yes, Yes No, No 19x19 discrete, 0.65 mm pitch 12x12 PoP , 0.4 mm pitch 16x16 , $ USB3.0 Ss Device DDR3, LPDDR2 8x8 Matrix Keyboard 4x PWM Ethernet (10/100), USB3 OWSI


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PDF PXA2128 40-nanometer SoC-001 Marvell PXA2128 ARMv7 MIPI Marvell h.264 Marvell android
2012 - Avastar 88W8787

Abstract: Marvell PXA2128 marvell wtm 3 MIPI Marvell
Text: €¢ Dual-channel independent memory controllers ( LPDDR2 or DDR3/DDR3L). • Multiple power islands, dynamic , ARMADA PXA2128 supports a full complement of peripherals in discrete and PoP packages, including , COMPARISON BLOCK DIAGRAM Dual-channel 2x 32b LPDDR2 or DDR3 HDMI+PHY 1.3c+3D HDCP 2x MIPI DSI , 12x12 PoP , 0.4 mm pitch 16x16 discrete, Packages Software Enhancements for Hybrid-SMP, new , 466 Mtri/sec 1.4 Gpix/sec Graphics Video 32KB/32KB D$/I$ USB3.0 Ss Device DDR3, LPDDR2


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PDF PXA2128 40-nanometer SoC-001 Avastar 88W8787 Marvell PXA2128 marvell wtm 3 MIPI Marvell
2008 - lpddr2

Abstract: micron lpddr2 lpddr2 datasheet lpddr2 mcp LPDDR2 SDRAM micron LPDDR 8Gb lpddr Datasheet LPDDR2 SDRAM Datasheet LPDDR2 SDRAM micron LPDDR2 PoP
Text: life. 2. High Performance The industry's fastest Mobile LPDDR2 delivers max clock speeds of up to , (LPSDR) 128Mb to 8Gb (LPDDR) 512Mb to 4Gb ( LPDDR2 ) Provides flexibility for a variety of application designs Configurations x16, x32 (LPSDR and LPDDR) x32, x64 ( LPDDR2 ) Enables the use of fewer components to support wide-bus architectures Voltage 1.8V (LPSDR and LPDDR) 1.2V ( LPDDR2 ) Helps , (LPSDR) Up to 200 MHz (LPDDR) Up to 533 MHz ( LPDDR2 ) Provides performance comparable to SDR, DDR


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2012 - Not Available

Abstract: No abstract text available
Text: Product Brief – 121-Ball LPDDR2-PCM and LPDDR2 MCP Features Product Brief LPDDR2-PCM and Mobile LPDDR2 121-Ball MCP MT66R7072A10AB5ZZW.ZCA, MT66R7072A10ACUXZW.ZCA MT66R5072A10ACUXZW.ZFA Features Figure 1: MCP Block Diagram Micron® LPDDR2-PCM and LPDDR2 components RoHS-compliant, “green” package Shared LPDDR2-PCM and LPDDR2 interfaces Space-saving multichip package Ultra , Interface LPDDR2-PCM Specific Features LPDDR2 Power • Memory interface – 16-bit data bus width


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PDF 121-Ball MT66R7072A10AB5ZZW MT66R7072A10ACUXZW MT66R5072A10ACUXZW 16-bit 09005aef84e25954 121ball
2011 - MCIMX535

Abstract: MCIMX535DVV MCIMX535DVV1C IMX53CEC samsung eMMC 4.5 emmc pcb layout *IMX53 H.263 diode ssi L28 tepbga-2
Text: Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP , 0.4 mm pitch , high as 1.2 GHz and interfaces with DDR2/LVDDR2-800, LPDDR2 -800, or DDR3-800 DRAM memories. This device , Map . . . . . . . . . . . . . 166 6.3. 12 x 12 mm Package on Package ( PoP ) Information 170 Revision , memory devices, including DDR2, low voltage DDR2, LPDDR2 , DDR3, NOR Flash, PSRAM, cellular RAM, NAND , -2 12 x 12 mm PoP , 0.4 mm pitch BGA Case FC-PBGA Part numbers with a PC prefix indicate non


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PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 MCIMX535DVV MCIMX535DVV1C samsung eMMC 4.5 emmc pcb layout *IMX53 H.263 diode ssi L28 tepbga-2
2011 - eMMC "thermal impedance"

Abstract: PCIMX535DVV1C Samsung eMMC 4.41 diode 4.7-16 100KPD emmc pcb layout eMMC PoP 4.712 n78c 062N
Text: Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm Ordering Information See Table 1 , -800, LPDDR2 -800, or DDR3-800 DRAM memories. This device is suitable for applications such as the following: · , Map . . . . . . . . . . . . . 169 6.3. PoP 12 x 12 mm Package on Package ( PoP ) Information . . . . . . , DDR2, LPDDR2 , DDR3, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNANDTM, and managed , Case TEPBGA-2 12 x 12 mm PoP 12 x 12 mm PoP Part numbers with a PC prefix indicate non production


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PDF IMX53CEC MCIMX53xD MX53xD DDR2/LVDDR2-800, eMMC "thermal impedance" PCIMX535DVV1C Samsung eMMC 4.41 diode 4.7-16 100KPD emmc pcb layout eMMC PoP 4.712 n78c 062N
2012 - TC358764

Abstract: PMIC - LED Drivers
Text: -SDRAM (U1, PoP Memory) .43 1.6.2NAND Flash Memory (U4 , PMIC Power management IC PoE Power over Ethernet PoP Package on Package POR , optimized through the use of POP (package-on-package) memory. This generation of processors lets you , Instruments OMAP44xx microcontroller (BGA547 packaging and package-onpackage ( PoP ) memory) • Improved , €¢ PoP memory device with 512 MB (up to 1 GB) LP DDR2 SDRAM1 • 4 kB (up to 32 kB) I2C EEPROM1


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PDF phyCORE-OMAP44xx L-760e PCM-049-xxx PCM-959 PCM-959/phyCORE-OMAP44xx TC358764 PMIC - LED Drivers
2012 - SCIMX538DZK1C

Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP N7U2 samsung* lpddr2* pop package MCIMX535DVV AMBA AXI
Text: Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP , 0.4 mm pitch , high as 1.2 GHz and interfaces with DDR2/LVDDR2-800, LPDDR2 -800, or DDR3-800 DRAM memories. This device , Map . . . . . . . . . . . . . 166 6.3. 12 x 12 mm Package on Package ( PoP ) Information 170 Revision , memory devices, including DDR2, low voltage DDR2, LPDDR2 , DDR3, NOR Flash, PSRAM, cellular RAM, NAND , -2 12 x 12 mm PoP , 0.4 mm pitch BGA Case FC-PBGA Case TEPBGA-2 and FC-PBGA are RoHS compliant


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PDF IMX53CEC MCIMX53xD MX53xD SCIMX538DZK1C samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP N7U2 samsung* lpddr2* pop package MCIMX535DVV AMBA AXI
2011 - pin vga CRT pinout

Abstract: samsung* lpddr2 i.MX53 LPDDR2-800 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Text: Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm Ordering , with DDR2/LVDDR2-800, LPDDR2 -800, or DDR3-800 DRAM memories. This device is suitable for , . . . . . . 150 6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 169 6.3. PoP 12 x 12 mm Package on Package ( PoP ) Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , types of external memory devices, including DDR2, low voltage DDR2, LPDDR2 , DDR3, NOR Flash, PSRAM


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PDF IMX53CEC MCIMX53xD MX53xD pin vga CRT pinout samsung* lpddr2 i.MX53 LPDDR2-800 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
2013 - NT6TL128M32AQ-G1

Abstract: NT6TL256T32 NT6TL256T32AQ-G1 NT6TL128M32AQ-G0 NT6TL128M32 hynix lpddr2 NT6TL256 NT6TL128T64AR-G0 NT6TL128T64AR-G1I NT6TL256T32AQ-G2
Text: 0.65mm pitch -168-Ball PoP 12mm x 12mm 0.5mm pitch -216-Ball PoP 12mm x 12mm 0.4mm pitch -220-Ball PoP 14mm x 14mm 0.5mml pitch -240-Ball PoP 14mm x 14 mm 0.5mm pitch Timing ­ cycle time -1.875ns @ RL , NT6TL128T64A5-G0 NT6TL128T64A5-G1 NT6TL128T64A5-G2 220-Ball PoP 14mm x 14mm 0.5mml pitch 240-Ball PoP 8Gb 256M x 64 , NT6TL128T64AR-G2I 216-Ball PoP 12mm x 12mm 0.4mm pitch 1.875 2.5 3.0 1.875 1.875 2.5 3.0 168-Ball PoP 12mm x 12mm 0.5mm pitch 168-Ball PoP 12mm x 12mm 0.5mm pitch 216-Ball PoP 12mm x 12mm 0.4mm pitch 216-Ball PoP 12mm


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PDF NT6TL128M32AI /NT6TL256T32AQ NT6TL256T32AS/NT6TL128T64AR NT6TL128M32AQ-G1 NT6TL256T32 NT6TL256T32AQ-G1 NT6TL128M32AQ-G0 NT6TL128M32 hynix lpddr2 NT6TL256 NT6TL128T64AR-G0 NT6TL128T64AR-G1I NT6TL256T32AQ-G2
2012 - SCIMX

Abstract: No abstract text available
Text: Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP , 0.4 mm pitch , speeds as high as 1.2 GHz and interfaces with DDR2/LVDDR2-800, LPDDR2 -800, or DDR3-800 DRAM memories , . . . . . . . 166 6.3. 12 x 12 mm Package on Package ( PoP ) Information 170 Revision History . . . , many types of external memory devices, including DDR2, low voltage DDR2, LPDDR2 , DDR3, NOR Flash , set -20 to +85 12 x 12 mm PoP , 0.4 mm pitch BGA Case FC-PBGA 1 Case TEPBGA-2 and FC-PBGA


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PDF IMX53CEC MCIMX53xD MX53xD SCIMX
OMAP4430

Abstract: ELPIDA mobile dram LPDDR2 OMAP4 LPDDR2 SDRAM memory Elpida LPDDR2 Memory Texas Instruments Pandaboard lpddr2 pcb design EDB8064B1PB-8D-F Micron LPDDR2 lpddr2* schematic
Text: Processor and its POP LPDDR2 memory, the input clock circuitry, the TWL6030 Power Companion IC, and the , Connector (J18) HS-USB (USBA0) POP ­ LPDDR2 8 Gb/1GB Composite Video Header (J12) CLK32KG , processor supports two LPDDR2 channels, accessible only via a POP memory device soldered on the 216 , . An 8Gb/1GB POP LPDDR2 DRAM device (Elpida P/N EDB8064B1PB-8D-F) is provided on the PandaBoard. The , listing of the PandaBoard features. Feature Processor POP Memory PMIC Debug Support PCB Indicators HS


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PDF DOC-21010 595-PANDABOARD UEVM4430G-01-00-00 OMAP4430 ELPIDA mobile dram LPDDR2 OMAP4 LPDDR2 SDRAM memory Elpida LPDDR2 Memory Texas Instruments Pandaboard lpddr2 pcb design EDB8064B1PB-8D-F Micron LPDDR2 lpddr2* schematic
EDB8064B1PB-8D-F

Abstract: OMAP4430 micron lpddr2 smps repair circuit smps repair ELPIDA mobile dram LPDDR2 LPDDR2 SDRAM memory OMAP4 Elpida LPDDR2 Memory EDB8064
Text: (Phoenix) Power Management Companion Device TWL6040 (Phoenix) Audio Companion Device POP Mobile LPDDR2 , OMAP4430 Processor and its POP LPDDR2 memory, the input clock circuitry, the TWL6030 Power Companion IC , ) Mini-AB USB Connector (J18) SDMMC1 HS-USB (USBA0) Composite Video Header (J12) POP ­ LPDDR2 , feedthroughs to the top POP footprint on the OMAP package, where they directly connect to the LPDDR2 VDD2 , OMAP4430 processor supports two LPDDR2 channels, accessible only via a POP memory device soldered on the


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PDF DOC-21010 EDB8064B1PB-8D-F OMAP4430 micron lpddr2 smps repair circuit smps repair ELPIDA mobile dram LPDDR2 LPDDR2 SDRAM memory OMAP4 Elpida LPDDR2 Memory EDB8064
JESD209-2E

Abstract: MSO UPGRADE PACKAGE
Text: MSO72004 with DPOJET Jitter and Eye Diagram Analysis (Opt. DJA) LPDDR2 BGA and PoP Interposers , , BGA interposers and MSO interposers LPDDR, LPDDR2 , LPDDR3 GDDR3, GDDR5 Datasheet DDRA , -4 LPDDR JESD209A LPDDR2 JESD209-2E LPDDR3 JESD209-3 Memory interface analysis in DPOJET , . P7500 Trimode Probeing System with accessories LPDDR2 component package on package interposer 4 , and PoP Interposers GDDR5 Solder Down and Socketed Interposers Tektronix is registered to ISO


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PDF MSO5000 MSO70000 DSO/MSO5000, DPO7000 DPO/DSA/MSO70000 5W-22329-8 JESD209-2E MSO UPGRADE PACKAGE
2012 - K4H511638JLCCC

Abstract: K9HFGY8S5A-HCK0 K4X2G323PD8GD8 samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 k4x2g323pd KLMAG2GE4A K4G10325FG-HC03 gddr5 samsung
Text: ES  1CH x32 LPDDR2 K4P8G304EC-AG(2) 168-FBGA, 12x12 PoP , DDP, 128x16*4 1.2V ES  , €¢ eMMC + LPDDR2 • eMMC + MDDR storage Pages 18–19 samsung.com/greenmemory • Solid , , 2CKE) K4X4G303PD-AGD8 168-FBGA, 12x12 PoP , DDP . 800MHz 1.8V Now 2Gb 1CH x32 K4P2G324ED-AG(1) 168-FBGA, 12x12 PoP , MONO, 1.2V Now 1CH x32 K4P4G324EB-AG(1,2) 168-FBGA, 12x12 PoP , MONO, 128Mx32 1.2V Now 1CH x32 K4P4G324EC-AG(2) 168-FBGA, 12x12 PoP , MONO


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PDF BR-12-ALL-001 K4H511638JLCCC K9HFGY8S5A-HCK0 K4X2G323PD8GD8 samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 k4x2g323pd KLMAG2GE4A K4G10325FG-HC03 gddr5 samsung
2011 - MCIMX535

Abstract: emmc DDR3 pcb layout SCIMX samsung eMMC 5.0 i.mx53 samsung NAND Flash DIE emmc Pin assignment eMMC rja rjc eMMC 4.4 samsung eMMC 4.5
Text: Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP , 0.4 mm pitch , , which operates at clock speeds as high as 1.2 GHz. It provides DDR2/LVDDR2-800, LPDDR2 -800, or DDR3 , ( PoP ) Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 Revision History . . . . , , low voltage DDR2, LPDDR2 , DDR3, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNANDTM , , Video IP Phone, Connected TV, Telehealth, Digital Signage 1­1.2 GHz ARM CortexTM-A8 2 GB, x32 LPDDR2


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PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 emmc DDR3 pcb layout SCIMX samsung eMMC 5.0 i.mx53 samsung NAND Flash DIE emmc Pin assignment eMMC rja rjc eMMC 4.4 samsung eMMC 4.5
All Type Of IC Pin Diagram Manual

Abstract: No abstract text available
Text: Device TWL6040 (Phoenix) Audio Companion Device POP Mobile LPDDR2 SDRAM Memory HDMI Connector (Type A , POP LPDDR2 memory, the input clock circuitry, the TWL6030 Power Companion IC, and the TWL6040 Audio , Connector (J18) SDMMC1 HS-USB (USBA0) Composite Video Header (J12) POP – LPDDR2 8 Gb/1GB , feedthroughs to the top POP footprint on the OMAP package, where they directly connect to the LPDDR2 VDD2 , Volatile Memory The OMAP4430 processor supports two LPDDR2 channels, accessible only via a POP memory


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PDF DOC-21010 All Type Of IC Pin Diagram Manual
2013 - NT6TL256T32AQ

Abstract: NT6TL128M32AI hynix lpddr2 NT6TL128M32AQ-G1 LPDDR2 1Gb Memory Hynix 4Gb LPDDR2 NT6TL128M32 NT6TL128M32AQ-G0 NT6TL256T32AQ-G1 Elpida LPDDR2 Memory
Text: 0.65mm pitch -168-Ball PoP 12mm x 12mm 0.5mm pitch -216-Ball PoP 12mm x 12mm 0.4mm pitch -220-Ball PoP 14mm x 14mm 0.5mml pitch -240-Ball PoP 14mm x 14 mm 0.5mm pitch Timing ­ cycle time -1.875ns @ RL , NT6TL128T64A5-G0 NT6TL128T64A5-G1 NT6TL128T64A5-G2 220-Ball PoP 14mm x 14mm 0.5mml pitch 240-Ball PoP 8Gb 256M x 64 , NT6TL128T64AR-G2I 216-Ball PoP 12mm x 12mm 0.4mm pitch 1.875 2.5 3.0 1.875 1.875 2.5 3.0 168-Ball PoP 12mm x 12mm 0.5mm pitch 168-Ball PoP 12mm x 12mm 0.5mm pitch 216-Ball PoP 12mm x 12mm 0.4mm pitch 216-Ball PoP 12mm


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PDF NT6TL128M32AI /NT6TL256T32AQ NT6TL256T32AS/NT6TL128T64AR NT6TL256T32AQ hynix lpddr2 NT6TL128M32AQ-G1 LPDDR2 1Gb Memory Hynix 4Gb LPDDR2 NT6TL128M32 NT6TL128M32AQ-G0 NT6TL256T32AQ-G1 Elpida LPDDR2 Memory
2012 - lpddr2 spec

Abstract: tablet mid H 204 TK1 samsung eMMC 5.1 emmc 4.5 samsung MCIMX535DVV1C emmc DDR3 pcb layout MLC nand 2012 SAMSUNG RF MODULATORS SCIMX
Text: Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP , 0.4 mm pitch , , which operates at clock speeds as high as 1.2 GHz. It provides DDR2/LVDDR2-800, LPDDR2 -800, or DDR3 , ( PoP ) Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 Revision History . . . . , DDR2, LPDDR2 , DDR3, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNANDTM, and managed , , Telehealth, Digital Signage 1­1.2 GHz ARM CortexTM-A8 2 GB, x32 LPDDR2 /DDR2/DDR3 Hardware (1080p30) Hardware


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PDF IMX53CEC MCIMX53xD MX53xD lpddr2 spec tablet mid H 204 TK1 samsung eMMC 5.1 emmc 4.5 samsung MCIMX535DVV1C emmc DDR3 pcb layout MLC nand 2012 SAMSUNG RF MODULATORS SCIMX
2004 - Elpida LPDDR2 Memory

Abstract: lpddr2 datasheet elpida lpddr2 lpddr2 ELPIDA mobile dram LPDDR2 ddr2 ram Jedec lpddr2 lpddr2 mcp ELPIDA mobile DDR LPDDR2 1Gb Memory
Text: the JEDEC LPDDR2 specification. Including the DRAM core operates at 1.2V versus 1.8V for DDR Mobile , Approach +85°C Operating temperature Flexible Response to SiP, MCP and PoP Elpida has focused , Chip Packages (MCPs). Elpida also developed a new packaging technology PoP called " PoP


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PDF E0566E80 Elpida LPDDR2 Memory lpddr2 datasheet elpida lpddr2 lpddr2 ELPIDA mobile dram LPDDR2 ddr2 ram Jedec lpddr2 lpddr2 mcp ELPIDA mobile DDR LPDDR2 1Gb Memory
2012 - samsung ddr3 ram MTBF

Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 k4B2G1646 KLMAG KLMAG2GE4A-A001 K4B2G0446 klm8g KLM8G2FE3B-B001 K4H561638N
Text: 6Gb 1.2V 216-FBGA, 12x12 PoP , DDP, 64Mx32*2 2CH x32/ch LPDDR2 168-FBGA, 12x12 PoP , MONO , €¢ NAND + MDDR • moviNAND + LPDDR2 • NOR + UtRAM storage Pages 18-19 samsung.com , -FBGA 1.8V ES Q1'12, CS in Q2'12 x32 (2CS, 2CKE) K4X4G303PC-AG(1) 168-FBGA, 12x12 PoP , DDP 1.8V Now x32 (2CS, 2CKE) K4X4G303PC-7G(1) 240-FBGA, 14x14 PoP , DDP 1.8V Now 1CH x32 K4P2G324EC-AG(1) 168-FBGA, 12x12 PoP , MONO, 1.2V EOL by end of 2012. (LBO '12 June


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PDF BR-12-ALL-001 samsung ddr3 ram MTBF KLM2G1HE3F-B001 KLM4G1FE3B-B001 k4B2G1646 KLMAG KLMAG2GE4A-A001 K4B2G0446 klm8g KLM8G2FE3B-B001 K4H561638N
Texas Instruments Pandaboard

Abstract: tv smps power supply repair omap4430 OMAP4460 EDB8064B1PB-8D-F usb3320c EDB8064 smps repair Chip level TIWI-R2 smps repair circuit
Text: Companion Device TWL6040 (Phoenix) Audio Companion Device TPS62361 Switching Power Supply POP Mobile LPDDR2 , include the OMAP4460 Processor and its POP LPDDR2 memory, the input clock circuitry, the TWL6030 Power , Expansion Connector (J7) Mini-AB USB Connector (J18) HS-USB (USBA0) POP ­ LPDDR2 8 Gb/1GB SDMMC2 , interfaces of the OMAP4460 die. The base address for the LPDDR2 is 0x8000 0000. An 8Gb/1GB POP LPDDR2 DRAM , /functionality. See Table 1 for a listing of the Pandaboard ES features. Feature Processor POP Memory PMIC


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PDF OMAP4460 DOC-21054 595-PANDABOARD-ES UEVM4460G-02-01-00 Texas Instruments Pandaboard tv smps power supply repair omap4430 EDB8064B1PB-8D-F usb3320c EDB8064 smps repair Chip level TIWI-R2 smps repair circuit
Supplyframe Tracking Pixel