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LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA
LTM4601IV-1#2DMPBF Linear Technology IC DC/DC UMODULE 12A 118-LGA
LTM4605EV#3CNPBF Linear Technology IC DC/DC UMODULE 5A 141-LGA
LTM9004IV-AB#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C
LTM4600IV#2DHPBF Linear Technology LTM4600 - 10A High Efficiency DC/DC µModule; Package: LGA; Pins: 104; Temperature: Industrial
LTM9004IV-AC#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C

LGA-28 land pattern Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2010 - 200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and , Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These drawings conform with the Surface Mount Design and Land Pattern Standard (IPC-SM , the land pattern drawings in this document together with their respective Figure numbers. These , heat path for thermal performance of amplifier products. Table 1. PCB Land Pattern Drawings


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PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
2013 - Si8235-BA-C-IS1

Abstract: LGA 32 land pattern silicon labs Si8233 SI8233-B-IM SI823 si8230 SI8238AB-C-IS1 E257455 LGA PACKAGE thermal resistance Si8237BBBIS1
Text: . . . . . . . . . . . . . . 43 8. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern : 16-Pin Narrow , 12. Land Pattern : 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .50 14. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . 28 4. Applications . . . . . . . . . . . . . . . . . .


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PDF Si823x Si8230/1/2/7 SOIC-16 Si8233/4/5/6/8 LGA-14 Si8235-BA-C-IS1 LGA 32 land pattern silicon labs Si8233 SI8233-B-IM SI823 si8230 SI8238AB-C-IS1 E257455 LGA PACKAGE thermal resistance Si8237BBBIS1
2014 - Si8237/8

Abstract: SI8233BD
Text: . . 43 8. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern : 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12. Land Pattern : 14 , . . . .50 14. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . 28 4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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PDF Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16 Si8237/8 SI8233BD
2014 - Not Available

Abstract: No abstract text available
Text: . . 43 8. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern : 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12. Land Pattern : 14 , . . . .50 14. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . 28 4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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PDF Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16
2010 - LGA land pattern

Abstract: WBSOIC-16 SI823 SI8233BD-C-IS Si8233 SI8235BB-C-IS1 SI8234-B-IS SI8234BB-C-IS1 Si823x si8235
Text: . . . . . . . . . . . 40 10. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 12. Land Pattern : 16-Pin Narrow Body , . Land Pattern : 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . .46 16. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6.1. High-Side


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PDF Si823x Si8230/1/2 SOIC-16 Si8233/4/5/6 LGA-14 SOIC-16 LGA land pattern WBSOIC-16 SI823 SI8233BD-C-IS Si8233 SI8235BB-C-IS1 SI8234-B-IS SI8234BB-C-IS1 Si823x si8235
2011 - SI8233BD-C-IS

Abstract: SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A
Text: . . . . . . . . . . . . . . 39 8. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 10. Land Pattern : 16-Pin Narrow , 12. Land Pattern : 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .45 14. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.1


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PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8233BD-C-IS SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A
2011 - LGA land pattern

Abstract: LH2015 SI8233AB-C-IS1 si8233 LGA-14 SI8235BB-C-IS1 WBSOIC-16 Si8233BB-C-IS Si8232 SI8233AD-C-IS
Text: . . 39 8. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 41 10. Land Pattern : 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 12. Land Pattern : 14 , . . . .45 14. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.1. High-Side/Low-Side Driver . . . . .


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PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 SOIC-16 LGA-14 LGA land pattern LH2015 SI8233AB-C-IS1 si8233 LGA-14 SI8235BB-C-IS1 WBSOIC-16 Si8233BB-C-IS Si8232 SI8233AD-C-IS
2012 - Si8233

Abstract: LGA-24 land pattern LGA PACKAGE thermal resistance
Text: . . . . . . . . . . . . . . 41 8. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 10. Land Pattern : 16-Pin Narrow , 12. Land Pattern : 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .48 14. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , 2.25 2 10 15 20 25 VDD=12V, Vout=VDD-5V Supply Voltage (V) Figure 28 . Propagation Delay vs. Load


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PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 Si8233 LGA-24 land pattern LGA PACKAGE thermal resistance
2010 - Si8233BB-C-IS

Abstract: LGA land pattern Si8230 SI8233BD-C-IS SI8234-B-IM mosfet igbt drivers theory Si823x solar inverters circuit diagram SI8234 si8233-b-is
Text: . . . . . . . . . . . . . . . . . . . . . . . . .40 11. Land Pattern : Wide-Body SOIC . . . . . . . , . Land Pattern : Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . 45 15. Land Pattern : 14 LD LGA . . . . . . . . . . . . . . . . . . . . , Thermal Pad (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . .48 17. Land Pattern : 14 LD LGA with , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6.1. RF, Magnetic, and


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PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 Si8233BB-C-IS LGA land pattern Si8230 SI8233BD-C-IS SI8234-B-IM mosfet igbt drivers theory Si823x solar inverters circuit diagram SI8234 si8233-b-is
2012 - SI8235

Abstract: Si8233 high side IGBT driver si8236 LGA-145 si8235bd-c-is si8231bb-b SI8234AB-C-IS1 LGA 32 land pattern SOIC127P600
Text: . . . . . . . . . . . . . . 41 8. Land Pattern : 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 10. Land Pattern : 16-Pin Narrow , 12. Land Pattern : 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .48 14. Land Pattern : 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , 2.75 2.5 2.25 2 10 15 20 25 Supply Voltage (V) VDD=12V, Vout=VDD-5V Figure 28 . Propagation Delay vs


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PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8235 Si8233 high side IGBT driver si8236 LGA-145 si8235bd-c-is si8231bb-b SI8234AB-C-IS1 LGA 32 land pattern SOIC127P600
2008 - AN3484

Abstract: MMA73x1L LGA land pattern MMA745xL LGA14
Text: recommended PCB land pattern for the package. 1 13 10x0.8 6x2 6 8 14x0.6 12x1 14x0.9 Figure 2. Recommended PCB Land Pattern for the 5 x 3 mm LGA Package OVERVIEW OF SOLDERING , pattern - 0.5 mm 0.8 mm Wider trace Cu: 0.9 x 0.6 mm sq. SM opening = PCB land pad + 0.1mm = , digital output accelerometer use the Land Grid Array (LGA) package platform. This application note , land should be designed with Non Solder Mask Defined (NSMD) as shown in Figure 5. 2. No additional


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PDF AN3484 MMA73x1L MMA745xL AN3484 LGA land pattern LGA14
1993 - pcb design of zigbee

Abstract: FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
Text: Lead (QFN32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71-Contact Land , . . . 99-Contact Land Grid Array (LGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . 2-1 2-3 2-4 2-5 2-6 2-7 2-8 Chapter 3 71 , Group LGA Land Grid Array MAC Media Access Controller MCU Microcontroller Unit NEXUS An embedded , -Contact Land Grid Array (LGA) The Land Grid Array (LGA) package is a standard flip-chip Ball Grid Array (BGA


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PDF CH370 pcb design of zigbee FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
Text: be an identical mirror image of the bottom pattern of the IR devices, see Figure 8. The land size on , Rectifier Introduction IR BGA (Ball Grid Array) and LGA ( Land Grid Array) devices are high performance , recommendations for using IR BGA devices. When using IR LGA devices, if vias are not in land pads (see Figure 4 , reference Figure 5 for different via types. If it is desired to place vias in land pads (see Figure 6 , thickness, and a via capture land of 0.64mm diameter (see Figure 5). 1.0 PCB Layout Design A


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PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
2012 - Not Available

Abstract: No abstract text available
Text: openings should be an identical mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land . The next figure shows an example of a 2x2 LGA part in a , to provide information about Kionix’s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , generate much heat. Therefore, only electrical vias are needed. If vias are not in the land pads, capped


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PDF 20-April-2012
2008 - ST LGA marking code

Abstract: No abstract text available
Text: to provide information about Kionix’s 3 x 5 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , lands. These openings should be an identical mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land . The pin 1 indicator triangle that is exposed , are needed. If vias are not in the land pads, capped, plugged, tented, un-capped or un-plugged vias


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PDF 03-July-2008 ST LGA marking code
2001 - MARKING T6C

Abstract: lga 1155 package Code T6S QFN-36 LAND PATTERN M33 TRANSISTOR 14SSOP QFN-52 nec 44pin marking 6-PIN PLASTIC TSON 36pin qfn
Text: (4.5 × 2.5 × 1.5) Package Code NE Package Name Drawings IC Package Land Pattern , 1.5) Package Name IC Drawings Package Land Pattern 4MM 39 4-Pin Minimold (39 , Land Pattern 6MM T 6-Pin Minimold 6MM TA Note T 6-Pin Minimold 6-Pin Super , View) (Bottom View) Package Name Drawings IC Package Land Pattern 8SOP G, GR , Land Pattern 12QFN T5F 12-Pin Plastic QFN 12TQFN T5J 12-Pin Plastic TQFN 12TSQFN


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PDF PX10051EJ35V0TN G0706 MARKING T6C lga 1155 package Code T6S QFN-36 LAND PATTERN M33 TRANSISTOR 14SSOP QFN-52 nec 44pin marking 6-PIN PLASTIC TSON 36pin qfn
2008 - Not Available

Abstract: No abstract text available
Text: mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land . The pin 1 indicator triangle that is exposed on the LGA substrate does not need to be , to provide information about Kionix’s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , needed. If vias are not in the land pads, capped, plugged, tented, un-capped or un-plugged vias can be


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PDF 03-July-08
2009 - LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control "BGA Rework Practices", AN1902 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework 221-O
Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land , considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF , Electrostatic Discharge High Coefficient of Thermal Expansion High Density Interconnect Land Grid Array Low , Surface Mount Technology Land Grid Array (LGA) Package Rework Application Note, Rev. 1.0 2 , . Land Grid Array (LGA) Package Rework Application Note, Rev. 1.0 Freescale Semiconductor 3 What


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PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control "BGA Rework Practices", AN1902 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework 221-O
2006 - LGA16 footprint

Abstract: TN0018 lga16 land pattern LGA16 L footprint lga16 land LGA14 JESD97 ST LGA-16 LGA16 LGA voiding
Text: paste can be dispensed on the board with a screen printing method through a stencil. The pattern of the , TN0018 PCB Design Guidelines PCB land and solder masking general recommendations are shown in Figure , open solder mask external to PCB land ; Pin #1 indicator is electrically connected to pin 1. Leave pin 1 indicator unconnected during soldering. PCB design rules Figure 1. Recommended land and solder mask design for LGA packages. Package footprint Solder mask opening external to land footprint


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PDF TN0018 LGA16 footprint TN0018 lga16 land pattern LGA16 L footprint lga16 land LGA14 JESD97 ST LGA-16 LGA16 LGA voiding
Not Available

Abstract: No abstract text available
Text: measurements. When mounted on the recommended land pattern , the cutoff frequency will shift down. Consult our , . When mounted on the recommended land pattern , the cutoff frequency will shift down. Consult our Sales , € E0 = 14.0GHz ï‚·ï€ F0 = 15.0GHz * Please call the factory for DXF output of Land Pattern The , Ground-Signal-Ground probe measurements. When mounted on the recommended land pattern , the cutoff frequency will shift , € ï‚·ï€ Cutoff frequencies between 8.0GHz and 15.0GHz* Low pass Absorptive Land Grid Array (LGA


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PDF FL02M651
2013 - Not Available

Abstract: No abstract text available
Text: mounted on the recommended land pattern , the cutoff frequency will shift down. Consult our Sales , . When mounted on the recommended land pattern , the cutoff frequency will shift down. Consult our Sales , Marking and Recommended Land Pattern : Marking: Marking Explanation: ï‚·ï€ Pin A1 Identifier ï‚·ï€ Two digit code representing Recommended Land Pattern : the cutoff frequency as listed below , output of Land Pattern The cutoff frequency, part numbering and product marking which list the cutoff


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PDF FL02M651
T5500

Abstract: thin film filter
Text: ) 625-8445 / www.thin-film.com FL02M651.03 - Page 3 of 3 Marking and Recommended Land Pattern : Marking: Marking Explanation: Pin A1 Identifier Recommended Land Pattern : Two digit code representing , processing Features: Cutoff frequencies between 8.0GHz and 15.0GHz Low pass Absorptive Land Grid Array (LGA) for high bandwidth Competitive pricing Description: Thin Film Technology FL7, Land Grid , 12.0GHz D0 = 13.0GHz E0 = 14.0GHz F0 = 15.0GHz Please call the factory for DXF output of Land


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PDF FL02M651 T5500 thin film filter
2012 - land pattern 0805

Abstract: T5500
Text: . Product Dimensions: Marking and Recommended Land Pattern : Marking: Marking Explanation: Pin A1 Identifier determined Recommended Land Pattern : Remaining marking to be Please call the factory for DXF output of Land Pattern Part Numbering: Ex. FL5B5BZ230S-T*-C Product Designator Orders Type , , Absorptive Land Grid Array (LGA) for high bandwidth Competitive pricing Description: Thin Film Technology FL5, Land Grid Array (LGA) series of low pass filters are designed for cost effective use in


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PDF FL02M653 -10dB 100mA 100Mohm 50Vdc land pattern 0805 T5500
2008 - lga16 land pattern

Abstract: LGA16 footprint TN0018 LGA 16L LGA16 L footprint 4x4x1 ST LGA-16 LGA16 LGA land pattern LGA14
Text: the board with a screen printing method through a stencil. The pattern of the soldering paste on the , design guidelines PCB land and solder masking general recommendations are shown in Figure 1. Refer to , recommended to open solder mask external to PCB land ; Pin #1 indicator must be left unconnected to ensure proper device functionality. PCB design rules Figure 1. Recommended land and solder mask design for LGA packages Package footprint Solder mask opening external to land footprint: suggested to


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PDF TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L LGA16 L footprint 4x4x1 ST LGA-16 LGA16 LGA land pattern LGA14
2007 - MMA7450L

Abstract: MMA73x0L MMA7450LR1 MMA7450LR2 MMA7450LT Introduction to accelerometers
Text: PCB land pattern for the package. 1 13 10x0.8 6x2 Bottom View 6 8 14x0.6 12x1 14x0.9 14 LEAD LGA CASE 1881-04 Figure 19. Recommended PCB Land Pattern for the 5 x 3 mm LGA , recommended. Via structure under Figure 20. Incorrect PCB Top Metal Pattern Under Package 3. PCB land , continued after these. PCB land pattern - 0.5 mm 0.8 mm Wider trace Cu: 0.9 x 0.6 mm sq. SM , Standby Operation Mode Enable Bus Mode Symbol Min Typ Max Unit AVDD AVDD 2.4 2.8


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PDF MMA7450L MMA7450L MMA73x0L MMA7450LR1 MMA7450LR2 MMA7450LT Introduction to accelerometers
Supplyframe Tracking Pixel