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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC1155IS8#TR Linear Technology LTC1155 - Dual High Side Micropower MOSFET Driver; Package: SO; Pins: 8; Temperature Range: -40°C to 85°C
LTC1155CN8#PBF Linear Technology LTC1155 - Dual High Side Micropower MOSFET Driver; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LTC1155CS8#TRPBF Linear Technology LTC1155 - Dual High Side Micropower MOSFET Driver; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LTC1155CN8 Linear Technology LTC1155 - Dual High Side Micropower MOSFET Driver; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LTC1155CS8#PBF Linear Technology LTC1155 - Dual High Side Micropower MOSFET Driver; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LTC1155IS8#TRPBF Linear Technology LTC1155 - Dual High Side Micropower MOSFET Driver; Package: SO; Pins: 8; Temperature Range: -40°C to 85°C

LGA 1155 PIN diagram Datasheets Context Search

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LGA 1155 Socket PIN diagram

Abstract: LGA 1155 PIN diagram 1155 lga socket core i7 2600 INTEL CORE I3 2120 Nuvoton nct6776f intel LGA 1155 PIN diagram 1960047831N001 NCT6776 LGA 1155 PIN
Text: III Features LGA 1155 Intel® CoreTM i7/i5/i3/Xeon® processors Dual Channel (ECC) DDR3 1333 MHz up , Intel LGA 1155 Sandy Bridge Processors Channel B (ECC) DDR3 1066/1333 DVI TI SN75DP139R GZR , WG2 version Socket Two 240- pin DDR3 memory sockets Onboard Intel HD Graphics Graphics VRAM 1 GB maximum shared memory with 2 GB and above system memory installed Video Output 15 pin VGA D-sub connector x1/onboard DVI pin header x 1 (Default on QG2 and WG2, optional on QVG) Interface 10/100/1000 Mbps


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PDF PCE-5126 Q67/B65/C206 1333MHz LGA1155 PCA-TPM-00A1E 1960047831N001 PCE-5126 PCE-5126. LGA 1155 Socket PIN diagram LGA 1155 PIN diagram 1155 lga socket core i7 2600 INTEL CORE I3 2120 Nuvoton nct6776f intel LGA 1155 PIN diagram NCT6776 LGA 1155 PIN
2011 - WPCM450RA0BX

Abstract: WPCM450 intel i5 lga 1155 socket PWS-1K62P-1R nuvoton TPM WPCM450R 1155 lga socket Matrox g200eW SC938
Text: -1200 family; socket H2 ( LGA 1155 ) 2. 2x 3.5" Hot-swap SATA3 (6 Gbps) 3. 1x (x8) PCI - E 2.0 low-profile slot 4 , processors Socket H2 ( LGA 1155 ) MBD -X9SCD -F * SYS-5037MC -H8TRF ( Black) Chassis Form Factor Model , Memory Type DIMM Sizes Memory Voltage Error Detection 4x 240- pin DDR3 DIMM sockets Supports up to 32 GB DDR3 ECC Un Buffered memory (UDIMM) 1333/1066MHz ECC DDR3, 240 - pin gold-plated DIMMs 8GB, 4GB, 2GB


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PDF 5037MC-H8TRF 5037MC-H8TRF] E3-1200 1333/1066MHz 82580DB 80Plus C202/C204 G200eW. WPCM450RA0BX WPCM450 intel i5 lga 1155 socket PWS-1K62P-1R nuvoton TPM WPCM450R 1155 lga socket Matrox g200eW SC938
LGA+1155+Socket+PIN+diagram

Abstract: 1155 lga socket
Text: 1 155 H2 1 © LGA TY Foxconn USE) S O C K E T OF 1155 SOCKET PART N O . , , R.O.C. T IT LE : FOR C U S TO M E R DRAWING LGA SOCKET DWG N°- : Mac Peng Ter ry L i u 06/10'11 1155 H2 5 5 1 - 0 0 0 0 - 1 122 SCALE vl3 SHEET REV . 2/1 1


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PDF BC-11-0035559 BC-11-0054449 LGA+1155+Socket+PIN+diagram 1155 lga socket
LGA1156

Abstract: lga 1155 LGA weight lga1155
Text: This document was generated on 08/08/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 47596-8830 Active LGA 1155 and LGA 1156 Back-plate Assembly, Shoulder Screw and 2 Pan Screws for Desktop PC, Lead-Free, Halogen-Free Documents: 3D Model Drawing (PDF) Product Specification PS-47596-001 (PDF) RoHS Certificate of Compliance (PDF) Series Processor Sockets 47596 Back Plate Assembly LGA1156 884982116177 image - Reference only EU RoHS ELV and RoHS Compliant


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PDF PS-47596-001 LGA1156 47596Series PS-47596-001 SD-47596-107 lga 1155 LGA weight lga1155
lga 1155

Abstract: nehalem LGA1156 lga1155 LGA+1155+Socket+PIN+diagram
Text: This document was generated on 01/25/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0475968813 Active LGA 1155 and LGA 1156 Back-plate Assembly for Desktop PC, without Screws, LeadFree, Halogen-Free Documents: 3D Model Drawing (PDF) Product Specification PS-47596-001 (PDF) RoHS Certificate of Compliance (PDF) Series Processor Sockets 47596 Back Plate Assembly LGA1156 image - Reference only EU RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No


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PDF PS-47596-001 LGA1156 PS-47596-001 SD-47596-004 47596Series lga 1155 nehalem lga1155 LGA+1155+Socket+PIN+diagram
lga 1155

Abstract: LGA1155 LGA1156 Intel lga 1156
Text: This document was generated on 06/08/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 47596-8814 Active LGA 1155 and LGA 1156 Assembly without ILM Cover, Back-plate Assembly for Desktop PC, Shepherd Hook Lever, Lead-Free, Halogen-Free Documents: 3D Model Drawing (PDF) Product Specification PS-47596-001 (PDF) RoHS Certificate of Compliance (PDF) Series Processor Sockets 47596 Back Plate, ILM Assembly LGA1156 image - Reference only EU RoHS ELV and


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PDF PS-47596-001 LGA1156 PS-47596-001 SD-47596-105, SD-47596-936 47596Series lga 1155 LGA1155 Intel lga 1156
2007 - LGA 1155 PIN diagram

Abstract: LGA 1155 pin out 1155 lga socket pins LGA 775 Socket PIN diagram LGA 1155 Socket PIN diagram 1155 lga socket lga 1155 socket lga 1155 pinout lga 1155 socket QFN tray qfn 4x4
Text: device is housed in a low profile 4x4 mm, 16- pin , flip-chip LGA or a 3x3 mm 16 pin QFN package , 0.50 4.00 BSC 4.00 BSC 1.00 BSC 0.50 BSC NBSG86A PACKAGE DIMENSIONS 16 PIN LGA , 4x4x0.96 , SEL 3 10 Q VTSEL C 4 9 VCC VTD0 5 Figure 1. BGA-16 and LGA -16 Pinout , . Pin Description Pin BGA QFN Name I/O C2 1 OLS (Note 3) Input C1 2 SEL , VTSEL - Common Internal 50 W Termination Pin for SEL/SEL. See Table 7. (Note 1) A1 5 VTD1


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PDF NBSG86A NBSG86A 16-pin, NBSG86A/D LGA 1155 PIN diagram LGA 1155 pin out 1155 lga socket pins LGA 775 Socket PIN diagram LGA 1155 Socket PIN diagram 1155 lga socket lga 1155 socket lga 1155 pinout lga 1155 socket QFN tray qfn 4x4
2008 - Not Available

Abstract: No abstract text available
Text: millimeters and angles are in degrees. Figure 2. 8- pin 3 x 3 mm LGA package outline diagram with dimensions. © Kionix 2008 03-July-08 Page 2 of 2 Figure 3. 10- pin 3 x 3 mm LGA package outline diagram , device land. The pin 1 indicator triangle that is exposed on the LGA substrate does not need to be , 1.20 0.65 Note: All units in mm Figure 5. Example of a 10- pin 3 x 3 mm LGA solder stencil , 3x3 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended


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PDF 03-July-08
2006 - DS4077L-CC0

Abstract: l949a
Text: continued at end of data sheet. Pin Configuration TOP VIEW N.C. 9 N.C. 8 N.C. 7 Block Diagram VDD , LGA ;9 pin ;126 mm 0C to +70C Dwg: 56-G6034-001A1 (PDF) Use pkgcode/variation: L949A-1* DS4077L-ADN LGA ;9 pin ;126 mm -40C to +85C RoHS/Lead-Free: See data sheet Dwg: 56-G6034-001A1 (PDF) Use pkgcode/variation: L949A-1* LGA ;9 pin ;126 mm -40C to +85C RoHS/Lead-Free: No Dwg: 56-G6034-001A1 (PDF) Use pkgcode/variation: L949A-1* LGA ;9 pin ;126 mm 0C to +70C Dwg: 56-G6034-001A1 (PDF) Use pkgcode/variation: L949A


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PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz DS4077L-CC0 l949a
2007 - lga 1155

Abstract: 1155 lga socket LGA 1155 PIN diagram LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram NBSG53AMA1TBG lga 1155 socket LGA16 3x3 footprint 1155 lga socket pins 04/LGA 1150 Socket PIN diagram
Text: products. A strappable control pin is provided to select between the two functions. The device is housed in a low profile 4x4 mm 16- pin Flip-Chip LGA (FCLGA) or a 3x3 mm 16 pin QFN package. The NBSG53A is , NBSG53A PACKAGE DIMENSIONS 16 PIN LGA , 4x4x0.96 CASE 526AB-01 ISSUE B NOTES: 1. DIMENSIONING AND , edge triggered device. http://onsemi.com MARKING DIAGRAM * SG 53A LYW FCBGA-16 BA SUFFIX , Figure 1. BGA-16 and LGA -16 Pinout (Top View) 6 7 8 VTD D D VTD Figure 2. QFN


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PDF NBSG53A NBSG53A 16-pin NBSG53A/D lga 1155 1155 lga socket LGA 1155 PIN diagram LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram NBSG53AMA1TBG lga 1155 socket LGA16 3x3 footprint 1155 lga socket pins 04/LGA 1150 Socket PIN diagram
2007 - LGA 1150 Socket PIN diagram

Abstract: LGA 1155 Socket PIN diagram 04/LGA 1150 Socket PIN diagram 16 pins qfn 3x3 footprint LGA-16 3x3 socket lga 1155 pinout lga 1155 socket 1155 lga socket pins LGA16 3x3 footprint
Text: . A strappable control pin is provided to select between the two functions. The device is housed in a low profile 4x4 mm 16- pin Flip-Chip LGA (FCLGA) or a 3x3 mm 16 pin QFN package. The NBSG53A is a , . BGA-16 and LGA -16 Pinout (Top View) Table 1. Pin Description Pin BGA C2 C1 QFN 1 2 Name VTCLK CLK I/O , NBSG53A PACKAGE DIMENSIONS 16 PIN LGA 4x4, 1.0P CASE 526AB-01 ISSUE C D 4X A B 0.10 C NOTES , http://onsemi.com MARKING DIAGRAM * FCBGA-16 BA SUFFIX CASE 489 SG 53A LYW FCLGA-16 MA SUFFIX


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PDF NBSG53A 16-pin NBSG53A/D LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram 04/LGA 1150 Socket PIN diagram 16 pins qfn 3x3 footprint LGA-16 3x3 socket lga 1155 pinout lga 1155 socket 1155 lga socket pins LGA16 3x3 footprint
2012 - Not Available

Abstract: No abstract text available
Text: LGA package outline diagram with dimensions. © Kionix 2012 20-April-2012 Page 2 of 7 LGA PCB , multilayer PCB: Figure 3. Example of a 12- pin 2 x 2 mm LGA in a multilayer PCB © Kionix 2012 20 , . Example of a 12- pin 2 x 2 mm LGA solder stencil layout © Kionix 2012 20-April-2012 Page 4 of 7 , 2x2 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 2 x 2 mm LGA packages and guidelines for developing PCB land


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PDF 20-April-2012
2010 - LY330ALH

Abstract: LGA-10 LY330ALHTR LGA10 mems three axis gyroscope 8161636B seismic sensor mems gyroscope three axis Gyroscope technical data gyroscope 9 AXIS
Text: levels of integration and production trimming to better match sensing element characteristics. LGA , plastic land grid array ( LGA ) package, which ST successfully pioneered for accelerometers. Today ST has , in plastic LGA packages. Table 1: Device summary Order code Temperature Package range (°C) Packing LY330ALH -40 to +85 LGA -10 (3x5x1) Tray LY330ALHTR -40 to +85 LGA -10 (3x5x1 , . February 2010 DocID16568 Rev 2 1/16 www.st.com Contents LY330ALH Contents 1 Block diagram


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PDF LY330ALH LGA-10 DocID16568 LY330ALH LGA-10 LY330ALHTR LGA10 mems three axis gyroscope 8161636B seismic sensor mems gyroscope three axis Gyroscope technical data gyroscope 9 AXIS
Not Available

Abstract: No abstract text available
Text: levels of integration and production trimming to better match sensing element characteristics. LGA , . The LY330ALH is available in a plastic land grid array ( LGA ) package, which ST successfully , the world for production of sensors in plastic LGA packages. Table 1: Device summary Order code Temperature Package range (°C) Packing LY330ALH -40 to +85 LGA -10 (3x5x1) Tray LY330ALHTR -40 to +85 LGA -10 (3x5x1) Tape and reel Description The LY330ALH is a high performance


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PDF LY330ALH LGA-10 DocID16568
2008 - ST LGA marking code

Abstract: No abstract text available
Text: Figure 2. 3 x 5 mm LGA package outline diagram with dimensions. © Kionix 2008 03-July-2008 Page 2 , 3x5 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 5 mm LGA packages and guidelines for developing PCB land , solder reflow process. 3x5 LGA Package Marking • Marking font type • Font size • Line space , name nd - 2 line – Assembly Build Lot code rd - 3 line – Date code (WWYY) th - 4 line – Pin


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PDF 03-July-2008 ST LGA marking code
2007 - LQFN-46

Abstract: hynix micro SD card micro sd spi mode toshiba LGA Nand MMC40 toshiba LGA MMC version 4.2 46-PIN backup protect pinout CRC16
Text: 1.00 04/18/2007 Add Die Pad, 46 PIN LGA , 51PIN LGA 1. Pin Assignment, p.11 2. Package Dimension , . 13 FIGURE 3.4 ­ 46 PIN LGA PINOUT . 14 FIGURE 3.5 ­ 51 PIN LGA PINOUT , . 31 FIGURE 5.3- 46 PIN LGA PACKAGE DIMENSION . 32 FIGURE 5.4- 51 PIN LGA PACKAGE DIMENSION


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PDF GL424 GL424 GL424-PMGXX 46-Pin 54-Pin GL424-WMGXX LQFN-46 hynix micro SD card micro sd spi mode toshiba LGA Nand MMC40 toshiba LGA MMC version 4.2 backup protect pinout CRC16
2009 - 802.11n RF Transceiver mimo

Abstract: SE2593A20 SE2593A20-R SE2593A20-T SIGE se2593a RF Transceiver mimo semiconductor se2593a20 wlan transmitter 802.11
Text: 2009 SE2593A20-EK1 Remark 30 pin LGA The SE2593A20 packaged in 5mm x 6mm x 1.0mm, Halogen free, Lead free, ROHS compliant, MSL 3 LGA package. Tape and Reel N/A The device also , power amplifiers, respectively. Tray 30 pin LGA Designed for ease of use, all RF ports are , time is less than 0.5 s. Samples 30 pin LGA The receive path is designed to maximize , , halogen free, RoHS compliant, MSL3 plated LGA package, 5 mm x 6 mm x 1.0 mm Ordering Information Part


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PDF SE2593A20 SE2593A20 IEEE802 DST-00093 May-26-2009 802.11n RF Transceiver mimo SE2593A20-R SE2593A20-T SIGE se2593a RF Transceiver mimo semiconductor se2593a20 wlan transmitter 802.11
2007 - Not Available

Abstract: No abstract text available
Text: /2006 First formal release 1.00 04/18/2007 Add Die Pad, 46 PIN LGA , 51PIN LGA 1. Pin , . 12 FIGURE 3.3 – 46 PIN LGA PINOUT . 13 FIGURE 3.4 – 51 PIN LGA PINOUT , . 27 FIGURE 5.2 - 46 PIN LGA PACKAGE DIMENSION . 29 FIGURE 5.3 - 51 PIN LGA PACKAGE DIMENSION


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PDF GL424 GL424 GL424-PMGXX 46-Pin GL424-WMGXX GL424-WOGXX
2009 - IC 4614

Abstract: 4614 fet LTM4614V C3216X7SOJ226M pin diagram for IC 4614 LT 4614 ltm 4614 dual fet 4614 LTM4614 10CE100FH
Text: b D E e F G H1 H2 aaa bbb eee TOTAL NUMBER OF LGA PADS: 144 LTMXXXXXX µModule COMPONENT PIN "A1" TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 144 1111 REV B SUGGESTED PCB LAYOUT TOP VIEW LTM4614 17 4614fb LTM4614 Package Description LTM4614 Component LGA Pinout PIN ID , Remote Sensing, LGA Package Pin Compatible with the LTM4600, LGA Package Synchronizable, PolyPhase Operation, LTM4603-1 Version Has No Remote Sensing, Pin Compatible with the LTM4601, LGA Package 2.375V VIN


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PDF LTM4614 4614fb IC 4614 4614 fet LTM4614V C3216X7SOJ226M pin diagram for IC 4614 LT 4614 ltm 4614 dual fet 4614 10CE100FH
2012 - Si8233

Abstract: LGA-24 land pattern LGA PACKAGE thermal resistance
Text: Package Outline: 16- Pin Narrow Body SOIC" , "11. Package Outline: 14 LD LGA (5 x 5 mm)" , and "13. Package , . Si8233 Two-Input HS/LS Isolated Driver (14 LD LGA ) Pin GNDI VIA VIB VDDI DISABLE Name 1 2 3 4 5 , . Si8234 PWM Input HS/LS Isolated Driver (14 LD LGA ) Pin GNDI PWM NC VDDI DISABLE Name 1 2 3 4 5 , Si8235 11 10 7 8 Table 16. Si8235 Dual Isolated Driver (14 LD LGA ) Pin GNDI VIA VIB VDDI DISABLE , electromagnetic immunity SOIC-16 LGA -14 narrow body Applications Power delivery systems Motor control


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PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 Si8233 LGA-24 land pattern LGA PACKAGE thermal resistance
2006 - Not Available

Abstract: No abstract text available
Text: LGA 9 LGA 9 LGA 9 LGA TOP MARK DS4077L-DCN DS4077L-DDN DS4077L-CCN DS4077L-CDN Ordering Information continued at end of data sheet. Pin Configuration TOP VIEW N.C. 9 N.C. 8 N.C. 7 Block Diagram VDD , Complementary Output Buffer Minimum ±110ppm Tuning Range (+25°C) 14mm x 9mm x 3.06mm Plastic LGA Package , CRYSTAL X2 VARACTOR CONTROL DS4077 LGA ( ) LVDS OPTION TRANSFER-MOLDED PLASTIC PACKAGE LVCMOS , . 100 differential load. Pin Description PIN LVCMOS 1 2, 5, 7, 8, 9 3 4 6 - LVDS 1 2, 7, 8, 9 3 -


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PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz DS4077L-ACN DS4077L-ADN
1155 lga socket

Abstract: DDR3 eccn lga 1155 socket intel i5 2430 DH61DL Dh61 612492 61-2492
Text: Board Form Factor Socket Embedded Options Available Launched Q1'11 Mini- ITX LGA 1155 No No 95 W N /A


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PDF DH61DL i7-2630QM /i7-2635 i7-2670 /i7-2675 i5-2430 i5-2435 i5-2410 products/51855/Intel-Desktop-Board-DH61DL 1155 lga socket DDR3 eccn lga 1155 socket intel i5 2430 DH61DL Dh61 612492 61-2492
2007 - LGA 1155 PIN diagram

Abstract: LGA 1150 Socket PIN diagram 1155 lga socket lga 1155 LGA16 3x3 footprint lga 4x4 footprint LGA 1155 Socket PIN diagram LGA 1155 pin out lga-16 4x4 socket lga 1155 pinout
Text: device is housed in a low profile 4x4 mm, 16- pin , flip-chip LGA or a 3x3 mm 16 pin QFN package , BSC 4.00 BSC 1.00 BSC 0.50 BSC NBSG86A PACKAGE DIMENSIONS 16 PIN LGA 4x4, 1.0P CASE 526AB-01 , 4 9 VCC VTD0 5 Figure 1. BGA-16 and LGA -16 Pinout (Top View) 6 VTD1 D1 7 8 D1 VTD1 Figure 2. QFN-16 Pinout (Top View) Table 1. Pin Description Pin BGA QFN , Termination Pin for SEL/SEL. See Table 7. (Note 1) A1 5 VTD1 - Internal 50 W termination pin


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PDF NBSG86A NBSG86A 16-pin, NBSG86A/D LGA 1155 PIN diagram LGA 1150 Socket PIN diagram 1155 lga socket lga 1155 LGA16 3x3 footprint lga 4x4 footprint LGA 1155 Socket PIN diagram LGA 1155 pin out lga-16 4x4 socket lga 1155 pinout
2009 - IC 4614

Abstract: IC ap 4614 LTM4614V 4614 fet ap 4614 LTM4614 pin diagram for IC 4614 LTM4614IV C4532X5R0J107M LT 4614
Text: Diagram for each channel. An external capacitor can be applied to the RUN/SS pin to increase the , case) thermal resistances under the Pin Configuration diagram . 4.0 3.5 3.5 LOAD CURRENT (A , 6.9850 LTM4614 PACKAGE DESCRIPTION LTM4614 Component LGA Pinout PIN ID FUNCTION PIN ID , Remote Sensing, LGA Package and Remote Sensing LTM4602 6A DC/DC Module Pin Compatible with the , offered in a space saving and thermally enhanced 15mm × 15mm × 2.82mm LGA package. The LTM4614 is


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PDF LTM4614 LTM4614 LTM8021 LTM8022 LTM8023 4614fa IC 4614 IC ap 4614 LTM4614V 4614 fet ap 4614 pin diagram for IC 4614 LTM4614IV C4532X5R0J107M LT 4614
2013 - Si8235-BA-C-IS1

Abstract: LGA 32 land pattern silicon labs Si8233 SI8233-B-IM SI823 si8230 SI8238AB-C-IS1 E257455 LGA PACKAGE thermal resistance Si8237BBBIS1
Text: Package Outline: 16- Pin Narrow Body SOIC" , "11. Package Outline: 14 LD LGA (5 x 5 mm)" , and "13. Package , (14 LD LGA ) Pin GNDI VIA VIB VDDI DISABLE Name 1 2 3 4 5 Input-side ground terminal. Non-inverting , Driver (14 LD LGA ) Pin GNDI PWM NC VDDI DISABLE Name 1 2 3 4 5 Input-side ground terminal. PWM input. No , LGA ) Pin GNDI VIA VIB VDDI DISABLE Name 1 2 3 4 5 Input-side ground terminal. Non-inverting logic , -16 narrow body High electromagnetic immunity LGA -14 Applications Power delivery systems Motor


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PDF Si823x Si8230/1/2/7 SOIC-16 Si8233/4/5/6/8 LGA-14 Si8235-BA-C-IS1 LGA 32 land pattern silicon labs Si8233 SI8233-B-IM SI823 si8230 SI8238AB-C-IS1 E257455 LGA PACKAGE thermal resistance Si8237BBBIS1
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