The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC1151CN8 Linear Technology LTC1151 - Dual ±15V Zero-Drift Operational Amplifier; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LTC1151CSW Linear Technology LTC1151 - Dual ±15V Zero-Drift Operational Amplifier; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C
LTC1151CSW#TR Linear Technology LTC1151 - Dual ±15V Zero-Drift Operational Amplifier; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C
LTC1151CN8#TR Linear Technology IC DUAL OP-AMP, 5 uV OFFSET-MAX, 2 MHz BAND WIDTH, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Operational Amplifier
LTC1151CN8#TRPBF Linear Technology IC DUAL OP-AMP, 5 uV OFFSET-MAX, 2 MHz BAND WIDTH, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8, Operational Amplifier
LTC1151CSW#PBF Linear Technology LTC1151 - Dual ±15V Zero-Drift Operational Amplifier; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C

LGA 1151 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
LGA 1150

Abstract: LGA 1151 LTM4617 LTM4604 LTM4602 LTM4608 ltm4607 LTM4600 LTM4613-LGA LTM4614
Text: NEWEST DATE CODE DEVICE CYCLES NUMBER OF FAILURES LGA 15mmx15mm LGA 15mmx9mm 12,513 0643 1151 3,058 , 63 0 0 1004 1151 LTM4620 LGA 77 0 0 1004 1017 LTM4627 LGA 77 0 0 1507 1025 LTM4627 LGA 77 0 0 1535 , LTM4620 LGA 63 0 0 500 1151 LTM4620 LGA 50 0 0 1000 1007 LTM4627 LGA 77 0 0 1500 1017 LTM4627 LGA 77 0 0 , 63 0 0 1000 77 0 1151 LTM4620 LGA 0 1000 77 0 1017 LTM4627 LGA 0 1500 77 0 1025 LTM4627 LGA 0 1500 77 , LTM4620 LGA 73 0 0 2000 1126 LTM4620 LGA 74 0 0 1500 1150 LTM4620 LGA 63 0 0 500 1151 LTM4620 LGA 63 0 0


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PDF LTM4600 LTM4601 LTM4601A LTM4602 LTM4603 LTM4604 LTM4605 LTM4606 LTM4607 LTM4608 LGA 1150 LGA 1151 LTM4617 LTM4613-LGA LTM4614
CPU COOLER

Abstract: LGA 1151 775 cpu connector 109X9112PT0H016 2510c888-001 PCM45F lga 775 intel CPU COOLER 775 CPU COOLER Sanyo denki 2511-T1
Text: SAN ACE MC CPU Cooler For Intel® 775-land LGA Package CPU Cooler " SAN ACE MC" PWM Control Function and Thermally Speed Control General specifications Specifications Model No. Rated Voltage , ,000 775-lamd LGA Duty Cycle - Fan speed characteristics Example PWM Frequency 25kHz , HoneywellPCM45F Lead wire AWG26 Yellow - Black Green Control Blue Sensor CPU Coolers 775-lamd LGA , finger guards or other metallic attachments. Please contact us for details. 1-15-1 , Kita-otsuka


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PDF 775-land 109X9112PT0H016 HoneywellPCM45F AWG26 775-lamd CPU COOLER LGA 1151 775 cpu connector 109X9112PT0H016 2510c888-001 PCM45F lga 775 intel CPU COOLER 775 CPU COOLER Sanyo denki 2511-T1
BTX LGA 775

Abstract: PCM45F 2510C888-001 CPU COOLER WIESON 2510c888-001 LGA 1151 12V cooler MOTOR San Ace 40 12v 109X7912PT1H012 San Ace 40
Text: Function and Thermally Speed Control Control input PWM duty - Fan speed characteristics 775-land LGA , ±1.5 70.6 ±1.5 CPU Coolers (3.5) 123± 2 775-lamd LGA Notice The products shown in the , prohibited. 1-15-1 , Kita-otsuka, Toshima-ku,Tokyo 170-8451, Japan. PHONE : +81 3 3917 5151 Home Page:http


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PDF 109X7912P1H012* 109X7912PT1H012* AWG26 UL1430 PCM45F 775-lamd BTX LGA 775 PCM45F 2510C888-001 CPU COOLER WIESON 2510c888-001 LGA 1151 12V cooler MOTOR San Ace 40 12v 109X7912PT1H012 San Ace 40
PCM45F

Abstract: 2510C888-001 775 cpu connector WIESON 2510c888-001 CPU COOLER 12V cooler MOTOR 9G0912PT2E012 9G0912P2E012 2511-T1 San Ace 60
Text: Thermally Speed Control 775-land LGA Control input PWM duty - Fan speed characteristics 9G0912P2E012 , 95.5±1.5 CPU Coolers (3.5) 123±2 775-lamd LGA Notice The products shown in the catalog are , . 1-15-1 , Kita-otsuka, Toshima-ku,Tokyo 170-8451, Japan. PHONE : +81 3 3917 5151 Home Page:http


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PDF 9G0912P2E012* 9G0912PT2E012* AWG26 UL1430 PCM45F 775-lamd PCM45F 2510C888-001 775 cpu connector WIESON 2510c888-001 CPU COOLER 12V cooler MOTOR 9G0912PT2E012 9G0912P2E012 2511-T1 San Ace 60
2510c888-001

Abstract: CPU COOLER PCM45F 775 cpu connector honeywell pcm45 molex connector catalog 12V cooler MOTOR WIESON 2510c888-001 pcm45 2511-T1
Text: SAN ACE MC CPU Cooler For Intel® Pentium® 4 Processor (775-land LGA Package) CPU Cooler " SanAce MC" PWM Control Function and Thermally Speed Control General specifications CPU Coolers Material Fream,impeller:resin mold Heatsink:alminum (core:copper) Life Expectancy Varies for each model (Survival rate: 90% at 60, rated voltage,and continuously run in a free air state) Motor Protection System , finger guards or other metallic attachments. Please contact us for details. 1-15-1 , Kita-otsuka


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PDF 775-land 500VAC, PCM45F AWG26 2510c888-001 CPU COOLER PCM45F 775 cpu connector honeywell pcm45 molex connector catalog 12V cooler MOTOR WIESON 2510c888-001 pcm45 2511-T1
2012 - LGA PACKAGE thermal resistance

Abstract: No abstract text available
Text: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA , solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intel’s Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molex’s LGA 2011-0 , €™). Compared with the LGA 1366 socket, the increase in the LGA 2011-0’s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA PACKAGE thermal resistance
2012 - Not Available

Abstract: No abstract text available
Text: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA , solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intel’s Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molex’s LGA 2011-0 , €™). Compared with the LGA 1366 socket, the increase in the LGA 2011-0’s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012
2009 - AN3281

Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS BGA PACKAGE thermal resistance Freescale fr-5 laminate BGA cte AN3311 AN1902 lga components
Text: Considerations for the Application of Land Grid Array ( LGA ) Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array ( LGA ) style packages. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead , . . . . . . . . 1 LGA RF Module . . . . . . . . . . . . . . . . . . . . . . . 3 Benefits of LGA .


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PDF AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS BGA PACKAGE thermal resistance Freescale fr-5 laminate BGA cte AN3311 AN1902 lga components
2009 - LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control "BGA Rework Practices", AN1902 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework 221-O
Text: Grid Array ( LGA ) Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array ( LGA ) style package. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead in finished products and are Reduction of , . . . . . 1 What is LGA ? . . . . . . . . . . . . . . . . . . . . . . . . . 3 LGA Rework . . . . .


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PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control "BGA Rework Practices", AN1902 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework 221-O
2002 - X-RAY INSPECTION

Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes , Array ( LGA ) is an area array matrix package that uses solder paste as the interconnect method, as , cross-section of the MAP and Overmolded LGA package. The MAP LGA uses a 0.26mm-0.38mm thick substrate , thickness ranges between 0.96mm and 1.12mm. The Overmolded LGA is similar in construction to the MAP LGA , however, the Overmolded LGA is much thicker. The substrate thickness ranges between 0.36-0.61mm and the


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PDF AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
2005 - LGA voiding

Abstract: NC-SMQ230 Indalloy 181 AN2920 Solder Paste, Indium, Type 3 7313 28 pin freescale ltcc ipc 610D bga thermal cycling reliability ltcc chip
Text: Land Grid Array ( LGA ) to reduce the amounts of lead in finished products and to become Reduction of Hazardous Substances (RoHS) compliant. This application note describes this HCTE Ceramic LGA and , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 What is LGA ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Benefits of LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Manufacturing with LGA . . . . . . . . . . . . . . . . . . . . . . 5 LGA


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PDF AN2920 LGA voiding NC-SMQ230 Indalloy 181 AN2920 Solder Paste, Indium, Type 3 7313 28 pin freescale ltcc ipc 610D bga thermal cycling reliability ltcc chip
2006 - DS4077L-CC0

Abstract: l949a
Text: Complementary Output Buffer Minimum ±110ppm Tuning Range (+25°C) 14mm x 9mm x 3.06mm Plastic LGA Package , LGA 9 LGA 9 LGA 9 LGA TOP MARK DS4077L-DCN DS4077L-DDN DS4077L-CCN DS4077L-CDN Ordering Information , CRYSTAL X2 VARACTOR CONTROL DS4077 LGA ( ) LVDS OPTION TRANSFER-MOLDED PLASTIC PACKAGE LVCMOS , 76.8 76.8 77.76 77.76 106.25 106.25 122.88 PIN-PACKAGE 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA TOP MARK DS4077L-ECN DS4077L-EDN DS4077L-FCN DS4077L-FDN DS4077L-ACN DS4077L-ADN


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PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz DS4077L-CC0 l949a
2009 - LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN3311 fr-5 laminate AN1902 BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Text: Considerations for the Application of Land Grid Array ( LGA ) Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array ( LGA ) style packages. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead , . . . . . . . . 1 LGA RF Module . . . . . . . . . . . . . . . . . . . . . . . 3 Benefits of LGA .


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PDF AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN3311 fr-5 laminate AN1902 BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
2012 - LGA 1366

Abstract: socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 LGA socket Intel lga 1156
Text: Approved by Intel and supporting its top-of-the-line Core i-7 processors, the compact LGA 2011-0 , and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intel's Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molex's LGA 2011-0 , Compared with the LGA 1366 socket, the increase in the LGA 2011-0's contact density of 12% while , establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly retains its 3


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA 1366 socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 LGA socket Intel lga 1156
2003 - diode sd 19

Abstract: 12 pin lga
Text: MOUNTING BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA TOPOLOGY Buck Buck Buck Buck Buck Buck Buck Boost Boost Boost Boost


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PDF FX5545GXX1 FX5545GXX2 FX5545GXX5 FX5545GXX6 FX5545G008 MCL4448 12-Jun-03 diode sd 19 12 pin lga
2012 - Not Available

Abstract: No abstract text available
Text: 2x2 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 2 x 2 mm LGA packages and guidelines for developing PCB land , solder reflow process. 2x2 LGA Package Marking • Marking font type • Font size • Line space , . Figure 1. 2x2 mm LGA package marking information. 36 Thornwood Dr. – Ithaca, NY 14850 tel , 7 2x2 LGA Package Outline and Dimensions The following diagrams show the outline of the


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PDF 20-April-2012
2004 - Not Available

Abstract: No abstract text available
Text: TOPOLOGY VOLTAGE (V) VOLTAGE (V) FX5545G001ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G201ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G005ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G105ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G205ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G305ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G008ADJ BGA or LGA Buck 2.5-6.0 0.8-4.5* FX5545G018ADJ BGA or LGA Buck 2.5-6.0 0.9-1.3 FX5545G108ADJ BGA or LGA Buck 2.5-6.0 0.9-4.5


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PDF FX5545G001ADJ FX5545G201ADJ 35-CTION 18-Feb-04
2009 - resistor 0306 package

Abstract: bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx
Text: Low Inductance Capacitors Introduction LAND GRID ARRAY ( LGA ) CAPACITORS LOW INDUCTANCE CHIP ARRAYS (LICA®) Land Grid Array ( LGA ) capacitors are based on the first Low ESL MLCC technology , the 3rd low inductance capacitor technology developed by AVX. LGA technology provides engineers with new options. The LGA internal structure and manufacturing technology eliminates the historic need for , family of LGA products are 2 terminal devices. A 2 terminal 0306 LGA delivers ESL performance that is


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PDF 300MHz resistor 0306 package bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx
2003 - Not Available

Abstract: No abstract text available
Text: FX5545G002ADJ FX5545G202ADJ FX5545G402ADJ FX5545G006ADJ FX5545G106ADJ MOUNTING BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA BGA or LGA TOPOLOGY Buck Buck Buck Buck Buck Buck Buck Buck Boost Boost Boost Boost Boost PIN


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PDF FX5545GXX1 FX5545GXX2 FX5545GXX5 FX5545GXX6 FX5545G008 MCL4448 12-Aug-03
2004 - FX5545G108ADJ

Abstract: FX5545G008ADJ
Text: TOPOLOGY VOLTAGE (V) VOLTAGE (V) FX5545G001ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G201ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G005ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G105ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G205ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G305ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G008ADJ BGA or LGA Buck 2.5-6.0 0.8-4.5* FX5545G018ADJ BGA or LGA Buck 2.5-6.0 0.9-1.3 FX5545G108ADJ BGA or LGA Buck 2.5-6.0 0.9-4.5* FX5545G002ADJ BGA or LGA Boost 2.5-6.0 3.3-6.0 FX5545G202ADJ BGA


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PDF FX5545G001ADJ FX5545G201ADJ FX5545G005ADJ 15-Jan-04 FX5545G108ADJ FX5545G008ADJ
2009 - Not Available

Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction LAND GRID ARRAY ( LGA ) CAPACITORS LOW INDUCTANCE CHIP ARRAYS (LICA®) Land Grid Array ( LGA ) capacitors are based on the first Low ESL MLCC technology , the 3rd low inductance capacitor technology developed by AVX. LGA technology provides engineers with new options. The LGA internal structure and manufacturing technology eliminates the historic need for , family of LGA products are 2 terminal devices. A 2 terminal 0306 LGA delivers ESL performance that is


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PDF 300MHz
1993 - pcb design of zigbee

Abstract: FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
Text: Grid Array ( LGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99-Contact Land Grid Array ( LGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , -Pin LGA Package Information 3.1 71-Pin LGA Component Copper Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 71-Pin LGA Solder Mask . . . . . . . . . . . . , -Pin LGA Solder Paste Stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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PDF CH370 pcb design of zigbee FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
2004 - FX5545G108ADJ

Abstract: No abstract text available
Text: TOPOLOGY VOLTAGE (V) VOLTAGE (V) FX5545G001ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G201ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G005ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G105ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G205ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G305ADJ BGA or LGA Buck 2.7-6.0 1.35-4.5* FX5545G008ADJ BGA or LGA Buck 2.5-6.0 0.8-4.5* FX5545G018ADJ BGA or LGA Buck 2.5-6.0 0.9-1.3 FX5545G108ADJ BGA or LGA Buck 2.5-6.0 0.9-4.5* FX5545G002ADJ BGA or LGA Boost 2.5-6.0 3.3-6.0 FX5545G202ADJ BGA


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PDF FX5545G001ADJ FX5545G201ADJ FX5545G005ADJ 06-Apr-04 FX5545G108ADJ
2008 - lga16 land pattern

Abstract: LGA16 footprint TN0018 LGA 16L LGA16 L footprint 4x4x1 ST LGA-16 LGA16 LGA land pattern LGA14
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA , environmental specification . . . . . . . . . . . 7 Appendix A LGA packages outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 A.1 A.2 LGA 4.4x7.5x1 mm, 16 lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 A.4 LGA 3x5x0.9 mm, 14 lead. . .


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PDF TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L LGA16 L footprint 4x4x1 ST LGA-16 LGA16 LGA land pattern LGA14
pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
Text: Rectifier's BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page , .4 LGA Devices .4 , LGA devices. Topics discussed include PCB layout placement, soldering, pick and place, reflow , Rework Guidelines for International Rectifier's BGA and LGA Packages by Kevin Hu, International Rectifier Introduction IR BGA (Ball Grid Array) and LGA (Land Grid Array) devices are high performance


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PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
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