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Part Manufacturer Description Datasheet Download Buy Part
LT6654AHLS8-2.5#PBF Linear Technology LT6654 - Precision Wide Supply High Output Drive Low Noise Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 125°C
LTC6652AHLS8-2.5#PBF Linear Technology LTC6652 - Precision Low Drift Low Noise Buffered Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 125°C
LT6654BHLS8-2.5#PBF Linear Technology LT6654 - Precision Wide Supply High Output Drive Low Noise Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 125°C
LT1236BILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LT1236AILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LTC6652BHLS8-2.5#PBF Linear Technology LTC6652 - Precision Low Drift Low Noise Buffered Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 125°C

LCC-26P-M04 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1997 - C2605

Abstract: LCC-26P-M04
Text: SMALL OUTLINE J-LEADED PACKAGE 26 PIN PLASTIC LCC-26P-M04 EIAJ code : SOJ028-P-0400-3 Lead pitch 50mil Package width 300mil Lead shape J bend Sealing method Plastic mold 26-pin plastic SOJ ( LCC-26P-M04 ) * : Resin protrusion. (Each side : 0.15 (.006) max) 26-pin plastic SOJ ( LCC-26P-M04 ) +0.35 +.014 3.40 -0.20 .134 -.008 2.25(.089)NOM * 17.15±0.13(.675±.005) 0.64(.025)MIN 22 18 14 R0.81(.032)TYP 26 7.62 (.300) 8.43±0.13 (.332±.005


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PDF LCC-26P-M04 SOJ028-P-0400-3 50mil 300mil 26-pin LCC-26P-M04) C2605 LCC-26P-M04
1998 - 26-pin

Abstract: No abstract text available
Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 26 PIN PLASTIC To Top / Package Lineup / Package Index LCC-26P-M04 EIAJ code :SOJ028-P-0400-3 26-pin plastic SOJ Lead pitch 50 mil Package width 300 mil Lead shape J bend Sealing method Plastic mold ( LCC-26P-M04 ) 26-pin plastic SOJ ( LCC-26P-M04 ) * : Resin protrusion. (Each side : 0.15 (.006) max) +0.35 +.014 3.40 ­0.20 .134 ­.008 * 17.15±0.13(.675±.005) 2.25(.089)NOM 0.64(.025


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PDF LCC-26P-M04 SOJ028-P-0400-3 26-pin LCC-26P-M04) C26054S-3C-1
Not Available

Abstract: No abstract text available
Text: . Parameter Access Time Low Power Dissipation • Operating Current • Standby Current LCC-26P-M04 , timing requirements for the MB814100 are not critical and all inputs are TTL compatible. iß DIP-18P- M04 , using earty write Absolute Maximum Ratings Parameter LCC- 26P -M03 ZIP-20P-M 02 (See Note , ._ Copyright © FPT- 26P -M01 FPT- 26P -M02 Thle device contain circuitry to protect fte Inputs against


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PDF MB814100-80L/-10L/-12L MB814100 048-bits FPT-26P-M01 FPT-26P-M02
Static RAM fujitsu

Abstract: ZIP-20P-M02
Text: Tstg -55 to+125 °C DIP—18P— M04 LCC-26P-M04 LCC- 26P -M03 ZIP-20P-M02 T.B.D. FPT- 26P -M01 T.B.D. FPT- 26P -M02 Note: Permanent device damage may occur if absolute maximum ratings are exceeded


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PDF MB814101-80U-10U- MB814101 FPT-26P-M01 FPT-26P-M02 Static RAM fujitsu ZIP-20P-M02
MB814400

Abstract: MB814100
Text: inputs are TTL compatible. Features DIP—18P- M04 LCC-26P-M04 LCC- 26P -M03 ZIP—20P-M02 T.B.D


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PDF MB81410O-BOL MB814100-12L MB814400 MB814100
1997 - SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: No file text available


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PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Not Available

Abstract: No abstract text available
Text: Current LCC-26P-M04 11 mW max. (TTL leveiyi .1 mW max. (CM OS level) • 4,194,304 words x 1 bit , ._ T.B.D. FPT- 26P -M01 FPT- 26P -M02 This device contains circuitry to protect the input« against d


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PDF MB814400-80U-10U-12L B814100 MB814100 048-bits FPT-26P-M01 FPT-26P-M02
Not Available

Abstract: No abstract text available
Text: performance • 512 refresh cycles every 8.2 ms LCC-26P-M04 ABSOLUTE MAXIMUM RATINGS (seeNOTE


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PDF MB81C4258A-60/-80/-10 MB81C4258A MB81C4258A ZIP-20P-M02
Static RAM fujitsu

Abstract: MB81C1002A
Text: capability On chip substrate bias generator for high performance LCC-26P-M04 T.B.D · 1,048,576 words x


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PDF MB81C1002A-60/-80/-10 MB81C1002A 1C1002A ZIP-20P-M02 Static RAM fujitsu
Not Available

Abstract: No abstract text available
Text: €¢ Standby Current & LCC-26P-M04 11 mW max. (TTL level)/5.5 mW max. (CMOS level) • 4,194,304 , )_ 26-LEAD PLASTIC LEADED CHIP CARRIER (CASE NO.: LCC-26P-M04 ) 2 ,098(2.50)N OM q , inputs are TTL compatible. Features DIP-1BP- M04 IIB814101-10 MB814101*12 Has Access Time , capability • On-chip substrate bias generator for high performance LCC- 26P -M03 Absolute Maximum , DESCRIPTIONS 26-P in SOJ: 18-Pln DIP: (TOP VIEW) (TOP VIEW) DIN C WE C 1 18 SS


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PDF MB814101-80/-10/-12 MB814101 26-LEAD MB814101-80 MB814101-10 MB814101-12
814400C

Abstract: No abstract text available
Text: critical and all inputs are TTL compatible. LCC-26P-M04 PRODUCT LINE & FEATURES Parameter MBà , ASSIGNMENTS AND DESCRIPTIONS 26-Pin SOJ: 26-Pin FPT: (TOP VIEW) (TOP VIEW) < LCC-26P-M04 , -60 MB814400C-70 PACKAGE DIMENSIONS Suffix : -PJN) 26-LEAD PLASTIC LEADED CHIP CARRIER (CASE No.: LCC-26P-M04 , function (Normal Bend) FPT- 26P -M01 Early write orO E controlled write capability RAS only , Marking side (Reverse Bend) FPT- 26P -M02 °C Permanent device damage may occur if the above


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PDF MB814400C 024-bits 374175b D11515 MB814400C-60 MB814400C-70 26-LEAD FPT-26P-M02) 814400C
1991 - MB81C100a

Abstract: fujitsu ten MB81C1000A MIKROELEKTRONIK Frankfurt
Text: max. 374 mW max. 341 mW max. DIP-18P- M04 297 mW max. Parameter Operating Low Current Power Dissipation Standby Current · · · · · · · · LCC-26P-M04 11 mW max. (TTL , ) (Suffix -PJ) 26-Lead Plastic Leaded Chip Carrier (Case No.: LCC-26P-M04 ) 19 MB81C1000A , , Read-Modify-Write capability On-chip substrate bias generator for high performance ZIP-20P-M02 * FPT-24P- M04 , -P) 18-Lead Plastic Dual In-Line Package (Case No.: DIP-18P- M04 ) 18 Not Recommended for New


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PDF MB81C1000A-60/-70/-80/-10 MB81C1000A D-6000 JV0053-916J4 MB81C1000A-60 MB81C1000A-70 MB81C1000A-80 MB81C1000A-10 MB81C100a fujitsu ten MIKROELEKTRONIK Frankfurt
S 576 B

Abstract: No abstract text available
Text: capability # On chip substrate bias generator for high performance & LCC-26P-M04 Z ÍP -2 0 P -M 0 2


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PDF MB81C1000A-60/-80/-10 MB81C1000A S 576 B
*81c4256a

Abstract: No abstract text available
Text: , On chip substrate bias generator for high performance & LCC-26P-M04 Z IP -20P -M 02 ABSOLUTE


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PDF MB81C4256A-60/-80/-10 MB81C4256A MB61C4256A *81c4256a
1995 - 814100A

Abstract: CA10
Text: -60 MB814100C-70 PACKAGE DIMENSIONS (Suffix : ­PJN) 26-LEAD PLASTIC LEADED CHIP CARRIER (CASE No.: LCC-26P-M04 , for the MB814100C are not critical and all inputs are TTL compatible. LCC­ 26P­M04 PRODUCT LINE & , ) (TOP VIEW) 26P­M04 > 26P ­M01> D IN 1 26 V SS WE 2 DOUT , refresh cycles every 16.4ms Self refresh function · · · · (Normal Bend) FPT­ 26P ­M01 Common I , NOTE: Copyright ­55 to +125 Unit Marking side (Reverse Bend) FPT­ 26P ­M02 °C


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PDF MB814100C-60/-70 MB814100C 814100A CA10
1991 - MB814400C

Abstract: 024-bits MB814400C-60
Text: Plastic SOJ Package ( LCC-26P-M04 ) Plastic TSOP Package (FPT- 26P -M01) (Normal Bend) Plastic TSOP Package (FPT- 26P -M02) (Reverse Bend) Package and Ordering Information ­ 26-pin plastic (300mil) SOJ , -60/MB814400C-70 s PIN ASSIGNMENTS AND DESCRIPTIONS 26-Pin SOJ: (TOP VIEW) 26-Pin TSOP: < LCC-26P-M04 > 26P -M01> DQ1 DQ2 WE RAS A9 1 2 3 4 5 26 25 24 23 22 VSS DQ4 , LEADED CHIP CARRIER (CASE No.: LCC-26P-M04 ) .140(3.55)MAX. .089(2.25)NOM *.675±.005 (17.15±0.13


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PDF DS05-10176-3E MB814400C-60/-70 MB814400C 024-bits F9607 MB814400C-60
1991 - MB81400

Abstract: mb814100c
Text: may affect device reliability. s PACKAGE Marking side LCC-26P-M04 (Normal Bend) FPT- 26P -M01 2 Marking side (Reverse Bend) FPT- 26P -M02 To Top / Lineup / Index MB814100C , ASSIGNMENTS AND DESCRIPTIONS 26-Pin SOJ: (TOP VIEW) 26-Pin FPT: (TOP VIEW) < LCC-26P-M04 > 26P -M01> DIN WE RAS N.C. A10 1 2 3 4 5 26 25 24 23 22 ASS DOUT CAS , DIMENSIONS (Suffix: -PJN) 26-LEAD PLASTIC LEADED CHIP CARRIER (CASE No.: LCC-26P-M04 ) .140(3.55)MAX .089


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PDF DS05-10177-2E MB814100C-60/-70 MB814100C 048-bits F9607 MB81400
IC MARKING A60

Abstract: No abstract text available
Text: timing requirements for the MB814101A are not critical and all inputs are TTL compatible. LCC-26P-M04 , -70 PACKAGE DIMENSIONS (Suffix: -PJN) 26-LEAD PLASTIC LEADED CHIP CARRIER (CASE No.: LCC-26P-M04 , only, CAS-before-RAS, or Hidden Refresh (Normal Bend) FPT- 26P -M01 · All input and output are TTL , extended periods may affect device reliability. (Reserve Bend) FPT- 26P -M02 This device contains , DESCRIPTIONS 2 6 -P in SOJ: (TOP VIEW) 26P -M 01> DIN C w e "C 2 6 -P in FPT: (TOP


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PDF MB814101A 048-bits JV0093-- 923J1 IC MARKING A60
7L Marking

Abstract: m02 marking amplifier
Text: timing requirements for the MB814100A are not critical and all inputs are TTL compatible. LCC-26P-M04 , -LEAD PLASTIC LEADED CHIP CARRIER (CASE No.: LCC-26P-M04 ) ,140(3.55)MAX 089(2-25)NQM 025(0.64)MIN .268±.020 , (Normal Bend) FPT- 26P -M01 ABSOLUTE MAXIMUM RATINGS (see Note) Parameter Voltage at any pin relative to , Marking side Vcc PD w mA °C (Reserve Bend) FPT- 26P -M02 "VoO SW fM Permanent device damage , -70 MB814100A-80 PIN ASSIGNMENTS AND DESCRIPTIONS 26-Pln FPT: (TOP VIEW ) «Norm al Bend : FPT- 26P -M01» 3 ] 1


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PDF OOA-60/-70/-80 MB814100A 048-bits SD-08286-01-92-DS 7L Marking m02 marking amplifier
1994 - CMOS Dynamic RAM 1M x 1

Abstract: dram 4bit Dynamic RAM
Text: . Plastic SOJ Package (LCC­ 26P­M04 ) PRODUCT LINE & FEATURES Parameter MB814400D­60 MB814400D


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PDF MB814400D-60/-70 MB814400D 300mil) CMOS Dynamic RAM 1M x 1 dram 4bit Dynamic RAM
Not Available

Abstract: No abstract text available
Text: in equipment that uses batteries for primary and/or auxiliary power. LCC-26P-M04 The MB814100A , -80 PACKAGE DIMENSIONS (Suffix: -PJN)_ 26-LEAD PLASTIC LEADED CHIP CARRIER (CASE No.: LCC-26P-M04 , , Read-Modify-Write capability • On chip substrate bias generator for high performance (Normal Bend) FPT- 26P , © 1990 by FUJITSU LIMITED BTM TTSb D 0 0 fib 7 0 411 ■t Marking side (Reserve Bend) FPT- 26P , DESCRIPTIONS 26-Pln FPT: 26-Pln SOJ: (TOP VIEW) Crop v ie w * «Normal Band : FPT- 26P -M01» C


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PDF MB814100A 048-bits MB814100A-60 MB814100A-70 MB814100A-80 26-LEAD FPT-26P-M02)
1991 - MB81C4256A

Abstract: MB81C4256A-80 *81c4256a mb81c4256a-70 MIKROELEKTRONIK Frankfurt
Text: Operating Low Current Power Dissipation Standby Current · · · · · · · · LCC-26P-M04 11 , Carrier (Case No.: LCC-26P-M04 ) 21 MB81C4256A-60 MB81C4256A-70 MB81C4256A-80 MB81C4256A , ZIP-20P-M02 * FPT-24P- M04 Absolute Maximum Ratings Parameter Symbol Ratings Unit , -Lead Plastic Flat Package (Case No.: FPT-24P- M04 ) 23 MB81C4256A-60 MB81C4256A-70 MB81C4256A


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PDF MB81C4256A-60/-70/-80/-10 MB81C4256A D-6000 JV0057-916J4 MB81C4256A-60 MB81C4256A-70 MB81C4256A-80 MB81C4256A-10 MB81C4256A-80 *81c4256a mb81c4256a-70 MIKROELEKTRONIK Frankfurt
MB814405C

Abstract: No abstract text available
Text: – PACKAGE Marking side I li» . Plastic SOJ Package ( LCC-26P-M04 ) Plastic TSOP Package (FPT- 26P , 26-Pin SOJ: (TOP VIEW) < LCC-26P-M04 > DQi c 1 26 ] Vss DQ2 c 2 25 ] DQ4 We e 3 24 ] DQ3 RAS e , refresh 27 MB814405C-60/MB814405C-70 PACKAGE DIMENSIONS 26 pin, Plastic SOJ ( LCC-26P-M04 ) +0.35 / . 0 , c 13 14 ] A4 26-Pin TSOP: (TOP VIEW) 26P -M01> DQi œ 1 26 xi Vss dq2 œ 2 25 h , -60/MB814405C-70 (Continued) 26 pin, Plastic TSOP(II) (FPT- 26P -M01 ) nnnnn :This dimension includes resin


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PDF MB814405C-60/-70 MB814405C MB814405C-60/MB814405C-70 FPT-26P-M01 F26001S-3C-3
e33i

Abstract: IC1001
Text: LCC-26P-M04 Absolute Maximum Ratings (See Note) Parameter Voltage at any pin relative to Vss , )_ 26-LEAD PLASTIC LEADED CHIP CARRIER (SOJ-26) (CASE No.: LCC-26P-M04 ) © 1 9 9 0 F V IIT S I , ns max. 25 ns max. 45 ns min. 297 mW max. DIP-18P- M04 EHP-18C-A02 5.5 mW max. (TTL level , o +125 Unit V V ZIP-20P-M02 w mA °C FPT-24P- M04 / FPT-24P-M05 N o te : Permanent , RAS n TE C 3 vss v 3 ^ DOUT CAS M04 > D A0 D Ae ] A7 « c A1 I


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PDF MB81C1001A-70L/-80L/-WL B81C1001A MB81C1001A 24-LEAD FPT-24P-M04) F24020S-2C MB81C1001A-70L MB81C1001A-80L MB81C1001A-10L e33i IC1001
D1881

Abstract: mbb1c1000 mb8l MB81C1000A ZIP-20P-M02 MBB1C1000A-10L RD7H ae1215
Text: reliability. Copyright © 19B0 by FUJITSU LIMITED and Fi#1mj Microalectionlcs, Inc. DIP-18P- M04 DIP—18C-A02 LCC-26P-M04 ZIP-20P-M02 FPT-24P- M04 / FPT-24P-M0S Thi« dart* Corwin« circuity to protect Ih , .: LCC-26P-M04 ) (1 7.1 5 ±0.13) 332±.005 [8.43± 0.1 3) .140(3.55) MAX. .089(2.25) NOM .025(0.64 , ) M04 > a9 E ■TOc doute vNslÎ nc.i RÂ?I te i ÂÏSt we c din c nc.c VssC , DIMENSIONS (Suffix: -P) 18-LEAD PLASTIC DUAL IN-LINE PACKAGE (CASE No.: DIP-18P- M04 ) rii"i


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PDF MB81CWOOA-70U-80L/-10L MB81C1000A MB81C1000Als F24Q2Ã B81C1OOOA-70 MB81C1000A-80L D1881 mbb1c1000 mb8l ZIP-20P-M02 MBB1C1000A-10L RD7H ae1215
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