UPD60510BF1-HN4-M1-A
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Renesas Electronics Corporation
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R-IN32M3 ASSP for Multi-Protocol Support |
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HFA3046BZ
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Renesas Electronics Corporation
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Ultra High Frequency Transistor Arrays |
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RJP3046DPP-00#T2
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Renesas Electronics Corporation
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Insulated-Gate Bipolar Transistors (IGBT) |
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HFA3046BZ96
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Renesas Electronics Corporation
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Ultra High Frequency Transistor Arrays |
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75844-304-64LF
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Amphenol Communications Solutions
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BergStikĀ®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch. |
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63453-046LF
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Amphenol Communications Solutions
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PREFERRED P/N SERIES FOR NEW PROJECT: 10131936
MinitekĀ® 2.00mm, Board to Board Connector, Minitek II VCC (HTP), PCB Mounted Receptacle , Vertical , Through Hole, Top Entry, Double row, 46 Positions, 2.00mm (0.079in) Pitch. |
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