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J-STD-033

Abstract: JEDEC J-STD-033 JSTD-033 JEDEC standard 033 J-STD033 40011 J-STD-020 MSL Rating jstd
Text: , MSL, J-STD-033 1. Introduction: The following application note is a guide for handling moisture sensitive surface mount devices and is based on the IPC/JEDEC industry standard J-STD-033 available from , specification sheet and the units are Dry Packed for storage, shipping, and handling per the IPC/JEDEC J-STD-033 , sensitive devices in a low humidity environment is according to the J-STD-033 Standard, in sealed moisture , Bake-out procedure. Please refer to the complete J-STD-033 for additional details. AN-40-011 Rev.: OR


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PDF AN-40-011) J-STD-033 J-STD-033 J-STD-020 AN-40-011 M129497 AN40011 JEDEC J-STD-033 JSTD-033 JEDEC standard 033 J-STD033 40011 J-STD-020 MSL Rating jstd
2015 - Not Available

Abstract: No abstract text available
Text: , MSL, J-STD-033 1. Introduction: The following application note is a guide for handling moisture sensitive surface mount devices and is based on the IPC/JEDEC industry standard J-STD-033 available from , specification sheet and the units are Dry Packed for storage, shipping, and handling per the IPC/JEDEC J-STD-033 , sensitive devices in a low humidity environment is according to the J-STD-033 Standard, in sealed moisture , Bake-out procedure. Please refer to the complete J-STD-033 for additional details. AN-40-011 Rev.: A


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PDF AN-40-011) J-STD-033 J-STD-033 J-STD-020 AN-40-011 M150261 AN40011
2014 - JEDEC J-STD-033 TAPE AND REEL

Abstract: No abstract text available
Text: Industry Standard IPC/JEDEC J-STD-033 . Table1 provides useful information for carrier tape and reels used , parts are discussed in section 4, section 5 and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 , , table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , “Joint Industry , . Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be


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PDF RFSA2534 RFSA2534 MN140910 JEDEC J-STD-033 TAPE AND REEL
2002 - EIA-583

Abstract: JESD31 JEDEC J-STD-033 TAPE AND REEL JESD-625 JEDEC JESD31 J-STD-033 JESD625 JESD-31 JSTD-033 JEP113
Text: Sensitivity Classification for Nonhermetic Solid-State Surface-Mount Devices Joint IPC/JEDEC Standard J-STD-033 , identification label should be followed (see J-STD-033 ) for opened packages or beyond the specified storage , label for opened packages or beyond the specified storage time should be followed (see J-STD-033 ). If , Moisture-Sensitive Devices JEDEC Publication JEP124 (superceded by J-STD033 ) Military Standard MIL-STD-750, Test


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2006 - JESD625-A

Abstract: J-STD-033 PCB Multicore CR39 RF5500 J-STD-033 SN62 PB36 ag2 JEDEC J-STD-033 rework station diagram IPC-020b-5-1
Text: Industry Standard IPC/ JEDEC J-STD-033 . Table 1 provides useful information for carrier tape and reels , section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the MSL of each device in , the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 , Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a


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PDF RF5500 EUDirective2002/95/EC RF5500 JESD625-A; J-STD-033) 5500010B JESD625-A J-STD-033 PCB Multicore CR39 J-STD-033 SN62 PB36 ag2 JEDEC J-STD-033 rework station diagram IPC-020b-5-1
1990 - beta transformer LPB-5015

Abstract: LPB-5015 LPB 5015 J-STD-033 LPB-5000 LPB-5012 JSTD-033 IPC-9503
Text: 24 hours. These parts are provided dry-packed in accordance with J-STD-033 . Tape and Reel packaging , Classification for Non-IC components) and Dry-Packed in accordance with JSTD-033 (Standard for handling, packing , provided dry-packed in accordance with J-STD-033 . Tape and Reel packaging is available upon request , Dry-Packed in accordance with JSTD-033 (Standard for handling, packing, shipping and use of Moisture/Reflow


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PDF LPB-5000 MIL-STD-1553 MIL-STD-1553, MIL-STD-1553A L-12/06-0 beta transformer LPB-5015 LPB-5015 LPB 5015 J-STD-033 LPB-5012 JSTD-033 IPC-9503
2007 - 793DX-CTC3-CTC4

Abstract: No abstract text available
Text: ) per J-STD-033 . Level 2a testing specifies a floor life of 4 weeks at 30 °C and 60 % relative , recommendations please refer to J-STD-033 . Conformal coated series: 591D, 592D, 592W, 195D, 695D, 594D, 595D


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PDF J-STD-020D J-STD-033. 21-Jun-13 793DX-CTC3-CTC4
2006 - JEDEC J-STD-033

Abstract: jedec JESD625-a 96SCAGS89 J-STD-033 RF2057 JESD625-A JEDEC J-STD-033 TAPE AND REEL J-STD-033 PCB multicore solder paste 62 JESD625A
Text: Standard IPC/ JEDEC J-STD-033 . y Table 1 provides useful information for carrier tape and reels used , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el


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PDF RF2057 EUDirective2002/95/EC RF2057 JESD625-A; J-STD-033) JEDEC J-STD-033 jedec JESD625-a 96SCAGS89 J-STD-033 JESD625-A JEDEC J-STD-033 TAPE AND REEL J-STD-033 PCB multicore solder paste 62 JESD625A
2006 - JEDEC J-STD-033

Abstract: RF2059 JESD625-A J-STD-033 GETEK FR4 SN62 PB36 ag2 JEDEC J-STD-033 TAPE AND REEL
Text: Standard IPC/ JEDEC J-STD-033 . y Table 1 provides useful information for carrier tape and reels used , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el


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PDF RF2059 EUDirective2002/95/EC RF2059 JESD625-A; J-STD-033) JEDEC J-STD-033 JESD625-A J-STD-033 GETEK FR4 SN62 PB36 ag2 JEDEC J-STD-033 TAPE AND REEL
2008 - JEDEC J-STD-033

Abstract: No abstract text available
Text: SPT 3M™ Humidity Indicator Cards (HICs) for IPC/JEDEC J-STD-033 IPC/JEDEC will soon release Revision B of the J-STD-033 standard for dry packaging surface mount devices. A new HIC will be required , card meets the IPC/JEDEC J-STD033A standard. Card Size: 2” x 3” inches Indicates: 5,10,15% Packing: 125 cards in an air-tight can. This card meets the future release of IPC/ JEDEC J-STD-033B , with IPC/JEDEC J-STD-033A . Specifications Materials: Accuracy: Tolerance: 75Â


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PDF J-STD-033 J-STD-033 51060HIC125 6HIC200 125/Can 7033-a C866-722-3736 JEDEC J-STD-033
2006 - JESD625-A

Abstract: RF2051TR13 RF2051 RFMD RF2051 J-STD-033
Text: Industry Standard IPC/ JEDEC J-STD-033 . Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape


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PDF RF2051 EUDirective2002/95/EC RF2051 JESD625-A; J-STD-033) 051020A JESD625-A RF2051TR13 RFMD RF2051 J-STD-033
2007 - Not Available

Abstract: No abstract text available
Text: within _ hours of factory conditions ≤ 30°C/60% RH, or b. Stored per J-STD-033 Devices require , at 23 ± 5°C b. 3a or 3b are not met If baking is required, refer to IPC/JEDEC J-STD-033 for bake


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PDF J-STD-033 J-STD-033 J-STD-020
2006 - 96SCAGS89

Abstract: JESD625-A J-STD-033 RF2053 multicore solder paste moisture handling
Text: Industry Standard IPC/ JEDEC J-STD-033 . Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape


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PDF RF2053 EUDirective2002/95/EC RF2053 JESD625-A; J-STD-033) 053020A 96SCAGS89 JESD625-A J-STD-033 multicore solder paste moisture handling
2006 - JESD625-a

Abstract: J-STD-033 Multicore CR39
Text: to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 . Table 1 provides useful , section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the MSL of each device in , the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/JEDEC J-STD-033 , Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a


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PDF SUF-1033 EUDirective2002/95/EC SUF-1033 JESD625-A; J-STD-033) SUF-1033010A JESD625-a J-STD-033 Multicore CR39
2006 - rf2052

Abstract: JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RFMD RF2052
Text: Industry Standard IPC/ JEDEC J-STD-033 . Table 1 provides useful information for carrier tape and reels , discussed in section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape


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PDF RF2052 EUDirective2002/95/EC RF2052 JESD625-A; J-STD-033) 052020A JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RFMD RF2052
2005 - Not Available

Abstract: No abstract text available
Text: more than 90 seconds. These parts are provided dry packed in accordance with J-STD-033 . Tape and Reel , Dry-Packed in accordance with JSTD-033 (Standard for handling, packing, shipping and use of Moisture /Reflow , processing. Dried transformers must be reflowed within 24 hours. J-STD-033 preconditioning (dry-pack) can be , Classification for Non-IC components) and Dry-Packed in accordance with JSTD-033 (Standard for handling, packing


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PDF SLP-8200 MIL-STD-1553 MIL-STD-1553A SLP-8200
JEDEC J-STD-033

Abstract: J-STD-033 MIL-I-18835 JSTD-033 ASTM 1249 molecular sieve MIL-PRF-81705D D-3464 F-1249 D-3464D
Text: and materials used meet the requirements defined in IPC/JEDEC J-STD-033 . Moisture Barrier Bag. The moisture barrier bag used for Spansion products is in compliance with IPC/ JEDEC J-STD-033 . It is designed , before use. Refer to IPC/JEDEC J-STD-033 for the bake procedure if the device carrier cannot withstand


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2015 - Not Available

Abstract: No abstract text available
Text: , Vishay has decided to implement vacuum seal packaging with dry pack, as required for MSL 3 per J-STD-033 , to order the above listed series in a dry pack as per the J-STD-033 standard. While our capacitors


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PDF J-STD-020D J-STD-033, J-STD-033
2006 - RF119

Abstract: JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Text: to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 . y Table 1 provides , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el


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PDF RF1195 EUDirective2002/95/EC RF1195 JESD625-A; J-STD-033) RF11950201 RF119 JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
2006 - JEDEC J-STD-033 TAPE AND REEL

Abstract: J-STD-033 SUF-5033 JESD625-A JEDEC J-STD-033
Text: , devices may be baked according to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 , , and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the MSL of each device , /JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a


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PDF SUF-5033 EUDirective2002/95/EC SUF-5033 JESD625-A; J-STD-033) SUF-5033010B JEDEC J-STD-033 TAPE AND REEL J-STD-033 JESD625-A JEDEC J-STD-033
2006 - JESD625-A

Abstract: SUF-8533 JESD625 J-STD-033
Text: , devices may be baked according to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 , , and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the MSL of each device , /JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a


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PDF SUF-8533 EUDirective2002/95/EC SUF-8533 JESD625-A; J-STD-033) SUF-8533010B JESD625-A JESD625 J-STD-033
2006 - RF1194

Abstract: RF1194TR7 RF1194TR13 J-STD-033 PCB JEDEC J-STD-033 JESD625 JESD625-a J-STD-033 smt pcb ipc standard
Text: to section 4, table 4-1, of Joint Industry Standard IPC/ JEDEC J-STD-033 . y Table 1 provides , section 4, section 5, and section 6 of Joint Industry Standard IPC/JEDEC J-STD-033 . RFMD qualifies the , Joint Industry Standard IPC/JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el


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PDF RF1194 EUDirective2002/95/EC RF1194 JESD625-A; J-STD-033) RF11940201 RF1194TR7 RF1194TR13 J-STD-033 PCB JEDEC J-STD-033 JESD625 JESD625-a J-STD-033 smt pcb ipc standard
2006 - avago shipping label Moisture Sensitivity

Abstract: JEDEC J-STD-033 J-STD-020B J-STD-033 JESD22-A120 murata REEL label lot number WS1401
Text: /JEDEC J-STD-020B and J-STD-033 . WS1401 is MSL3. Thus, according to the J-STD-033 p.11 the maximum , barrier bag is 12 months at <40oC and 90% relative humidity (RH) J-STD-033 p.7. Out-of-Bag Time Duration , hours J-STD-033 p.8. CAUTION: Tape and reel materials typically cannot be baked at the temperature


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PDF WS1401 WS1401, WS1401 320exp 35eV/kT) 5989-2536EN avago shipping label Moisture Sensitivity JEDEC J-STD-033 J-STD-020B J-STD-033 JESD22-A120 murata REEL label lot number
2000 - TST-9100

Abstract: transformer dash 2 b-5 TST-9000 TST-9102 TST-9112 TST-9106 TST-9104 TST-9117 IPC-9503 TST-9107
Text: dry-packed in accordance with J-STD-033 . Tape and Reel packaging is available. Contact factory for furnther , Classification for Non-IC components) and Dry-Packed in accordance with JSTD-033 (Standard for handling, packing , °C for more than 90 seconds. These parts are provided dry-packed in accordance with J-STD-033 . Tape and , Dry-Packed in accordance with JSTD-033 (Standard for handling, packing, shipping, and use of Moisture/Reflow


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PDF TST-9100 MIL-STD-1553A MIL-STD-1553 F-01/08-0 transformer dash 2 b-5 TST-9000 TST-9102 TST-9112 TST-9106 TST-9104 TST-9117 IPC-9503 TST-9107
2001 - tlp 1205 1553

Abstract: TLP-1115 dielectric tlp 16 tlp 1205 transformer TLP-1112 TLP1005 tlp1012 tlp 1005 transformer IPC-9503 Beta Transformer Technology
Text: reflowed within 24 hours. These parts are provided dry-packed in accordance with J-STD-033 . Tape and reel , with J-STD-033 (Standard for handling, packing, shipping and use of Moisture/Reflow sensitive surface , processing. Dried transformers must be reflowed within 24 hours. J-STD-033 preconditioning (dry-pack) can be , Non-IC components) and DryPacked in accordance with J-STD-033 (Standard for handling, packing, shipping


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PDF TLP-1000 MIL-STD-1553 MIL-STD-1553, MIL-STD-1553A D-01/05-0 tlp 1205 1553 TLP-1115 dielectric tlp 16 tlp 1205 transformer TLP-1112 TLP1005 tlp1012 tlp 1005 transformer IPC-9503 Beta Transformer Technology
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