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RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
LT1584 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1580 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1005CT-5 Linear Technology IC VREG 5 V FIXED POSITIVE REGULATOR, PSFM, Fixed Positive Single Output Standard Regulator
LT117AHVH Linear Technology IC VREG 1.25 V-60 V ADJUSTABLE POSITIVE REGULATOR, MBCY3, TO-39, 3 PIN, Adjustable Positive Single Output Standard Regulator

JEDEC J-STD-033 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2014 - JEDEC J-STD-033 TAPE AND REEL

Abstract: No abstract text available
Text: , table 4-1 of Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part , additional details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , “Joint Industry , . Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be , ‰¤3 Pre-baking requirements Refer to JEDEC J-STD-033 if original device package is unsealed. Maximum , ; moisture sensitive (Ref. JESD625-A; IPC/ JEDEC J-STD-033 ) Shelf-life in bag 12 months at <40°C and


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PDF RFSA2534 RFSA2534 MN140910 JEDEC J-STD-033 TAPE AND REEL
JEDEC J-STD-033

Abstract: J-STD-033 MIL-I-18835 JSTD-033 ASTM 1249 molecular sieve MIL-PRF-81705D D-3464 F-1249 D-3464D
Text: before use. Refer to IPC/ JEDEC J-STD-033 for the bake procedure if the device carrier cannot withstand , and materials used meet the requirements defined in IPC/ JEDEC J-STD-033 . Moisture Barrier Bag. The moisture barrier bag used for Spansion products is in compliance with IPC/ JEDEC J-STD-033 . It is designed , MOISTURE SENSITIVITY To better classify the moisture sensitivity of Spansion products, the IPC/ JEDEC joint


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2006 - JESD625-A

Abstract: RF2051TR13 RF2051 RFMD RF2051 J-STD-033
Text: Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape , number of reflow cycles <3 Pre-baking requirements Refer to JEDEC J-STD-033 if original device , thickness Handling requirements ESD sensitive; moisture sensitive (Ref. JESD625-A; IPC/ JEDEC J-STD-033


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PDF RF2051 EUDirective2002/95/EC RF2051 JESD625-A; J-STD-033) 051020A JESD625-A RF2051TR13 RFMD RF2051 J-STD-033
2006 - rf2052

Abstract: JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RFMD RF2052
Text: Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape , number of reflow cycles <3 Pre-baking requirements Refer to JEDEC J-STD-033 if original device , thickness Handling requirements ESD sensitive; moisture sensitive (Ref. JESD625-A; IPC/ JEDEC J-STD-033


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PDF RF2052 EUDirective2002/95/EC RF2052 JESD625-A; J-STD-033) 052020A JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE RF2052TR13 RFMD RF2052
2006 - JESD625-A

Abstract: J-STD-033 PCB Multicore CR39 RF5500 J-STD-033 SN62 PB36 ag2 JEDEC J-STD-033 rework station diagram IPC-020b-5-1
Text: the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/ JEDEC J-STD-033 , Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a , cycles <3 Pre-baking requirements Refer to JEDEC J-STD-033 if original device package is , JEDEC J-STD-033 if original device package is unsealed. Maximum reflow temperature 260°C Time


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PDF RF5500 EUDirective2002/95/EC RF5500 JESD625-A; J-STD-033) 5500010B JESD625-A J-STD-033 PCB Multicore CR39 J-STD-033 SN62 PB36 ag2 JEDEC J-STD-033 rework station diagram IPC-020b-5-1
2006 - JEDEC J-STD-033 TAPE AND REEL

Abstract: J-STD-033 SUF-5033 JESD625-A JEDEC J-STD-033
Text: / JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a , JEDEC J-STD-033 if original device package is unsealed. Maximum reflow temperature 260°C Time , (min.) Handling requirements ESD sensitive; moisture sensitive (Ref. JESD625-A; IPC/ JEDEC J-STD-033


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PDF SUF-5033 EUDirective2002/95/EC SUF-5033 JESD625-A; J-STD-033) SUF-5033010B JEDEC J-STD-033 TAPE AND REEL J-STD-033 JESD625-A JEDEC J-STD-033
2006 - JESD625-A

Abstract: SUF-8533 JESD625 J-STD-033
Text: / JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor life exposures can be extended , . Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a , JEDEC J-STD-033 if original device package is unsealed. Maximum reflow temperature 260°C Time , (min.) Handling requirements ESD sensitive; moisture sensitive (Ref. JESD625-A; IPC/ JEDEC J-STD-033


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PDF SUF-8533 EUDirective2002/95/EC SUF-8533 JESD625-A; J-STD-033) SUF-8533010B JESD625-A JESD625 J-STD-033
2006 - JEDEC J-STD-033

Abstract: RF2059 JESD625-A J-STD-033 GETEK FR4 SN62 PB36 ag2 JEDEC J-STD-033 TAPE AND REEL
Text: Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el , requirements Refer to JEDEC J-STD-033 if original device package is unsealed. Maximum reflow temperature , JEDEC J-STD-033 if original device package is unsealed. Maximum reflow temperature 260°C ar


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PDF RF2059 EUDirective2002/95/EC RF2059 JESD625-A; J-STD-033) JEDEC J-STD-033 JESD625-A J-STD-033 GETEK FR4 SN62 PB36 ag2 JEDEC J-STD-033 TAPE AND REEL
2006 - JEDEC J-STD-033

Abstract: jedec JESD625-a 96SCAGS89 J-STD-033 RF2057 JESD625-A JEDEC J-STD-033 TAPE AND REEL J-STD-033 PCB multicore solder paste 62 JESD625A
Text: Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el , . <3 Pre-baking requirements Refer to JEDEC J-STD-033 if original device package is unsealed , JEDEC J-STD-033 if original device package is unsealed. Maximum reflow temperature 260°C ar


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PDF RF2057 EUDirective2002/95/EC RF2057 JESD625-A; J-STD-033) JEDEC J-STD-033 jedec JESD625-a 96SCAGS89 J-STD-033 JESD625-A JEDEC J-STD-033 TAPE AND REEL J-STD-033 PCB multicore solder paste 62 JESD625A
2006 - 96SCAGS89

Abstract: JESD625-A J-STD-033 RF2053 multicore solder paste moisture handling
Text: Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry Standard , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Caution: Tape , number of reflow cycles <3 Pre-baking requirements Refer to JEDEC J-STD-033 if original device , thickness Handling requirements ESD sensitive; moisture sensitive (Ref. JESD625-A; IPC/ JEDEC J-STD-033


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PDF RF2053 EUDirective2002/95/EC RF2053 JESD625-A; J-STD-033) 053020A 96SCAGS89 JESD625-A J-STD-033 multicore solder paste moisture handling
2006 - JESD625-a

Abstract: J-STD-033 Multicore CR39
Text: the parts must be baked according to section 4, table 4-1 of Joint Industry Standard IPC/ JEDEC J-STD-033 , Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry Standard Handling, Packing, Shipping, and Use of , JEDEC J-STD-033 for baking requirements. Caution: Tape and reel materials typically must be baked for a , cycles <3 Pre-baking requirements Refer to JEDEC J-STD-033 if original device package is , / JEDEC J-STD-033 ). Shelf-life in bag 12 months at < 40°C and < 90% relative humidity RoHS status


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PDF SUF-1033 EUDirective2002/95/EC SUF-1033 JESD625-A; J-STD-033) SUF-1033010A JESD625-a J-STD-033 Multicore CR39
2006 - RF119

Abstract: JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Text: Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el , Pre-baking requirements Refer to JEDEC J-STD-033 if original device package is unsealed. Maximum , . JESD625-A; IPC/ JEDEC J-STD-033 ). Shelf-life in bag 12 months at < 40°C and < 90% relative humidity


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PDF RF1195 EUDirective2002/95/EC RF1195 JESD625-A; J-STD-033) RF11950201 RF119 JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
2006 - RF1194

Abstract: RF1194TR7 RF1194TR13 J-STD-033 PCB JEDEC J-STD-033 JESD625 JESD625-a J-STD-033 smt pcb ipc standard
Text: Joint Industry Standard IPC/ JEDEC J-STD-033 to remove any moisture absorbed into the part. The floor , additional details on rework procedures. Reference Documents: 1. IPC/ JEDEC J-STD-033 , "Joint Industry , 4.2.1 or 4.2.2 has not been satisfied. Refer to JEDEC J-STD-033 for baking requirements. Pr el , Pre-baking requirements Refer to JEDEC J-STD-033 if original device package is unsealed. Maximum , . JESD625-A; IPC/ JEDEC J-STD-033 ). Shelf-life in bag 12 months at < 40°C and < 90% relative humidity


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PDF RF1194 EUDirective2002/95/EC RF1194 JESD625-A; J-STD-033) RF11940201 RF1194TR7 RF1194TR13 J-STD-033 PCB JEDEC J-STD-033 JESD625 JESD625-a J-STD-033 smt pcb ipc standard
1998 - JEDEC J-STD-033

Abstract: J-STD-033 P3188 TG25 P3188TR
Text: materials. Components are dry-packed and sealed as shipped. Handle in accordance with IPC/ JEDEC J-STD-033 procedure for components classified as IPC/ JEDEC J-STD-020 Moisture Sensitivity Level 5a. ETALDOC 588 , IPC/ JEDEC J-STD-033 . ORDERING CODE Certified by BSI to IEC 60950 Third Edition (1999) (IEC CB


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PDF P3188 22bis P3188 6500VDC. E203175 FIN-03101, JEDEC J-STD-033 J-STD-033 TG25 P3188TR
2011 - STM11

Abstract: ASTM d882
Text: . These bags are tested to meet or exceed certain electrical and physical requirements of IPC/ JEDEC J-STD-033 , * <.0003 g/100 sq.in./24 hrs IPC/ JEDEC J-STD-033 17 lbs MIL-STD-3010 2065 6 mils MIL-STD-3010 1003 5400 PSI


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PDF J-STD-033, 1104-B STM11 ASTM d882
D882 p

Abstract: N E C D882 JEDEC J-STD-033 D882 J-STD-033 MIL-PRF-81705 h D882 MILPRF-81705 JSTD-033 ASTM 1249
Text: QC traceability. Standards Meets electrical and physical requirements of IPC/ JEDEC J-STD-033 , of IPC/ JEDEC J-STD-033 MIL-PRF-81705 Type I, STATIC DISSIPATIVE POLYMER and EIA 583, for static


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PDF J-STD-033, MIL-PRF81705 g/100 1161-B D882 p N E C D882 JEDEC J-STD-033 D882 J-STD-033 MIL-PRF-81705 h D882 MILPRF-81705 JSTD-033 ASTM 1249
2008 - popcorn

Abstract: JEDEC J-STD-033 J-STD-020D J-STD-033 IC-Haus Gmbh
Text: These containers cannot be subjected to high temperature. Reference IPC/ JEDEC J-STD-033 for bake , ://www.jedec.org IPC/ JEDEC J-STD 033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface , melting temperatures. In their joint standard J-STD-020 from June 2007 IPC and JEDEC differentiate , EU directive 2000/53/EC End-of-Life Vehicles (ELV): http://europa.eu.int IPC/ JEDEC J-STD 020 , Recommended Reflow Soldering Conditions following IPC/ JEDEC J-STD-020 tpk = 20 s max. 245.260 ° (CR) / 230


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PDF J-STD-020D D-55294 popcorn JEDEC J-STD-033 J-STD-033 IC-Haus Gmbh
1997 - DAA 2-4 wire

Abstract: J-STD-033 P3000 JEDEC J-STD-033 TAPE AND REEL J-STD-033 PCB
Text: as shipped. Handle in accordance with IPC/ JEDEC J-STD-033 procedure for components classified as IPC/ JEDEC J-STD-020 Moisture Sensitivity Level 5a. Page 2 of 4 May 2005 P3000 600 ohm , 245ºC in accordance with IPC/ JEDEC J-STD-033 . ORDERING CODE Certified by BSI to IEC 950:1991/A4


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PDF P3000 P3000 UL94V-0 2002/95/EC, E203175 FIN-03101, DAA 2-4 wire J-STD-033 JEDEC J-STD-033 TAPE AND REEL J-STD-033 PCB
1997 - P2781

Abstract: J-STD-033 TG25
Text: and sealed as shipped. Handle in accordance with IPC/ JEDEC J-STD-033 procedure for components classified as IPC/ JEDEC J-STD-020 Moisture Sensitivity Level 5a. ETALDOC 240/14 Page 3 of 5 , Recommended peak body temperature 245°C in accordance with IPC/ JEDEC J-STD-033 . ETAL and P2781 are Trade


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PDF P2781 22bis 32bis P2781 6500VDC. E203175 FIN-03101, J-STD-033 TG25
2011 - MIL-STD-3010

Abstract: ASTM d882 IPC s20.20 1161B
Text: requirements of IPC/ JEDEC J-STD-033 , ANSI/ESD S541, EIA 625, and to be ANSI/ESD S20.20 program compliant , Amine Content Typical Values Test Method* <.0003 g/100 sq.in./24 hrs IPC/ JEDEC J-STD-033 20 lbs MIL-STD


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PDF J-STD-033, 1161-B MIL-STD-3010 ASTM d882 IPC s20.20 1161B
1997 - P2781

Abstract: JESD97 J-STD-033 TG25
Text: materials. Components are dry-packed and sealed as shipped. Handle in accordance with IPC/ JEDEC J-STD-033 procedure for components classified as IPC/ JEDEC J-STD-020 Moisture Sensitivity Level 5a. ETALDOC 240 , Profile peak 260ºC 10s Recommended peak body temperature 245ºC in accordance with IPC/ JEDEC J-STD-033 . ETAL and P2781 are Trade Marks of Profec Technologies Ltd. The Trade Mark ETAL is


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PDF P2781 22bis 32bis P2781 6500VDC. P2781ÿ E203175 JESD97 J-STD-033 TG25
1997 - P3081

Abstract: CTR21 J-STD-033 P2781 TG25 JEDEC J-STD-033 P3081TR
Text: materials. Components are dry-packed and sealed as shipped Handle in accordance with IPC/ JEDEC J-STD-033 procedure for components classified as IPC/ JEDEC J-STD-020 Moisture Sensitivity Level 5a. ETALDOC 459 , IPC/ JEDEC J-STD-033 . ORDERING CODE Certified by BSI to IEC 60950 Third Edition (1999) (IEC CB


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PDF P3081 P3081 P2781 E203175 FIN-03101, CTR21 J-STD-033 TG25 JEDEC J-STD-033 P3081TR
1998 - P3081

Abstract: P3181 TRANSFORMER P3181 CTR21 J-STD-033 P2781 SD95 TG25
Text: accordance with IPC/ JEDEC J-STD-033 procedure for components classified as IPC/ JEDEC J-STD-020 Moisture , Profile peak 260°C 10s Recommended peak body temperature 245°C in accordance with IPC/ JEDEC J-STD-033


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PDF P3181 56kbps) P3181 P2781 250Vrms, E203175. 88kVrms, E203175 P3081 TRANSFORMER P3181 CTR21 J-STD-033 SD95 TG25
1994 - J-STD-033

Abstract: P2782 TG25
Text: accordance with IPC/ JEDEC J-STD-033 procedure for components classified as IPC/ JEDEC J-STD , temperature Profile peak 260°C 10s Recommended peak body temperature 245°C in accordance with IPC/ JEDEC J-STD-033 . ETAL and P2782 are Trade Marks of Profec Technologies Ltd. The Trade Mark ETAL is


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PDF P2782 22bis P2782 6500tion, 250Vrms, E203175. 88kVrms, E203175 J-STD-033 TG25
2010 - IC-Haus Gmbh

Abstract: J-STD-020D J-STD-033
Text: temperature. Reference IPC/ JEDEC J-STD-033 for bake procedure. COB-Package Models After opening the dry , directive 2000/53/EC End-of-Life Vehicles (ELV): http://europa.eu.int IPC/ JEDEC J-STD 020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices: http://www.jedec.org IPC/ JEDEC J-STD 033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices: http , melting temperatures. In their joint standard J-STD-020 from June 2007 IPC and JEDEC differentiate


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PDF J-STD-020D D-55294 IC-Haus Gmbh J-STD-033
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