The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
HPA00441ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
CAB4AZNRR Texas Instruments DDR4RCD01 JEDEC compliant DDR4 Register for RDIMM and LRDIMM operation up to DDR4-2400 253-NFBGA 0 to 0

JEDEC FBGA Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2001 - eh 11757

Abstract: 0.3mm pitch BGA Coffin-Manson Equation JEDEC FBGA thermal cycling data weibull PCB design for very fine pitch csp package FBGA 63 BGA Solder Ball 0.35mm 0.4mm pitch BGA pi metal detector
Text: parameters such as solder ball size and board thickness is also presented. JEDEC FBGA specification , Chain patterns on the FBGA package. 2. "- - - - -" Dash traces are Daisy Chain patterns on the PCB. 3 , of a separate network for the support balls. Figure 1. FBGA 32 Mb and 64 Mb Silicon Daisy Chain , slug to the substrate. Currently AMD has three types of FBGA daisy chains: Stitched Daisy Chains , DAISY CHAIN PACKAGE TYPES PB = 80-ball Fortified Ball Grid Array ( FBGA ) 1.00 mm pitch, 13 x 11 mm


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2013 - CY7C1371DV33

Abstract: No abstract text available
Text: CY7C1371DV33 Acronyms Acronym CMOS CE CEN EIA JEDEC FBGA I/O JTAG NoBL OE SRAM TCK TDI TMS TDO TQFP WE chip , enable Available in JEDEC-standard Pb-free 100-pin TQFP and 165-ball FBGA packages Three chip enables for , Configurations (continued) Figure 2. 165-ball FBGA (13 × 15 × 1.4 mm) pinout CY7C1371DV33 1 A B C D E F G H J , -ball FBGA package). When this scan cell, called the "extest output bus tristate," is latched into the , number (31:29) Device depth (28:24) Device width (23:18) Cypress device ID (17:12) Cypress JEDEC ID Code


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PDF CY7C1371DV33 18-Mbit CY7C1371DV33
2012 - Not Available

Abstract: No abstract text available
Text: CY7C1371DV33 Acronyms Acronym CMOS CE CEN EIA JEDEC FBGA I/O JTAG NoBL OE SRAM TCK TDI TMS TDO TQFP WE chip , enable Available in JEDEC-standard Pb-free 100-pin TQFP and 165-ball FBGA packages Three chip enables for , Configurations (continued) Figure 2. 165-ball FBGA (13 × 15 × 1.4 mm) pinout CY7C1371DV33 1 A B C D E F G H J , -ball FBGA package). When this scan cell, called the "extest output bus tristate," is latched into the , number (31:29) Device depth (28:24) Device width (23:18) Cypress device ID (17:12) Cypress JEDEC ID Code


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PDF CY7C1371DV33 18-Mbit CY7C1371DV33
2002 - fluke 52 k/j Thermocouple

Abstract: transistor smd G46 7512 pin diodes in micro semi data sheet smd transistor marking ey BGA-64 pad AMD reflow soldering profile BGA MCP Technology Trend SMD MARKING CODE h5 SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Text: FBGA User's Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV , purposes only and may be trademarks of their respective companies. FBGA User's Guide Chapter 1 , Fine-Pitch Ball Grid Array ( FBGA ) - - - - - - - - - - - - - - 9 Package Construction . . . . . . . . . . . . , . FBGA Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 The Impact of Die Size Changes on FBGA Package Size . . . . . . . . . . . . . . . . . . . . . . . . . 9 The


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PDF N32-2400 22142J fluke 52 k/j Thermocouple transistor smd G46 7512 pin diodes in micro semi data sheet smd transistor marking ey BGA-64 pad AMD reflow soldering profile BGA MCP Technology Trend SMD MARKING CODE h5 SMD MARKING CODE l6 BGA Solder Ball 0.6mm
2005 - ep600i

Abstract: MS-034 1152 BGA processor cross reference EP2S60 EP2S30 TQFP 144 PACKAGE DIMENSION EP2S15 Cyclone II EP2C35 Cross Reference altera ep610
Text: Device Package Pins EP2S15 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S30 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S60 Flip Chip FBGA 484 Flip Chip FBGA EP2S90 672 Flip Chip FBGA 1,020 484 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 Flip Chip FBGA 1,508 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S180 1,508 Table 2


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2005 - bd248

Abstract: UBGA169 HC1S6 EP1800 324 bga thermal EP2S60 EP2S180 EPM7192 EPM3032A application Cyclone II EP2C35
Text: ), Fineline Ball Grid Array ( FBGA ), Ultra FineLine Ball-Grid Array (UBGA), Pin-Grid Array (PGA), Plastic , Devices Device EP2S15 Package Pins 672 Flip Chip FBGA 484 Flip Chip FBGA EP2S60 484 Flip Chip FBGA EP2S30 Flip Chip FBGA 672 Flip Chip FBGA 484 Flip Chip FBGA Flip Chip FBGA 484 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 1,020 Flip Chip FBGA EP2S90 672 Flip Chip FBGA 1,508 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508


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2007 - PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA TQFP 144 PACKAGE DIMENSION FBGA 1760 84 FBGA thermal
Text: -Pin MBGA - Wire Bond Added 780-Pin FBGA option 2 - Wire Bond, 256-Pin UBGA - Wire Bond, 68-Pin MBGA - , added for Stratix III Thermal Resistance information 1517-Pin FineLine Ball-Grid Array ( FBGA ) - Flip Chip data sheet was added 1760-Pin FineLine Ball-Grid Array ( FBGA ) - Flip Chip data sheet was added , (BGA), FineLine BGA® ( FBGA ), Ultra FineLine BGA (UBGA), Micro FineLine BGA (MBGA), Pin-Grid Array , Enhanced configuration devices Table 2. Arria GX Devices in FineLine Ball Grid Array ( FBGA ) - Flip Chip


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PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA TQFP 144 PACKAGE DIMENSION FBGA 1760 84 FBGA thermal
2010 - EP4CE6 package

Abstract: EP4CE40 EP4CE55 Altera EP4CE6 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: code reference, package acronym, leadframe material, lead finish (plating), JEDEC outline reference , ) FineLine BGA ( FBGA ) Hybrid FineLine BGA (HBGA) Micro FineLine BGA (MBGA) Plastic Dual , Lidless: UBGA, Flip Chip (EP2AGX65) EP2AGX65 Lidless: FBGA , Flip Chip (EP2AGX45) Lidless: FBGA , Flip Chip (EP2AGX45) EP2AGX45 358 358 Lidless: FBGA , Flip Chip, (EP2AGX65) 572 Lidless: FBGA , Flip Chip (EP2AGX65) EP2AGZ300 (1) 572 Lidless: FBGA , Flip Chip (EP2AGX125) 780 1152


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PDF DS-PKG-16 EP4CE6 package EP4CE40 EP4CE55 Altera EP4CE6 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
2010 - EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance jedec package MO-247 Theta JC of FBGA EP4CE22 QFN148
Text: reference, package acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead , ) Ceramic Dual In-Line Package (CerDIP) FineLine BGA ( FBGA ) Hybrid FineLine BGA (HBGA , , Flip Chip (EP2AGX45) 572 780 572 Lidless: FBGA , Flip Chip (EP2AGX95) 780 1152 Lidless: FBGA , Flip Chip (EP2AGX125) 572 Lidless: FBGA , Flip Chip (EP2AGX125) 780 Lidless: FBGA , Flip Chip (EP2AGX125) EP2AGX260 Lidless: FBGA , Flip Chip, (EP2AGX65) Lidless: FBGA , Flip Chip


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PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance jedec package MO-247 Theta JC of FBGA EP4CE22 QFN148
FBGA 152

Abstract: 78 ball fbga thermal resistance FBGA1020 68 ball fbga thermal resistance FBGA-484 EP2S90 EP2S60 EP2S30 EP2S180 EP2S15
Text: ® ( FBGA ) packages. Table 10­1. Stratix II Devices in FBGA Packages Device Package Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA Flip-chip FBGA 484 780 Flip-chip FBGA 1,020 Flip-chip FBGA EP2S130 1,020 Flip-chip FBGA EP2S90 672 Flip-chip FBGA 1,508 1,020 Flip-chip FBGA 1,508 Flip-chip FBGA 1,020 Flip-chip FBGA Altera Corporation


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PDF SII52010-4 EP2S15 EP2S30 EP2S60 FBGA 152 78 ball fbga thermal resistance FBGA1020 68 ball fbga thermal resistance FBGA-484 EP2S90 EP2S60 EP2S30 EP2S180 EP2S15
BT 1610

Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
Text: , respectively, are available in FineLine BGA® ( FBGA ) packages. Table 16­1. Stratix II Devices in FBGA Packages Device Package Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA Flip-chip FBGA 484 780 Flip-chip FBGA 1,020 Flip-chip FBGA EP2S130 1,020 Flip-chip FBGA EP2S90 672 Flip-chip FBGA 1,508 1,020 Flip-chip FBGA 1,508 Flip-chip FBGA 1,020


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BT 1610

Abstract: EP2S90 EP2S60 EP2S30 EP2S180 EP2S15 JEDEC FBGA FBGA-484 datasheet FBGA 12x12 heat sink 672-FBGA
Text: ® ( FBGA ) packages. Table 16­1. Stratix II Devices in FBGA Packages Device Package Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA Flip-chip FBGA 484 780 Flip-chip FBGA 1,020 Flip-chip FBGA EP2S130 1,020 Flip-chip FBGA EP2S90 672 Flip-chip FBGA 1,508 1,020 Flip-chip FBGA 1,508 Flip-chip FBGA 1,020 Flip-chip FBGA Altera Corporation


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PDF SII52010-4 EP2S15 EP2S30 EP2S60 BT 1610 EP2S90 EP2S60 EP2S30 EP2S180 EP2S15 JEDEC FBGA FBGA-484 datasheet FBGA 12x12 heat sink 672-FBGA
MS-034 1152 BGA

Abstract: FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 MS 034 aaj AGX52014-1 MS-034 altera cross reference
Text: pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 484-Pin FBGA , , respectively, are available in FineLine BGA® ( FBGA ) packages. Table 14­1. Arria GX Devices in FBGA Packages Device EP1AGX35 EP1AGX50 Pins Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA EP1AGX20 Package 484 484 Flip-chip FBGA 780 Flip-chip FBGA Altera Corporation May 2008 1152 Flip-chip FBGA


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PDF AGX52014-1 EP1AGX35 EP1AGX50 EP1AGX20 EP1AGX90 FBGA35 152-pin MS-034 1152 BGA FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 MS 034 aaj MS-034 altera cross reference
FBGA-484 datasheet

Abstract: arria MS-034 AGX52014-1
Text: JEDEC Publication No. 95. 484-Pin FBGA - Flip Chip All dimensions and tolerances conform to , Altera Arria GX devices, respectively, are available in FineLine BGA® ( FBGA ) packages. Table 14­1. Arria GX Devices in FBGA Packages Device EP1AGX35 EP1AGX50 Pins Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA EP1AGX20 Package 484 484 Flip-chip FBGA 780 Flip-chip FBGA Altera Corporation May 2007 1152


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PDF 152-pin FBGA-484 datasheet arria MS-034 AGX52014-1
FBGA-484 datasheet

Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
Text: Altera Arria GX devices, respectively, are available in FineLine BGA® ( FBGA ) packages. Table 14­1. Arria GX Devices in FBGA Packages Device EP1AGX35 EP1AGX50 Pins Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA 484 Flip-chip FBGA 780 Flip-chip FBGA EP1AGX20 Package 484 484 Flip-chip FBGA 780 Flip-chip FBGA Altera Corporation May 2008 1152 Flip-chip FBGA EP1AGX90 780 Flip-chip FBGA EP1AGX60 Flip-chip FBGA 1152 Flip-chip FBGA


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PDF Packa35 152-pin FBGA-484 datasheet MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
2002 - 240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Text: FineLine BGA 484 Thermally Enhanced BGA Cavity Down 356 Non-Thermally Enhanced FBGA , Cavity Up 652 Non-Thermally Enhanced FBGA EP20K300E 652 Non-Thermally Enhanced FBGA 672 , Thermally Enhanced FBGA EP20K1000E Thermally Enhanced BGA Cavity Down Thermally Enhanced FBGA 1,020 , 24.7 22.1 17.8 256 FBGA 8.8 28.7 24.5 22.3 20.5 240 PQFP 4.0 26.0 23.4 20.8 17.1 256 FBGA 6.6 24.3 20.2 18.1 16.4 324 FBGA


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PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
FBGA-484 datasheet

Abstract: 84 FBGA outline asme y14.5m FBGA-484 FBGA1152 FBGA PACKAGE thermal resistance bt 146 MS-034 AGX52014-1 altera cross reference
Text: , respectively, are available in FineLine BGA® ( FBGA ) packages. Table 14­1. Arria GX Devices in FBGA Packages Device Package Pins EP1AGX20 Flip-chip FBGA 484 Flip-chip FBGA 780 EP1AGX35 Flip-chip FBGA 484 Flip-chip FBGA 780 EP1AGX50 Flip-chip FBGA 484 Flip-chip FBGA Altera Corporation May 2007 Flip-chip FBGA 484 780 Flip-chip FBGA EP1AGX90 1152 Flip-chip FBGA EP1AGX60 780 Flip-chip FBGA 1152 Flip-chip FBGA 1152 14­1 Package


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PDF AGX52014-1 EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX90 EP1AGX60 152-pin FBGA-484 datasheet 84 FBGA outline asme y14.5m FBGA-484 FBGA1152 FBGA PACKAGE thermal resistance bt 146 MS-034 altera cross reference
2007 - 3S110

Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
Text: ), FineLine® BGA ( FBGA ), and Hybrid FineLine BGA (HBGA). f For additional packaging information, refer , for Stratix III devices on a board meeting JEDEC Altera Corporation DS-STXTHRML-2.0 1 , JEDEC board specifications require two signal and two power/ground planes and are available at www.jedec.org. Table 2. Stratix III Device Thermal Resistance for Boards Meeting JEDEC Specifications Device , ./min. 200 ft./min. 400 ft./min. 3S50 484 Flip Chip FBGA 12.6 10 8.5 7.2 2.72


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2007 - EP3C40F484

Abstract: pin information ep3c10 PIN INFORMATION FOR EP3C55 EP3C16F484 U256 EP3C40 EP3C16 EP3C40Q240 100 PIN PQFP ALTERA DIMENSION EP3c55
Text: ( FBGA ), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead , devices are provided for a board meeting JEDEC specifications and for a typical board. The JEDEC board , devices on a board meeting JEDEC specifications for thermal resistance calculation. Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2) Device JA (C/W , Information Data Sheet Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC


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PDF EP3C25 EP3C10 EP3C40F484 pin information ep3c10 PIN INFORMATION FOR EP3C55 EP3C16F484 U256 EP3C40 EP3C16 EP3C40Q240 100 PIN PQFP ALTERA DIMENSION EP3c55
2008 - micro fineline BGA

Abstract: EPM240 EPM570-144TQFP EPM570 EPM240Z EPM240G EPM2210 EPM1270 fbga Substrate design guidelines JEDEC Package Code MS-026-AED
Text: which Altera® MAX II devices are available in thin quad flat pack (TQFP), FineLine BGA ( FBGA ), and , BGA Packages (Part 1 of 2) Device Package Pin EPM240Z MBGA (1) 68 EPM240 FBGA (1 , (Part 2 of 2) Device Package Pin FBGA (1) 100 MBGA (1) 100 TQFP 100 EPM570Z MBGA (1) 144 EPM570 TQFP 144 FBGA 256 MBGA (1) 256 EPM1270 TQFP 144 EPM1270G FBGA 256 MBGA (1) 256 EPM2210 FBGA 256 EPM2210G FBGA 324 EPM570


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PDF MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP EPM570 EPM240Z EPM240G EPM2210 EPM1270 fbga Substrate design guidelines JEDEC Package Code MS-026-AED
fbga Substrate design guidelines

Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S180
Text: Altera Stratix II and Stratix II GX devices, respectively, are available in FineLine BGA® ( FBGA ) packages. Table 10­1. Stratix II Devices in FBGA Packages Device Package Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA Flip-chip FBGA 484 780 Flip-chip FBGA 1,020 Flip-chip FBGA EP2S130 1,020 Flip-chip FBGA EP2S90 672 Flip-chip FBGA 1,508


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32Gb Nand flash toshiba

Abstract: toshiba emmc toshiba 16GB Nand flash emmc toshiba eSD memory toshiba THGBM1G4D1EBAI7 THGBM1G thgbm 4GB eMMC toshiba emmc Sequential Interleave Mode emmc 4.3 standard jedec
Text: controller. Full compliance w ith JEDEC /MMCA Ver. 4.3 and SDA Ver. 2.0 high-speed memory standards for memory , THGBM1G6D4EBAI4 THGBM1G5D2EBAI7 Capacity Package 32GB 16GB 16GB 8GB 4GB 169Ball FBGA 14x18x1.4mm 169Ball FBGA 12x18x1.4mm 169Ball FBGA 14x18x1.4mm 169Ball FBGA 12x18x1.3mm 169Ball FBGA 12x16x1.3mm 169Ball FBGA 12x16x1.3mm 169Ball FBGA 11.5x13x1.2mm Sam ple Shipm ent Oct., 08 Sept., 08 4Q, 08 (Oct.~Dec.) Sept., 08 Sept , Package 32GB 16GB 16GB 8GB 4GB 169Ball FBGA 14x18x1.4mm 169Ball FBGA 12x18x1.4mm 169Ball FBGA 14x18x1.4mm


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PDF 32GB1 32Gb Nand flash toshiba toshiba emmc toshiba 16GB Nand flash emmc toshiba eSD memory toshiba THGBM1G4D1EBAI7 THGBM1G thgbm 4GB eMMC toshiba emmc Sequential Interleave Mode emmc 4.3 standard jedec
2012 - KLM8G2FE3B

Abstract: klm8g samsung eMMC 4.5 TLC nand klm8g2 SAMSUNG emmc 153 ball eMMC memory KLM4G samsung tlc nand flash Samsung KLMBG4GE2A
Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package , Council ( JEDEC ) requires memory to be produced in extremely compact sizes to allow space for other , JEDEC , and key functionality yields strong power management and performance optimization. Samsung eMMC , Standard, mature interface by JEDEC Intelligent firmware Provides strong power management and , 3.6 153 FBGA * 1 chip (mono) Mass production KLM8G1WE4A 8 GB x8 1.7 - 1.95 2.7 -


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K4T1G164QF

Abstract: 1GB DDR2 4 banks K4T51083QI-HCE7 K4T51163QI m470t5663 k4t51083qi K4T1G164QQ-HC K4T1G164QE samsung ddr2 240pin 1gb K4T1G164QE-HC
Text: : x16 : x 4 Stack ( JEDEC Standard) : x 8 Stack ( JEDEC Standard) : : : : : : FBGA (Lead-free) FBGA DDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA DSP (Lead-free & Halogen-free, Thin) FBGA (Lead-free & Halogen-free, Flip Chip) 10. Temp & Power C , )F7/E6 256M x 8 64M x 16 64M x 16 -3- PKG 60 ball FBGA Avail. Now 84 ball FBGA 60 ball FBGA Now 84 ball FBGA 60 ball FBGA Now 84 ball FBGA Now 60 ball


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PDF 68Ball 10MAX K4T1G164QF 1GB DDR2 4 banks K4T51083QI-HCE7 K4T51163QI m470t5663 k4t51083qi K4T1G164QQ-HC K4T1G164QE samsung ddr2 240pin 1gb K4T1G164QE-HC
2009 - EDE2116ACBG

Abstract: EDE2116ACBG-1J-F EDE1116AGBG-1J-F DDR3-800D DDR3-800E ELPIDA lpddr EDE1116AGBG EDJ1108DBSE DDR3 layout EDE1032AGBG
Text: .9 13. DDR Mobile RAMTM - JEDEC Standard ( 14. DDR Mobile RAMTM - FBGA .10 15. Mobile RAMTM - JEDEC Standard (LPSDR) .10 16. Mobile RAMTM - FBGA , . 1.5+/-0.075 8K/64ms A 1.5+/-0.075 8K/64ms B Package 78- FBGA 78- FBGA Product


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PDF E1454E90 240-pin M01E0706 EDE2116ACBG EDE2116ACBG-1J-F EDE1116AGBG-1J-F DDR3-800D DDR3-800E ELPIDA lpddr EDE1116AGBG EDJ1108DBSE DDR3 layout EDE1032AGBG
Supplyframe Tracking Pixel