The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
LT1584 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1580 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1005CT-5 Linear Technology IC VREG 5 V FIXED POSITIVE REGULATOR, PSFM, Fixed Positive Single Output Standard Regulator
LM317HVH Linear Technology IC VREG 1.2 V-57 V ADJUSTABLE POSITIVE REGULATOR, MBCY3, TO-39, 3 PIN, Adjustable Positive Single Output Standard Regulator

J-STD-020C Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
J-STD-020C

Abstract: ipc 620 ipc 610 78426 78145 78143 2N2411 JSTD020C TES-2N JORDAN
Text: IPC/JEDEC J-STD-020C Table of Contents page Tested Flowchart 1 Tested Data before , after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO , Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard , Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process Visual


Original
PDF J-STD-020C 2N-2411 J-STD-020C ipc 620 ipc 610 78426 78145 78143 2N2411 JSTD020C TES-2N JORDAN
0853.12

Abstract: J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
Text: 40sec acc. to IPC/ JEDEC J-STD-020C < 5m at 20 mV > 3kV between L-N (50Hz; 1 min) > 4kV between L-N , Alloy Gold-Plated Copper Alloy Gold-Plated Copper Alloy Reflow Condition acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s acc


Original
PDF com/pg02b W/10A 500VAC/DC E39328 0853.12 J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
2N2423

Abstract: TES-2N 81121 15029 81413
Text: IPC/JEDEC J-STD-020C Table of Contents Page Tested Flowchart 1 Tested Data before , Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C , maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process , J-STD-020C Standard NO 31 After 3th Reflow Process 14 Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After


Original
PDF J-STD-020C 2N-2423 J-STD-020C 2N2423 TES-2N 81121 15029 81413
Not Available

Abstract: No abstract text available
Text: . to IPC/ JEDEC J-STD-020C < 5 m at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N > 10 M between , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263


Original
PDF com/pg02b
2013 - Not Available

Abstract: No abstract text available
Text: €‰sec acc. to IPC/ JEDEC J-STD-020C < 5 mΩ at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , . to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 , Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm


Original
PDF com/PG02
2013 - Not Available

Abstract: No abstract text available
Text: €‰sec acc. to IPC/ JEDEC J-STD-020C < 5 mΩ at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263


Original
PDF com/pg02b
smd fuse marking

Abstract: smd fuse marking 20 J-STD-020D fuse holder 5x20 JEDEC tray standard 13 fuse smd marking blue JSTD020C J-STD-020-C J-STD-020C
Text: (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C , Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x 173 mm(500 pcs.) 0031.8222 l Spec. Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , . Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Blister


Original
PDF com/pg02b W/10A 500VAC/DC smd fuse marking smd fuse marking 20 J-STD-020D fuse holder 5x20 JEDEC tray standard 13 fuse smd marking blue JSTD020C J-STD-020-C J-STD-020C
smd fuse marking

Abstract: smd fuse marking 20 JEDEC J-STD-020c 8309 J-STD-020C 0031.8221 8326 JSTD020C
Text: variants) 245°C / 3sec acc. to IEC 60068-2-58, Test Td 240 - 260°C / 20 - 40sec acc. to JEDEC J-STD-020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x , JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8263 l


Original
PDF com/pg02b W/10A Distribu516 smd fuse marking smd fuse marking 20 JEDEC J-STD-020c 8309 J-STD-020C 0031.8221 8326 JSTD020C
Not Available

Abstract: No abstract text available
Text: J-STD-020C , Tp=245 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8221 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=245 +0/-5 °C, tp = , Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=245 +0/-5 °C, tp = max. 30 s Blister Tray 266 x , J-STD-020C , Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263 l Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = max


Original
PDF com/PG02
J-STD-020C

Abstract: J-STD-020-C JSTD-020C JSTD020C J-STD020C SRR1806 SRR1005 SDR1005 SDR1806 SRR1003
Text: " Power Chokes Meets J-STD-020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD-020C , Table 4-2, for components with a height greater than , design improvement allows an increase of the maximum soldering temperature to meet the JEDEC J-STD-020C , +250 °C maximum per J-STD-020C. · SDR1005, SDR1806, and SDR2207 (non-shielded) · SRR0804, SRR0805


Original
PDF J-STD-020C J-STD-020C, J-STD-020C. SDR1005, SDR1806, SDR2207 SRR0804, J-STD-020C J-STD-020-C JSTD-020C JSTD020C J-STD020C SRR1806 SRR1005 SDR1005 SDR1806 SRR1003
J-STD-020-C

Abstract: J-STD-020C JSTD020C STD-020C SRR0805 J-STD020C SRR1005 SRR1806 SRR6603 SDR1806
Text: Temperature of "Oval Shaped" Power Chokes Meets J-STD-020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD-020C , Table 4-2, for components with , meet the JEDEC J-STD-020C standard. All of the models listed that shipped after February 1, 2006 may be soldered at a temperature of +250 °C maximum per J-STD-020C. · SDR1005, SDR1806, and SDR2207


Original
PDF J-STD-020C J-STD-020C, 25mum J-STD-020C. SDR1005, SDR1806, SDR2207 SRR0804, J-STD-020-C J-STD-020C JSTD020C STD-020C SRR0805 J-STD020C SRR1005 SRR1806 SRR6603 SDR1806
2009 - G029

Abstract: JESD22a121 J-STD-002B
Text: /JEDEC J-STD-020C Table 4-1 and 4-2 (See Appendix 4). Pulse offers Sn100 or Sn alloy coatings on the , mount components, Pulse uses the peak solder temperature rating per J-STD-020C Table 5-2 and Figure 5 , to recertify that Pulse products meet the levels defined in the IPC/JEDEC J-STD-020C standard , : JEDEC J-STD-020C Table 5-2 "Classification Reflow Profiles" SN-Pb Eutectic Assembly Pb-Free , Peak Temperature JEDEC J-STD-020C Figure 5 . "Classification Reflow Profile" ©2009 Pulse


Original
PDF
2004 - JEDEC J-STD-020C

Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 J-STD-035 JESD22-A120 AMD reflow soldering profile BGA semiconductors cross reference ipc-sm-786A
Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY , . IPC/JEDEC J-STD-020C ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Moisture/Reflow Sensitivity , J-STD-020C Acknowledgment Members of the IPC Association Connecting Electronics Industries® IPC , , Plexus Corp. iii IPC/JEDEC J-STD-020C July 2004 This Page Intentionally Left Blank iv July 2004 IPC/JEDEC J-STD-020C Table of Contents 1 1.1 1.2 2 PURPOSE


Original
PDF J-STD-020C J-STD-020B 1-580987-46-X JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 J-STD-035 JESD22-A120 AMD reflow soldering profile BGA semiconductors cross reference ipc-sm-786A
2013 - JSTD020C

Abstract: J-STD-020C
Text: Soldering Zone TL (2)Preheat RT (1)Ramp up t1 t2 Time Form-1Reference JEDEC J-STD-020C , Temperature" Form-2 (Reference JEDEC J-STD-020C Table 4-1) 350mm3 350mm3 240 +0 , Temperature" Form-3 (Referencre JEDEC J-STD-020C Table 4-2) 350mm 3 350mm3-2000mm3 2000mm3 260 +0


Original
PDF AT06C10I IEEE802 AT06C10I 100KHz 2000Vrms, 06C10I J-STD-020C 350mm3 JSTD020C
2013 - J-STD-020C

Abstract: No abstract text available
Text: )Preheat RT (1)Ramp up t1 t2 Time Form-1Reference JEDEC J-STD-020C Table 5-2 IR reflow , -2 (Reference JEDEC J-STD-020C Table 4-1) 350mm3 350mm3 240 +0/-5ºC 225 +0/-5ºC , -3 (Referencre JEDEC J-STD-020C Table 4-2) 350mm 3 350mm3-2000mm3 2000mm3 260 +0/-5ºC 260 +0/-5ºC 260


Original
PDF AT06C10I IEEE802 AT06C10I 100KHz 2000Vrms, 06C10I J-STD-020C 350mm3
AT06C10I

Abstract: No abstract text available
Text: )Preheat (1)Ramp up t1 t2 Time IR reflow profile Form-1(Reference JEDEC J-STD-020C Table , € Form-2 (Reference JEDEC J-STD-020C Table 4-1) ≥ 350mm3 < 350mm3 240 +0/-5ºC 225 +0/-5ºC ï , -3 (Referencre JEDEC J-STD-020C Table 4-2) < 350mm 3 350mm3-2000mm3 > 2000mm3 260 +0/-5ºC 260 +0/-5ºC


Original
PDF AT06C10I IEEE802 100KHz 2000Vrms, 60minutes J-STD-020C 350mm3 AT06C10I
2013 - 12CrNi177

Abstract: Zestron
Text: Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245/5 245/5 245/5 245/5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40


Original
PDF
MSL Rating

Abstract: J-STD-020C passive
Text: Moisture Sensitivity Note Moisture/Reflow Sensitivity Classification(MSL),as defined in IPC/JEDEC Standard J-STD-020C , is not offered as part ofBournsresistive component standardproduct or packaging. J-STD-020C applies tononhermetic solid state surface mount devices and does not include passive resistive components. However, as a courtesy to frequent customer requests, Bourns resistive passive componentsmay be considered tobe compliant with an MSL = 1 rating. Bourns recommendsa maximum floor life of 4


Original
PDF J-STD-020C, J-STD-020C MSL Rating passive
2008 - IND1005-U

Abstract: B78476A8065A003 dcmr EPCOS 350 07 B78476 EPCOS 350 08 b78476a IND1005 IND1014-F 43 toroid core
Text: J-STD-020C Optimized for all major transceiver ICs Industry standard footprint RoHS-compatible , MSL stands for Moisture Sensitivity Level and is specified in JEDEC J-STD-020C as well as the solder , toroid, case and potting (UL 94 V-0) Compliant with IPC/JEDEC J-STD-020C Compliant with IEEE 802.3 MSL , J-STD-020C Compliant with IEEE 802.3 MSL level 2 Auto MDIX capable RoHS-compatible Marking , -0) Compliant with IPC/JEDEC J-STD-020C Compliant with IEEE 802.3 MSL level 2 RoHS-compatible Marking


Original
PDF
2011 - zestron

Abstract: 12CrNi177
Text: Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245/5 245/5 245/5 245/5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40


Original
PDF
JW Miller

Abstract: J-STD-020C JEDEC 2a MSL Rating Solid State Devices
Text: Moisture Sensitivity Note Moisture/Reflow Sensitivity Classification (MSL), as defined in IPC/JEDEC Standard J-STD-020C , applies to non-hermetic, solid state, surface-mount devices and does not include inductive components. J-STD-020C imposes dry packaging for solid state components with an MSL greater than "1." Bourns®/JW Miller's chip inductors and power inductors may be considered to be compliant with an MSL = 2a rating, specifying a floor life of four (4) weeks under the conditions: 30 °C


Original
PDF J-STD-020C, J-STD-020C JW Miller JEDEC 2a MSL Rating Solid State Devices
2013 - lph 36

Abstract: No abstract text available
Text: Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245/5 245/5 245/5 245/5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40


Original
PDF
td 3101

Abstract: a 3101
Text: . to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Approvals pending 3101.0071 l , . Thermoplastic 2 acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Approvals pending 3101.0076 , JEDEC JSTD- 020C < 5m at 20 mV > 3kV between L-N (50Hz; 1 min) > 4kV between L-N > 10M between L-N


Original
PDF com/pg02 W/10A J-STD-020C, td 3101 a 3101
1999 - SFH4272

Abstract: GPLY6724 OHLPY970
Text: Leuchtquelle 200µm x 200µm · Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard J-STD-020C · Black , to JEDEC Standard J-STD-020C Anwendungen Applications · Miniaturlichtschranken und , (nach J-STD-020C ) (acc. to J-STD-020C ) OHLA0687 300 Maximum Solder Profile Recommended Solder


Original
PDF 645nm J-STD-020C SFH4272 GPLY6724 OHLPY970
J-STD-020-C

Abstract: J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Text: Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C ) Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP Time within 5 ° of peak TP Ramp-down rate Lead Free Assembly 150 °C 200 °C 60-180 seconds 3 °C/second maximum 217 °C 60-120 seconds 245 °C , Reflow Profile (IPC/JEDEC J-STD-020C ) Wave soldering Maximum peak temperature: 250 °C ­ 260 °C for


Original
PDF J-STD-020C) J-STD-020-C J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Supplyframe Tracking Pixel