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J-STD-020C Datasheets Context Search

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J-STD-020C

Abstract: ipc 620 ipc 610 ipc 502 JORDAN TES-2N 2N2411 78143 78145 78426
Text: IPC/JEDEC J-STD-020C Table of Contents page Tested Flowchart 1 Tested Data before , after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO , Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard , Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process Visual


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PDF J-STD-020C 2N-2411 J-STD-020C ipc 620 ipc 610 ipc 502 JORDAN TES-2N 2N2411 78143 78145 78426
0853.12

Abstract: J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
Text: 40sec acc. to IPC/ JEDEC J-STD-020C < 5m at 20 mV > 3kV between L-N (50Hz; 1 min) > 4kV between L-N , Alloy Gold-Plated Copper Alloy Gold-Plated Copper Alloy Reflow Condition acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s acc


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PDF com/pg02b W/10A 500VAC/DC E39328 0853.12 J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
2N2423

Abstract: TES-2N 81121 15029 81413
Text: IPC/JEDEC J-STD-020C Table of Contents Page Tested Flowchart 1 Tested Data before , Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C , maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process , J-STD-020C Standard NO 31 After 3th Reflow Process 14 Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After


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PDF J-STD-020C 2N-2423 J-STD-020C 2N2423 TES-2N 81121 15029 81413
Not Available

Abstract: No abstract text available
Text: . to IPC/ JEDEC J-STD-020C < 5 m at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N > 10 M between , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263


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PDF com/pg02b
2013 - Not Available

Abstract: No abstract text available
Text: €‰sec acc. to IPC/ JEDEC J-STD-020C < 5 mΩ at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , . to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 , Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm


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PDF com/PG02
2013 - Not Available

Abstract: No abstract text available
Text: €‰sec acc. to IPC/ JEDEC J-STD-020C < 5 mΩ at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263


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PDF com/pg02b
smd fuse marking

Abstract: smd fuse marking 20 J-STD-020D fuse holder 5x20 JEDEC tray standard 13 fuse smd marking blue JSTD020C J-STD-020-C J-STD-020C
Text: (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C , Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x 173 mm(500 pcs.) 0031.8222 l Spec. Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , . Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Blister


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PDF com/pg02b W/10A 500VAC/DC smd fuse marking smd fuse marking 20 J-STD-020D fuse holder 5x20 JEDEC tray standard 13 fuse smd marking blue JSTD020C J-STD-020-C J-STD-020C
smd fuse marking

Abstract: smd fuse marking 20 JEDEC J-STD-020c 8309 J-STD-020C 0031.8221 8326 JSTD020C
Text: variants) 245°C / 3sec acc. to IEC 60068-2-58, Test Td 240 - 260°C / 20 - 40sec acc. to JEDEC J-STD-020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C ), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x , JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8263 l


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PDF com/pg02b W/10A Distribu516 smd fuse marking smd fuse marking 20 JEDEC J-STD-020c 8309 J-STD-020C 0031.8221 8326 JSTD020C
Not Available

Abstract: No abstract text available
Text: J-STD-020C , Tp=245 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8221 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=245 +0/-5 °C, tp = , Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=245 +0/-5 °C, tp = max. 30 s Blister Tray 266 x , J-STD-020C , Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263 l Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = max


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J-STD-020C

Abstract: J-STD-020-C J-STD020C JSTD020C JSTD-020C SRR0804 SRR0805 SRR1003 SRR1005 SRR1806
Text: " Power Chokes Meets J-STD-020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD-020C , Table 4-2, for components with a height greater than , design improvement allows an increase of the maximum soldering temperature to meet the JEDEC J-STD-020C , +250 °C maximum per J-STD-020C. · SDR1005, SDR1806, and SDR2207 (non-shielded) · SRR0804, SRR0805


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PDF J-STD-020C J-STD-020C, J-STD-020C. SDR1005, SDR1806, SDR2207 SRR0804, J-STD-020C J-STD-020-C J-STD020C JSTD020C JSTD-020C SRR0804 SRR0805 SRR1003 SRR1005 SRR1806
J-STD-020-C

Abstract: J-STD-020C JSTD020C STD-020C SDR1005 SDR1806 SRR0804 SRR0805 SRR1003 SRR1005
Text: Temperature of "Oval Shaped" Power Chokes Meets J-STD-020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD-020C , Table 4-2, for components with , meet the JEDEC J-STD-020C standard. All of the models listed that shipped after February 1, 2006 may be soldered at a temperature of +250 °C maximum per J-STD-020C. · SDR1005, SDR1806, and SDR2207


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PDF J-STD-020C J-STD-020C, 25mum J-STD-020C. SDR1005, SDR1806, SDR2207 SRR0804, J-STD-020-C J-STD-020C JSTD020C STD-020C SDR1005 SDR1806 SRR0804 SRR0805 SRR1003 SRR1005
2009 - G029

Abstract: JESD22a121 J-STD-002B
Text: /JEDEC J-STD-020C Table 4-1 and 4-2 (See Appendix 4). Pulse offers Sn100 or Sn alloy coatings on the , mount components, Pulse uses the peak solder temperature rating per J-STD-020C Table 5-2 and Figure 5 , to recertify that Pulse products meet the levels defined in the IPC/JEDEC J-STD-020C standard , : JEDEC J-STD-020C Table 5-2 "Classification Reflow Profiles" SN-Pb Eutectic Assembly Pb-Free , Peak Temperature JEDEC J-STD-020C Figure 5 . "Classification Reflow Profile" ©2009 Pulse


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2004 - JEDEC J-STD-020C

Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY , . IPC/JEDEC J-STD-020C ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Moisture/Reflow Sensitivity , J-STD-020C Acknowledgment Members of the IPC Association Connecting Electronics Industries® IPC , , Plexus Corp. iii IPC/JEDEC J-STD-020C July 2004 This Page Intentionally Left Blank iv July 2004 IPC/JEDEC J-STD-020C Table of Contents 1 1.1 1.2 2 PURPOSE


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PDF J-STD-020C J-STD-020B 1-580987-46-X JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
2013 - JSTD020C

Abstract: J-STD-020C
Text: Soldering Zone TL (2)Preheat RT (1)Ramp up t1 t2 Time Form-1Reference JEDEC J-STD-020C , Temperature" Form-2 (Reference JEDEC J-STD-020C Table 4-1) 350mm3 350mm3 240 +0 , Temperature" Form-3 (Referencre JEDEC J-STD-020C Table 4-2) 350mm 3 350mm3-2000mm3 2000mm3 260 +0


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PDF AT06C10I IEEE802 AT06C10I 100KHz 2000Vrms, 06C10I J-STD-020C 350mm3 JSTD020C
2013 - J-STD-020C

Abstract: No abstract text available
Text: )Preheat RT (1)Ramp up t1 t2 Time Form-1Reference JEDEC J-STD-020C Table 5-2 IR reflow , -2 (Reference JEDEC J-STD-020C Table 4-1) 350mm3 350mm3 240 +0/-5ºC 225 +0/-5ºC , -3 (Referencre JEDEC J-STD-020C Table 4-2) 350mm 3 350mm3-2000mm3 2000mm3 260 +0/-5ºC 260 +0/-5ºC 260


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PDF AT06C10I IEEE802 AT06C10I 100KHz 2000Vrms, 06C10I J-STD-020C 350mm3
AT06C10I

Abstract: No abstract text available
Text: )Preheat (1)Ramp up t1 t2 Time IR reflow profile Form-1(Reference JEDEC J-STD-020C Table , € Form-2 (Reference JEDEC J-STD-020C Table 4-1) ≥ 350mm3 < 350mm3 240 +0/-5ºC 225 +0/-5ºC ï , -3 (Referencre JEDEC J-STD-020C Table 4-2) < 350mm 3 350mm3-2000mm3 > 2000mm3 260 +0/-5ºC 260 +0/-5ºC


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PDF AT06C10I IEEE802 100KHz 2000Vrms, 60minutes J-STD-020C 350mm3 AT06C10I
2013 - 12CrNi177

Abstract: Zestron
Text: Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245/5 245/5 245/5 245/5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40


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MSL Rating

Abstract: J-STD-020C passive
Text: Moisture Sensitivity Note Moisture/Reflow Sensitivity Classification(MSL),as defined in IPC/JEDEC Standard J-STD-020C , is not offered as part ofBournsresistive component standardproduct or packaging. J-STD-020C applies tononhermetic solid state surface mount devices and does not include passive resistive components. However, as a courtesy to frequent customer requests, Bourns resistive passive componentsmay be considered tobe compliant with an MSL = 1 rating. Bourns recommendsa maximum floor life of 4


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PDF J-STD-020C, J-STD-020C MSL Rating passive
2008 - IND1005-U

Abstract: B78476A8065A003 dcmr EPCOS 350 07 B78476 IND1005 b78476a EPCOS 350 08 FERRITE TOROID 43 toroid core
Text: J-STD-020C Optimized for all major transceiver ICs Industry standard footprint RoHS-compatible , MSL stands for Moisture Sensitivity Level and is specified in JEDEC J-STD-020C as well as the solder , toroid, case and potting (UL 94 V-0) Compliant with IPC/JEDEC J-STD-020C Compliant with IEEE 802.3 MSL , J-STD-020C Compliant with IEEE 802.3 MSL level 2 Auto MDIX capable RoHS-compatible Marking , -0) Compliant with IPC/JEDEC J-STD-020C Compliant with IEEE 802.3 MSL level 2 RoHS-compatible Marking


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2011 - zestron

Abstract: 12CrNi177
Text: Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245/5 245/5 245/5 245/5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40


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JW Miller

Abstract: J-STD-020C JEDEC 2a MSL Rating Solid State Devices
Text: Moisture Sensitivity Note Moisture/Reflow Sensitivity Classification (MSL), as defined in IPC/JEDEC Standard J-STD-020C , applies to non-hermetic, solid state, surface-mount devices and does not include inductive components. J-STD-020C imposes dry packaging for solid state components with an MSL greater than "1." Bourns®/JW Miller's chip inductors and power inductors may be considered to be compliant with an MSL = 2a rating, specifying a floor life of four (4) weeks under the conditions: 30 °C


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PDF J-STD-020C, J-STD-020C JW Miller JEDEC 2a MSL Rating Solid State Devices
2013 - lph 36

Abstract: No abstract text available
Text: Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245/5 245/5 245/5 245/5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40


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td 3101

Abstract: a 3101
Text: . to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Approvals pending 3101.0071 l , . Thermoplastic 2 acc. to JEDEC J-STD-020C , Tp=260 +0/-5 °C, tp = 20-40 s Approvals pending 3101.0076 , JEDEC JSTD- 020C < 5m at 20 mV > 3kV between L-N (50Hz; 1 min) > 4kV between L-N > 10M between L-N


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PDF com/pg02 W/10A J-STD-020C, td 3101 a 3101
1999 - SFH4272

Abstract: GPLY6724 OHLPY970
Text: Leuchtquelle 200µm x 200µm · Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard J-STD-020C · Black , to JEDEC Standard J-STD-020C Anwendungen Applications · Miniaturlichtschranken und , (nach J-STD-020C ) (acc. to J-STD-020C ) OHLA0687 300 Maximum Solder Profile Recommended Solder


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PDF 645nm J-STD-020C SFH4272 GPLY6724 OHLPY970
J-STD-020-C

Abstract: J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Text: Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C ) Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP Time within 5 ° of peak TP Ramp-down rate Lead Free Assembly 150 °C 200 °C 60-180 seconds 3 °C/second maximum 217 °C 60-120 seconds 245 °C , Reflow Profile (IPC/JEDEC J-STD-020C ) Wave soldering Maximum peak temperature: 250 °C ­ 260 °C for


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PDF J-STD-020C) J-STD-020-C J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
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