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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
LT1584 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1580 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1005CT-5 Linear Technology IC VREG 5 V FIXED POSITIVE REGULATOR, PSFM, Fixed Positive Single Output Standard Regulator
LT117AHVH Linear Technology IC VREG 1.25 V-60 V ADJUSTABLE POSITIVE REGULATOR, MBCY3, TO-39, 3 PIN, Adjustable Positive Single Output Standard Regulator

J-STD-020B Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
SnPb36Ag2

Abstract: J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
Text: components shipment in volume in 2003 Standardisation IPC/JEDEC J-STD-020B · In July 2002, IPC/JEDEC approved a new procedure for high temperature Pb-free soldering, known as J-STD-020B standard · J-STD-020B takes two families of packages into account: "small" packages, having a body volume < 350 , profiles are specified by J-STD-020B : a profile with peak at 250°C for "small" packages and a profile with , Standardisation IPC/JEDEC J-STD-020B · E3 procedures are conform with the J-STD-020B · Existing results


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PDF 2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
2004 - SOLDERABILITY TEST

Abstract: No abstract text available
Text: tested per IPC/JEDEC J-STD-020B “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid , , three cycles, five minutes between cycles, at 245° C per table 5.2 of J-STD-020B , using the lead-free , passed testing per IPC/JEDEC J-STD-020B , Level 1. The results are summarized in the table below , Number of Samples Number Pass Number Fail IPC/JEDEC J-STD-020B , Level 1 20 20 0 IPC/JEDEC J-STD-020B , Level 1 20 20 0 Contact resistance remained within specification


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PDF MIL-STD-202, SOLDERABILITY TEST
JEDEC Code e3

Abstract: IEC-60068-2 J-STD-020B SSOT-23 IEC600682-58 TO92S package SC-75A SC-89 Si4410BDY-T1 Si4410BDY-T1-E3
Text: remain MSL Level 1 (JEDEC J-STD-020B ) · Easy to order by adding `-E3' to standard parts numbers , classification in accordance with JEDEC standard J-STD-020B. Qualification results will be available upon , profiles specified in J-STD-020B when released. In addition, all products will continue to meet the , accordance with JEDEC STD 020B can be evaluated upon special request. Device Identification Part numbers


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PDF J-STD-020B) QFN-16 SC-70 SC-89 O-100 OT-23 TSOT-23 SQFP-48 JEDEC Code e3 IEC-60068-2 J-STD-020B SSOT-23 IEC600682-58 TO92S package SC-75A SC-89 Si4410BDY-T1 Si4410BDY-T1-E3
JEDEC J-STD-033A

Abstract: AMD Package moisture LBA399 F-1249 J-STD-033A MIL-I-18835 MIL-PRF-81705D ASTM 1249 J-STD-033 J-STD-020B
Text: classify the moisture sensitivity of its products, AMD has adopted the IPC/JEDEC joint standard J-STD-020B. , sensitivity of IC components. IPC/JEDEC Standard J-STD-020B. This test standard defines six different , steps. The only difference between each J-STD-020B flow is the parameters of the moisture soak step , /JEDEC J-STD-020B. DRY PACKING PROCESS AND MATERIALS The first step in the dry pack process is to


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2005 - JEDEC J-STD-020B

Abstract: JEDEC MO-153 74VHC14 J-STD-020B 74VHC14MTCX 74VHC14M 74VHC14N 74VHC14MTC_NL VHC04 VHC14
Text: Pb-Free package per JEDEC J-STD-020B. Note 1: Surface mount packages are also available on Tape and Reel , (per JEDEC J-STD-020B ). Device is available in Tape and Reel only. Note 3: "_NL" indicates Pb-Free product (per JEDEC J-STD-020B ). © 2005 Fairchild Semiconductor Corporation DS011617


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PDF 74VHC14 VHC14 VHC04 JEDEC J-STD-020B JEDEC MO-153 74VHC14 J-STD-020B 74VHC14MTCX 74VHC14M 74VHC14N 74VHC14MTC_NL
431ai

Abstract: J-STD-020B J-STD-020-B 84-1 LMI 3LD-SOT-89 MP180 84-1LMI S6431 bd6431 JSTD020B
Text: 311005J JSTD- 020B JSTD- 020B 2/27/2004 2/27/2004 3/26/2004 3/26/2004 25 22 Marking


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PDF 431AI-2-27-2004-93 431AI MP180 S6431 BD6431/NX-PK 311005J 2004-RM-42 311005J 431ai J-STD-020B J-STD-020-B 84-1 LMI 3LD-SOT-89 MP180 84-1LMI bd6431 JSTD020B
2010 - IMB03C

Abstract: IMB06CGR IMB02C IMB Electronics 1462041-1 1462041 imb06cg IMB06C IMB04CGR IMB03CGR
Text: IEC 60058-2-58 and Signal Relays IPC/JEDEC J-STD-020B Recommended Soldering Conditions Packing , IM IEC and (Continued) - 60058-2-58 A/B Relay typical Full line: 20-40sec IPC/JEDEC J-STD-020B , forced cooling Soldering130°C conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B 100°C 180°C 240°C 130°C 100°C Temperature °C 180°C 130°C 100°C Time (s) Time (s) 20-40sec IPC/JEDEC J-STD-020B


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PDF 60mm2 10x6mm 0W/62 220VDC/250VAC 220VDC, 125VDC, 250VAC, 125VA IMB03C IMB06CGR IMB02C IMB Electronics 1462041-1 1462041 imb06cg IMB06C IMB04CGR IMB03CGR
J-STD-020B

Abstract: VSMF4720 VSMF4720-GS08 VSMF4720-GS18
Text: 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B J-STD-051, soldered on PCB SYMBOL VR , 2a, acc. to J-STD-020B. 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s , Time (s) Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020B for Preconditioning acc. to


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PDF VSMF4720 J-STD-020 AEC-Q101 2002/95/EC 2002/96/EC 18-Jul-08 J-STD-020B VSMF4720 VSMF4720-GS08 VSMF4720-GS18
2009 - diode Sr 26

Abstract: No abstract text available
Text: UNIT V mA mA A mW °C °C °C °C K/W tp/T = 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B , , acc. to J-STD-020B. Temperature (°C) 200 max. 30 s 150 max. 120 s 100 50 0 0 50 100 150 200 250 , (Pb)-free Reflow Solder Profile acc. J-STD-020B for Preconditioning acc. to JEDEC, Level 2a TAPE


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PDF VSMG2720 J-STD-020 2002/95/EC 2002/96/EC VSMG2720 18-Jul-08 diode Sr 26
2005 - 7Z86

Abstract: 7z86 8 MA05B NC7SZ86 NC7SZ86L6X NC7SZ86M5X NC7SZ86P5 NC7SZ86P5X
Text: JEDEC J-STD-020B. Note 1: "_NL" indicates lead-free product (per JEDEC J-STD-020B ). Note 2: "_NL" indicates lead-free product (per JEDEC J-STD-020B ). Device is available in Tape and Reel only. TinyLogic


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PDF NC7SZ86 NC7SZ86 7Z86 7z86 8 MA05B NC7SZ86L6X NC7SZ86M5X NC7SZ86P5 NC7SZ86P5X
2008 - J-STD-020B

Abstract: VSMF4720 VSMF4720-GS08 VSMF4720-GS18
Text: tp/T = 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B J-STD-051, soldered on PCB , < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020B. 200 max. 30 s 150 max. 100 , acc. J-STD-020B for Preconditioning acc. to JEDEC, Level 2a DRYING In case of moisture absorption


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PDF VSMF4720 VSMF4720 18-Jul-08 J-STD-020B VSMF4720-GS08 VSMF4720-GS18
J-STD-020B

Abstract: VSMG2720 VSMG2720-GS08 VSMG2720-GS18
Text: -May-09 TEST CONDITION tp/T = 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B J-STD , sensitivity level 2a, acc. to J-STD-020B. max. 30 s max. 120 s Devices are packed in moisture barrier , . J-STD-020B for Preconditioning acc. to JEDEC, Level 2a DRYING In case of moisture absorption


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PDF VSMG2720 J-STD-020 AEC-Q101 2002/95/EC 2002/96/EC 18-Jul-08 J-STD-020B VSMG2720 VSMG2720-GS08 VSMG2720-GS18
nt600

Abstract: ESD test plan J-STD-020B JESD78 NT600H-10000 100C J-STD-020-B
Text: Condition Start End S/S 2006-RM-33 2006-RM-32 545005AJ E545004AJ JSTD- 020B JSTD- 020B


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PDF 972A-1-10-2006-472 NT600H-10000 S1972A BD1972A BI1972 E545004AJ 545005AJ 2006-RM-32 2006-RM-33 nt600 ESD test plan J-STD-020B JESD78 NT600H-10000 100C J-STD-020-B
2005 - 7Z00

Abstract: MO-178 MO178 jedec MO-178 AB NC7SZ00M5X-NL NC7SZ00M5 NC7SZ00L6X NC7SZ00P5 NC7SZ00P5X NC7SZ00
Text: JEDEC J-STD-020B. Note 1: "_NL" indicates lead-free product (per JEDEC J-STD-020B ). Note 2: "_NL" indicates lead-free product (per JEDEC J-STD-020B ). Device is available in Tape and Reel only. TinyLogic


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PDF NC7SZ00 NC7SZ00 7Z00 MO-178 MO178 jedec MO-178 AB NC7SZ00M5X-NL NC7SZ00M5 NC7SZ00L6X NC7SZ00P5 NC7SZ00P5X
2005 - 7Z04

Abstract: NC7SZ04M5X SOT70 Package dimensions SOT70 SOT70 Package NC7SZ04L6X SOT23-5 MARK R50 NC7SZ04P5 NC7SZ04P5X R50 SOT23
Text: -Lead MicroPak, 1.0mm Wide 5k Units on Tape and Reel Pb-Free package per JEDEC J-STD-020B. Note 1: "_NL" indicates Pb-Free product (per JEDEC J-STD-020B ). Device is available in Tape and Reel only. Note 2: "_NL" indicates Pb-Free product (per JEDEC J-STD-020B ). TinyLogic£ is a registered trademark of Fairchild


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PDF NC7SZ04 NC7SZ04 7Z04 NC7SZ04M5X SOT70 Package dimensions SOT70 SOT70 Package NC7SZ04L6X SOT23-5 MARK R50 NC7SZ04P5 NC7SZ04P5X R50 SOT23
7361

Abstract: JESD97 J-STD-020B
Text: terminations. MSL PCT, LSR, MCT and TB series moisture sensitivity level per IPC/Jedec J-STD-020B is level 1. CGT series moisture sensitivity level per IPC/Jedec J-STD-020B is level 3. Visual standard Lead-free


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2005 - 7Z08

Abstract: SOT23 JEDEC NC7SZ08P5X_NL SOT23-5 MARK R50 NC7SZ08M5X NC7SZ08P5X R50 SOT23 NC7SZ08M5 NC7SZ08L6X NC7SZ08
Text: package per JEDEC J-STD-020B. Note 1: "_NL" indicates lead-free product (per JEDEC J-STD-020B ). Note 2: "_NL" indicates lead-free product (per JEDEC J-STD-020B ). Device is available in Tape and Reel only


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PDF NC7SZ08 NC7SZ08 7Z08 SOT23 JEDEC NC7SZ08P5X_NL SOT23-5 MARK R50 NC7SZ08M5X NC7SZ08P5X R50 SOT23 NC7SZ08M5 NC7SZ08L6X
2005 - 74AC20

Abstract: MTC14 M14D M14A AC20 74AC20SJ 74AC20SC 74AC20PC 74AC20MTC N14A
Text: . Specify by appending suffix letter "X" to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: "_NL" indicates Pb-Free package (per JEDEC J-STD-020B ). Logic Symbol Connection Diagram


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PDF 74AC20 74AC20SC 14-Lead MS-012, 74AC20SJ 74AC20MTC MTC14 MO-153, 74AC20 MTC14 M14D M14A AC20 74AC20SJ 74AC20SC 74AC20PC 74AC20MTC N14A
2005 - Q65110A3653

Abstract: e9555 SFH 3710
Text: Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020B ) (acc. to J-STD-020B ) OHLA0687 T 250


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PDF E9555 E9555 Q65110A3653 Q65110A3653 SFH 3710
2005 - 74LVX00

Abstract: MTC14 M14D M14A LVX00 74LVX00SJ 74LVX00MX 74LVX00MTCX 74LVX00MTC 74LVX00M
Text: "X" to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: "_NL" indicates Pb-Free package (per JEDEC J-STD-020B ). Device available in Tape and Reel only. Logic Symbol Connection


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PDF 74LVX00 LVX00 74LVX00M 14-Lead MS-012, 74LVX00MX 14-LeadWITHOUT 74LVX00 MTC14 M14D M14A 74LVX00SJ 74LVX00MTCX 74LVX00MTC 74LVX00M
ecopack

Abstract: SMD Packages J-STD-033A
Text: following JEDEC STD- 020B requirements and criteria : 245°C profile applied to large packages (>350mm3) and , Temperature in °C E3-profile 260°C for small packages vs. J-STD 020B ­250°C 280 260 240 220 200 180


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PDF J-STD020B ecopack SMD Packages J-STD-033A
2004 - phototransistor 550 nm

Abstract: No abstract text available
Text: Preconditioning acc. to JEDEC Level 2 (nach J-STD-020B ) (acc. to J-STD-020B ) OHLA0687 T 250 Maximum Solder


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PDF Q65110A3107 phototransistor 550 nm
2005 - Not Available

Abstract: No abstract text available
Text: acc. to JEDEC Level 2 (nach J-STD-020B ) (acc. to J-STD-020B ) OHLA0687 T 250 Maximum Solder


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PDF Q65110A3107
2005 - Not Available

Abstract: No abstract text available
Text: acc. to JEDEC Level 2 (nach J-STD-020B ) (acc. to J-STD-020B ) OHLA0687 T 250 Maximum Solder


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PDF Q65110A3107 Q65110A3512 Q65110A3511
1999 - Q65110A3107

Abstract: Q65110A35 GEOY7009 OHFP2578 Q65110A3511 SFH3710
Text: J-STD-020B ) (acc. to J-STD-020B ) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile


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