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Part Manufacturer Description Datasheet Download Buy Part
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
LT1584 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1580 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1005CT-5 Linear Technology IC VREG 5 V FIXED POSITIVE REGULATOR, PSFM, Fixed Positive Single Output Standard Regulator
LM317HVH Linear Technology IC VREG 1.2 V-57 V ADJUSTABLE POSITIVE REGULATOR, MBCY3, TO-39, 3 PIN, Adjustable Positive Single Output Standard Regulator

J-STD-002B Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2004 - Kester 182

Abstract: No abstract text available
Text: shown in Table 1. A key exception in this testing to IPC/JEDEC J-STD-002B was the solder pot , Conference, IEEE, pp 6-9. 4 IPC/JEDEC J-STD-002B specification – 4.3.1 Test E Wetting Balance Test , immersion speed: 25.4 mm/s immersion depth: 3 mm flux approved for J-STD-002B : Kester 182 (slightly , IPC/JEDEC J-STD-002B specification section 4.3.1 Wetting Balance Test) are: T0 - time to zero , solder at 220 °C. 7 From IPC/JEDEC J-STD-002B Tyco Electronics Test Report – Solderability of


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PDF 10NOV04 Kester 182
2004 - SOLDERABILITY TEST

Abstract: No abstract text available
Text: /JEDEC J-STD-002B , Test Method A. The following two groups of DIP switches were used for the testing , Number Fail IPC/EIA/JEDEC J-STD-002B 20 20 0 IPC/EIA/JEDEC J-STD-002B 20 20 0 IPC/EIA/JEDEC J-STD-002B 20 20 0 IPC/EIA/JEDEC J-STD-002B 20 20 0 3. Process


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PDF MIL-STD-202, SOLDERABILITY TEST
2011 - marking CODE 001

Abstract: 106G 204D 213B J-STD-002B LR29862 fuse 8A
Text: ± 0.200 [0.039 ± 0.008 1.63 + 0.1/-0.2 [0.064 + 0.004/-0.008] IPC/EIC/JEDEC J-STD-002B , IPC/EIC/JEDEC J-STD-002B , Condition B MIL -STD-202, Method 107G, Condition B Mechanical Shock


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PDF E10480 LR29862 EIA-481, com/series/469 marking CODE 001 106G 204D 213B J-STD-002B LR29862 fuse 8A
2013 - J-STD-002B

Abstract: 32VAC
Text: -STD-202, Method 201A MIL -STD-202, Method 204D, Condition D IPC/EIC/JEDEC J-STD-002B , Condition D IEC , Resistance to Solder Heat IPC/EIC/JEDEC J-STD-002B , Condition B MIL-STD-202, Method 103B, Conditions D


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PDF E10480 lR29862 EIA-481, J-STD-002B 32VAC
2012 - Part marking

Abstract: No abstract text available
Text: , Condition D IPC/EIC/JEDEC J-STD-002B , Condition D Materials Moisture IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability Humidity Resistance to Solder Heat IPC/EIC/JEDEC J-STD-002B , Condition B


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PDF E10480 LR29862 EIA-481, com/series/438 Part marking
2014 - Not Available

Abstract: No abstract text available
Text: -020C, Level 1 Sensitivity Level Mechanical Shock Vibration IPC/EIC/JEDEC J-STD-002B , Condition B , , Condition A Thermal Shock IEC 60127-4 IPC/EIC/JEDEC J-STD-002B , Condition D Part Marking System


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PDF E10480 LR29862 EIA-481,
2011 - 1206 footprint IPC

Abstract: No abstract text available
Text: Wetting IPC/JEDEC J-STD-002B test B Electrical Test not required Magnification 50X SMD conditions , damage - Leaching IPC/JEDEC J-STD-002B test D Leadfree solder, 260 ° 30 seconds C, immersion


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PDF PE1206-series PE1206 PE1206 J-STD-002B 1206 footprint IPC
2010 - 2010 SMD SURFACE RESISTANCE

Abstract: surface mount diode w1 Yageo resistor 2010 106G J-STD-002B 910M smd APT2010
Text: / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B -55/+125 °C Note , % + 0.0005) Well tinned (>95% covered) No visible damage - Leaching IPC/JEDEC J-STD-002B


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PDF PT2010 PT2010 J-STD-002B 2010 SMD SURFACE RESISTANCE surface mount diode w1 Yageo resistor 2010 106G J-STD-002B 910M smd APT2010
2014 - Not Available

Abstract: No abstract text available
Text: IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability IPC/EIC/JEDEC J-STD-002B , Condition , , Condition D Dissolution of Metallization IPC/EIC/JEDEC J-STD-002B , Condition D Terminal Strength


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PDF E10480 LR29862 EIA-481,
2013 - iec 60286

Abstract: No abstract text available
Text: , Method 204D, Condition D IPC/EIC/JEDEC J-STD-002B , Condition D IEC 60127-4 Moisture IPC/JEDEC J-STD , /EIC/JEDEC J-STD-002B , Condition B MIL-STD-202, Method 103B, Conditions D MIL-STD-202, Method 210F


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PDF E10480 LR29862 EIA-481, iec 60286
2013 - Not Available

Abstract: No abstract text available
Text: Moisture IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability IPC/EIC/JEDEC J-STD-002B , , Condition D Dissolution of Metallization IPC/EIC/JEDEC J-STD-002B , Condition D Terminal Strength


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PDF E10480 LR29862 EIA-481,
1206 footprint IPC

Abstract: 1206 footprint dimension RESISTOR footprint dimension RESISTOR FOOTPRINT 1206 PF1206FRF7W0R01L Resistor dimensions 1206 to mm YAGEO CHIP RESISTORS Mounting 1206 footprint PF1206 1206 smd resistor
Text: Solderability - Wetting IPC/JEDEC J-STD-002B test B MIL-STD-202 Method 106G - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC 60068-2-58 PROCEDURE 1,000 hours at


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PDF PF1206 PF1206 1206 footprint IPC 1206 footprint dimension RESISTOR footprint dimension RESISTOR FOOTPRINT 1206 PF1206FRF7W0R01L Resistor dimensions 1206 to mm YAGEO CHIP RESISTORS Mounting 1206 footprint 1206 smd resistor
RESISTOR footprint dimension

Abstract: YAGEO CHIP RESISTORS MARKING RC yageo RC0100JR-0710RL Yageo 01005 Yageo part marking footprint dimension of resistors yageo RC0100 106G
Text: 2 mm bending time: 60±5 seconds ±(1%+0.05) Solderability - Wetting IPC/JEDEC J-STD-002B , Well tinned (>95% covered) No visible damage -Leaching IPC/JEDEC J-STD-002B test D Solder


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PDF RC01005 RC01005 RESISTOR footprint dimension YAGEO CHIP RESISTORS MARKING RC yageo RC0100JR-0710RL Yageo 01005 Yageo part marking footprint dimension of resistors yageo RC0100 106G
smd jsp

Abstract: SN100C "IPC-9701" IPC-9701 HASL IPC-A-610C J-STD-002B SN63
Text: balance test method per J-STD-002B (Test Method F) with solder bath temperature of 263°C and a 2 , average wetting force of .20 mN/mm. · Metallization dissolution resistance ­ Per J-STD-002B (Test


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PDF IPC-A-610C smd jsp SN100C "IPC-9701" IPC-9701 HASL IPC-A-610C J-STD-002B SN63
2014 - Not Available

Abstract: No abstract text available
Text: -020C, Level 1 Sensitivity Level Mechanical Shock Vibration IPC/EIC/JEDEC J-STD-002B , Condition B , , Condition A Thermal Shock IEC 60127-4 IPC/EIC/JEDEC J-STD-002B , Condition D Part Marking System


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PDF E10480 LR29862 EIA-481,
2013 - Not Available

Abstract: No abstract text available
Text: , Condition D IPC/EIC/JEDEC J-STD-002B , Condition D IEC 60127-4 Materials Moisture IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability Humidity Test Resistance to Solder Heat IPC/EIC/JEDEC J-STD-002B


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PDF E10480 LR29862 EIA-481,
2009 - J-STD-002B

Abstract: Resistor-1w smd code marking resistor Reel Taping Specification JEDEC smd marking 2D SMD resistors codes smd code marking 2D SMD MARKING CODE 3f YAGEO CHIP RESISTORS MARKING PR2512FKF070R005L
Text: / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC 60068-2-58 MIL-STD-202 Method


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PDF PR2512 PR2512 J-STD-002B Resistor-1w smd code marking resistor Reel Taping Specification JEDEC smd marking 2D SMD resistors codes smd code marking 2D SMD MARKING CODE 3f YAGEO CHIP RESISTORS MARKING PR2512FKF070R005L
2013 - Not Available

Abstract: No abstract text available
Text: J-STD-002B , Condition B Humidity MIL-STD-202, Method 103B, Conditions D Resistance to Solder , J-STD-002B , Condition D Terminal Strength IEC 60127-4 Part Marking System Amp Code 1.54 Â


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PDF E10480 lR29862 EIA-481,
J-STD-002B

Abstract: Yageo 0805 resistor YAGEO CHIP RESISTORS MARKING yageo smd 0805 thick film resistor 0.25w resistor 1/4 J-STD002B PT0805FR-7W0R22L 106G led(0805)r PT0805FR
Text: / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B MIL-STD-202 Method 106G - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC


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PDF PT0805 J-STD-002B Yageo 0805 resistor YAGEO CHIP RESISTORS MARKING yageo smd 0805 thick film resistor 0.25w resistor 1/4 J-STD002B PT0805FR-7W0R22L 106G led(0805)r PT0805FR
2013 - Not Available

Abstract: No abstract text available
Text: /JEDEC J-STD-020C, Level 1 Sensitivity Level Mechanical Shock Vibration IPC/EIC/JEDEC J-STD-002B , -STD-202, Method 213B, Condition A Thermal Shock IEC 60127-4 IPC/EIC/JEDEC J-STD-002B , Condition


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PDF E10480 LR29862 EIA-481,
Resistor dimensions 1206 to mm

Abstract: 106G 1206 smd resistor 000 Ceramic Resistor 5W J-STD-002B PT-120 PT1206FR-7W0R22L smd resistor 000 1206 yageo 1206 smd
Text: Solderability - Wetting IPC/JEDEC J-STD-002B test B MIL-STD-202 Method 106G - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC 60068-2-58 PROCEDURE 1,000 hours at


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PDF PT0805 Resistor dimensions 1206 to mm 106G 1206 smd resistor 000 Ceramic Resistor 5W J-STD-002B PT-120 PT1206FR-7W0R22L smd resistor 000 1206 yageo 1206 smd
pf2512 YAGEO

Abstract: YAGEO PF2512 PF2512 2w SMD CODE MARKING pf2512fkf7w0r YAGEO PF2512 datasheet smd transistor 2d SMD MARKING CODE transistor smd code marking resistor Chip Resistors Mounting
Text: / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B -Leaching , : 3±0.5 seconds Well tinned (>95% covered) No visible damage IPC/JEDEC J-STD-002B test D


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PDF PF2512 PF2512 J-STD-002B pf2512 YAGEO YAGEO PF2512 2w SMD CODE MARKING pf2512fkf7w0r YAGEO PF2512 datasheet smd transistor 2d SMD MARKING CODE transistor smd code marking resistor Chip Resistors Mounting
2w SMD CODE MARKING

Abstract: 106G J-STD-002B J-STD002B PT0603
Text: 60115-1 4.13 Board Flex/ Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC


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PDF PT0603 PT0603 termina50X 2w SMD CODE MARKING 106G J-STD-002B J-STD002B
2011 - thermal fuse Littelfuse

Abstract: 106G 204D 213B J-STD-002B LR29862 ampere displays
Text: Humidity Test Resistance to Solder Heat Dimensions IPC/EIC/JEDEC J-STD-002B , Condition D , Vibration, High Frequency IPC/EIC/JEDEC J-STD-002B , Condition B MIL -STD-202, Method 213B


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PDF E10480 LR29862 EIA-481, com/series/437 thermal fuse Littelfuse 106G 204D 213B J-STD-002B LR29862 ampere displays
2010 - Not Available

Abstract: No abstract text available
Text: DS90219- 002B 1 VPTc10-28 Series SPECIFICATIONS (TCASE = -55°C to +100°C, VIN = +28V ± 5%, Full , by qualification testing. DS90219- 002B 2 VPTc10-28 Series BLOCK DIAGRAM Figure 2 , Converters) DS90219- 002B 3 VPTc10-28 Series PERFORMANCE CURVES 50 40 30 Vout (V) 20 10 0 -10 -40 , during 202V, 350ms Transient Figure 7 ­ Vin, Vout during 100V, 100ms Transient DS90219- 002B 4 , Figure 10 ­ MIL-STD-461D/E Two VPT100-2800S With VPTi10-28 Input Module DS90219- 002B 5 VPTc10


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PDF VPTc10-28 MIL-STD-1275, MIL-STD704, MIL-STD-461. MIL-STD-883, DS90219-002B
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