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Part Manufacturer Description Datasheet Download Buy Part
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
LT1584 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1580 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1005CT-5 Linear Technology IC VREG 5 V FIXED POSITIVE REGULATOR, PSFM, Fixed Positive Single Output Standard Regulator
LT117AHVH Linear Technology IC VREG 1.25 V-60 V ADJUSTABLE POSITIVE REGULATOR, MBCY3, TO-39, 3 PIN, Adjustable Positive Single Output Standard Regulator

J-STD-002 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
J-STD-020C

Abstract: ipc 620 ipc 610 78426 78145 78143 2N2411 JSTD020C TES-2N JORDAN
Text: 30.4 28.8 36.8 45.6 40 25.6 41.6 37.6 22.4 31.2 36 32.8 0 0 0.02 0 0.02 0 0.02 0 0 0 0.02 0.02 0.02 0.02 - 0.02 0 0.02 0.02 0.02 0.02 0.02 0 0.02 0 0.02 0.02 0 0.02 0.02 0.000 0.707 0.121 0.08 0.1 0.141 0.141 0.12 0.161 0.221 0.201 0.1 0.101 0.1 , 34.4 41.6 34.4 - 0.02 0.02 0.04 0 0 0.04 0 0 0 0 0.02 0.02 0 0.02 0.02 0 0.04 0 0 0 0 - 0.02 0.061 0.02 0.02 0 0 0.02 0 0.020 0.381 0.362 0.322 0.402 0.342 0.362


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PDF J-STD-020C 2N-2411 J-STD-020C ipc 620 ipc 610 78426 78145 78143 2N2411 JSTD020C TES-2N JORDAN
2N2423

Abstract: TES-2N 81121 15029 81413
Text: 19.2 21.6 26.4 -0.5 ~ 0.5 0.00 0.04 0.01 0.04 -0.03 0.07 -0.01 0.05 -0.01 0.05 0.02 , 0.01 0.05 0.00 0.03 0.02 0.03 -0.01 0.05 0.00 0.03 0.00 0.05 -0.01 0.05 0.00 0.05 0.01 0.04 0.02 0.03 0.03 0.03 0.02 0.01 0.01 0.04 0.01 0.03 0.00 0.04 0.01 0.05 Load , 0.00 0.05 0.01 0.04 -0.05 0.07 -0.03 0.05 0.01 0.05 0.02 0.04 0.01 0.05 -0.01 0.05 -0.01 0.07 0.02 0.05 0.01 0.05 - 0.02 0.04 0.01 0.03 -0.52 0.03 0.01 0.03 0.01 0.04 0.01


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PDF J-STD-020C 2N-2423 J-STD-020C 2N2423 TES-2N 81121 15029 81413
2013 - JESD 201 class 1A

Abstract: No abstract text available
Text: ® eSMP® SeriesV10PN50 J-STD-002 low voltage high frequency DC/DC converters, CHARACTERISTICS MECHANICAL , solderable per J-STD-002 VRRM - halogen-free, RoHS-compliant, and 22-B102 Base P/N-M3 0.40 V VF atJ F , 22-B102 solderable per 260 °C TJIFSM 2 150 °C J-STD-002 and JESD tin plated 1A whisker test , reverse voltage 150 °C TJ max. J-STD-002 and JESD 22-B102 Maximum repetitive A V suffix at I V , please meets JESD 201 10 IF (1) TJ max. 150 °C TJ max. TO-277A (SMPC) 150 °C J-STD-002 and A


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PDF O-277A V10PN50 V15PN50 VMN-PT0378-1308 91000TO JESD 201 class 1A
2004 - J-STD-002

Abstract: CA110338 E174545 C0804
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 , C Recommended Pad Layout 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004


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PDF MF-SMDF050 J-STD-002 CA110338 E174545 C0804
2004 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3. 3.4 ± 0.1 (.134 ± .004) D Recommended Storage: 40 °C max , . 0.30 (0.012) Max. 1.09 (0.043) 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6


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PDF MF-SMDF050
2001 - 122j

Abstract: c822j
Text: ° C a b o v e t h e a m b i e n t temperature of 25°C Measured at 25°C IEC 68-2-54, ANSI/ J-STD-002 , -682J- 07P/C-822J- L (µH) 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 F L (MHZ) 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 Tol. (%) ±10 ±10 ±5 ±5 ±5 ±5 ±5 ±5 ±5


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PDF 07P/C 07P/C-681K- 07P/C-821K- 07P/C-102J- 07P/C-122J- 07P/C-152J- 07P/C-182J- 07P/C-222J- 07P/C-272J- 07P/C-332J- 122j c822j
2001 - 223J50

Abstract: 333J50
Text: , ANSI/ J-STD-002 MIL-STD-202F, Method 208D ANSI/I-JSTD-003 2. DC-Resistance 3. Solderability (W etting , 39000 47000 56000 68000 82000 100000 150000 F L (MHZ) 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 Tol. (%) ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 Q min 50 50 50 50 50 50 50 50 50


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PDF 11P/C 11P/C-103J-50 11P/C-123J-50 11P/C-153J-50 11P/C-183J-50 11P/C-223J-50 11P/C-273J-50 11P/C-333J-50 11P/C-393J-50 11P/C-473J-50 223J50 333J50
2004 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± 0.1 (.063 ± .004) 2.0 ± 0.1


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PDF MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150
2015 - Not Available

Abstract: No abstract text available
Text: hours), samples from 4 IPC/EIA/JEDEC J-STD-002 12/0 IPC/EIA/JEDEC J-STD-002 12/0 , Lead Free solder IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 Thermal Shock Thermal Shock samples from


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PDF AN-00-004) AN-00-004 M150261 AN00004
2001 - c471k

Abstract: No abstract text available
Text: °C IEC 68-2-54, ANSI/ J-STD-002 MIL-STD-202F, Method 208D ANSI/I-JSTD-003 2. DC-Resistance 3 , 12000 15000 18000 22000 27000 33000 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 Tol. (%) ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10


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PDF 09P/C 09P/FC 09P/FC 09P/C-100K- 09P/C-150K- 09P/C-220K- 09P/C-330K- 09P/C-470K- c471k
2004 - MF diode By 127

Abstract: J-STD-002 95% MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 jstd 002
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3. E , Layout C A 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± 0.1 (.063 ± .004) B


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PDF MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF diode By 127 J-STD-002 95% MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 jstd 002
2004 - MFSMDF030

Abstract: 0 281 002 472
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , Recommended Pad Layout 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1


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PDF MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 MFSMDF030 0 281 002 472
2004 - J-STD-002

Abstract: 0 281 002 472 MF-SMDF200 MF-SMDF150 MF-SMDF100 MF-SMDF050 MF-SMDF030 MF-SMDF150/33 J-STD-002 95% IEEE-472 074
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , View 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) B MM


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PDF MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 J-STD-002 0 281 002 472 MF-SMDF200 MF-SMDF150 MF-SMDF100 MF-SMDF050 MF-SMDF030 MF-SMDF150/33 J-STD-002 95% IEEE-472 074
PRCP-USMF020

Abstract: PRCP-USMF035
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. D , 8.00 8.00 8.00 5.00 5.00 1.50 0.60 0.02 0.20 0.10 0.10 1.00 5.00 0.6 0.6 0.6 0.6 , / 0.47 / 0.70 / 0.85 / C 0.09 0.12 0.24 0.47 0.58 0.94 1.40 1.70 85 C 0.02 / 0.06 0.05 , ) Packaging: 3000 pcs. per reel. 1.0 ± 0.05 (.039 ± . 002 ) MM (INCHES) Recommended Pad Layout C


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PDF PRCP-USMF005 PRCP-USMF010 PRCP-USMF020 PRCP-USMF035 PRCP-USMF050 PRCP-USMF075 PRCP-USMF110 PRCP-USMF150* PRCP-USMF020 PRCP-USMF035
2010 - MF-USMF005

Abstract: MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150
Text: ANSI/ J-STD-002 . 95 % min. coverage UL File Number , immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2 , 0.60 0.6 5.000 8.00 0.02 0.6 0.200 1.300 8.00 0.20 0.6 0.180 0.900 , Top and Bottom View 1.0 ± 0.05 (.039 ± . 002 ) MM (INCHES) 1.0 ± 0.05 (.039 ± . 002 ) 2.5 ± , °C 85 °C MF-USMF005 0.08 0.07 0.06 0.05 0.04 0.04 0.03 0.03 0.02


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PDF
2008 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max , 0.02 0.20 0.10 0.10 1.00 5.00 1.00 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.7 Environmental , . per reel. Top and Bottom View A Side View C Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 2.5 ± 0.1 (.098 ± .004) 2.0 ± 0.1 (.079 ± .004) D A Min. 3.00 (0.118) 3.00 (0.118


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PDF MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110
2006 - MF-USMF020

Abstract: MF-USMF150-2 MF-USMF005 MF-USMF010 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2 , Seconds at 23 °C 0.25 0.50 8.00 8.00 8.00 8.00 5.00 5.00 1.50 0.60 0.02 0.20 0.10 0.10 , °C 0.03 0.06 0.12 0.22 0.29 0.47 0.70 0.85 85 °C 0.02 0.05 0.10 0.18 0.23 0.39 0.58 , (.039 ± . 002 ) MM (INCHES) Recommended Pad Layout C A D Min. 0.30 (0.012) 0.30


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PDF MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150* Hold35 MF-USMF020 MF-USMF150-2 MF-USMF005 MF-USMF010 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150
2010 - Not Available

Abstract: No abstract text available
Text: / J-STD-002 . 95 % min. coverage UL File Number , Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C , 0.15 0.30 0.40 0.75 1.00 1.50 2.20 3.00 3.50 Seconds at 23 °C 1.50 0.60 0.02 0.20 0.10 0.10 1.00 , A Side View C Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± , 0.24 0.35 0.55 0.80 1.00 1.35 70 °C 0.03 0.06 0.12 0.22 0.29 0.47 0.70 0.85 1.25 85 °C 0.02 0.05 0.10


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PDF
2005 - MF-SMDF050

Abstract: J-STD-002 95 MF-SMDF150
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH , Layout C Top and Bottom View 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1


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PDF MF-SMDF050 MF-SMDF050 J-STD-002 95 MF-SMDF150
2007 - MF-USMF005

Abstract: MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH , at 23 °C 0.25 0.50 8.00 8.00 8.00 8.00 5.00 5.00 8.00 8.00 1.50 0.60 0.02 0.20 , ) 2.80 (0.110) 2.80 (0.110) Packaging: 3000 pcs. per reel. 1.0 ± 0.05 (.039 ± . 002 ) MM , (0.016) 0.40 (0.016) 0.40 (0.016) 1.0 ± 0.05 (.039 ± . 002 ) 2.5 ± 0.1 (.098 ± .004) B 2.0 ±


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PDF MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 MF-USMF175* MF-USMF200* MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150
2009 - MF-USMF005

Abstract: MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , . 002 ) 2.5 ± 0.1 (.098 ± .004) B 2.0 ± 0.1 (.079 ± .004) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2 , 8.00 1.50 0.60 0.02 0.20 0.10 0.10 1.00 5.00 1.00 Tripped Power Dissipation Watts , (0.110) Packaging: 3000 pcs. per reel. 1.0 ± 0.05 (.039 ± . 002 ) MM (INCHES) Recommended Pad


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PDF MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 MF-USMF175X* MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150
2010 - Not Available

Abstract: No abstract text available
Text: / J-STD-002 . 95 % min. coverage UL File Number , Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C , 0.15 0.30 0.40 0.75 1.00 1.50 2.20 3.00 3.50 Seconds at 23 °C 1.50 0.60 0.02 0.20 0.10 0.10 1.00 , A Side View C Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± , 0.24 0.35 0.55 0.80 1.00 1.35 70 °C 0.03 0.06 0.12 0.22 0.29 0.47 0.70 0.85 1.25 85 °C 0.02 0.05 0.10


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PDF
2009 - MF-USMF

Abstract: marking RH MF-USMF150 MF-USMF110 MF-USMF075 MF-USMF050 MF-USMF035 MF-USMF020 MF-USMF010 MF-USMF005
Text: ANSI/ J-STD-002 . 95 % min. coverage UL File Number , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. 2.0 , 0.50 0.60 0.6 0.400 5.000 8.00 0.02 0.6 0.75 0.200 1.300 8.00 0.20 , Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± 0.1 (.063 ± .004) B , 0.03 0.02 MF-USMF010 0.15 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.05


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PDF MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF marking RH MF-USMF150 MF-USMF110 MF-USMF075 MF-USMF050 MF-USMF035 MF-USMF020 MF-USMF010 MF-USMF005
2005 - J-STD-002

Abstract: 77-1 MF-SMDF050 MF-SMDF150
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH , Layout C Top and Bottom View 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1


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PDF MF-SMDF050 J-STD-002 77-1 MF-SMDF050 MF-SMDF150
2005 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 , ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1 (.134 ± .004) D E


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PDF MF-SMDF050 MF-SMDF150*
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