The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC1706EMS-82#TR Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-82#TRPBF Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-82 Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-82#PBF Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-85#PBF Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-85 Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C

Intel SO Package Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2004 - ixp425

Abstract: IXP42X IXP400 IXDP425 ixp400 embedded processor intel DOC i8255 IXC1100 AEN6568 IXCDP1100
Text: support package , but is NOT a configurable option, so modifications are required in non-Coyote gateway , Reference Board." } package CYGPKG_DEVS_ETH_ARM_NEW425_I82559 { alias { "NEW425 / Intel 82559 ethernet , NEW425_i82559_eth_driver.cdl description "Ethernet driver for NEW425 with Intel 82559 PCI NIC." } package , Intel ®IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor: Customizing , IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


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PDF IXP42X IXC1100 i686-pc-linux-gnulibc2 ixp425 IXP400 IXDP425 ixp400 embedded processor intel DOC i8255 IXC1100 AEN6568 IXCDP1100
2006 - PCM45F

Abstract: ECC-00177-01-GP heatsink EEP-N41CS-I1-GP cpu socket mPGA479m MPGA479M thermal test vehicle -intel ECC-00178-01-GP intel package drawings
Text: Dimensions (3D View) Dual-Core Intel ® Xeon® processor LV and ULV Thermal Design Guide 9 Package , Package Dual-Core Intel ® Xeon® processor LV and ULV Thermal Design Guide 13 Package Information , capacity without a thermal solution is also limited, so Intel recommends the use of a heatsink for all , may be available in the Dual-Core Intel ® Xeon® processor LV and ULV Datasheet. 4.2 Package , thickness of the TIM between the heatsink and device package . Dual-Core Intel ® Xeon® processor LV and


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Intel Express 550T Routing Switch

Abstract: 8930 NP1505 ES550T
Text: management package (bundled 256K buffer. For general network free with every Intel switch). traffic, this , . monitoring, and so on), but use to add a Stack Interface modThe Intel Express also the switch's Layer 3 , dropped packets. Intel is working on this problem, so look for an upgrade soon. In fact, the ES550T/F , WHAT TO BUY, HOW TO BUY IT . Intel Express 550T Routing Switch C O M P A N Y . Intel Corp. Hillsboro, OR; 800-538-3373, 503-264-7354


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PDF 100BaseT 10BaseT 550Ts NP1505 Intel Express 550T Routing Switch 8930 NP1505 ES550T
2014 - intel edison

Abstract: No abstract text available
Text: Intel® Edison Board Support Package Release Notes September 2014 Revision ww37 Document , information. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS , DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE


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PDF EBSPRN-ww37 EDISON-1468 EDISON-1500 EDISON-1489 EDISON-1421 EDISON-1494 FAT16 EDISON-1322 intel edison
Intel 1702 eprom

Abstract: 1702 eprom intel 1103 ram intel 1702 chemical reactor 29610* intel 1702 INTEL
Text: so named because the intel channel is comprised of negatively charged carriers. CMOS or , evolutionary so that development time of new processes and products can be reduced without compromising Intel , in tei Intel Memory Technologies Aprii 1994 Order Number: 296102-003 Intel Memory , .2-13 2 I 2-7 INTEL MEMORY TECHNOLOGIES Most of this handbook is devoted to techniques and , majority of memory devices manufactured at Intel . There are three major MOS technology families- PMOS


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2006 - honeywell pcm45

Abstract: mpga479 cpu socket mPGA479m socket 478 motherboard manual PCM45F pcm45 L2400 INTEL embedded processors Core 2 duo intel core 2 duo ECC-00177-01-GP
Text: Applications 9 Intel ® CoreTM Duo processor-Package Information 2 Package Information The Intel , . Intel ® CoreTM Duo processor on 65 nm process for Embedded Applications 10 TDG Package Information-Intel® CoreTM Duo processor Figure 2. Micro-FCPGA Package (Sheet 1 of 2) TDG Intel ® CoreTM , Information Figure 3. Micro-FCPGA Package (Sheet 2 of 2) Intel ® CoreTM Duo processor on 65 nm process , . Micro-FCBGA Package (Sheet 1 of 2) TDG Intel ® CoreTM Duo processor on 65 nm process for Embedded


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2001 - APD -25dbm 10ghz

Abstract: APD 10ghz GD16585 LXT16785 g.709 ONTO DEMUX GD16589 LXT16784 STM-64
Text: Intel ® LXT16785 version is assembled in a 132 ball BGA plastic package with signal pins compatible to , product brief ® Intel LXT16784/LXT16785/LXT16795 MUX/DeMUX Chipset Product Description Intel Internet Exchange Architecture ® The Intel ® LXT16784, LXT16785, and the LXT16795 form a , test equipment. The Intel ® LXT16784/85/95 chipset is manufactured using a well-proven silicon bipolar , Dissipation: 1.4W s High integration s 132 PBGA Package s Small physical form factor (13


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PDF LXT16784/LXT16785/LXT16795 LXT16784, LXT16785, LXT16795 STM-64 OC-192 LXT16784/85/95 USA/0401/5K/ASI/DC APD -25dbm 10ghz APD 10ghz GD16585 LXT16785 g.709 ONTO DEMUX GD16589 LXT16784 STM-64
2001 - GD16585

Abstract: LXT16749 GD16589 IXF30007 LXT16759 STM-64 INTEL CLOCK AND DATA RECOVERY serial parallel transport stream
Text: available: s The Intel ® LXT16749 version is assembled in a 132 ball BGA plastic package with signal , product brief ® Intel LXT16748/LXT16749/LXT16759 MUX/DeMUX Chipset Product Description Intel Internet Exchange Architecture The Intel ® LXT16748, LXT16749, and LXT16759 form a , fiber-optic test equipment. The Intel ® LXT16748/49 chipset is manufactured using well-proven silicon bipolar , 12.5Gbit/s chipset can be used with the Intel ® IXF30007 (EFEC) to provide 9dB system sensitivity


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PDF LXT16748/LXT16749/LXT16759 LXT16748, LXT16749, LXT16759 STM-64 OC-192 LXT16748/49 USA/0401/5K/ASI/DC GD16585 LXT16749 GD16589 IXF30007 LXT16759 INTEL CLOCK AND DATA RECOVERY serial parallel transport stream
2010 - 0x199

Abstract: 0x19B INTEL nehalem CPU On Deadlock Problem of On-Chip Buses Supporting Out-of-Order Transactions
Text: Intel ® Xeon® Processor 7500 Series Datasheet, Volume 2 March 2010 Order Number: 323341-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED , PROVIDED IN INTEL 'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS , INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for


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1997 - 29f400 psop

Abstract: 28Fx00 AMD marking CODE flash 29LV160 amd part marking amd 29f200 28F400B5 29f200 problem 29f400 29F800
Text: 's pinout, so there is no pin conflict, but since this feature is not supported on the Intel device, it , E AP-643 APPLICATION NOTE Designing Flexible Sockets for Intel ® Boot Block Flash Memories , Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel 's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty


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PDF AP-643 28F200B5, 28F004/400B5, 28F800B5 AP-680 28Fxx0B3 29LV160/800/400 29f400 psop 28Fx00 AMD marking CODE flash 29LV160 amd part marking amd 29f200 28F400B5 29f200 problem 29f400 29F800
2005 - Thermagon T-MATE2905

Abstract: mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master fanless motherboard AF-S-10H-07B shinetsu 855GME THIRD generation chassis
Text: . 9 2.1 2.2 3 Intel ® 82854 GMCH Package , total package thermal design power: (Ts ­ Tamb )/TDP. sa , heatsink 8 Intel ® 82854 GMCH ­ Thermal Design Guide 2 Mechanical Guidelines 2.1 Intel ® 82854 GMCH Package The Intel , the package dimensions of the Intel ® 82854 GMCH. The drawing is not drawn to scale and the units , electrical shorts. Figure 1. Intel 82854 GMCH micro-FCBGA package dimensions (mm) Intel ® 82854 GMCH ­


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PDF D14844-001 335C866801A 51-SA AF-S-10H-07B ECB-002272 ECB-00228 ECB-00229 Thermagon T-MATE2905 mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master fanless motherboard AF-S-10H-07B shinetsu 855GME THIRD generation chassis
2001 - GD16585

Abstract: GD16589 IXF32003 LXT16784 LXT16785 INTEL CLOCK AND DATA RECOVERY submarine 10Gbps avalanche
Text: product brief ® Intel LXT16784/LXT16785 MUX/DeMUX Chipset Product Description The Intel , with Forward Error Correction (FEC), submarine systems, and fiber-optic test equipment. The Intel , Dissipation: 1.4W s High integration s 132 PBGA Package s Small physical form factor (13 , integration s 132 PBGA Package s Small physical form factor (13 x13mm) Reduced board space s , interface into the net device. The Intel ® LXT16784 has a DeMUX merged with a CDR and is fully compliant


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PDF LXT16784/LXT16785 LXT16784 LXT16785 OC-192 LXT16784/85 LXT16784 LXT16785. USA/0901/5K/ASI/DC GD16585 GD16589 IXF32003 INTEL CLOCK AND DATA RECOVERY submarine 10Gbps avalanche
2001 - GD16585

Abstract: GD16589 IXF32003 LXT16784 LXT16785 INTEL CLOCK AND DATA RECOVERY
Text: product brief ® Intel LXT16784/LXT16785 MUX/DeMUX Chipset Product Description The Intel , with Forward Error Correction (FEC), submarine systems, and fiber-optic test equipment. The Intel , Critical in MSA module applications s 132 PBGA Package s Small physical form factor (13mm x , in MSA module applications s 132 PBGA Package s Small physical form factor (13mm x 13mm , interface into the net device. The Intel ® LXT16784 has a DeMUX merged with a CDR and is fully compliant


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PDF LXT16784/LXT16785 LXT16784 LXT16785 OC-192 LXT16784/85 USA/1101/2K/ASI/DC GD16585 GD16589 IXF32003 INTEL CLOCK AND DATA RECOVERY
1996 - PLCC 32 intel package dimensions

Abstract: 845 bios chip intel 845 circuit diagram all chip TSOP 48 LAYOUT TSOP 48 thermal resistance ap623 AP-623 tsop 48 PIN SOCKET PCB Layout am 28f040
Text: -623 CONTENTS PAGE 1.0 INTRODUCTION 2.0 INTEL 'S BOOT BLOCK FLASH MEMORY 3.0 BOOT BLOCK PACKAGE AND PINOUT , Intel is Sharp. They provide a 2-/4-Mbit flash memory in a 56-lead TSOP package . Again, availability , Figure 17, a board can be designed to accommodate both Sharp's 56-lead TSOP package and Intel 's Boot , E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel 's Boot Block Flash , connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


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PDF AP-623 AP-607 AB-57 AB-60 PLCC 32 intel package dimensions 845 bios chip intel 845 circuit diagram all chip TSOP 48 LAYOUT TSOP 48 thermal resistance ap623 AP-623 tsop 48 PIN SOCKET PCB Layout am 28f040
2008 - FCBGA 956 pin

Abstract: heatsink ECC-00178-01-GP 45nm 956-ball mobile processors PCM45F G751 C1100 Instrumentation Amplifier IC with tl084
Text: Processors-Package Information 2.0 Package Information The Intel ® CoreTM2 Duo Processor (XE and SV) is , also minimal, so Intel requires the use of a heatsink for all usage conditions. 3.2 Maximum , micro-FCPGA package . Intel ® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 11 , Intel ® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design , WITH INTEL ® PRODUCTS. EXCEPT AS PROVIDED IN INTEL 'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS


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PDF 45-nm FCBGA 956 pin heatsink ECC-00178-01-GP 45nm 956-ball mobile processors PCM45F G751 C1100 Instrumentation Amplifier IC with tl084
2006 - intel 8250

Abstract: 8250 intel 0X00800000 intel E1000 SERIAL 8250 i386 ex board Memory Access Scheduler ep80219 e1000 intel driver intel 8250 datasheet
Text: Intel ® I/O Processors Linux - Debian Installation Guide March 2006 Order Number: 306507003US March 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE , DOCUMENT. EXCEPT AS PROVIDED IN INTEL 'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE


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PDF 306507003US intel 8250 8250 intel 0X00800000 intel E1000 SERIAL 8250 i386 ex board Memory Access Scheduler ep80219 e1000 intel driver intel 8250 datasheet
2002 - INTEL fcBGA PACKAGE thermal resistance

Abstract: fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"
Text: Ultra Low Voltage Intel ® Celeron® Processor in the Micro FC-BGA Package Thermal Design Guide , Intel ® Celeron® Processor in the Micro FC-BGA Package may contain design defects or errors known as , . 8 Ultra-Low Voltage Intel ® Celeron® Processor (0.13 µ) in the Micro FC-BGA Package Thermal Data , Voltage Intel ® Celeron® processor in the surface mount, 479-pin, micro FC-BGA package . Detailed , Thermal Design Guide ULV Intel ® Celeron® Processor in the Micro FC-BGA Package Table 1


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PDF PL1664-65) INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"
2005 - 1168-ball micro-FCBGA

Abstract: fujikura heat sink 478 Celeron d 2,26 001ss INTEL Micro-FCPGA Package Dimensions
Text: Constraint Zone for the Intel ® Celeron® M Processor in the micro-FCBGA Package , -01 . 34 Intel ® Celeron® M Processor in the Micro-FCBGA Package Heat Sink #1 (EID-BAN24-CUALC-001SS) . 37 Intel ® Celeron® M Processor in the Micro-FCPGA Package Heat Sink #2 (EID-BAN24-CUALC , Intel ® Celeron® M Processor in the micro-FCBGA Package Intel ® Celeron® M Processor on 90 nm Process , 2.2.6.1 Intel ® Celeron® M Processor in the Micro-FCBGA Package - Copper Base, Aluminum Fin Heat Sink


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1998 - StrongARM SA110

Abstract: dhrystone intel cpu power section
Text: Order Number: 278192-001 Information in this document is provided in connection with Intel products , granted by this document. Except as provided in Intel 's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a , right. Intel products are not intended for use in medical, life saving, or life sustaining applications


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PDF SA-110 StrongARM SA110 dhrystone intel cpu power section
2006 - ECC-00060-01

Abstract: 252612 G751 thermal design guide -intel micro-FCPGA intel MOTHERBOARD pcb design
Text: . 20 Intel ® Pentium® M and Celeron ® M Processors in the Micro-FCBGA Package Mechanical Stack-Up , -00076-01 . 36 Intel ® Pentium® M and Celeron® M Processors in the Micro-FCBGA Package - Copper Base , Intel ® Pentium® M and Celeron® M Processors in the Micro-FCPGA Package - Copper Base, Aluminum Snap Fin , Processor Package The Intel ® Pentium® M and Celeron® M processors are available in the 479-Ball Micro-Flip , centered on the package ; therefore, they have a die offset. The die offsets for the Intel Pentium M and


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1997 - sense amplifier bitline memory device

Abstract: Intel nor flash AP-644 AP-646 AP-647 29785
Text: 's µBGA* Package User's Guide, order number 297846). 4.0 SUMMARY Intel 's technological advances , 297846 µBGA* Package User's Guide NOTES: 1. Please call the Intel Literature Center at (800 , E TECHNICAL PAPER Intel StrataFlashTM Memory Technology September 1997 Order Number: 297859-001 Information in this document is provided in connection with Intel products. No license , document. Except as provided in Intel 's Terms and Conditions of Sale for such products, Intel assumes no


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PDF AP-644 AP-646 AP-647 sense amplifier bitline memory device Intel nor flash 29785
2006 - EEP-N41ES-02

Abstract: EEP-N41CS-01 mobile Thermal Design Guide EEP-N41SS-01 G751 shinetsu intel MOTHERBOARD pcb design in Intel Pentium 4 Processors 745 MPGA479M
Text: Recommended PCB Volumetric Constraint Zone for the Intel ® Pentium® M Processor in the micro-FCBGA Package , ® Pentium® M Processor in the micro-FCPGA Package . 19 Intel ® Pentium® M , . 19 Intel ® Pentium® M Processor in the micro-FCPGA Package Mechanical Stack-up in the Single-Slot , Intel ® Pentium® M Processor in the micro-FCPGA Package Mechanical Stack-up in the 1U Form Factor , -01 . 34 Intel ® Pentium® M Processor in the Micro-FCBGA Package Heatsink #1


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2010 - CEL9220HF13

Abstract: DDR4 DIMM SPD JEDEC CEL9220 CEL9220HF CEL-9220HF13 SE97B cel-9220 DDR4 spd DDR4 jedec SE97BTP,547
Text: original JEDEC - 3.0 to 3.6V ­ Intel approved ­ SE97B ­ new JEDEC - 3.0 to 3.6V ­ Intel approved Updates , shutdown Temperature Accuracy Production Flow and Package Information Background on why use TS and SPD , 1010A2A1A0 so master sees two different devices EEPROM is organized as a 256 x 8-bit with 10 years of data , temperature range from ­40 °C to +125 °C 0.3 mm min vs 0.2 mm JEDEC JEDEC compliant package from APB ­ SE97BTP , Critical Alarm setting only Set /Event output active high Set to Interrupt Mode so that you have to clear


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PDF SE97BTP PCA9541 CEL9220HF13 DDR4 DIMM SPD JEDEC CEL9220 CEL9220HF CEL-9220HF13 SE97B cel-9220 DDR4 spd DDR4 jedec SE97BTP,547
2005 - JESD22-B110

Abstract: JESD22-B110 condition F PCM45 honeywell pcm45 microDIMM inphi PC2-3200 infineon p ASHRAE
Text: Intel Rev. 0.9 Fully Buffered DIMM Specification Addendum INTEL ® Fully Buffered DIMM SPECIFICATION ADDENDUM Rev. 0.9 March 21, 2006 3/21/2006 1 Intel Confidential Intel Rev. 0.9 , with Intel ® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel 's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied


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2001 - serial parallel transport stream

Abstract: LXT16743
Text: product brief ® Intel LXT16742/LXT16743 MUX/DeMUX Chipset Product Description Intel Internet Exchange Architecture ® The Intel ® LXT16742 and Intel ® LXT16743 form a high-performance MUX , Intel ® LXT16742/43 chipset is manufactured using a well-proven silicon bipolar technology that offers , . Ideal for DWDM applications. s 132 CBGA Package s Small physical form factor (13 x 13mm , wrapping. Ideal for DWDM applications. s 132 CBGA Package s Small physical form factor (13 x


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PDF LXT16742/LXT16743 LXT16742 LXT16743 STM-64/16, OC-192/48, LXT16742/43 USA/0401/5K/ASI/DC serial parallel transport stream LXT16743
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