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Part Manufacturer Description Datasheet Download Buy Part
CC112X-IPC-4L-868RD Texas Instruments CC112x IPC 868/915MHz 4 layer Reference Design
CC112X-IPC-2L-868RD Texas Instruments CC112x IPC 868/915MHz 2 layer Reference Design
DLPC200ZEWCM Texas Instruments Digital Controller for DLP5500 DMD 780-BGA
DLPC200ZEW Texas Instruments Digital Controller for DLP5500 DMD 780-BGA
DLPC200ZEWT Texas Instruments SPECIALTY CONSUMER CIRCUIT, PBGA780, PLASTIC, FBGA-780
DLPC200 Texas Instruments SPECIALTY MICROPROCESSOR CIRCUIT, PBGA780, PLASTIC, FBGA-780

IPC-SM-780 solder paste Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1995 - IPC-SM-780

Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
Text: circuit boards (PCBs). These reflow processes consist of applying a eutectic solder paste to a circuit board, placing devices onto the paste , drying the paste , and then conveying the board through an oven , Because different board designs use different solder paste , circuit boards, number of devices, and types , stage, the solder paste dries while its more volatile ingredients evaporate. After preheating, the , Melting Temperature of Solder (183° C) Temperature (° C) 150 2 Minutes or More 1° to 3° C per


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PDF oC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
1995 - IPC-SM-780

Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
Text: circuit boards (PCBs). These reflow processes consist of applying a eutectic solder paste to a circuit board, placing devices onto the paste , drying the paste , and then conveying the board through an oven , different board designs use different solder paste , circuit boards, number of devices, and types of devices , Temperature of Solder (183° C) 50 1° to 3° C per Second Preheat Flux Activation 50 100 150 Time (Seconds) Reflow 200 250 Cool 0 0 Reflow In the preheat stage, the solder paste dries while its more


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PDF varyinI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
1999 - IPC-SM-786A

Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
Text: These reflow processes consist of applying a eutectic solder paste to a circuit board, placing devices onto the paste , and then conveying the board through an oven with successive heating elements of , different number and types of devices, solder paste , and circuit boards, no single temperature profile , 100 200 250 Time (Seconds) Reflow Stages In the preheat stage, the solder paste dries , 250 Maximum Package Body Temperature (220o C) 200 o Melting Temperature of Solder (183 C


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1995 - IPC-SM-780

Abstract: No abstract text available
Text: applying a eutectic solder paste to a circuit board, placing devices onto the paste , drying the paste , and , . Temperature Profiles Because different board designs use different solder paste , circuit boards, number and , Time (Seconds) Reflow 200 250 Cool 0 0 Reflow Stages In the preheat stage, the solder paste , Temperature (o C) 150 2 Minutes or More 100 1 to 3 C per Second o o Melting Temperature of Solder (183 C , 150° C for a minimum of two minutes so the flux in the paste can clean the bonding surfaces properly


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PDF ANSI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780
2002 - BGA and QFP Altera Package mounting profile

Abstract: BGA PROFILING infrared heating gun JEP113-B JESD22-A113-B GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE J-STD-033 J-STD-020A Reliability Data Plastic Packages QFP altera board
Text: boards (PCBs). The reflow process consists of applying a eutectic solder paste to a circuit board , temperature profile that is dependent on application, available equipment, and solder paste . However, the , recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder , the preheat stage, the solder paste dries while its more volatile ingredients evaporate. After , , along with Qualitex 778 water-soluble solder paste . Altera reliability stress boards are between four


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2005 - IPC-7525

Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
Text: or viscosity of solder paste flux matrix, solder void percentage, or different land pattern designs , ratio is critical for the release of the printed solder paste and is dependent on the aperture , solder paste during the board mounting process. Non-clean paste is preferred over clean paste due to , Pb-free pastes. Once the solder paste is printed, the MLP component should be placed and convection/IR , shock. 2. Soaking Zone: Thermal soak zone to remove solder paste violates and for activation of flux


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PDF AN-5067 IPC-7525 jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
2005 - QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: package and the system board is made by printing the solder paste on the system board and reflowing it , designing the system board pad pattern and solder paste printing. The QFN package has a Exposed Pad , include: amount of solder paste coverage in thermal pad region, stencil design for peripheral and , board, type of solder paste , and reflow profile. It should be emphasized that this is just a guideline , between the component and the PCB can be made by screen printing solder paste on the PCB and re-flowing


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alpha OM-338

Abstract: OM-338 JEP-140 IPC-SM-786 JEP140 OM338 alpha OM-338 application notes CLP0603
Text: Solder paste type · Reflow soldering process parameters A1 E A b e D · Solder mask opening 2 , solder paste is applied to the PCB by using a screen print process. The recommended stencil thickness for , Thickness of 80 m Note · A wider stencil opening will result in a better solder paste release from the , , and opening. If a tilting of the package is observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and


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PDF CLP0603 28-Oct-11 alpha OM-338 OM-338 JEP-140 IPC-SM-786 JEP140 OM338 alpha OM-338 application notes
2002 - AN-1112

Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
Text: . Solder Paste Reflow and Cleaning , surface mount assembly operations include, PCB Layout · Printing solder paste on PCB. · Component , solder paste for printing. 3 www.national.com AN-1112 Surface Mount Assembly Considerations , to be exerted during placement. It is recommended that bumps be dipped into solder paste on PCB to greater than 20% of paste block height. The following sections describe solder joint reliability


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2006 - AN-772

Abstract: EM-99 20-lead lfcsp tssop 16 exposed pad stencil MO229 MO-220 MO220 JESD51-5 IPC-SM-782 ipc-SM-782* tssop
Text: thickness, PCB perimeter pad design, thermal paddle and via design, stencil design, solder paste , and , solder . It is generally accepted that the toe fillets are formed depending on the type of solder paste , good side fillet on the outside. The first step in achieving good standoff is the solder paste , AN-772 solder balling) if the solder paste coverage is too big. It is recommended that smaller multiple openings in the stencil should be used instead of one big opening for printing solder paste on


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PDF AN-772 EM-2000-011) TM-00-11) AN05425 AN-772 EM-99 20-lead lfcsp tssop 16 exposed pad stencil MO229 MO-220 MO220 JESD51-5 IPC-SM-782 ipc-SM-782* tssop
2002 - IPC-SM-785

Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
Text: Printing Process Component Placement Solder Paste Reflow and Cleaning Rework Qualification Solder , MOUNT ASSEMBLY CONSIDERATIONS Printing solder paste on PCB. · · Component placement using , embrittlement. · Use Type 3 (25 to 45 micron particle size range) or finer solder paste for printing , force needs to be exerted during placement. It is recommended that bumps be dipped into solder paste , respective product qualification reports. SOLDER PASTE REFLOW AND CLEANING · Micro SMD is


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PDF AN-1112 IPC-SM-785 GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
2001 - stencil tension

Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
Text: Printing Process Component Placement Solder Paste Reflow and Cleaning Rework Qualification Solder , AN100926 www.national.com AN-1112 SURFACE MOUNT ASSEMBLY CONSIDERATIONS Printing solder paste on , particle size range) or finer solder paste for printing. · The fan-out for the traces should be , placement. It is recommended that bumps be dipped into solder paste on PCB to greater than 20% of paste , reports. SOLDER PASTE REFLOW AND CLEANING · Micro SMD is compatible with industry standard reflow


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PDF AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
2003 - gold embrittlement

Abstract: ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern IPC-SM-782 ADXL193
Text: connections to one pad would lead to solder migration. Balanced trace entry to the pad minimizes component rotation. Vias and through holes should not be part of the pad. Additionally, solder mask thickness has to be monitored if the component is not placed into a solder mask window , (but within the limits of the castellation). The surface tension of the liquid solder pulls the , mismatch, so the solder has to handle this stress. The larger the LCC package, the higher the stress. An


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PDF AN-652 ADXL78/ADXL278/ADXL193 E03707 gold embrittlement ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern IPC-SM-782 ADXL193
JESD22-A113

Abstract: QFN-20 reflow ipc-SM-782 JESD47 QFN-20 JESD-47 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
Text: Design, PCB thickness, type of components, component density and recommended solder paste profile. The , recommended during reflow. Type 3 or 4 Solder Paste is recommended, particularly for QFN packages due to the fine pitch. The maximum reflow temperature for the solder paste should not be exceeded. Reference , ://www.carsem.com/. · See the applicable Silicon Laboratories Datasheet for the recommended Solder Mask Layout , Metcal APR-5000 (http://www.metcal.com/) III. QFN and QFP Solder Profile Guidelines MCU Products MSL


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PDF IPC-SM-782 APR-5000 QFN-24 -QFN11 JESD22-A113 QFN-20 reflow JESD47 QFN-20 JESD-47 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
2225 capacitor footprint dimension

Abstract: ipc-SM-782 IPC-SM-782 0805 2211 size footprint 0603 footprint IPC 1206 footprint IPC ceramic capacitor footprint 0402 dimension 0402 capacitor ipc-SM-782 3530 novacap 1825 footprint dimension
Text: PHASE processes, where the solder volume is controlled by the solder paste deposition on the circuit , is to introduce the IPC-SM-782 methodology for solder reflow land patterns. The methodology will be , accuracy along with desired solder fillets. NOVACAP strongly recommends the user review the IPC-SM , additional modifications needed for solder fillet visual requirements and level of robustness. The amount of solder applied to the chip capacitor will influence the reliability of the device. Excessive


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PDF IPC-SM-782 2225 capacitor footprint dimension IPC-SM-782 0805 2211 size footprint 0603 footprint IPC 1206 footprint IPC ceramic capacitor footprint 0402 dimension 0402 capacitor ipc-SM-782 3530 novacap 1825 footprint dimension
PCB design for 0.2mm pitch csp package

Abstract: led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA Amkor CSP mold compound Soldering guidelines and SMD footprint design MLF 6x6 mlf 0.3mm pitch led 3mm 8x8 matrix guideline pad dimension 1210
Text: Voiding 4.4 Stencil Thickness and Solder Paste 4.5 Solder joint standoff height and fillet formation 4.6 Reflow Profile Rework Process 7.1 Component Removal 7.2 Site Redress 7.3 Solder Paste , include: amount of solder paste coverage in thermal pad region, stencil design for peripheral and thermal , , type of solder paste , and reflow profile. This applications note provides the guidelines for this , electrical connection between the package and the motherboard is made by printing the solder paste on the


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1996 - SMD Thick Film Chip Resistor

Abstract: ipc-SM-782 solder joint smd TRANSISTOR NY NY MAKING TRANSISTOR AVX film chip capacitors military connector cross reference NY TRANSISTOR MAKING LIST Pot bourns mil board mount tabs
Text: joints and low manufacturing defects. As a side note, the total equivalent wet laydown of solder paste , solder paste . FORCE DUE TO ADHESION OF SOLDER TO THE LAND FORCE EXERTED BY THE MASS OF THE PART , , reflowing the solder paste on to the component termination. Asymmetry in pad thermal mass results in , sources with a problem board. Screening solder paste on the pads with a stencil and then reflowing the , beginning to insure yields and reliability. You cannot slap components down on a PC board with solder and


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PDF 5M1093-R SMD Thick Film Chip Resistor ipc-SM-782 solder joint smd TRANSISTOR NY NY MAKING TRANSISTOR AVX film chip capacitors military connector cross reference NY TRANSISTOR MAKING LIST Pot bourns mil board mount tabs
2015 - Not Available

Abstract: No abstract text available
Text: 0.4 0.22 0.4 solder paste deposit solder land plus solder paste R 0.025 0.12 22740 , better solder paste release from the stencil. So the best quality can be obtained by using the optimum , observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and the package shear strength. soldering mask , 0.22 solder paste deposit solder land plus solder paste 3. SCREEN PRINT PROCESS R 0.025


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PDF VCUT05E1-SD0 CLP0603 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12
2015 - Not Available

Abstract: No abstract text available
Text: : 0.85 solder land 0.4 0.22 0.4 solder paste deposit solder land plus solder paste R , better solder paste release from the stencil. So the best quality can be obtained by using the optimum , observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and the package shear strength. soldering mask , paste deposit solder land plus solder paste R 0.025 3. SCREEN PRINT PROCESS The solder paste is


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PDF VBUS05B1-SD0 CLP0603 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12
2005 - Not Available

Abstract: No abstract text available
Text: general term "reflow" refers to several methods used in heating the circuit so that solder paste reflows , solder paste that is screened onto the circuit. Recommended temperature limits for solder reflow are , circuit passes through the zone the vapor condenses on the solder paste , pad, and termination resulting in heat transfer and reflow of the solder paste . Vapor phase reflow produces consistent circuit heating , micro-cracking conditions. SOLDER PRE-HEAT CYCLE Proper preheating is essential to prevent thermal shock


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2002 - IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil QFN 16 CARSEM package outline qfn 44 PACKAGE footprint 7x7 DIe Size metcal VPI-1000 qfn 48 7x7 stencil QFN 8 CARSEM APR-5000
Text: PASTE SCREEN PRINTING PROCESS Solder Paste Solder Stencils Lead finger Stencil Design Exposed Pad , 2-1. General Guidelines for Assembly Quality Solder Paste Quality Uniform viscosity and texture. Free from foreign material. Solder paste should be used before the expiration date. Shipment and , ) of the lead finger is in contact with the solder paste covered land area on the board. Alignment , , component density, and the recommended profile of the solder paste being used. A reflow profile will need


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2004 - ATMEL reflow temp

Abstract: cason cason 8 pcb pattern ATMEL JEDEC-STD-020 SOIC-8s2 8S2 8-lead SOIC 8 pcb pattern DVD laser pickup assembly 8S2 Soic 8s2 pcb
Text: solder paste wicking along the trace, away from the joint area and possibly impacting board level , . Studies have shown good results when using the following reflow guidelines based on the solder paste used , and print the same solder paste with a metal blade and a miniature stencil. · Footprint , manufacturers. PCB Land Pattern and Solder Mask Design The CASON package is primarily composed of copper , Figure 2. The solder lands on the package side are Non Solder Mask Defined (NSMD); i.e. the pad is


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PDF 128-Mbit 3438B ATMEL reflow temp cason cason 8 pcb pattern ATMEL JEDEC-STD-020 SOIC-8s2 8S2 8-lead SOIC 8 pcb pattern DVD laser pickup assembly 8S2 Soic 8s2 pcb
2012 - alpha OM-338

Abstract: JEP140 JEP-140 OM-338 HASL IPC-SM-786 SMD MARKING CODE 2L E4 smd
Text: Thickness of 80 m Note · A wider stencil opening will result in a better solder paste release from the , . If a tilting of the package is observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and the package shear strength. 4. SOLDER PASTE TYPE Type 4 solder pastes (or smaller powder sizes) are , ) solder paste . 3. SCREEN PRINT PROCESS The solder paste is applied to the PCB by using a screen print


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PDF VCUT05D1-SD0 CLP0603 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 alpha OM-338 JEP140 JEP-140 OM-338 HASL IPC-SM-786 SMD MARKING CODE 2L E4 smd
2013 - Not Available

Abstract: No abstract text available
Text: copper pad plating. 3. SCREEN PRINT PROCESS The solder paste is applied to the PCB by using a screen , €¢ A wider stencil opening will result in a better solder paste release from the stencil. So the best , € If a tilting of the package is observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and the package shear strength. 4. SOLDER PASTE TYPE Type 4 solder pastes (or smaller powder sizes) are


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PDF VBUS05A1-SD0 CLP0603 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12
2013 - Not Available

Abstract: No abstract text available
Text: /immersion gold over copper pad plating. 3. SCREEN PRINT PROCESS The solder paste is applied to the PCB , Thickness of 80 μm Note • A wider stencil opening will result in a better solder paste release from , , thickness, and opening.ï€ ï€ If a tilting of the package is observed, the amount of solder paste , of solder paste and the package shear strength. 4. SOLDER PASTE TYPE Type 4 solder pastes (or , -338 CSP (96.5 % Sn/3 % Ag/0.5 % Cu) solder paste . 5. REFLOW SOLDERING PROCESS A standard


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PDF VCUT05D1-SD0 CLP0603 224electronic 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12
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