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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
LT1584 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1580 Linear Technology IC VREG FIXED POSITIVE REGULATOR, Fixed Positive Single Output Standard Regulator
LT1005CT-5 Linear Technology IC VREG 5 V FIXED POSITIVE REGULATOR, PSFM, Fixed Positive Single Output Standard Regulator
LM317HVH Linear Technology IC VREG 1.2 V-57 V ADJUSTABLE POSITIVE REGULATOR, MBCY3, TO-39, 3 PIN, Adjustable Positive Single Output Standard Regulator

IPC/JEDECJ-STD-020C Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2010 - PM25LD020C

Abstract: pm25ld020c-sce PM25LD010C
Text: Interface Output SPI Bus Interface Pm25LD010C/ 020C FEATURES • Low Power Consumption - Typical 10 , Operation - Maximum 10ms sector, block or chip erase GENERAL DESCRIPTION The Pm25LD010C/ 020C are 1Mbit , programmed in standard EPROM programmers. The Pm25LD010C/ 020C are accessed through a 4-wire SPI Interface , uniform 64 KByte). The Pm25LD010C/ 020C are manufactured on pFLASH™’s advanced non-volatile technology , , 2010, Rev: 0.4 Pm25LD010C/ 020C PRODUCT ORDERING INFORMATION Pm25LDxxx - S C E R Packing Type


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PDF Pm25LD010C/ Pm25LD010C: Pm25LD020C: 32KByte 64KByte PM25LD020C pm25ld020c-sce PM25LD010C
J-STD-020C

Abstract: ipc 620 ipc 610 78426 78145 78143 2N2411 JSTD020C TES-2N JORDAN
Text: IPC/JEDEC J-STD- 020C Table of Contents page Tested Flowchart 1 Tested Data before , after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD- 020C Standard NO , Temperature Profile as per IPC/JEDEC J-STD- 020C Standard NO 31 After 3th Reflow Process Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD- 020C Standard , Temperature Profile as per IPC/JEDEC J-STD- 020C Standard NO 31 After 3th Reflow Process Visual


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PDF J-STD-020C 2N-2411 J-STD-020C ipc 620 ipc 610 78426 78145 78143 2N2411 JSTD020C TES-2N JORDAN
1997 - 05f0

Abstract: 16C54 AN511 PIC16C5X pla 007a P21A
Text: 0206 002C 006E 006F 0070 006D 000A 000B 000C 000D 000E 020C 0F00 0E0F 0643 050E 000F 020C 0010 0F01 0011 0E0F 00121 00122 00123 00124 00125 00126 00127 00128 00129 00130 , -9 AN511 0012 0643 0013 052E 0014 0015 0016 0017 0018 020C 0F02 0E0F 0643 054E 0019 001A 001B 001C 001D 020C 0F03 0E0F 0643 056E 001E 001F 0020 0021 0022 020C 0F04 0E0F 0643 058E 0023 0024 0025 0026 0027 020C 0F05 0E0F 0643 05AE 0028 0029 002A 002B


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PDF AN511 xxxx0011b) 00001111b) PIC16C5X 12-bit] 05f0 16C54 AN511 pla 007a P21A
0853.12

Abstract: J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
Text: 40sec acc. to IPC/ JEDEC J-STD- 020C < 5m at 20 mV > 3kV between L-N (50Hz; 1 min) > 4kV between L-N , Alloy Gold-Plated Copper Alloy Gold-Plated Copper Alloy Reflow Condition acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s acc


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PDF com/pg02b W/10A 500VAC/DC E39328 0853.12 J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
2N2423

Abstract: TES-2N 81121 15029 81413
Text: IPC/JEDEC J-STD- 020C Table of Contents Page Tested Flowchart 1 Tested Data before , Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD- 020C , maximum Temperature Profile as per IPC/JEDEC J-STD- 020C Standard NO 31 After 3th Reflow Process , J-STD- 020C Standard NO 31 After 3th Reflow Process 14 Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD- 020C Standard NO 31 After


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PDF J-STD-020C 2N-2423 J-STD-020C 2N2423 TES-2N 81121 15029 81413
1994 - pla 007a

Abstract: P16C57 P23A 16C57 1Y01 00D7 0E27 PIC16C5X AN511 0011B
Text: 0006 0206 002C 006E 006F 0070 006D 000A 000B 000C 000D 000E 020C 0F00 0E0F 0643 , 020C 0F01 0E0F 0643 052E EVAL_P Preg_a,bit1,P1_x,P1_a movf input,W xorlw P1_x andlw P1_a , 0015 0016 0017 0018 020C 0F02 0E0F 0643 054E EVAL_P Preg_a,bit2,P2_x,P2_a movf input,W , ; product term = 1 0019 001A 001B 001C 001D 020C 0F03 0E0F 0643 056E EVAL_P Preg_a,bit3 , 001E 001F 0020 0021 0022 020C 0F04 0E0F 0643 058E 0023 0024 0025 0026 0027 020C


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PDF AN511 PIC16C5X pla 007a P16C57 P23A 16C57 1Y01 00D7 0E27 AN511 0011B
1997 - B00000001

Abstract: 0743 0084 05CE 000000FB 058E P21A pla 007a P19A 7-seg 0743
Text: 0206 002C 006E 006F 0070 006D 000A 000B 000C 000D 000E 020C 0F00 0E0F 0643 050E 000F 020C 0010 0F01 0011 0E0F 00121 00122 00123 00124 00125 00126 00127 00128 00129 00130 , -9 AN511 0012 0643 0013 052E 0014 0015 0016 0017 0018 020C 0F02 0E0F 0643 054E 0019 001A 001B 001C 001D 020C 0F03 0E0F 0643 056E 001E 001F 0020 0021 0022 020C 0F04 0E0F 0643 058E 0023 0024 0025 0026 0027 020C 0F05 0E0F 0643 05AE 0028 0029 002A 002B


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PDF AN511 xxxx0011b) 00001111b) PIC16C5X 12-bit] DS00511E-page B00000001 0743 0084 05CE 000000FB 058E P21A pla 007a P19A 7-seg 0743
1997 - pla 007a

Abstract: 00203 16C54 AN511 PIC16C5X 000000FB 000000FD microchip an511
Text: 0206 002C 006E 006F 0070 006D 000A 000B 000C 000D 000E 020C 0F00 0E0F 0643 050E 000F 020C 0010 0F01 0011 0E0F 00121 00122 00123 00124 00125 00126 00127 00128 00129 00130 , -9 AN511 0012 0643 0013 052E 0014 0015 0016 0017 0018 020C 0F02 0E0F 0643 054E 0019 001A 001B 001C 001D 020C 0F03 0E0F 0643 056E 001E 001F 0020 0021 0022 020C 0F04 0E0F 0643 058E 0023 0024 0025 0026 0027 020C 0F05 0E0F 0643 05AE 0028 0029 002A 002B


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PDF AN511 xxxx0011b) 00001111b) PIC16C5X 12-bit] D-81739 pla 007a 00203 16C54 AN511 000000FB 000000FD microchip an511
Not Available

Abstract: No abstract text available
Text: . to IPC/ JEDEC J-STD- 020C < 5 m at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N > 10 M between , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263


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PDF com/pg02b
2013 - Not Available

Abstract: No abstract text available
Text: €‰sec acc. to IPC/ JEDEC J-STD- 020C < 5 mΩ at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263


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PDF com/pg02b
2013 - Not Available

Abstract: No abstract text available
Text: €‰sec acc. to IPC/ JEDEC J-STD- 020C < 5 mΩ at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , . to JEDEC J-STD- 020C , Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=240 +0/-5 , Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm


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PDF com/PG02
smd fuse marking

Abstract: smd fuse marking 20 JEDEC J-STD-020c 8309 J-STD-020C 0031.8221 8326 JSTD020C
Text: variants) 245°C / 3sec acc. to IEC 60068-2-58, Test Td 240 - 260°C / 20 - 40sec acc. to JEDEC J-STD- 020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD- 020C ), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD- 020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD- 020C ), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x , JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8263 l


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PDF com/pg02b W/10A Distribu516 smd fuse marking smd fuse marking 20 JEDEC J-STD-020c 8309 J-STD-020C 0031.8221 8326 JSTD020C
smd fuse marking

Abstract: smd fuse marking 20 J-STD-020D fuse holder 5x20 JEDEC tray standard 13 fuse smd marking blue JSTD020C J-STD-020-C J-STD-020C
Text: (acc. to JEDEC J-STD- 020C ), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD- 020C ), Tp=240 +0/-5 °C , Copper Alloy (acc. to JEDEC J-STD- 020C ), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x 173 mm(500 pcs.) 0031.8222 l Spec. Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , . Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = 20-40 s Blister


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PDF com/pg02b W/10A 500VAC/DC smd fuse marking smd fuse marking 20 J-STD-020D fuse holder 5x20 JEDEC tray standard 13 fuse smd marking blue JSTD020C J-STD-020-C J-STD-020C
Not Available

Abstract: No abstract text available
Text: J-STD- 020C , Tp=245 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8221 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=245 +0/-5 °C, tp = , Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=245 +0/-5 °C, tp = max. 30 s Blister Tray 266 x , J-STD- 020C , Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263 l Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD- 020C , Tp=260 +0/-5 °C, tp = max


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PDF com/PG02
J-STD-020C

Abstract: J-STD-020-C JSTD-020C JSTD020C J-STD020C SRR1806 SRR1005 SDR1005 SDR1806 SRR1003
Text: " Power Chokes Meets J-STD- 020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD- 020C , Table 4-2, for components with a height greater than , design improvement allows an increase of the maximum soldering temperature to meet the JEDEC J-STD- 020C , +250 °C maximum per J-STD- 020C . · SDR1005, SDR1806, and SDR2207 (non-shielded) · SRR0804, SRR0805


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PDF J-STD-020C J-STD-020C, J-STD-020C. SDR1005, SDR1806, SDR2207 SRR0804, J-STD-020C J-STD-020-C JSTD-020C JSTD020C J-STD020C SRR1806 SRR1005 SDR1005 SDR1806 SRR1003
J-STD-020-C

Abstract: J-STD-020C JSTD020C STD-020C SRR0805 J-STD020C SRR1005 SRR1806 SRR6603 SDR1806
Text: Temperature of "Oval Shaped" Power Chokes Meets J-STD- 020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD- 020C , Table 4-2, for components with , meet the JEDEC J-STD- 020C standard. All of the models listed that shipped after February 1, 2006 may be soldered at a temperature of +250 °C maximum per J-STD- 020C . · SDR1005, SDR1806, and SDR2207


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PDF J-STD-020C J-STD-020C, 25mum J-STD-020C. SDR1005, SDR1806, SDR2207 SRR0804, J-STD-020-C J-STD-020C JSTD020C STD-020C SRR0805 J-STD020C SRR1005 SRR1806 SRR6603 SDR1806
2005 - RTD CIRCUITS analog instruments

Abstract: 8B35 DI-8B35 rtd circuit of output 5v circuit DI-8B35-01 DI-8B35-02 DI-8B35-03 rtd 392 platinum rtd frequency response
Text: -8B35-04 ± 0.20°C ±0.15°C ± 0.20°C ±0.45°C Output Offset Gain Output, 100kHz Bandwidth, -3dB Response , ) *Includes conformity, hysteresis, and repeatability. Accuracy* ± 0.20°C ±0.15°C ± 0.20°C ±0.45°C 241


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PDF DI-8B35 1500Vrms 240VAC 120dB DI-8B35 DI-8B35-01 DI-8B35-02 DI-8B35-03 DI-8B35-04 RTD CIRCUITS analog instruments 8B35 rtd circuit of output 5v circuit DI-8B35-01 DI-8B35-02 DI-8B35-03 rtd 392 platinum rtd frequency response
SCT2-W08H30-020C-R7H-H

Abstract: auk 505 16X1 H30mm SIM CARD 020C sim card socket
Text: . LTD. 1 I I I CATEGORY PART No. SCT2-W08H30- 020C -R7H-H DRAWING No. SCT2-W08H30- 020C -R7H-H SCALE , MEMBER OF AUK GROUP xmwmfòmnm'ZìEi AUK CONTRACTORS CO. LTD. I I CATEGORY PART No. SCT2-W08H30- 020C -R7H-H DRAWING No. SCT2-W08H30- 020C -R7H-H SCALE NONE APPROVED BY CHECKED BY DRAWING BY MEI HZF REV. QQJ


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PDF SCT2-W08H30-020C-R7H-H SCT2-W08H30-020C-R7H-H auk 505 16X1 H30mm SIM CARD 020C sim card socket
1999 - AVX TAZ

Abstract: 004C CWR06 CWR09 MIL-C-55365 TAZ Series SOT-23 marking 020X
Text: 2.0 20 volt @ 85°C (13 volt @ 125°C) TAZA474() 020C * TAZB684() 020C * TAZB105() 020C * TAZD225() 020C * TAZE335() 020C * TAZF685() 020C * TAZG156() 020C * TAZH226() 020C * A B B D E F G H 0.47 0.68


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PDF CWR06 CWR09 MIL-C-55365/4. MIL-C-55365) UL94V-O SP-R-0022A. CWR11 AVX TAZ 004C MIL-C-55365 TAZ Series SOT-23 marking 020X
2009 - G029

Abstract: JESD22a121 J-STD-002B
Text: rating per IPC/JEDEC JSTD- 020C Table 5-2 and Figure 5 (See Appendix 3). Surface Mount Device (SMD) peak , /JEDEC J-STD- 020C Table 4-1 and 4-2 (See Appendix 4). Pulse offers Sn100 or Sn alloy coatings on the , mount components, Pulse uses the peak solder temperature rating per J-STD- 020C Table 5-2 and Figure 5 , to recertify that Pulse products meet the levels defined in the IPC/JEDEC J-STD- 020C standard , : JEDEC J-STD- 020C Table 5-2 "Classification Reflow Profiles" SN-Pb Eutectic Assembly Pb-Free


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2004 - JEDEC J-STD-020C

Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 J-STD-035 JESD22-A120 AMD reflow soldering profile BGA semiconductors cross reference ipc-sm-786A
Text: IPC/JEDEC J-STD- 020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY , . IPC/JEDEC J-STD- 020C ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Moisture/Reflow Sensitivity , J-STD- 020C Acknowledgment Members of the IPC Association Connecting Electronics Industries® IPC , , Plexus Corp. iii IPC/JEDEC J-STD- 020C July 2004 This Page Intentionally Left Blank iv July 2004 IPC/JEDEC J-STD- 020C Table of Contents 1 1.1 1.2 2 PURPOSE


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PDF J-STD-020C J-STD-020B 1-580987-46-X JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 J-STD-035 JESD22-A120 AMD reflow soldering profile BGA semiconductors cross reference ipc-sm-786A
2001 - Not Available

Abstract: No abstract text available
Text: €¡) 020C * TAZB684(‡) 020C * TAZB105(‡) 020C * TAZD225(‡) 020C * TAZE335(‡) 020C * TAZF685(‡) 020C * TAZG156(‡) 020C * TAZH226(‡) 020C * A B B D E F G H 0.47 0.68 1.0 2.2 3.3 6.8 15.0


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PDF CWR09 050minutes. TAZB105( TAZD225( TAZE335( TAZF685( TAZH226( TAZH106(
NIS06JR22TRF

Abstract: JEDEC-STD-020C spacification
Text: : Values at 20 degreeC [2] HUMIDITY CHARACTERISTICS JEDEC-STD- 020C Inductors shall be subjected to 95%RH at , RESISTANCE JEDEC-STD- 020C Inductors shall be subjected to 85degreeC for 500 hours. Measurements shall be made after 1 hour stabilization at room temperature. [4] THERMAL SHOCK JEDEC-STD- 020C -40degreeC / 30 minutes , JEDEC-STD- 020C Inductors shall be subjected to -40degreeC for 500 hours. Measurements shall be made after 1 hour stabilization at room temperature. [6] HIGH TEMPERATURE LOAD LIFE JEDEC-STD- 020C With rated


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PDF NIS06 NIS06JR22TRF NIS06JR22TRF] JEDEC-STD-020C 60degreeC 85degreeC 10min spacification
osc 50mhz smd 5x7

Abstract: Sunny TCXO NPC 5037 Motorola lv93 Sunny 50MHz plastic raw material CRYSTAL SMD 25MHZ SUNNY XTAL 25mhz 50ppm Alcatel-Lucent Sunny Oscillators
Text: -30 -30 -40 -50 -40 -40 -20 0 20 40 60 Temperature Degree C ( 0.20C step size , Degree C ( 0.20C step size) Hot to Cold-3.0V Cold to Hot-3.0V Hot to Cold-3.3V Cold to Hot , -10 -40 -40 -20 0 20 40 60 Temperature Degree C ( 0.20C step size) 80 -50 -40 -20 0 20 40 60 Temperature Degree C ( 0.20C step size) 80 20 10 Frequency vs , Temperature Degree C ( 0.20C step size) -50 80 Freq-25MHz Manufacturer-SiTime 50 30 -40


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NIS04JR10TRF

Abstract: isopropylalcohol
Text: : Values at 20 degreeC [2] HUMIDITY CHARACTERISTICS JEDEC-STD- 020C Inductors shall be subjected to 95%RH at , RESISTANCE JEDEC-STD- 020C Inductors shall be subjected to 85degreeC for 500 hours. Measurements shall be made after 1 hour stabilization at room temperature. [4] THERMAL SHOCK JEDEC-STD- 020C -40degreeC / 30 minutes , JEDEC-STD- 020C Inductors shall be subjected to -40degreeC for 500 hours. Measurements shall be made after 1 hour stabilization at room temperature. [6] HIGH TEMPERATURE LOAD LIFE JEDEC-STD- 020C With rated


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PDF NIS04 NIS04JR10TRF NIS04JR10TRF] JEDEC-STD-020C 60degreeC 85degreeC 10min isopropylalcohol
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