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0380090070 0380090070 ECAD Model Molex STRIP MARKER 12 STD
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CY7C281A-45JC

Abstract: C282A c282a2
Text: : Package Diagrams 24-Lead (600-Mil) CerDIP D12 M IL-STD-1835 D-3 Config-A pin CY7C281A CY7C282A 24-Lead (300-Mil) CerDIP D14 M IL-STD-1835 D-9 Config-A l - . D I M E N i l D N C [N MI N. MA INCHE , ) 24-Lead Rectangular Cerpack K73 M IL-STD-1835 F-Config-A CY7C281A CY7C282A 28-Square Leadless Chip Carrier L64 M IL-STD-1835 C-4 d im e n iid n : en i n c h e d MIN. MAX, j - ,04


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PDF 300-mil 600-mil 28-pin 600-mil-wide CY7C281A CY7C282A CY7C281A-45JC C282A c282a2
Not Available

Abstract: No abstract text available
Text: M IL-STD-1835 D -3 Config.A DIMENSIONS IN INCHES MIN. MAX 24-Lead (300-Mil) CerDIP D14 28-Square Leadless Chip Carrier L64 MIL— STD— 1835 D - 9 Config. A MIL— STD— 1835 C -4 , IL-STD - 1835 C -4 DIMENSIONS IN INCHES HIN M AX. BOTTDM ^ Oig _ £ 028 .087 .114 045 066 24-Lead (600-MU) Windowed CerDIP W12 M IL-STD-1835 D -3 Config. A 280 D IA LENS PIN 1 , Package Diagrams (continued) 24-Lead (300-Mil) Windowed CerDIP W14 M IL-STD— 1835 D -9 Config. A 175


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PDF CY7C243 CY7C244 CY7C243 CY7C244
TD100

Abstract: No abstract text available
Text: BSC NDTES: DIMENSIONS ARE COMPLIANT TD M IL-STD-1835 , A2. TOLERANCES UNLESS OTHERWISE SPECIFIES


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PDF IL-STD-1835, TD-100, TD100
Not Available

Abstract: No abstract text available
Text: BSC a ß NDTES: DIMENSIONS ARE COMPLIANT TD M IL-STD-1835 , Al, TOLERANCES UNLESS THERVISE


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PDF IL-STD-1835,
Not Available

Abstract: No abstract text available
Text: fü HARRIS S E M I C O N D U C T O R ACTS10MS Radiation Hardened Triple Three-Input NAND Gate Pinouts 14 LEAD CERAM IC DUAL-IN-LINE M IL-STD-1835 DESIGNATOR CDIP2-T14, LEAD FINISH C TOP VIEW A1 ^ B1 , LEAD C ER AM IC FLATPACK M IL-STD-1835 DESIGNATOR CDFP3-F14, LEAD FINISH C TOP VIEW A1 B1 A2 1 . 2 3 4 , (Fiatpack) K14.A M IL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK , ACTS10MS Ceramic Duai-in-Line Metai Seai Packages (SBDIP) c1 LEAD FINISH D14.3 MIL-STD- 1835 CDIP2-T14


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PDF ACTS10MS IL-STD-1835 CDIP2-T14, 1-800-4-HARRIS
Not Available

Abstract: No abstract text available
Text: fü HARRIS S E M I C O N D U C T O R ACTS08MS Radiation Hardened Quad 2-Input AND Gate Pinouts 14 LEAD CERAM IC DUAL-IN-LINE M IL-STD-1835 DESIGNATOR CDIP2-T14, LEAD FINISH C TOP VIEW A1 ^ B1 H , FLAT PACK M IL-STD-1835 DESIGNATOR CDFP3-F14, LEAD FINISH C TOP VIEW A1 B1 Y1 A2 B2 Y2 1* 2 3 4 5 6 7 , Ceramic Metal Seal Flatpack Packages (Flatpack) K14.A M IL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 , .3 MIL-STD- 1835 CDIP2-T14 (D -1, CONFIGURATION C) 14 LEAD CERAM IC DUAL-IN-LINE METAL SEAL PACKAGE INCHES


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PDF ACTS08MS IL-STD-1835 CDIP2-T14, 1-800-4-HARRIS
Not Available

Abstract: No abstract text available
Text: fü HARRIS S E M I C O N D U C T O R ACTS20MS Radiation Hardened Dual 4-Input NAND Gate Pinouts 14 LEAD CERAM IC DUAL-IN-LINE M IL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW A1 ^ , 14 LEAD C ER AM IC FLATPACK M IL-STD-1835 DESIGNATOR, CDFP3-F14, LEAD FINISH C TOP VIEW A1 B1 NC C1 , Metal Seal Flatpack Packages (Flatpack) K14.A M IL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD , 518824 ACTS20MS Ceramic Dual-ln-Line Metal Seal Packages (SBDIP) c1 LEAD FINISH D14.3 MIL-STD- 1835


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PDF ACTS20MS IL-STD-1835 CDIP2-T14, 1-800-4-HARRIS
C2657

Abstract: 8193rd
Text: CYPHiiSS: Package Diagrams 28-Lead (300-M il) CerDIP D22 M IL-STD-1835 D-15 Config. A CY7C265 28 , .: m m MA PIN 1 , 28-S quare Lead less C hip C a rrie r L64 M IL-STD-1835 C -4 28-Pin W ind o w e d L e adless C hip C a rrie r Q64 M IL-STD-1835 C -4 ,44£ .458 9 CYPRESS , d C erDIP W22 M IL-S TD - 1835 D ^ S C o n fig .A ,14 0 X ,3 0 0 DP © Cypress Semiconductor


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PDF CY7C265 7C265W 28-pin, 300-m C2657 8193rd
s08d

Abstract: No abstract text available
Text: fü HARRIS S E M I C O N D U C T O R 4 CS08MS Radiation Hardened Quad 2-Input NAND Gate Pinouts 14 LEAD CERAM IC DUAL-IN-LINE M IL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW A1 ^ , ] Y3 14 LEAD C ER AM IC FLATPACK M IL-STD-1835 DESIGNATOR, CDFP3-F14, LEAD FINISH C TOP VIEW A1 1 2 , 518843 ACS08MS Ceramic Metal Seal Flatpack Packages (Flatpack) K14.A M IL-STD-1835 CDFP3-F14 (F , LEAD FINISH D14.3 MIL-STD- 1835 CDIP2-T14 (D -1, CONFIGURATION C) 14 LEAD CERAM IC DUAL-IN-LINE METAL


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PDF CS08MS IL-STD-1835 CDIP2-T14, 1-800-4-HARRIS s08d
Not Available

Abstract: No abstract text available
Text: HARRIS S E M I C O N D U C T O R ACS86MS Radiation Hardened Quad 2-Input Exclusive OR Gate Pinouts 14 LEAD CERAM IC DUAL-IN-LINE M IL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW May , LEAD C ER AM IC FLATPACK M IL-STD-1835 DESIGNATOR, CDFP3-F14, LEAD FINISH C TOP VIEW 1 14 13 12 11 11 , ) K14.A M IL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE , Seal Packages (SBDIP) c1 LEAD FINISH MIL-STD- 1835 CDIP2-T14 (D -1, CONFIGURATION C) 14 LEAD CERAM


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PDF ACS86MS IL-STD-1835 CDIP2-T14, 1-800-4-HARRIS
aS3131

Abstract: u2331
Text: . C ï PHtiSS: CY7C245A Package Diagram s 24-Lead (300-Mil) CerDIPD14 M IL-STD-1835 D , ill M A/ PIN 1 28-Square Leadless ChipCarrier L64 MIL-STD- 1835 C-4 28-Pin Windowed Leadless Chip Carrier Q64 M IL-STD-1835 C-4 d im e n :id n 3 nr-j in c h e : min, MAX, ,G87 ,114 , M IL-STD-1835 D-9 Config.A CY7C245A PIN 1 - , d im e n l id n : in in c h e : MIN


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PDF 15-ns 300-mil, 24-pin CY7C245A CY7C245A aS3131 u2331
Not Available

Abstract: No abstract text available
Text: -Square L64 Carrier Chip Lead less M IL-STD-1835 C-4 28-Pin Windowed Leadless Chip Carrier Q64 M IL-STD-1835 , IL-STD-1835 D - 9 Config.A p ir . l dimen : idn: m m in inch e : MA BAIE , Document #: 38-00073-F 10 'TPRESS: Package Diagrams 24-Lead (300-Mil) CerDIP D14 MIL-STD- 1835 D


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PDF
Not Available

Abstract: No abstract text available
Text: FLATPACK M IL-STD-1835 , DESIGNATOR CDFP4-F16, LEAD FINISH C TOP VIEW MRI- - 1 · CP P 0 l= tf , Semiconductor ACS161MS Radiation Hardened 4 -Bit Synchronous Counter Pinouts 16 PIN CER AM IC DUAL-IN-LINE MIL-STD- 1835 , DESIGNATOR CDIP2-T16, LEAD FINISH C TOP VIEW MR January 1996 Features Devices QML Qualified in Accordance with MIL-PRF-38535 Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96706 and Harris' QM Plan 1.25 Micron Radiation Hardened SOS CMOS Total D o s e


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PDF ACS161MS MIL-STD-1835, CDIP2-T16, MIL-PRF-38535 ACS161MS 2240mm 2240mm 05A/cm2 ACS161M
CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: atmel at28C010 AT28C010 5962-38267
Text: , Non-Windowed, Ceramic Dual inline Package (Cerdip) Dimensions in Inches and (Millimeters) M IL-STD-1835 D , Inches and (Millimeters) M IL-STD-1835 F-18 CONFIG B JEDEC OUTLINE MO-115 .120(3.05) .006(.152) .004 , (Millimeters)* M IL-STD-1835 C-12 44L, 44-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC) Dimensions in Inches and (Millimeters)* M IL-STD-1835 C-5 .6 62(16.8) .442(11.2) .100(2.54) / .085(2.16


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PDF 128-Bytes 128-Byte AT28C010 0010C-- 10/98/xM CERAMIC LEADLESS CHIP CARRIER LCC 44 atmel at28C010 5962-38267
Not Available

Abstract: No abstract text available
Text: ACS10MS S e m iconductor Radiation Hardened Triple Three-Input NAND Gate A rii 1995 p Pinouts Features 1.25 Micron Radiation Hardened SOS CMOS 14 LEAD CERAM IC DUAL-IN-LINE M IL-STD-1835 , FLATPACK M IL-STD-1835 DESIGNATOR CDFP3-F14, LEAD FINISH C TOP VIEW - VIH = 70% of VCC Min • Input , Dual-ln-Lirie Metal Seal Packages (SBDIP) c1 ±\ n n n n D14.3 MIL-STD- 1835 CDIP2-T14 (D , (Flatpack) K14.A MIL-STD- 1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK


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PDF ACS10MS IL-STD-1835 CDIP2-T14,
Not Available

Abstract: No abstract text available
Text: HCS21MS H R I A RS Ê S E M I C O N D U C T O R M f Ë V È Radiation Hardened Dual 4-Input AND Gate September 1995 Pinouts Features • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAM IC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) M IL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg â , (FLATPACK) M IL-STD-1835 CDFP3-F14, LEAD FINISH C TOP VIEW • Input Logic Levels - VIL = 30% of VCC


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PDF HCS21MS IL-STD-1835 CDIP2-T14, Q0b227
Not Available

Abstract: No abstract text available
Text: 14 LEAD CERAM IC FLAT PACK M IL-STD-1835 DESIGNATOR, CDFP3-F14, LEAD FINISH C TOP VIEW A1 B1 , IL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE INCHES SYMBOL , fü HARRIS S E M I C O N D U C T O R 4 CSOOMS Radiation Hardened Quad 2-Input NAND Gate Pinouts 14 LEAD CERAM IC DUAL-IN-LINE MIL-STD- 1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW A1 ^ B1 , Packages (SBDIP) c1 LEAD FINISH D14.3 MIL-STD- 1835 CDIP2-T14 (D -1, CONFIGURATION C) 14 LEAD CERAM IC


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PDF MIL-STD-1835 CDIP2-T14, 1-800-4-HARRIS
Not Available

Abstract: No abstract text available
Text: ACSOOMS Semiconductor Radiation Hardened Quad 2-Input NAND Gate April 1995 Pinouts Features 14 LEAD C ER AM IC DUAL-IN-LINE M IL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW , Levels - VIL = 30% of VCC Max 14 LEAD C ER AM IC FLAT PACK M IL-STD-1835 DESIGNATOR, C DFP3-F14 , ) c1 ±\ n n n n D14.3 MIL-STD- 1835 CDIP2-T14 (D-1, CONFIGURATION C) 14 LEAD C ER AM IC , Number 7 518813 ACSOOMS Ceramic Metal Seal Flatpack Packages (Flatpack) K14.A MIL-STD- 1835


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PDF IL-STD-1835 CDIP2-T14,
Not Available

Abstract: No abstract text available
Text: ACS20MS S e m iconductor Radiation Hardened Dual 4 -Input NAND Gate A rii 1995 p Features Pinouts 14 LEAD CERAM IC DUAL-IN-LINE M IL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP , €¢ Input Logic Levels 14 LEAD C ER AM IC FLATPACK M IL-STD-1835 DESIGNATOR, CDFP3-F14, LEAD FINISH C TOP , .3 MIL-STD- 1835 CDIP2-T14 (D-1, CONFIGURATION C) 14 LEAD C ER AM IC DUAL-IN-LINE METAL SEAL PACKAGE LEAD , ACS20MS Ceramic Metal Seal Flatpack Packages (Flatpack) K14.A MIL-STD- 1835 CDFP3-F14 (F


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PDF ACS20MS IL-STD-1835 CDIP2-T14,
Not Available

Abstract: No abstract text available
Text: -26C32RH 16 LEAD CERAM IC SIDEBRAZE DIP M IL-STD-1835 : CDIP2-T16 TOP VIEW - Total Dose Up to 300K RAD (Si , Range T ] DIN 12] ENABLE Description HS9-26C32RH 16 LEAD FLATPACK M IL-STD-1835 : CDFP4-F16 , .3 MIL-STD- 1835 CDIP2-T16 (D-2, CONFIGURATION C) 16 LEAD CERAM IC DUAL-IN-LIN E METAL SEAL PACKAGE LEAD , 9 518790 HS-26C32RH Packaging (Continued) K16.A MIL-STD- 1835 CDFP4-F16 (F-5A, CONFIGURATION


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PDF HS-26C32RH HS1-26C32RH IL-STD-1835: CDIP2-T16 RS-422 138mW
Not Available

Abstract: No abstract text available
Text: M IL-STD-1835 D - 9 Config .A DIMENSIONS IN INCHES M M MAX 24—Lead Rectangular Cerpack K73 M IL-STD-1835 28-S q uare Leadless Chip Carrier L64 F -6 Config .A M IL-STD-1835 C


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PDF PALCE22V10 181-MHz 110-MHz 15-ns 25-ns
Not Available

Abstract: No abstract text available
Text: HCTS02MS Semiconductor Radiation Hardened Quad 2-Input NOR Gate August 1995 Pinouts Features • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAM IC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) M IL-STD-1835 CDIP2-T14 TOP VIEW • Total Dose 200K RAD(Si) • SEP Effective LET No , Range: 4.5V to 5.5V 14 LEAD CERAM IC METAL SEAL FLATPACK PACKAGE (FLATPACK) M IL-STD-1835 CDFP3-F14 , HCTS02MS Packaging c1 ±\ n n n n D14.3 MIL-STD- 1835 CDIP2-T14 (D-1, CONFIGURATION C) 14 LEAD C


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PDF HCTS02MS IL-STD-1835 CDIP2-T14
Not Available

Abstract: No abstract text available
Text: HCTS4002MS Semiconductor Radiation Hardened Dual 4-Input NOR Gate August 1995 Features Pinouts 3 Micron Radiation Hardened CMOS SOS 14 LEAD CERAM IC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) M IL-STD-1835 CDIP2-T14 TOP VIEW Total Dose 200K RAD (Si) SEP Effective LET No Upsets: >100 MEV-cm2/mg O [7 A1 [7 B1 [7 ci [7 D1 [7 NC [7 G N D [7 Y1 Single Event Upset (SEU , FLATPACK PACKAGE (FLATPACK) M IL-STD-1835 CDFP3-F14 TOP VIEW LSTTL Input Compatibility - VIL = 0.8V


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PDF HCTS4002MS IL-STD-1835 CDIP2-T14
Not Available

Abstract: No abstract text available
Text: HCS21MS Semiconductor Radiation Hardened Dual 4-Input AND Gate September 1995 Features Pinouts 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAM IC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) M IL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW Total Dose 200K RAD (Si) SEP Effective LET No Upsets: >100 MEV-cm2/mg A1 Single Event Upset (SEU) Immunity < 2 x 10"9 Errors/Bit-Day (Typ , Voltage Range: 4.5V to 5.5V 14 LEAD CER AM IC METAL SEAL FLATPACK PACKAGE (FLATPACK) M IL-STD-1835


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PDF HCS21MS IL-STD-1835 CDIP2-T14,
Not Available

Abstract: No abstract text available
Text: ) . See M IL-STD-1835 T herm al Resistance, Junction-to-A m bient ( 8 j A , ADI Designation M IL-STD - 1835 5962-9313001MPA N/A 8-Pin Cerdip Q-8 G D IP1-T 8 or


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PDF AD830 5962-9313001MPA
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