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935305477118 NXP Semiconductors IC MMIC AMP LNA HVSON10
DB-HVSON10-LPC9103 FDI Future Designs Inc Interface Modules & Development Tools DBHVSON10LPC9103 w/ LPC9103 loaded Rev 1

HVSON10 Datasheets Context Search

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Not Available

Abstract:
Text: SAB9 includes support for most NXP LPC9xx devices in the following packages: TSSOP, HVSON10 , HQVFN28 , mount parts such as the HVSON10 and HQVFN28. All signals from every socket (except PLC44) are brought , like HVSON10 & HQVFN28 • On board LED for testing Technical Details SAB9 Supported Devices , P89LPC93xFDH P89LPC9107FDH P89LPC9102FTK HVSON10 P89LPC9103FTK P89V52xxA PLCC44 USB-ICP-SAB9 shown


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PDF HVSON10, HQVFN28, DIP28. HVSON10 HQVFN28. PLC44) 14-pin, P89LPC93xFHN HQVFN28 P89LPC92xFN
2013 - Not Available

Abstract:
Text: HV S ON 10 SOT650-1 HVSON10 ; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 Rev. 2 — 18 April 2013 Packing , ) 330 x 12 6000 1 341 x 338 x 26 SOT650-1 NXP Semiconductors HVSON10 ; Reel pack; SMD , -1 NXP Semiconductors HVSON10 ; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part , . 3 of 4 SOT650-1 NXP Semiconductors HVSON10 ; Reel pack; SMD, 13" Q1/T1 Standard product


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PDF OT650-1 HVSON10; 001aak603 OT650-1
USB-ICP-SAB9

Abstract:
Text: SAB9 includes support for most NXP LPC9xx devices in the following packages: TSSOP, HVSON10 , HQVFN28 , mount parts such as the HVSON10 and HQVFN28. All signals from every socket (except PLC44) are brought , HVSON10 & HQVFN28 · On board LED for testing Technical Details SAB9 Supported Devices Device , P89LPC93xFDH P89LPC9107FDH P89LPC9102FTK HVSON10 P89LPC9103FTK P89V52xxA PLCC44 USB-ICP-SAB9 shown


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PDF HVSON10, HQVFN28, DIP28. HVSON10 HQVFN28. PLC44) 14-pin, 92xFDH P89LPC93xFDH P89LPC9107FDH USB-ICP-SAB9 PLC44 P89LPC9107FDH P89LPC9103FTK P89LPC9102FTK LPC9xx HQVFN28 DIP28 bread board
2011 - Not Available

Abstract:
Text: ON 10 SOT650-2 HV S HVSON10 ; reel pack; standard product orientation; 12NC ending 138 Rev. 1 — 21 September 2011 Packing information 1. Packing method Printed plano box , -2 NXP Semiconductors HVSON10 ; reel pack; standard product orientation; 12NC ending 138 2. Product , HVSON10 ; reel pack; standard product orientation; 12NC ending 138 4. Reel dimensions A Z W2 , © NXP B.V. 2011. All rights reserved. 3 of 4 SOT650-2 NXP Semiconductors HVSON10 ; reel pack


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PDF OT650-2 HVSON10; 001aak603 OT650-2
2003 - MRC317

Abstract:
Text: Charger detection · Built-in current sensing · Small 3 × 3 mm HVSON10 package with excellent thermal , guarantee fail-safe operation. PACKAGE TYPE NUMBER NAME UBA2007TK/N2 HVSON10 DESCRIPTION plastic thermal , specification of HVSON10 package, see Chapter 12. Fig.2 Pin configuration. 2003 Oct 01 5 Philips , . HVSON10 is mounted to a water-cooled heatsink with the topside of the package. Package is mounted to a 4 , 14 Philips Semiconductors Product specification Charge switch 12 PACKAGE OUTLINE HVSON10


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PDF 807IRELESS SCA75 613502/01/pp19 MRC317 charger of battery PHILIPS CD 245 Fast Charge Wireless Charger HVSON-10 PCF50604
2008 - Not Available

Abstract:
Text: × 3.0 mm × 0.85 mm HVSON10 package NXP Semiconductors SA58672 3.0 W mono class-D audio , . Ordering information Package Name SA58672TK SA58672UK HVSON10 WLCSP9 Description plastic thermal enhanced , Transparent top view (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 , B2 C2 A3 B3 C3 HVSON10 4 2 3 5 9 1 7 8 10 6 (DAP) channel positive input analog supply voltage (level , SD other pins WLCSP9; derating factor 10 mW/K Tamb = 25 °C Tamb = 75 °C Tamb = 85 °C HVSON10


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PDF SA58672 SA58672 10-terminal
2009 - Not Available

Abstract:
Text: × 3.0 mm × 0.85 mm HVSON10 package NXP Semiconductors SA58672 3.0 W mono class-D audio , . Ordering information Package Name SA58672TK SA58672UK HVSON10 WLCSP9 Description plastic thermal enhanced , Transparent top view (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 , B2 C2 A3 B3 C3 HVSON10 4 2 3 5 9 1 7 8 10 6 (DAP) channel positive input analog supply voltage (level , SD other pins WLCSP9; derating factor 10 mW/K Tamb = 25 °C Tamb = 75 °C Tamb = 85 °C HVSON10


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PDF SA58672 SA58672 10-terminal prov26
2004 - LPC915

Abstract:
Text: TSSOP14 HVSON10 HVSON10 SO8 SO8 SO8 SO8, DIP8 SO8 SO8, DIP8 SO8, DIP8 P89LPC91x family Big


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PDF P89LPC91x 80C51 14-pin/ 16-pin P89LPC912/913/914/915/916/917 LPC900 80C51 LPC915 TSSOP28 P89lpc901 MCB900 LPC917 LPC912 EPM900 a 13483
2004 - lpc901

Abstract:
Text: TSSOP20, DIP20 TSSOP16 TSSOP16 TSSOP14 TSSOP14 TSSOP14 TSSOP14 TSSOP14 HVSON10 HVSON10 SO8 SO8


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PDF P89LPC90x 80C51 P89LPC901/902/903/904/906/907/908 LPC900 80C51 lpc901 lpc903 PAB90x-2 p89lpc904 P89lpc901 LPC904 PAB90x-1 TSSOP28 flash memory dip8
2004 - TSSOP20 FOOTPRINT

Abstract:
Text: TSSOP14 HVSON10 HVSON10 SO8 SO8 SO8 SO8, DIP8 SO8 SO8, DIP8 SO8, DIP8 P89LPC92x family Big


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PDF P89LPC92x 80C51 20-pin P89LPC920/921/922/924/925 LPC900 80C51 TSSOP20 FOOTPRINT HVSON10 TSSOP28 P89LPC935 P89LPC936 P89LPC933 P89LPC932A1 P89LPC931
2004 - HVQFN28

Abstract:
Text: TSSOP14 HVSON10 HVSON10 SO8 SO8 SO8 SO8, DIP8 SO8 SO8, DIP8 SO8, DIP8 P89LPC93x family


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PDF P89LPC93x 28-pin P89LPC930/931/932A1/933/934/935/936/938 LPC900 HVQFN28 TSSOP28 LPC935 P89LPC936 TSSOP-28 LPC938 P89LPC934 lpc900 lpc935 pwm
2003 - charger of battery PHILIPS CD 245

Abstract:
Text: detection · Built-in current sensing · Small 3 × 3 mm HVSON10 package with excellent thermal properties , ORDERING INFORMATION PACKAGE TYPE NUMBER NAME UBA2007TK/N2 2003 Oct 01 HVSON10 DESCRIPTION , MRC313 This diagram is a bottom view For mechanical specification of HVSON10 package, see Chapter 12 , CONDITIONS UNIT 22(2) note 1 VALUE K/W Notes 1. HVSON10 is mounted to a water-cooled , Semiconductors Product specification Charge switch UBA2007 12 PACKAGE OUTLINE HVSON10 : plastic


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PDF UBA2007 SCA75 613502/01/pp19 charger of battery PHILIPS CD 245 pcf50604 convection oven temperature sensor handset charger circuit diagram HVSON10 MRC313 MRC317 SWITCH MODE CURRENT SOURCE UBA2007
2009 - portable dvd player schematic diagram of video

Abstract:
Text: dissipation with 3.0 mm × 3.0 mm × 0.85 mm HVSON10 package SA58672 NXP Semiconductors 3.0 W mono , SA58672TK HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals , (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 SA58672 , . Symbol Pin description Pin Description WLCSP9 HVSON10 INP A1 4 channel positive , WLCSP9; derating factor 10 mW/K HVSON10 ; derating factor 20 mW/K Tamb ambient temperature


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PDF SA58672 SA58672 10-terminal portable dvd player schematic diagram of video class d power amplifier SA58672TK usb mp3 player circuit diagram pcb layout SA58672UK MPZ1608S221A MO-229 ipod repair HVSON10 BLM21PG221SN1
2003 - pcf50601

Abstract:
Text: Small 3 × 3 mm HVSON10 package with excellent thermal properties · The UBA2008 is qualified according , NUMBER NAME UBA2008TK/N2 2003 Oct 01 HVSON10 DESCRIPTION plastic thermal enhanced very thin , This diagram is a bottom view For mechanical specification of HVSON10 package, see Chapter 12. Fig , 22(2) note 1 VALUE K/W Notes 1. HVSON10 is mounted to a water-cooled heatsink with the , UBA2008 12 PACKAGE OUTLINE HVSON10 : plastic thermal enhanced very thin small outline package; no leads


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PDF UBA2008 SCA75 613502/01/pp19 pcf50601 MRC319 UBA2008 UBA2008TK MRC318 PCF50604 HVSON10
2008 - HSVON10

Abstract:
Text: . Ordering information Type number Package Name Description PCF2120TK HVSON10 plastic , Fig 2. Pin configuration HVSON10 package PCF2120_1 Product data sheet 001aah559 Fig 3 , . Pin description Symbol Pin Pad Description HVSON10 Wire bond die n.c. 1 - , 7 of 14 PCF2120 NXP Semiconductors Quartz oscillator 14. Package outline HVSON10 , PROJECTION ISSUE DATE 01-01-22 02-02-08 Fig 9. Package outline SOT650-1 ( HVSON10 ) PCF2120


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PDF PCF2120 PCF2120 HSVON10 HVSON10 JESD22-A114 JESD22-A115 JESD78 MO-229 nxp pcf2120 PCF2120TK PCF2120U
MO-229

Abstract:
Text: PDF: 2001 Jan 22 Philips Semiconductors Package outline HVSON10 : plastic, heatsink very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.90 mm SOT650-1 y1 C X y A B D E A terminal 1 index area C A4 detail X v M B w M b 1 5 L Eh Bottom view 6 10 e Dh DIMENSIONS (mm are the original dimensions) A UNIT max. mm 0.90 OUTLINE VERSION SOT650-1 A4 b D Dh E Eh e L v w y


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PDF HVSON10: OT650-1 MO-229 MO-229 HVSON10 sot650 HVSON-10
2010 - Not Available

Abstract:
Text: Package outline HVSON10 : plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 10 x 10 x 0.85 mm X A B D SOT1325-1 E A A1 c terminal 1 index area detail X terminal 1 index area e1 e L C b 1 5 C A B C v w y1 C y Eh 10 6 Dh 0 5 mm scale Dimensions (mm are the original dimensions) Unit A A1 b max 1.00 0.05 0.80 nom 0.85 0.02 0.70 min 0.80 0.00 0.60 mm c 0.2 D(1) Dh


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PDF HVSON10: OT1325-1 MO-229 sot1325-1
2003 - MRC319

Abstract:
Text: current sensing · Small 3 × 3 mm HVSON10 package with excellent thermal properties · The UBA2008 is , NUMBER NAME UBA2008TK/N2 HVSON10 DESCRIPTION plastic thermal enhanced very thin small outline package; no , MRC319 This diagram is a bottom view For mechanical specification of HVSON10 package, see Chapter 12 , SYMBOL Rth(j-c) Notes 1. HVSON10 is mounted to a water-cooled heatsink with the topside of the package , 14 Philips Semiconductors Product specification Charge switch 12 PACKAGE OUTLINE HVSON10


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PDF 807IRELESS SCA75 613502/01/pp19 MRC319 MRC320 MRC314 MRC318 pcf50601 PCF50604
2010 - NX3L4684

Abstract:
Text: HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 × 3 × 0.85 , configuration SOT1049-2 (XQFN10U) Fig 4. Pin configuration SOT650-1 ( HVSON10 ) 7.2 Pin description , packages: above 132 °C the value of Ptot derates linearly with 14.1 mW/K. For HVSON10 packages: above 135 , NX3L4684 NXP Semiconductors Dual low-ohmic single-pole double-throw analog switch HVSON10 : plastic , ISSUE DATE 01-01-22 02-02-08 Fig 32. Package outline SOT650-1 ( HVSON10 ) NX3L4684_4 Product data


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PDF NX3L4684 NX3L4684 HVSON10 MO-229 NX3L4684GM NX3L4684TK
2009 - SA58672UK

Abstract:
Text: dissipation with 3.0 mm × 3.0 mm × 0.85 mm HVSON10 package SA58672 NXP Semiconductors 3.0 W mono , SA58672TK HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals , (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 SA58672 , . Symbol Pin description Pin Description WLCSP9 HVSON10 INP A1 4 channel positive , WLCSP9; derating factor 10 mW/K HVSON10 ; derating factor 25 mW/K Tamb ambient temperature


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PDF SA58672 SA58672 10-terminal SA58ns SA58672UK SA58672TK portable dvd player schematic diagram of video MPZ1608S221A MO-229 ipod repair HVSON10 BLM21PG221SN1 AUX0025
2004 - Not Available

Abstract:
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVSON10 package SOT650-1 Gx D (0.105) P C SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy SPx tot SPy tot SPx


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PDF HVSON10 OT650-1 OT650-1
1996 - HVSON10

Abstract:
Text: PDF: 2002 Feb 08 Philips Semiconductors Package outline HVSON10 : plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm SOT650-1 0 1 2 mm scale X A B D A A1 E c detail X terminal 1 index area C e1 terminal 1 index area e 5 y y1 C v M C A B w M C b 1 L Eh 6 10 Dh DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D(1) Dh E(1) Eh


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PDF HVSON10: OT650-1 MO-229 HVSON10 MO-229
2008 - Diodes smd E5H

Abstract:
Text: : TSSOP8, TSSOP10, HVSON8, HVSON10 3. Applications I I I I I RGB or RGBA LED drivers for color , 0.85 mm SOT908-1 PCA9632TK2 9632 HVSON10 plastic thermal enhanced very thin small , view Pin configuration for HVSON8 Fig 5. Pin configuration for HVSON10 6.2 Pin description , + I2C-bus low power LED driver Table 3. Pin description for TSSOP10 and HVSON10 Symbol Pin , SDA 9 I/O serial data line VDD 10 power supply supply voltage [1] HVSON10


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PDF PCA9632 PCA9632 PCA9633 Diodes smd E5H PCA9632DP2 sot552-1 HVSON10 PCA9632DP1 JESD78 JESD22-A115 JESD22-A114
2009 - Not Available

Abstract:
Text: Package outline HVSON10 : plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm SOT650-2 X A B D E A A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L K Eh 10 6 Dh 0 1 Dimensions Unit mm 2 mm scale A(1) A1 b max 1.00 0.05 0.30 nom 0.85 0.03 0.25 min 0.80 0.00 0.18 c D(1) Dh E(1) Eh e e1 K L


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PDF HVSON10: OT650-2 MO-229 sot650-2
2009 - HVSON10

Abstract:
Text: -2 NX3L4684TK -40 °C to +125 °C HVSON10 plastic thermal enhanced very thin small outline package; no , . Transparent top view Pin configuration SOT1049-2 (XQFN10U) Fig 4. Pin configuration SOT650-1 ( HVSON10 , mW/K. For HVSON10 packages: above 135 °C °C the value of Ptot derates linearly with 17.2 mW/K. 10 , Semiconductors Dual low-ohmic single-pole double-throw analog switch HVSON10 : plastic thermal enhanced very , 02-02-08 Fig 32. Package outline SOT650-1 ( HVSON10 ) NX3L4684_2 Product data sheet © NXP B.V. 2009


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PDF NX3L4684 NX3L4684 HVSON10 JESD22-A114E MO-229 NX3L4684GM NX3L4684TK
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