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2010 - HVQFN64

Abstract: HVQFN40 ADC1613D065WO ADC1410S080 ADC1410S065 ADC1215S125 ADC1215S105 ADC1215S080 ADC1215S065 ADC1215S
Text: , and x8 interpolation · 1.8 / 3.3 590 90 70.3 HVQFN64 9x9 · · 1.8 / 3.3 490 90 70.5 HVQFN64 9x9 · · 1.8 / 3.3 390 91 70.6 DAC1008D series , Dissipation (mW) SFDR (dBc) Interpolation · 1.8 / 3.3 350 91 70.7 HVQFN64 9x9 , / 3.3 850 77 2x., 4x., 8x HVQFN64 9x9 · 1.8 / 3.3 850 77 2x., 4x., 8x HVQFN64 9x9 · · 1.8 / 3.3 350 91 70.7 HVQFN40 6x6 Single 12-bit ADC 80 Msps ·


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PDF ADC1215S ADC1215S065/DB ADC1215S065 ADC1215S080/DB ADC1215S080 ADC1215S105/DB ADC1215S105 ADC1215S125/DB ADC1215S125 ADC1410S065/DB HVQFN64 HVQFN40 ADC1613D065WO ADC1410S080 ADC1410S065
2009 - LQFP64

Abstract: ARM7 LPC2138 LQFP-64 HVQFN64 LPC213x ARM LPC213X AD10 32 KB SRAM LPC2136 LPC2132
Text: Flash 32 KB 512 KB SRAM LPC213x/01 3.3-V LQFP64 (10 x10 x 1.4 mm) HVQFN64 (9 x 9 x 0.85 mm , LQFP64 LQFP64, HVQFN64 · LQFP64, HVQFN64 LQFP64 · LQFP64 LQFP64 · LQFP64 LQFP64, HVQFN64 · LQFP64, HVQFN64 www.nxp.com © 2009 NXP N.V. 2009 ( ) 10 NXP


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PDF LPC213x 60-MHz LPC213x/01 15-MHz LQFP64 HVQFN64 16C550 LQFP64 ARM7 LPC2138 LQFP-64 LPC213x ARM LPC213X AD10 32 KB SRAM LPC2136 LPC2132
2012 - Not Available

Abstract: No abstract text available
Text: -bit ADC up to 125 Msps • • 1.8 / 3.0 610 87 71.4 HVQFN64 9x9 ADC1412D105 Dual 14-bit ADC up to 105 Msps • • 1.8 / 3.0 555 85 71.8 HVQFN64 9x9 ADC1412D080 Dual 14-bit ADC up to 80 Msps • • 1.8 / 3.0 435 86 72.0 HVQFN64 9x9 ADC1412D065 Dual 14-bit ADC up to 65 Msps • • 1.8 / 3.0 405 86 72.1 HVQFN64 9x9 , -bit ADC up to 125 Msps • • 1.8 / 3.0 610 87 71.4 HVQFN64 9x9 ADC1412D105


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PDF DAC1001D125 DAC1001D125-DB DAC1001D125 DAC1003D160 DAC1003D160-DB DAC1003D160 DAC1005D650-DB DAC1005D650 DAC1005D750-DB DAC1005D750
2010 - convertisseur dc dc

Abstract: DAC1408D 16888 LTE baseband frequency synthesizer for LTE Applications Dual-channel Transceiver mimo nxp 32 bit JESD204A DAC1408D750 transceiver 4G LTE
Text: low-power option } SPI control/status interface } HVQFN64 package } MDS (Multi-DAC Synchronisation , HVQFN64 9x9 DAC1208D series DAC1208D750 Dual 12-bit DAC 750 Msps · 1.8 / 3.3 700 77 2x, 4x, 8x HVQFN64 9x9 DAC1008D series DAC1008D750 Dual 10-bit DAC 750 Msps · 1.8 / 3.3 700 77 2x, 4x, 8x HVQFN64 9x9 650Msps maximum output rate is also available for


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PDF DAC1408D JESD204A-compliant JESD204A. JESD204A HVQFN64 14-bit) convertisseur dc dc 16888 LTE baseband frequency synthesizer for LTE Applications Dual-channel Transceiver mimo nxp 32 bit DAC1408D750 transceiver 4G LTE
2007 - lqfp64

Abstract: LQFP64 package ARM7 LPC2138 LQFP-64 nxp lpc2138 ARM7TDMI-S pll ARm 7 lpc2138 block diagram with ARM 7 LPC2138 UART REGISTERS LPC2131 LPC2132
Text: : P ­ LQFP64 (10 x 10 x 1.4 mm) ­ HVQFN64 (9 x 9 x 0.85 mm) Applications 4 utomotive , , Fast I/Os, and BOD 1 Packages LQFP64 · LQFP64 LQFP64, HVQFN64 · LQFP64, HVQFN64 LQFP64 · LQFP64 LQFP64 · LQFP64 LQFP64, HVQFN64 · LQFP64, HVQFN64 www.nxp.com


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PDF 60-MHz, 32-bit LPC213x 10-bit 32-bit LPC213x/01 lqfp64 LQFP64 package ARM7 LPC2138 LQFP-64 nxp lpc2138 ARM7TDMI-S pll ARm 7 lpc2138 block diagram with ARM 7 LPC2138 UART REGISTERS LPC2131 LPC2132
2010 - samtec connector

Abstract: ADC0808D250 ADC0808D ADC1415S080 LVDS connector ADC1010S080 HVQFN64 DEMO
Text: 610 87 71.4 HVQFN64 9x9 · · 1.8 / 3.0 555 85 71.8 HVQFN64 9x9 Dual 14-bit ADC up to 80Msps · · 1.8 / 3.0 435 86 72.0 HVQFN64 9x9 Dual 14-bit ADC up to , 1.8 / 3.0 630 87 71.4 HVQFN64 9x9 · 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 , HVQFN64 9x9 · · 1.8 / 3.0 435 86 69.9 HVQFN64 9x9 Dual 12-bit ADC up to 65Msps · · 1.8 / 3.0 405 86 70.0 HVQFN64 9x9 ADC1210S125 Single 12-bit ADC up to


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PDF ADC1207S080 ADC1207S080/DB ADC1207S080 ADC1210S ADC1210S065/DB ADC1210S065 ADC1210S065F1/DB ADC1210S065F2/DB ADC1413D125 samtec connector ADC0808D250 ADC0808D ADC1415S080 LVDS connector ADC1010S080 HVQFN64 DEMO
2011 - Not Available

Abstract: No abstract text available
Text: • • 1.8 / 3.0 610 87 71.4 HVQFN64 9x9 ADC1412D105 Dual 14-bit ADC up to 105 Msps • • 1.8 / 3.0 555 85 71.8 HVQFN64 9x9 ADC1412D080 Dual 14-bit ADC up to 80 Msps • • 1.8 / 3.0 435 86 72.0 HVQFN64 9x9 ADC1412D065 Dual 14-bit ADC up to 65 Msps • • 1.8 / 3.0 405 86 72.1 HVQFN64 9x9 , HVQFN64 9x9 ADC1212D105 Dual 12-bit ADC up to 105 Msps • • 1.8 / 3.0 555 85


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PDF JESD204A/JESD204B) JESD204A, JESD204B voltag628D1G25
2010 - Not Available

Abstract: No abstract text available
Text: dual-stage linearity calibration } Input bandwidth: 600 MHz } SPI control/status interface } HVQFN64 , ) 1.8 / 3.0 LVCMOS LVDS/ DDR SFDR (dBc) Package 610 71.4 HVQFN64 9x9 610 69.6 HVQFN64 9x9 610 66.2 HVQFN56 8x8 Other maximum samples rates (105, 080, 065 Msps


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PDF ADC1112D ADC1212D ADC1412D 14-bit HVQFN64 14-bit)
2009 - Not Available

Abstract: No abstract text available
Text: Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm A B D SOT804-3 terminal 1 index area E A A1 c detail X e1 1/2 e e L 17 32 C C A B C v w b y1 C y 33 16 e e2 Eh 1/2 e 1 terminal 1 index area 48 64 49 X Dh 0 2.5 Dimensions Unit mm 5 mm scale A A1 b max 1.00 0.05 0.30 nom 0.85 0.02 0.21 min 0.80 0.00 0.18 c D


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PDF HVQFN64: OT804-3 OT804-6 sot804-3
2002 - HVQFN64

Abstract: MO-220 jedec package MO-220 64 sot804
Text: PDF: 2003 Mar 27 Philips Semiconductors Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-1 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 1/2 y1 C v M C A B w M C b e 17 y 32 L 33 16 e e2 Eh 1/2 1 terminal 1 index area e 48 49 64 X Dh 0 5 10 mm scale DIMENSIONS (mm are the original


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PDF HVQFN64: OT804-1 MO-220 HVQFN64 MO-220 jedec package MO-220 64 sot804
2009 - 1763A

Abstract: ISP1763AETTM ISP1763 ISP1763AHNTM "USB" peripheral ST-Ericsson marking information
Text: for portable applications; available in HVQFN64 and TFBGA64 Restriction of Hazardous Substances (RoHS , HVQFN64 ; 64 terminals; body 9 × 9 × 0.85 mm 5. Marking Table 2. Marking codes Marking code[1] 1763A


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PDF ISP1763A ISP1763A ISP1582 ISP1763 1763A ISP1763AETTM ISP1763AHNTM "USB" peripheral ST-Ericsson marking information
2010 - Not Available

Abstract: No abstract text available
Text: Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm A B D SOT804-5 terminal 1 index area E A A1 c detail X e1 e L1 L 1/2 e v w b 17 32 16 C C A B C y y1 C 33 Et e Es e2 Eh 1/2 e 1 terminal 1 index area 48 64 X 49 Ds Dt Dh L2 0 5 mm scale Dimensions Unit A A1 b c max 1.00 0.05 0.30 nom 0.85 0.02 0.21 0.2


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PDF HVQFN64: OT804-5 sot804-5
2010 - Not Available

Abstract: No abstract text available
Text: Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm A B D SOT804-4 terminal 1 index area E A A1 c detail X e1 e L1 L 1/2 e v w b 17 32 16 C C A B C y y1 C 33 Et e Es e2 Eh 1/2 e 1 terminal 1 index area 48 64 Ds Dh Dt L2 0 2.5 mm 5 mm scale Dimensions Unit X 49 A A1 b c max 1.00 0.05 0.30 nom 0.85


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PDF HVQFN64: OT804-4 sot804-4
2009 - ISP1763

Abstract: ISP1568 TFBGA128 USB Hub Controllers USB Controllers PXA255 SOT923 PCIE interface ISP1583 SOT407-1
Text: ISP1763 PCI/WinCE kit · FlexiUSB stack for high-speed host and device · HVQFN64 (SOT923-2) · TFBGA64 , split bus kit · ISP1583 mass storage kit · HVQFN64 (SOT804-1) · TFBGA64 (SOT543-1) 6 x 6 mm ·


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PDF ISP1160/01 PXA25x/WinCE QFP64 OT314-2, OT414-1) SAC105 ISP1582 HVQFN56 ISP1763 ISP1568 TFBGA128 USB Hub Controllers USB Controllers PXA255 SOT923 PCIE interface ISP1583 SOT407-1
2004 - HVQFN64

Abstract: jedec package MO-220 64 SOT804-2 MO-220 sot804
Text: Package outline Philips Semiconductors HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e y1 C v M C A B w M C b 1/2 e 17 y 32 L 33 16 e e2 Eh 1/2 e 1 terminal 1 index area 48 49 64 X Dh 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1


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PDF HVQFN64: OT804-2 MO-220 HVQFN64 jedec package MO-220 64 SOT804-2 MO-220 sot804
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-1 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 17 y1 C v M C A B w M C b 1/2 e 32 L y 33 16 e e2 Eh 1/2 e 1 terminal 1 index area 48 49 64 X Dh 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A4 b c D D1


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PDF HVQFN64: OT804-1 MO-220
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm B D SOT923-1 A terminal 1 index area E A A1 c detail X e1 L e 1/2 e 17 v w b 32 M M C C A B C y1 C y 33 16 e e2 Eh 1/2 e 1 terminal 1 index area 48 64 49 Dh X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 b c D (1) Dh


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PDF HVQFN64: OT923-1
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 17 L y1 C v M C A B w M C b 1/2 e 32 y 33 16 e e2 Eh 1/2 e 1 terminal 1 index area 48 49 64 X Dh 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A4 b c D D1


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PDF HVQFN64: OT804-2 MO-220
2010 - BGA7133

Abstract: BGA7130 BGA7203 qubic4 BLF7G22-130 BLF6G21-10G SOT502 BLF7G22LS-200 BLF6G22-130 SOT538A
Text: 73.2 LVCMOS and LVDS/DRR HVQFN64 9x9 ADC1410S series Single 14-bit ADC up to 65/80/105 , -bit ADC up to 65/80/105/125Msps 1.8 / 3.3 350 91 70.7 LVCMOS and LVDS/DRR HVQFN64 9x9 , HVQFN64 9x9 DAC1405D series ADC1005S060 ADC1002S020 ADC0801S040 DACs Type Dual 14 , / 3.3 850 77 2x. 4x. 8x HVQFN64 9x9 DAC1205D series Dual 12-bit DAC upto 650/750 Msps , . 4x. 8x HVQFN64 9x9 DAC1005D series Dual 10-bit DAC upto 650/750 Msps 1.8 / 3.3 550


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PDF HTQFP80 12x12 DAC1001D125 10-bit LQFP48 BGA7133 BGA7130 BGA7203 qubic4 BLF7G22-130 BLF6G21-10G SOT502 BLF7G22LS-200 BLF6G22-130 SOT538A
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HVQFN64 : plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm B D SOT923-2 A terminal 1 index area E A A1 c detail X e1 1/2 e L e 17 b v w 32 16 C C A B C M M y y1 C 33 e e2 En Em Ek Ej Eh 1/2 e 1 terminal 1 index area 48 64 49 Dh X Dj Dk Dm e2 0 5 mm max nom min v w y y1 0.5 0.4 0.3 0.1 0.05 0.05 0.1


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PDF HVQFN64: OT923-2
2004 - Not Available

Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN64 package SOT804-1 Hx Gx D P C (0.105) SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste nSPx nSPy 3 occupied area 3 Hx Hy DIMENSIONS in mm P Ax Ay Bx By C


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PDF HVQFN64 OT804-1 OT804-1
2004 - PMEG2020EA

Abstract: smps repair circuit 40V NPN embedded package TEA1620P TEA1622 smps repair TEA1623P pecl clock so8 30v 3a schottky barrier type rectifiers smd transistor bq
Text: 4 8/10 19(4)/16 60 LQFP144 HVQFN64 HVQFN64 HVQFN64 HVQFN64 * includes Watchdog


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PDF PCK12429 PBSS5540X PCK111/PCK210/PCKEL14/PCKEP14 TDA9965A PMEG2020EA smps repair circuit 40V NPN embedded package TEA1620P TEA1622 smps repair TEA1623P pecl clock so8 30v 3a schottky barrier type rectifiers smd transistor bq
2013 - Not Available

Abstract: No abstract text available
Text: HVQFN64 package Typical Applications • Wireless and wired broadband communications • Spectral


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PDF ADC1212D 12-Bit ADC1412D ADC1112D125. HVQFN64 ADC1212D125HN-C1 ADC1212D105HN-C1 ADC1212D080HN-C1 ADC1212D065HN-C1
2012 - Not Available

Abstract: No abstract text available
Text: , two’s complement, gray code  Power-down and Sleep modes  HVQFN64 package 3. Applications , ADC1212D125HN-C1 125 HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9  9  0.85 mm SOT804-3 ADC1212D105HN-C1 105 HVQFN64 plastic thermal enhanced very , -3 ADC1212D080HN-C1 80 HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9  9  0.85 mm SOT804-3 ADC1212D065HN-C1 65 HVQFN64 plastic thermal enhanced very thin


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PDF ADC1212D 12-bit
2007 - LPC2148 interfacing circuit with adc

Abstract: LPC2148 interfacing circuit with dac LPC2148 interfacing circuit with on chip adc ARM LPC2148 block diagram with ARM LPC2148 application notes ARM LPC2148 features circuit diagram ARM7 LPC2148 block diagram of lpc2148 microcontroller ttl 74118 lpc2132fbd64 LPC2148 interfacing circuit with adc using pwm
Text: -2 SOT314-2 SOT314-2 SOT314-2 SOT804-2 Type number HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm LPC2132FHN64/01 HVQFN64 plastic thermal enhanced , HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × , LPC2134/36/38. Fig 5. LPC2132/38 HVQFN64 pin configuration LPC2131_32_34_36_38_4 © NXP B.V. 2007


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PDF LPC2131/32/34/36/38 16/32-bit 10-bit LPC2131/32/34/36/38 128-bit 32-bit 16-bit LPC213x LPC213x LPC2148 interfacing circuit with adc LPC2148 interfacing circuit with dac LPC2148 interfacing circuit with on chip adc ARM LPC2148 block diagram with ARM LPC2148 application notes ARM LPC2148 features circuit diagram ARM7 LPC2148 block diagram of lpc2148 microcontroller ttl 74118 lpc2132fbd64 LPC2148 interfacing circuit with adc using pwm
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