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2009 - HTQFP100

Abstract: AD9788 AD9779A AD9785 AD9787 DAC1205D650 DAC5687 DAC5688
Text: dBc 81 dBc AD9788 AD9779A DAC5688 DAC5687 HTQFP100 DAC1205D650 12-bit 83 dBc 80 dBc AD9787 AD9778A HTQFP100 DAC1005D650 10-bit 81 dBc 78 dBc AD9785 AD9776A HTQFP100 DAC1405 Demo Board www.nxp.com © 2009 NXP B.V. All rights reserved. Reproduction in


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PDF 10/12/14-bit, DAC1x05D650 14-bit 32-bit 10/12/14-bit ratQFP100 DAC1005D650 10-bit AD9785 AD9776A HTQFP100 AD9788 AD9779A AD9785 AD9787 DAC1205D650 DAC5687 DAC5688
2002 - HTQFP100

Abstract: LQFP48 DB4042 HBCC32 TZA3043 TZA3041 TZA3033 TZA3031 TZA3023 TZA3013
Text: 30-3250 30-3250 QFP64 HLQFP100 HLQFP100 HTQFP100 HTQFP100 TZA3015 Notes: X X X 50 , HTQFP100 Status January-01 116 95 112 86 125 300 1500 BiCMOS BiCMOS BiCMOS BiCMOS


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PDF MSD818 TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 2-12mV HTQFP100 LQFP48 DB4042 HBCC32 TZA3043 TZA3041 TZA3033 TZA3031 TZA3023 TZA3013
2008 - LQFP48

Abstract: ADC1002S020 ADC0801S040 CAR alarm INTEGRATED CIRCUIT 8 bit ttl ADC
Text: /parallel CMOS HTQFP100 14x14 DAC1201D125 Dual 12-bits DAC 125 Msps 3.3V 185 mW 79 dB - , 950 mW 83 dB 2x, 4x, 8x Interleaved /parallel CMOS HTQFP100 14x14 DAC1401D125 Dual , /parallel CMOS HTQFP100 14x14 Package Imaging Front End Selection Table Type Description


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PDF 216mW 125nV/Hz SSOP20 LQFP48 ADC1002S020 ADC0801S040 CAR alarm INTEGRATED CIRCUIT 8 bit ttl ADC
2010 - HVQFN64

Abstract: HVQFN40 ADC1613D065WO ADC1410S080 ADC1410S065 ADC1215S125 ADC1215S105 ADC1215S080 ADC1215S065 ADC1215S
Text: 64 · 1.8 / 3.3 550 77 2x., 4x., 8x HTQFP100 14x14 Dual 10-bit DAC 650 Msps · 1.8 / 3.3 550 77 2x., 4x., 8x HTQFP100 14x14 DAC1003D160 Dual 10-bit DAC 160 Msps , HTQFP100 14x14 Dual 14-bit DAC 650 Msps · 1.8 / 3.3 550 77 2x., 4x., 8x HTQFP100 14x14 , 2x., 4x., 8x HTQFP100 14x14 Dual 12-bit DAC 650 Msps · 1.8 / 3.3 550 80 2x., 4x., 8x HTQFP100 14x14 NXP Semiconductors


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PDF ADC1215S ADC1215S065/DB ADC1215S065 ADC1215S080/DB ADC1215S080 ADC1215S105/DB ADC1215S105 ADC1215S125/DB ADC1215S125 ADC1410S065/DB HVQFN64 HVQFN40 ADC1613D065WO ADC1410S080 ADC1410S065
SnPb36Ag2

Abstract: J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
Text: 205 200 150 FQFP208 HVQFN48 VSO56 HTQFP100 SO28 100 50 0 Temperature in degree C , FQFP208 HVQFN48 VSO56 100 50 HTQFP100 SO28 0 0 100 200 300 400 0 60 , test (-40/+125 oC) lead-free and lead-containing reflow solder Sn plated HTQFP100 components (Cu-based leadframe) HTQFP100 , reflow ln[1/(1-f)] 10 1 SnPb SnAgCu 0,1 0,01 100 1000 N


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PDF 2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA Infineon diffusion solder lead-free solder joint reliability thermal cycle reflow temperature bga FeNi42-leadframe FeNi42 JSTD020B bga thermal cycling reliability
2001 - LQFP48

Abstract: cgy2141 LQFP32 TZA3013 TZA3023 TZA3033 TZA3043 TZA3012 CGY2151
Text: HLQFP100 HTQFP100 HTQFP100 X X X X -38 -32 -28 -24 -28 -22,4 -16 EAM [Vppse] E.R


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PDF TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 LQFP32 LQFP48 cgy2141 LQFP32 TZA3013 TZA3023 TZA3033 TZA3043 TZA3012 CGY2151
2010 - samtec connector

Abstract: ADC0808D250 ADC0808D ADC1415S080 LVDS connector ADC1010S080 HVQFN64 DEMO
Text: 1.8 / 3.0 630 87 71.4 HVQFN64 9x9 · 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 Dual 12-bit DAC 650 Msps · 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 , · 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1005D650 Dual 10-bit DAC 650 Msps · 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1003D160 Dual 10-bit DAC , 2x, 4x, 8x HTQFP100 14x14 DAC1405D650 Dual 14-bit DAC 650 Msps · 1.8 / 3.3 435


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PDF ADC1207S080 ADC1207S080/DB ADC1207S080 ADC1210S ADC1210S065/DB ADC1210S065 ADC1210S065F1/DB ADC1210S065F2/DB ADC1413D125 samtec connector ADC0808D250 ADC0808D ADC1415S080 LVDS connector ADC1010S080 HVQFN64 DEMO
SnPb36Ag2

Abstract: Lead Free reflow soldering profile BGA semiconductors cross reference Infineon diffusion solder FeNi42 BGA Ball Crack philips pb-free products STD-020C BGA and QFP Package freescale 020C
Text: 260 250 205 200 150 FQFP208 HVQFN48 VSO56 HTQFP100 SO28 100 50 0 Temperature in , 235 200 150 FQFP208 HVQFN48 100 VSO56 50 HTQFP100 SO28 0 0 100 200 , plated HTQFP100 components (Cu-based lead-frame) HTQFP100 , reflow ln[1/(1-f)] 10 1 SnPb


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PDF 2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA semiconductors cross reference Infineon diffusion solder FeNi42 BGA Ball Crack philips pb-free products STD-020C BGA and QFP Package freescale 020C
HTQFP100

Abstract: No abstract text available
Text: PDF: 2001 Mar 30 Philips Semiconductors Package outline HTQFP100 : plastic, heatsink thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT638-1 c y heatsink side X Dh A 75 51 76 50 ZE e E HE Eh A2 A (A3) A1 w M bp Lp pin 1 index L detail X 26 100 1 25 w M bp e ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1 A2


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PDF HTQFP100: OT638-1 HTQFP100
2012 - Not Available

Abstract: No abstract text available
Text: HTQFP100 14x14 HVQFN56 8x8 DAC1408D series ADC1213D065 1.8 / 3.0 445 86 70.0 , Dual 14-bit DAC 650 Msps • 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 , 2x, 4x, 8x HTQFP100 14x14 ADC1212D105 Dual 12-bit ADC up to 105 Msps • • 1.8 , -bit DAC 650 Msps • 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 DAC1203D160 , -bit DAC 750 Msps • 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 • • 1.8


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PDF DAC1001D125 DAC1001D125-DB DAC1001D125 DAC1003D160 DAC1003D160-DB DAC1003D160 DAC1005D650-DB DAC1005D650 DAC1005D750-DB DAC1005D750
2005 - philips l 6.1

Abstract: HTQFP100 MS-026 sot638
Text: Package outline Philips Semiconductors HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 (A3) A1 w M bp Lp pin 1 index L detail X 26 100 1 25 bp e w M ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1


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PDF HTQFP100: OT638-1 MS-026 philips l 6.1 HTQFP100 MS-026 sot638
HTQFP100

Abstract: a7551
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 (A3) A1 w M bp Lp pin 1 index L detail X 26 100 1 25 bp e w M ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT


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PDF HTQFP100: OT638-1 HTQFP100 a7551
2008 - Not Available

Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-2 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste nSPx nSPy 3 occupied area 3 DIMENSIONS in mm P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx


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PDF HTQFP100 OT638-2 OT638-2
2008 - 4433619 crystal

Abstract: saf7115 4433619 oscillator SAF7115HW 3579545 crystal oscillator ITU-601 SMD K4 G13 SAF7115HW/V1 TRANSISTOR SMD 2x t SMD CODE N10
Text: HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 × 14 × 1 mm; exposed die , Transparent top view 001aag269 a. HTQFP100 Fig 2. b. TFBGA160 Pin configuration Table 2. Pin allocation table ( HTQFP100 ) Pin Symbol Pin Symbol Pin Symbol Pin Symbol 1 VDDD , . Pin allocation table ( HTQFP100 ) .continued Pin Symbol Pin Symbol Pin Symbol Pin , description Type[1] Pin HTQFP100 Description TFBGA160 Supplies (analog) VDDA0 23 M2 P


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PDF SAF7115 SAF7115 10-bit 4433619 crystal 4433619 oscillator SAF7115HW 3579545 crystal oscillator ITU-601 SMD K4 G13 SAF7115HW/V1 TRANSISTOR SMD 2x t SMD CODE N10
2005 - Not Available

Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-1 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste nSPx nSPy 5 occupied area 5 DIMENSIONS in mm P1 P2 Ax


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PDF HTQFP100 OT638-1 OT638-1
2011 - Not Available

Abstract: No abstract text available
Text: €¢ 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1405D650 Dual 14-bit DAC 650 Msps • 1.8 / 3.3 435 77 2x, 4x, 8x HTQFP100 14x14 DAC1403D160 DAC1403D160 Dual 14 , €¢ 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 DAC1205D650 Dual 12-bit DAC 650 Msps • 1.8 / 3.3 435 80 2x, 4x, 8x HTQFP100 14x14 DAC1203D160 Dual 12-bit DAC 160 Msps â , HTQFP100 14x14 DAC1005D650 Dual 10-bit DAC 650 Msps • 1.8 / 3.3 435 77 2x, 4x, 8x


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PDF JESD204A/JESD204B) JESD204A, JESD204B voltag628D1G25
2005 - HTQFP100

Abstract: MS-026 sot638
Text: Package outline Philips Semiconductors HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh (A3) A A2 w M bp pin 1 index A1 Lp L detail X 26 100 1 25 bp e w M ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1


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PDF HTQFP100: OT638-2 MS-026 HTQFP100 MS-026 sot638
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 (A3) A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp e ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. 1.2 mm A1 A2 A3 bp c D(1


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PDF HTQFP100: OT638-1 MS-026
2008 - saf7115

Abstract: ITU-601 Video Decoders PAL color bar GENERATOR SAF7118 QFP44 AEC-Q100 ypbpr scart SAF7129A TFBGA160
Text: PPAL Level 3 AEC-Q100 HTQFP100 , TFBGA160 Q3/2008 Package QFP44 Availability


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PDF SAF7115 SAF7113 SAF7118 SAF7129A ITU-601 2xITU-601 HBGA156, saf7115 ITU-601 Video Decoders PAL color bar GENERATOR SAF7118 QFP44 AEC-Q100 ypbpr scart SAF7129A TFBGA160
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh (A3) A A2 w M θ bp pin 1 index A1 Lp L detail X 26 100 1 25 w M bp e ZD v M A D B HD v M B 0 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. 1.2 mm A1 A2 A3 bp c D(1


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PDF HTQFP100: OT638-2 MS-026
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE (A3) A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w ZD v D A v bp e B B HD 0 5 10 mm scale Dimensions Unit mm A A1 A2 D(1) Dh E(1) Eh 0.27 0.20 14.1 0.22 0.15


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PDF HTQFP100: OT638-4 MS-026 sot638-4
2010 - Not Available

Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HTQFP100 package SOT638-3 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste nSPx nSPy 3 occupied area 3 DIMENSIONS in mm P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy SLx SLy


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PDF HTQFP100 OT638-3
2009 - Not Available

Abstract: No abstract text available
Text: Package outline HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-6 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE (A3) A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w ZD v D A v bp e B B HD 0 5 10 mm scale Dimensions Unit mm A A1 A2 D(1) Dh E(1) Eh 0.27 0.20 14.1 0.22 0.15


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PDF HTQFP100: OT638-6 sot638-6
2008 - Not Available

Abstract: No abstract text available
Text: Package outline HTQFP100 : plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE (A3) A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) D(1) Dh E(1) Eh max 1.20 0.15 1.05 0.27


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PDF HTQFP100: OT638-3 MS-026
2010 - BGA7133

Abstract: BGA7130 BGA7203 qubic4 BLF7G22-130 BLF6G21-10G SOT502 BLF7G22LS-200 BLF6G22-130 SOT538A
Text: -bit DAC upto 650/750 Msps 1.8 / 3.3 550 77 2x. 4x. 8x HTQFP100 14x14 DAC1403D160 Dual , 1.8 / 3.3 550 80 2x. 4x. 8x HTQFP100 14x14 HTQFP80 12x12 DAC1203D160 Dual 12 , 77 2x. 4x. 8x HTQFP100 14x14 DAC1003D160 Dual 10-bit DAC 160 Msps 3.3 210 80


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PDF HTQFP80 12x12 DAC1001D125 10-bit LQFP48 BGA7133 BGA7130 BGA7203 qubic4 BLF7G22-130 BLF6G21-10G SOT502 BLF7G22LS-200 BLF6G22-130 SOT538A
Supplyframe Tracking Pixel