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Part Manufacturer Description Datasheet Download Buy Part
LT1194CJ8 Linear Technology IC OP-AMP, 7000 uV OFFSET-MAX, 350 MHz BAND WIDTH, CDIP8, 0.300 INCH, HERMETIC SEALED, CERDIP-8, Operational Amplifier
PMP7877.4 Texas Instruments Power Reference Design for Xilinx? Zynq-7000
PMP7877.5 Texas Instruments Power Reference Design for Xilinx? Zynq-7000
PMP7877.1 Texas Instruments Power Reference Design for Xilinx? Zynq-7000
PMP7877 Texas Instruments Power Reference Design for Xilinx? Zynq-7000
PMP7877.7 Texas Instruments Power Reference Design for Xilinx? Zynq-7000

HTG 7000 Datasheets Context Search

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2007 - KAI-10100-CXB

Abstract: KAI-10100 213msec Kodak KAI-10100
Text: signals to the HCCD must be stopped and HTG input must be High. H2 must be stopped in the high state while , falling edge of the HTG . Charge is transferred from the last V1 phase of the even column VCCD into HCCDA , electronic shutter (SUB), VCCD (Vx), and HTG should be not be pulsed. This prevents unwanted noise from being , low while the vertical registers transfer the next line to the horizontal. H2 and HTG are held high. HTG shifts low then H1 taken high. This shifts the charge in the Horizontal Registers forward one


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PDF MTD/PS-1029 KAI-10100 KAI-10100-CXB 213msec Kodak KAI-10100
peek 457

Abstract: 180D 00123700 HTG 7000
Text: resistance» casa-to-elnk — - 0.030 °c/w Htg , surface smooth, flat and greased. Single side cooled. For , , Junction-to-Case 8000 7000 6000 NUMBER OF E0URL RHPLITUDE HALF CYCLE CURRENT PULSES - N Fig. 11 â


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PDF 08OO8 R34BF 25//S B34BF R34BF14A. D0-200AB E1017 peek 457 180D 00123700 HTG 7000
2012 - KAI-10100

Abstract: KAI-10100-CXC-CB-XA kai image sensor dar PLUS 1029
Text: timing signals to the HCCD must be stopped and HTG input must be High. H2 must be stopped in the high , after the falling edge of the HTG . Charge is transferred from the last V1 phase of the even column VCCD , inputs to the electronic shutter (SUB), VCCD (Vx), and HTG should be not be pulsed. This prevents , and HTG are held high. HTG shifts low then H1 taken high. This shifts the charge in the Horizontal , VOUTB VDD COG H4L ESD GND SUB GND HTG H4 H3 H2 H1 Video Output A Reset Gate Ground Video Output B


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PDF KAI-10100 PS-0027 4H2106 4H2107 D263T PS-0027 KAI-10100-CXC-CB-XA kai image sensor dar PLUS 1029
S77R14A

Abstract: S77R12B hockey stat sheet TQ 5100 HTG 7000 S77R10B S77R16A 5L02
Text: °c/w Htg . aurfece 6B>ooth, flet end greased. Single side. For double side, divide value by 2. Wt , €” Sinusoidal Waveforms, 50 to 400 Hz 1000 2000 3000 1000 5000 AVERAGE ON-STATE CURRENT - fl 6000 7000 Fig


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PDF S77R16A S77R14A S77R1SB S77R10B S77R12B hockey stat sheet TQ 5100 HTG 7000 5L02
2010 - KAI-10100

Abstract: Kodak KAI-10100 KAI-10100-CXC KAI-10100-CXB vx 1937
Text: timing signals to the HCCD must be stopped and HTG input must be High. H2 must be stopped in the high , after the falling edge of the HTG . Charge is transferred from the last V1 phase of the even column , HTG should be not be pulsed. This prevents unwanted noise from being introduced www.kodak.com/go , vertical registers transfer the next line to the horizontal. H2 and HTG are held high. HTG shifts low then , VOUTB VDD COG H4L ESD GND SUB GND HTG H4 H3 H2 H1 ©Eastman Kodak Company, 2010


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PDF MTD/PS-1029 KAI-10100 4H2106 4H2107 MTD/PS-1197 D263T MTD/PS-1029 Kodak KAI-10100 KAI-10100-CXC KAI-10100-CXB vx 1937
2009 - KAI-10100

Abstract: vx 1937 KAI-10100-CXC-CB-XE KAI-10100-CXC Kodak KAI-10100
Text: signals to the HCCD must be stopped and HTG input must be High. H2 must be stopped in the high state while , falling edge of the HTG . Charge is transferred from the last V1 phase of the even column VCCD into HCCDA , electronic shutter (SUB), VCCD (Vx), and HTG should be not be pulsed. This prevents unwanted noise from being , low while the vertical registers transfer the next line to the horizontal. H2 and HTG are held high. HTG shifts low then H1 taken high. This shifts the charge in the Horizontal Registers forward one


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PDF MTD/PS-1029 KAI-10100 4H2106 4H2107 vx 1937 KAI-10100-CXC-CB-XE KAI-10100-CXC Kodak KAI-10100
digital multimeter avr

Abstract: AT84AS001 AT84AS001CTPY 9BP8 AT84AS001-eb Lorch FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.2 Atmega128 hardware guide adc AT84AS001VTPY
Text: AT84AS001-EB Evaluation board was designed in a six metal-layer board using FR4 HTG epoxy dielectric material , planes. The board is made in FR4 HTG epoxy dielectric material (ISOLA IS410). The following table gives , microstrip lines DC signals traces FR4 HTG / dielectric layer Layer thickness = 200 mm Layer 2 Copper layer Copper thickness = 18 µm Upper ground plane = reference plane FR4 HTG / dielectric , VCCA and VCCD and 3V3 FR4 HTG / dielectric layer Layer thickness = 349 µm Layer 4 Copper


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PDF AT84AS001-EB AT84AS0001 5467B digital multimeter avr AT84AS001 AT84AS001CTPY 9BP8 Lorch FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.2 Atmega128 hardware guide adc AT84AS001VTPY
DIN EN 60352-2 exact crimping

Abstract: crimping
Text: Description in mm2 AWG 9012000000 D.21 9012020000 D.21 HTG 59 9012010000 D.21 HTG , 9006320000 D.22 CTX 501 9006370000 D.22 CTX 502 coaxial connectors page HTG 58/59 coaxial connectors Order No. tool HTG 58 coaxial connectors Crimping tool 9006380000 D , / HTX188 HTG 58 / HTG 59 / HTG 58/59 F ​ or coaxial connectors such as BNC, TNC and N plugs F , Station 3: A / B C D Tool data Length Weight Note mm mm mm mm HTG 174 Coaxial connector


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PDF
2006 - AT84AS003

Abstract: FR4 epoxy dielectric constant 4.4 digital rf delay line 4.3 GHz 142-0701-851 AT84AS0003-EB FR4 epoxy dielectric FR4 epoxy dielectric constant 4.2 100 watt RO4003 AT84AS003VTP
Text: RO4003 200 µm and FR4 HTG epoxy dielectric materials. The board implements the following devices: The , and FR4 HTG epoxy dielectric materials. The following table gives a detailed description of the board , 50 microstrip return Layer 4 FR4 HTG /dielectric layer Layer thickness = 170 µm Layer 5 Copper layer Copper thickness = 35 µm Power planes = VCCA and VCCD Layer 6 FR4 HTG /dielectric , VEE and 3.3V Layer 8 FR4 HTG /dielectric layer Layer thickness = 170 µm AT84AS003-EB


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PDF AT84AS003-EB 5426B AT84AS003 FR4 epoxy dielectric constant 4.4 digital rf delay line 4.3 GHz 142-0701-851 AT84AS0003-EB FR4 epoxy dielectric FR4 epoxy dielectric constant 4.2 100 watt RO4003 AT84AS003VTP
fms 7000

Abstract: S38BF20B S38BF T-25 VR91 15a negetive diode HTG 7000 PG173
Text: ° rectangular aava, dodili aide cooled. *thCS Thanaal realstance, caae-to-eink — - 0.030 Htg . aurface , aooo 7000 INITIAL Tj = 125°C RATED VRRH APPLIED SINUSOIDALLY_ AFTER SURGE. : NUMBER OF EQUAL


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PDF 554S2 S38BF S38BF20B. OG0707S T0-200AC T0-200AC fms 7000 S38BF20B T-25 VR91 15a negetive diode HTG 7000 PG173
R300F

Abstract: 250R E1017 HTG 7000 PG63
Text: Therteal re6istBncef case-to-slnk ALL - - 0.04 °C/W Htg . surface snooth» flat and graasad. ■t Weight , rr Ll. 7000 g 6000 z z sooo U) u. HOOD rr z 3000 Œ 2000 X CE X


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PDF 4fls5455 0d07cà R30DF R30DFR R300F R300FR R3DDFR10A. 250R E1017 HTG 7000 PG63
7000R

Abstract: T0-209AC
Text: Thermal resistance, cese-to-eink — - 0.100 °c/w Htg . surface smooth, flet and greased. ■t Weight â , 7000 20 40 BO B0 100 120 1M0 160 160 200 RRTE OF FALL OF ON-STRTE CURRENT (-di/dt) - R/VS Fig. 9 â


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PDF S18CF16A0. S18CF T0-209AC 7000R T0-209AC
Not Available

Abstract: No abstract text available
Text: sid e - 0.053 °C/H 120° recten g u ler wave, double sid e 0.040 °C /* Htg . su , cc 10000 INSTRNTRNEOUS 9000 8000 7000 5 100 2 INSTRNTRNEOUS GRTE CURRENT -


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PDF DDD7741 S30E16A S30E14A S3DE12B S30E10B TjD7744
2014 - Not Available

Abstract: No abstract text available
Text: temperature (Tg): MATERIAL Tg 105 °C FR4 125 °C to 135 °C FR4 HTG / FR5 170 °C to 180 °C , more and more engineers use FR4 HTG / FR5 or IMS (Insulated Metal Substrate). These new materials have , FR4 HTG D2TO35 FR4 HTG 70 TEMP. OF RESISTIVE ELEMENT (°C) POWER APPLIED (W , certain hazardous substances like lead, another type of PC board “FR” is more and more used: FR4 HTG


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PDF DTO25, D2TO20, D2TO35) O-220 D2TO20 O-263 D2TO35 DTO25 O-252
2006 - FR4 epoxy dielectric constant 4.4

Abstract: AT84AS004 FR4 epoxy dielectric constant 4.2 FR4 dielectric constant 4.4 thickness 1.6 AT84AS004-EB HP8665 FR4 epoxy dielectric constant 3.2 FR4 dielectric constant 4.6 RO4003 w17 transistor
Text: 200 µm and FR4 HTG epoxy dielectric materials. The board implements the following devices: The 10 , HTG epoxy dielectric materials. The following table gives a detailed description of the board , 50 microstrip return Layer 4 FR4 HTG /dielectric layer Layer thickness = 170 µm Layer 5 Copper layer Copper thickness = 35 µm Power planes = VCCA and VCCD Layer 6 FR4 HTG /dielectric , VEE and 3.3V Layer 8 FR4 HTG /dielectric layer Layer thickness = 170 µm AT84AS004-EB


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PDF AT84AS004-EB 5432B FR4 epoxy dielectric constant 4.4 AT84AS004 FR4 epoxy dielectric constant 4.2 FR4 dielectric constant 4.4 thickness 1.6 HP8665 FR4 epoxy dielectric constant 3.2 FR4 dielectric constant 4.6 RO4003 w17 transistor
2009 - TP10

Abstract: VSP2560PT VSP7502 VSP7502ZWV VSP7502ZWVR 0000B
Text: supply voltage DVDD2_SPI LVDVDD DRVDD2 DVDD3 DVDD3_SPI H-TG supply voltage H1VDD3 RGVDD3 , System RST or DLL RST Unstable DLL Status Register Setting Stable RST Not Active HTG , ADC DLL HTG LVDS Not active Not active Not active Not active High-Z Active , ms Minimum = 10 ms HTG Status Active Low Active LVDS Status Active Hi-Z , Address 1 INPMOD = 0 Address 67-72 HTG Phase Setting Address 66 HTG Enable VD Edge Address


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PDF VSP7502 SBES006 VSP7502 BGA-159 TP10 VSP2560PT VSP7502ZWV VSP7502ZWVR 0000B
2009 - CTP10

Abstract: MTP15 ipx 460 sb 460 0000B MTP10 TP10 VSP7502ZWVR VSP7502ZWV VSP7502 VSP2560PT
Text: supply voltage DVDD2_SPI LVDVDD DRVDD2 DVDD3 DVDD3_SPI H-TG supply voltage H1VDD3 RGVDD3 , System RST or DLL RST Unstable DLL Status Register Setting Stable RST Not Active HTG , ADC DLL HTG LVDS Not active Not active Not active Not active High-Z Active , ms Minimum = 10 ms HTG Status Active Low Active LVDS Status Active Hi-Z , Address 1 INPMOD = 0 Address 67-72 HTG Phase Setting Address 66 HTG Enable VD Edge Address


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PDF VSP7502 SBES006 VSP7502 BGA-159 CTP10 MTP15 ipx 460 sb 460 0000B MTP10 TP10 VSP7502ZWVR VSP7502ZWV VSP2560PT
352AS

Abstract: 6.3A 250V 15x6mm
Text: No. 53586 The conductor is soldered or crimped on with an HTG 58 crimping tool HTG 58 901200


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PDF 10-Pole 00V/6A/1 50V/6A/1 75mm2 50V/6A/0 250VAC 352AS 6.3A 250V 15x6mm
BJ89 Trompeter

Abstract: TAI-175 CJ380 pl803
Text: DASH CQNNECTDR NO TYPE -1 PL80 -2 CJBÜ -3 BJ89 BJB9F -5 PL803 CJB03 BJB93 BJB93F PL3BD -10 CJ380 -1 1 BJ3B9 -12 BJ389F MATERIAL, 1-015B-14A 1-0152-14A 3-0035-14A 305-0D39-14A 3-0105-14A 3-0111-14A 3-0253-14A 3-0107-14A 3-0103-14A 3-021B-14A 3-02B4-14A 3-02B1-14A ASSEMBLE PER FIG 1A 2A 3A 4A HTG HDLE FIG DATA CONTAINED IN THIS DOCUMENT IS PROPRIETARY TO TRDMPETER ELECTRONICS INC. AND SHALL NOT BE DISCLOSED. CDPIEO OR USED FDR PROCUREMENT OR MANUFACTURE WITHOUT EXPRESS WRITTEN PERMISSION DF


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PDF PL803 CJB03 BJB93 BJB93F CJ380 BJ389F 1-015B-14A 152-14A 035-14A 305-0D39-14A BJ89 Trompeter TAI-175
2002 - Not Available

Abstract: No abstract text available
Text: °F) T-1 Temp. Range (0°-100°F) No. Htg . Dim. B Wt. Wt. kW Volts W/in2 Elem. in (cm) Model No , . Htg . Dim. B Wt. Wt. kW Volts W/in2 Elem. in (cm) Model No. Price Ib (kg) Model No. Price Ib (kg


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PDF Dependabl16 ARMT-31205T1/480V/* ARMT-31505T1/208V/ ARMT-31505T1/240V/ ARMT-31505T1/480V/* ARMT-31805T1/208V/ ARMT-31805T1/240V/ ARMT-31805T1/480V/* ARMT-3305E2/240V/3P,
2014 - Not Available

Abstract: No abstract text available
Text: sockets Free sockets PVG HVG HWG PVG HRG HTG PVG Coaxial Type (50 Ω) Models , configuration (page 9) M7x0.5 HTG Fixed socket, key (G), nut fixing, long shell S9 ø 11 ø 10.2 26 Part number HTG .03.30●.CLLSV Sealing resin Stycast® S9 Panel cut-out (page 11 , Cut-outs HWG HRG, HTG , HVG, HVP, HVR 13 0.1 6.4 +0 0.1 ø 7.1+0 13 0.1 ø 7.1+0


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PDF P1008,
2002 - Not Available

Abstract: No abstract text available
Text: 48 53 47 46 46 51 No. Htg . Dim. B Elem. in (cm) 3 3 3 3 3 3 3 3 67⁄8 (17


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PDF SPECIFICATIONS-390A/* MTI-3120A/* MTI-3150A/* MTI-3180A/* MTI-330E2/* MTI-345E2/* MTI-360E2/* MTI-375E2/* MTI-390E2/* MTI-3120E2/*
R7. Atmel ATMega 128 Reference Manual

Abstract: Atmel ATmega 32 interfacing with RF transmitter AT84AS001 digital multimeter avr micrel TX 433 MHz layout circuit DIAGRAM AVR GENERATOR DIAGRAM AVR ac GENERATOR Lorch ATMEGA 32 AVR DATASHEET e2v ccd
Text: use of FR4 HTG (ISOLA IS410 with 45% resin content) epoxy dielectric material for the board, the , FR4 HTG 1270 µm 5.3.2 Output data signals In the case of the use of FR4 HTG epoxy dielectric , 5-2. Board Layout for the Differential Digital Outputs e = 40 µm 310 µm 325 µm FR4 HTG 310


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PDF AT84AS001 12-bit AT84AS001 R7. Atmel ATMega 128 Reference Manual Atmel ATmega 32 interfacing with RF transmitter digital multimeter avr micrel TX 433 MHz layout circuit DIAGRAM AVR GENERATOR DIAGRAM AVR ac GENERATOR Lorch ATMEGA 32 AVR DATASHEET e2v ccd
2007 - AVR181: Automotive Grade0 - PCB and Assembly Recommendations

Abstract: ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101
Text: Standard FR4 HTG (up to 175°C), Cost: 1.151 · Polyimide or Cyanate Ester (to 250°C) Cost: 1.91 , standard FR4. The temperature cycling resistance of FR4 HTG materials is sufficient for most lead-free , alternative board materials such as FR5, glass/BT-epoxy, glass/polyimide We recommend the FR4 HTG as the


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PDF AVR181: AVR181: Automotive Grade0 - PCB and Assembly Recommendations ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101
2002 - Not Available

Abstract: No abstract text available
Text: . Range (60°-250°F) T-1 Temp. Range (0°-100°F) No. Htg . Dim. B Weight Weight kW Phase W/in2 Elem


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PDF ARMTS-3455E2/* ARMTS-3605E2/* ARMTS-3755E2/* ARMTS-3905E2/* ARMTS-3120E2/* ARMTS-3150E2/* 2ARMTS-3180E2/* ARMTS-3305T1/240/3P, ARMTS-3305E2T1/* ARMTS-3455E2T1/*
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