10118615-505003LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 5 Positions ,2.54mm (0.100in) Pitch. |
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10118615-502003LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 2 Positions ,2.54mm (0.100in) Pitch. |
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10118615-503003LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 3 Positions ,2.54mm (0.100in) Pitch. |
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10118615-501003LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 1 Positions ,2.54mm (0.100in) Pitch. |
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5962-8515501RA
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Texas Instruments
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High-Performance Impact PAL Circuits 20-CDIP -55 to 125 |
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5962-8515505RA
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Texas Instruments
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Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125 |
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