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LT1158IN#TR Linear Technology IC HALF BRDG BASED MOSFET DRIVER, PDIP16, 0.300 INCH, PLASTIC, DIP-16, MOSFET Driver
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LT1158IN#TRPBF Linear Technology IC HALF BRDG BASED MOSFET DRIVER, PDIP16, 0.300 INCH, PLASTIC, DIP-16, MOSFET Driver

HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1990 - HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E

Abstract: to-92 hall sensor GH sc-59 ultrasonic range meter IC Ultrasonic welding circuit transistor Common collector configuration thermoset plastics Application Note 27703 HALL EFFECT TO 92 leadframe
Text: GENERAL INFORMATION HALL-EFFECT DEVICES : SOLDERING , GLUING , POTTING , ENCAPSULATING, and LEAD , * Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming plastic body of the part to temperatures in , with the customer. Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead , Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming Potting 1. The first rule when


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1990 - HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E

Abstract: hall effect sensor GH SC-59 HALL EFFECT Loctite 406 LT HALL SENSOR to-92 hall sensor Ultrasonic welding circuit
Text: GENERAL INFORMATION HALL-EFFECT DEVICES : SOLDERING , GLUING , POTTING , ENCAPSULATING, and LEAD , Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming plastic body of the part to temperatures in , with the customer. Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead , Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming Potting 1. The first rule when


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1990 - N140 ALLEGRO

Abstract: Ultrasonic welding generator TO-236A FLEX THERMOSET COMPOUND HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Allegro Hall-Effect ICs pressure low die bond sensor RTV Loctite 406 GH SC-59 TRA-CON
Text: Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming plastic body of the part , cooperative effort with the customer. Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and , Application Note 27703.1 GENERAL INFORMATION HALL-EFFECT DEVICES : SOLDERING , GLUING , Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming Potting 1. The first rule when , Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming 0.030" min 0.030" min


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1990 - Loctite 406

Abstract: HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Injection mold foam Ultrasonic welding generator FLEX THERMOSET COMPOUND N140 AH010 N140 ALLEGRO
Text: Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming plastic body of the part , with the customer. Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead , Application Note 27703.1 GENERAL INFORMATION HALL-EFFECT DEVICES : SOLDERING , GLUING , Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming Potting 1. The first rule when , : Soldering , Gluing , Potting , Encapsulating, and Lead Forming and to lengthen the potential moisture


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1990 - N140 ALLEGRO

Abstract: HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Allegro Hall-Effect ICs GTS2000 Ultrasonic welding generator
Text: © 1990, 2002 Allegro MicroSystems, Inc. Hall-Effect Devices : Soldering , Gluing , Potting , Application Note 27703.1B GENERAL INFORMATION HALL-EFFECT DEVICES : SOLDERING , GLUING , Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming when using this package and , Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming MODULES Allegro offers a , : Soldering , Gluing , Potting , Encapsulating, and Lead Forming 220°C. See reflow chart below. Hand


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PDF 1-508-ALLEGRO N140 ALLEGRO HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Allegro Hall-Effect ICs GTS2000 Ultrasonic welding generator
1995 - Application Note 27701

Abstract: AMS-702 hallsensor application hallsensor GH-053 ALLEGRO Hallsensor GH053 A3134ELT HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Application Note 27703
Text: , Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices


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PDF MH-015 Application Note 27701 AMS-702 hallsensor application hallsensor GH-053 ALLEGRO Hallsensor GH053 A3134ELT HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Application Note 27703
1995 - hall current sensor 3A

Abstract: A1201 A3134 A3134ELT AMS-702
Text: devices is available in: · Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note 27703.1; · , Hall-Sensor Devices , Application Note 27703.2. All are provided in Allegro Electronic Data Book, AMS-702. or , APPLICATIONS INFORMATION The output of these devices (pin 3) switches low when the magnetic field at the , . Allegro products are not authorized for use as critical components in life-support appliances, devices


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PDF A3134 A1201 MH-026 hall current sensor 3A A1201 A3134 A3134ELT AMS-702
1995 - Application Note 27701

Abstract: A1201 A3134 A3134ELT AMS-702
Text: , Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices , . 3. Only low-temperature (240°C) reflow-soldering techniques are recommended for SOT89 devices


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PDF A3134 A1201 MH-026 Application Note 27701 A1201 A3134 A3134ELT AMS-702
1995 - 27631

Abstract: 27701 A 27631 AMS-702 lt 719 A3134ELT
Text: , Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices , . 3. Only low-temperature (240°C) reflow-soldering techniques are recommended for SOT89 devices


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PDF MH-026 27631 27701 A 27631 AMS-702 lt 719 A3134ELT
1995 - HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING

Abstract: 27631 A 27631 hall current sensor 3A A3134ELT AMS-702
Text: , Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices , . 3. Only low-temperature (240°C) reflow-soldering techniques are recommended for SOT89 devices


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PDF MH-026 HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING 27631 A 27631 hall current sensor 3A A3134ELT AMS-702
2002 - Not Available

Abstract: No abstract text available
Text: ; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note , independence and minimal power requirement allow these devices to easily replace reed switches for superior , . -65°C to +170°C Caution: These CMOS devices have input static protection (Class 3) but are still , the mismatching of these resistors. These devices use a proprietary dynamic offset cancellation , sample-andhold circuit and further processed using low-offset bipolar circuitry. This technique produces devices


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PDF OT23W) A3212
2002 - mh 3212

Abstract: No abstract text available
Text: ; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note , independence and minimal power requirement allow these devices to easily replace reed switches for superior , . -65°C to +170°C Caution: These CMOS devices have input static protection (Class 3) but are still , the mismatching of these resistors. These devices use a proprietary dynamic offset cancellation , sample-andhold circuit and further processed using low-offset bipolar circuitry. This technique produces devices


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PDF OT23W) A3212 mh 3212
2002 - Application Note 27701

Abstract: allegro latchup Allegro Hall-Effect ICs A1143 A3163 A3163ELT A3163EUA Application Note 27703
Text: Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , 0.0195" 0.50 mm NOM Operation. The output of these devices turns on when a magnetic field (south , , Application Note 27703; · Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2; and · , °C) reflow-soldering techniques are recommended for SOT89 devices . 8 115 Northeast Cutoff, Box 15036 Worcester , life-support appliances, devices , or systems without express written approval. The information included


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PDF A3163 A1143. Application Note 27701 allegro latchup Allegro Hall-Effect ICs A1143 A3163 A3163ELT A3163EUA Application Note 27703
2002 - Not Available

Abstract: No abstract text available
Text: Hall-effect devices is available in: · Hall-Effect IC Applications Guide , Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note 27703.1; · , dependencies, and thermal stress. The two devices differ only in output polarity; the A3361x output current , Hall-Sensor Devices , Application Note 27703.2. More detailed descriptions of the chopper-stabilized circuit , portion of the offset is a result of the mismatching of these resistors. These devices use a proprietary


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PDF A3361 A3362 A1142 A1143.
2002 - Allegro Hall-Effect ICs

Abstract: A3163ELT A3163EUA
Text: Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , 0.0195" 0.50 mm NOM Operation. The output of these devices turns on when a magnetic field (south , , Application Note 27703; · Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2; and · , °C) reflow-soldering techniques are recommended for SOT89 devices . 8 115 Northeast Cutoff, Box 15036 Worcester , life-support appliances, devices , or systems without express written approval. The information included


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PDF OT89/TO-243AA Allegro Hall-Effect ICs A3163ELT A3163EUA
1992 - A3121 8 pin

Abstract: Allegro 3120 Diode LT 410 A 3121 IC UGs 3030 A3121EUA A3121 3122 rod A3123 A3133
Text: for Hall-effect devices is available in: · Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application , temperature and supply voltage changes. The unipolar switching characteristic makes these devices ideal for use with a simple bar or rod magnet. The three basic devices (A3121, A3122, and A3123) are identical , mm 0.043" 1.09 mm The output of these devices (pin 3) switches low when the magnetic field at


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PDF A3121, A3122, A3133 A110x A3121 8 pin Allegro 3120 Diode LT 410 A 3121 IC UGs 3030 A3121EUA A3121 3122 rod A3123 A3133
2002 - FH-020

Abstract: Hall-Effect IC Applications Guide
Text: ; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note , SWITCH FUNCTIONAL DESCRIPTION Chopper-Stabilized Technique. These devices use a proprietary dynamic , thermal stress. This technique produces devices that have an extremely stable quiescent Hall output , , then, captured by a sample-and-hold circuit. Operation. The output of these devices turns ON when a , Surface-Mount Hall-Sensor Devices , Application Note 27703.2. More detailed descriptions of the


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PDF OT23W) A3260-- FH-020 Hall-Effect IC Applications Guide
1992 - Diode LT 410

Abstract: A3121 8 pin lt 719 Diode LT 442 UGN 3122 diode LT 229 A3121 HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E LT 442 Allegro Hall-Effect ICs
Text: Guide, Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and , both temperature and supply voltage changes. The unipolar switching characteristic makes these devices ideal for use with a simple bar or rod magnet. The three basic devices (A3121, A3122, and A3123) are , mm 0.043" 1.09 mm The output of these devices (pin 3) switches low when the magnetic field at , Note 27703; and · Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. All are


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PDF A3121, A3122, A3123) PH-003A Diode LT 410 A3121 8 pin lt 719 Diode LT 442 UGN 3122 diode LT 229 A3121 HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E LT 442 Allegro Hall-Effect ICs
2002 - FH-020

Abstract: A3260 A3260ELHLT A3260EUA A3260LLHLT A3260LUA MH-025 AN 27701
Text: 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application , . These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency , overmolding, temperature dependencies, and thermal stress. This technique produces devices that have an , Operation. The output of these devices turns ON when a magnetic field (north pole) perpendicular to the , Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. More detailed descriptions of the


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PDF A3260 FH-020 A3260 A3260ELHLT A3260EUA A3260LLHLT A3260LUA MH-025 AN 27701
2002 - 27631

Abstract: A 27631 2 wire LT HALL SENSOR Allegro Hall-Effect ICs HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E A3260LUA A3260LLHLT A3260EUA A3260ELHLT tape hall sensor proximity sensor application notes
Text: 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application , . These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency , overmolding, temperature dependencies, and thermal stress. This technique produces devices that have an , Operation. The output of these devices turns ON when a magnetic field (north pole) perpendicular to the , Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. More detailed descriptions of the


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PDF A3260 27631 A 27631 2 wire LT HALL SENSOR Allegro Hall-Effect ICs HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E A3260LUA A3260LLHLT A3260EUA A3260ELHLT tape hall sensor proximity sensor application notes
2002 - hall current sensor 3A

Abstract: A 27631 lt 719 A3260ELH A3260 MA-012-3
Text: 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application , Chopper-Stabilized Technique. These devices use a proprietary dynamic offset cancellation technique, with an , devices that have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and , CURRENT Operation. The output of these devices turns ON when a magnetic field (north pole , Soldering of Surface-Mount Hall-Sensor Devices , Application Note 27703.2. More detailed descriptions of the


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PDF OT23W) PH-003-5 A3260-- hall current sensor 3A A 27631 lt 719 A3260ELH A3260 MA-012-3
2002 - mh 3212

Abstract: A3212ELH 3212 A3212
Text: Guide, Application Note 27701; · Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and , output is off. The polarity independence and minimal power requirement allow these devices to easily , Temperature Range, TS . -65°C to +170°C Caution: These CMOS devices have input , . A large portion of the offset is a result of the mismatching of these resistors. These devices use , further processed using low-offset bipolar circuitry. This technique produces devices that have an


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PDF A3212 mh 3212 A3212ELH 3212
1993 - lt 719

Abstract: 3141 hall sensor 3144 hall sensor Allegro Hall-Effect ICs A3143 A3142 A3141ELT A3141 UGs 3030 UGN 3140 sensor
Text: Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note 27703.1 , devices ideal for use with a simple bar or rod magnet. The four basic devices (3141, 3142, 3143, and 3144 , BRANDED SURFACE Dwg. GH-042-1 1 2 The output of these devices (pin 3) switches low when the , Surface-Mount Hall-Sensor Devices , Application Note 27703.2. 3 All are provided in Allegro Electronic Data , . MH-003E in Dwg. MH-003E mm Devices in the `U' package are NOT RECOMMENDED FOR NEW DESIGN


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PDF PH-003A lt 719 3141 hall sensor 3144 hall sensor Allegro Hall-Effect ICs A3143 A3142 A3141ELT A3141 UGs 3030 UGN 3140 sensor
2002 - Not Available

Abstract: No abstract text available
Text: Hall-effect devices is available in: • Hall-Effect IC Applications Guide, Application Note 27701; • Hall-Effect Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note 27703.1; â , . Suffix “UA” ACTIVE AREA DEPTH 0.0195" 0.50 mm NOM Operation. The output of these devices turns , Hall-Sensor Devices , Application Note 27703.2; and • Two-Wire Hall-Effect Sensors, Application Note 27704 , FOR 2-WIRE APPLICATIONS CRITERIA FOR DEVICE QUALIFICATION All Allegro devices are subjected to


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PDF A3163 A1143.
2002 - A3212

Abstract: A3212EEHLT A3212ELHLT A3212EUA A3212LLHLT A3212LUA MH030
Text: Devices : Soldering , Gluing , Potting , Encapsulating, and Lead Forming, Application Note 27703.1; · , requirement allow these devices to easily replace reed switches for superior reliability and ease of , . -65°C to +170°C Caution: These CMOS devices have input static protection (Class 3) but are still , offset is a result of the mismatching of these resistors. These devices use a proprietary dynamic offset , circuitry. This technique produces devices that have an extremely stable quiescent Hall output voltage


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PDF A3212 OT23W) PH-016-1 A3212 A3212EEHLT A3212ELHLT A3212EUA A3212LLHLT A3212LUA MH030
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