The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
1-1337584-0 TE Connectivity (1-1337584-0) Gold
1059402-1 TE Connectivity (1059402-1) Gold
1-1337580-0 TE Connectivity (1-1337580-0) Gold
6648221-2 TE Connectivity (6648221-2) CONTACT,PIN,#8 Au plated
770258-1 TE Connectivity (770258-1) SL.156 .045 POST CONTACT AU
2213374-1 TE Connectivity (2213374-1) Blade Contact, gold plated

Gold 5.5V 0.1F Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Electric Double Layer Capacitors, Radial Lead Type

Abstract: No abstract text available
Text: . E7.6 Contents 1. 2. Introduction Principles and features of Gold capacitors 2-1 , layer capacitor 2-5 Features 3. Product type & selecting method of Gold capacitors 3-1 , technique of Gold capacitor 4-1 Life design 4-2 Notes in using Electric Double Layer Capacitors 4-3 When making an order 5. Gold capacitors Characteristics data ………1 ……â , Electric Double Layer Capacitors ( Gold Capacitors) were developed by the Central Research Laboratory of


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2010 - 54HC4053

Abstract: 940806401F 54HC273 54HC08 940900701F 940104801F M54HC245K 940104701F 920110501F 920110601F
Text: 9201/105/01F or 02F ESCC flight Specify ESCC variant number in PO Flat-14 Gold or solder dip , variant number in PO DIL-14 Gold or solder dip 920110503F or 04F 2.20 - Strip pack M54HC02K 9201/113/01F or 02F ESCC flight Specify ESCC variant number in PO Flat-14 Gold or solder , Specify ESCC variant number in PO DIL-14 Gold or solder dip 920111303F or 04F 2.20 - Strip , variant number in PO Flat-14 Gold or solder dip 920111401F or 02F 0.70 Y Strip pack


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PDF M54HCxxx M54HCTxxx Flat-14 DIL-14 Flat-16 DIL-16 Flat-20 DIL-20 Flat-24 DIL-24 54HC4053 940806401F 54HC273 54HC08 940900701F 940104801F M54HC245K 940104701F 920110501F 920110601F
2011 - 940900701F

Abstract: 54HC4053 54HC273 940501301F 940104801F 920305001F 920110601F 54HC08 940806401F 920112001F
Text: ESCC variant number in PO 9401/055/01F or 02F ESCC flight Specify ESCC variant number in PO Gold or solder dip 920110501F or 02F Gold or solder dip 920110503F or 04F Gold or solder dip 920111301F or 02F Gold or solder dip 920111303F or 04F Gold or solder dip 920111401F or 02F Gold or solder dip 920111403F or 04F Gold or solder dip 940103301F or 02F Gold or solder dip 940103303F or 04F Gold or solder dip 940105501F or 02F Gold or solder dip 940105503F or 04F Gold or solder dip 920110601F or 02F Gold or solder


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PDF M54HCxxx M54HCTxxx Flat-16 DIL-16 Flat-14 DIL-14 M54HCTxxx 940900701F 54HC4053 54HC273 940501301F 940104801F 920305001F 920110601F 54HC08 940806401F 920112001F
2011 - 940900703F

Abstract: No abstract text available
Text: 9201/105/01F or 02F ESCC flight Specify ESCC variant number in PO Flat-14 Gold or solder dip , variant number in PO DIL-14 Gold or solder dip 920110503F or 04F 2.20 - Strip pack M54HC02K 9201/113/01F or 02F ESCC flight Specify ESCC variant number in PO Flat-14 Gold or solder , Specify ESCC variant number in PO DIL-14 Gold or solder dip 920111303F or 04F 2.20 - Strip , variant number in PO Flat-14 Gold or solder dip 920111401F or 02F 0.70 Y Strip pack


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PDF M54HCxxx M54HCTxxx Flat-14 DIL-14 Flat-16 DIL-16 Flat-20 DIL-20 Flat-24 DIL-24 940900703F
2006 - diode schottky RS1

Abstract: Gold 5.5V 0.1F HEL-777-A-T-0 LNJ208R8ARA MAX6603 voltage regulator 6.2v MAX6603EVKIT MAX667ESA MMSZ5234B zener diode 6.2v
Text: 0 C8 1 D1 1 1 3-pin header ( gold contact finish) JU2, JU3, JU4 3 2-pin headers ( gold contact finish) LED1, LED2 2 Red LEDs (0603) Panasonic LNJ208R8ARA R1, R2 2 , Shunts ( gold contact finish) Open (0603) 10µF ±10%, 10V X5R ceramic capacitor (1210) TDK


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PDF MAX6603 MAX6603ATB+ MAX6603 diode schottky RS1 Gold 5.5V 0.1F HEL-777-A-T-0 LNJ208R8ARA voltage regulator 6.2v MAX6603EVKIT MAX667ESA MMSZ5234B zener diode 6.2v
Gold 5.5V 0.1F

Abstract: DSASW0036800
Text: Sealing Symmetry=t/T×100(%) AuSn Terminal T Tungsten (metalized) Gold / Nickel Terminal


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PDF 327SMO 1000pcs Gold 5.5V 0.1F DSASW0036800
2011 - Not Available

Abstract: No abstract text available
Text: (minimum) gold plating over 100 microinches (nominal) nickel plating 24 13 1 12 0.100 TYP


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PDF ADC-228A 20MHz, ADC-228A 24-pin 20MSPS
motor operated ball valve

Abstract: FP5503-WDP FP5503 MO-211 wlcsp-9 diode t62
Text: : Organic Solder ability Preservative (OSP) finish recommended. Electronless nickel-immersion gold finish with gold thickness ranging from 0.05 microns to 0.127 microns may also be used. Because the PCB pad


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PDF FP5503 10-Bit FP5503 120mA MO-229-0. MO-211. motor operated ball valve FP5503-WDP MO-211 wlcsp-9 diode t62
OSC 50.000 MHZ 3.3V SMD

Abstract: No abstract text available
Text: 2.2 1.5 Tungsten (metalized) TAPE SPECIFICATIONS Gold / Nickel Terminal plating RoHS


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PDF 99SMOHG 99SMOHG1 99SMOHG 1000pcs OSC 50.000 MHZ 3.3V SMD
Not Available

Abstract: No abstract text available
Text: #1 Tungsten (metalized) #2 Gold / Nickel Terminal plating (surface) / (under


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PDF 99SMOV 25est 1000pcs
2008 - AB16

Abstract: ADS-935 ADS-939 AB14 TRAIN 40pin 400 mm
Text: ) 1 Lead Finish: 50 microinches (minimum) gold plating over 100 microinches (nominal) nickel


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PDF ADS-939A 16-Bit, 10MHz 16-bit 40-pin, ADS-939A AB16 ADS-935 ADS-939 AB14 TRAIN 40pin 400 mm
DSASW0036800

Abstract: No abstract text available
Text: 1.0 AuSn Terminal Tungsten (metalized) TAPE SPECIFICATIONS Gold / Nickel Terminal


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PDF 32SMOHG 1000pcs DSASW0036800
Gold 5.5V 0.22F

Abstract: 0846 remoto Gold 5.5V 0.1F EECS0HD473 capacitor 473 473 capacitor capacitor SD
Text: Electric Double Layer Capacitors( Gold Capacitor)/SD Stacked Coin Type Series: SD s Feature Endurance : 70°C 1000 h Japan s Recommended Applications Memory back-up for Video, Audio, Cameras, Telephones, Printer, Data terminal, Rice cooker, Intelligent remoto controller s Specifications -25 to +70°C Category temp. range Maximum Operating Voltage 5.5 V .DC 0.022 to 0.33 F ±30% of initial measured value at +20°C (-25 to +70°C) < 5 times of initial measured value at +20°C (at -25°C) Nominal


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PDF EE236 Gold 5.5V 0.22F 0846 remoto Gold 5.5V 0.1F EECS0HD473 capacitor 473 473 capacitor capacitor SD
97SMOVH

Abstract: 45Vdd
Text: Lid J Compliant (Pb-free) B M Gold / Nickel (surface) / (under) 1.75±0.1 V


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PDF 97SMOVH 97SMOVH 45Vdd
CRYSTAL 20 mhZ

Abstract: 97SMOV
Text: (surface) / (under) Compliant (Pb-free) RoHS SOLDERING PATTERN 1.8 Gold / Nickel Terminal


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PDF 97SMOV 1000pcs 2000pcs CRYSTAL 20 mhZ 97SMOV
2009 - ADC-228AMC

Abstract: ADC-228AMM
Text: Lead Material: Kovar alloy Lead Finish: 50 microinches (minimum) gold plating over 100 microinches


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PDF ADC-228A 20MHz, ADC-228A 24-pin ADC-228AMC ADC-228AMM
2000 - EECS0HD

Abstract: Gold 5.5V 0.22F capacitor .022
Text: Electric Double Layer Capacitors( Gold Capacitor)/SD Stacked Coin Type Series: SD I Feature Endurance : 70°C 1000 h Japan I Recommended Applications Memory back-up for Video, Audio, Cameras, Telephones, Printer, Data terminal, Rice cooker, Intelligent remote controller I Specifications -25 to +70°C Category temp. range Maximum Operating Voltage 5.5 V .DC 0.022 to 0.33 F ±30% of initial measured value at +20°C (-25 to +70°C) 5 times of initial measured value at +20°C (at -25°C) Nominal


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2011 - Not Available

Abstract: No abstract text available
Text: microinches (minimum) gold plating over 100 microinches (nominal) nickel plating 40 21 1.11/1.08


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PDF ADS-939 16-Bit, 10MHz 16-bit 40-pin, ADS-939
2010 - HMC864

Abstract: No abstract text available
Text: IS .004" SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL , clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface , . Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding


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PDF HMC864 HMC864 750mA 025mm
2008 - ads-939

Abstract: 749958 749958-2 ADS-B933 AB14 AB16
Text: ) 1 Lead Finish: 50 microinches (minimum) gold plating over 100 microinches (nominal) nickel


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PDF ADS-939 16-Bit, 10MHz 16-bit 40-pin, ADS-939 749958 749958-2 ADS-B933 AB14 AB16
2007 - M40Z300

Abstract: M40Z300W M4ZXX-BR00SH SOH28
Text: . The 28-pin, 330mil SOIC provides sockets with gold plated contacts for direct connection to a separate SNAPHAT housing containing the battery. The SNAPHAT housing has gold plated pins which mate with


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PDF M40Z300 M40Z300W M40Z300: M40Z300W: M40Z300 M40Z300W M4ZXX-BR00SH SOH28
2005 - photodiode germanium

Abstract: 20GHz Bandwidth PIN Photodetector germanium photodiode PIN MAX3864 MAX3864ESA 72CID
Text: reliable operation, the MAX3864 uses gold metalization. Connections to the die should be made with gold


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PDF MAX3864 490nA -24dBm phot55 MS012 photodiode germanium 20GHz Bandwidth PIN Photodetector germanium photodiode PIN MAX3864ESA 72CID
2011 - Not Available

Abstract: No abstract text available
Text: microinches (minimum) gold plating over 100 microinches (nominal) nickel plating 24-Pin DDIP Versions 24 , : 50 microinches (minimum) gold plating over 100 microinches (nominal) nickel plating 1 12


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PDF 8/10/12-Bit 12-Bit 20ppm/ MIL-STD-883 ADS-926 ADS-B916/917 HS-24 DAC-HF/926
2010 - AAT2823

Abstract: AAT2823IBK-T1 AAT2823IBK-1-T1 AAT2823-1 AAT2822IBK-T1 AAT2822-AAT2825 3S13P AAT2824-1 Sc70-6 marking c14 R5464K
Text: SGL Gold Manufacturer AnalogicTech BAT54SDW-7-F MSS1P5-M3/89A SD25-2R2R Diodes Inc Vishay


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PDF AAT2822/23/24/25 AAT2822-AAT2825 AAT2822 AAT2823 AAT2823IBK-T1 AAT2823IBK-1-T1 AAT2823-1 AAT2822IBK-T1 3S13P AAT2824-1 Sc70-6 marking c14 R5464K
2009 - bit325

Abstract: 74HC86 AB14 AB16 ADS-933 ADS-933MC ADS-933MM 74hc868
Text: microinches (minimum) gold plating over 100 microinches (nominal) nickel plating 1.11/1.08 (28.20/27.43


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PDF ADS-933 16-Bit, 16-bit 40-pin, ADS-933 bit325 74HC86 AB14 AB16 ADS-933MC ADS-933MM 74hc868
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