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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
HPA00441ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
CAB4AZNRR Texas Instruments DDR4RCD01 JEDEC compliant DDR4 Register for RDIMM and LRDIMM operation up to DDR4-2400 253-NFBGA 0 to 0

G42-88/JEDEC Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1999 - JESD51-7

Abstract: JESD51-1 JESD-51 G30-88 JESD-51-1 JESD51 JESD51-5 TB379 thermal resistance standards
Text: thermal characterization test standards. Currently, the JEDEC organization is the recognized source for , will always be lower than resistance values for a given device/package combination. Current JEDEC , designed to SEMI standards. This then transitioned to the use of test boards designed to JEDEC , the " JEDEC 1S" board. In addition to the above mentioned JEDEC specifications, JESD51-5 should be , Corporation: The SEMI board and JEDEC (1S) board result in similar JA values. With only top side copper


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PDF TB379 JESD51-7 JESD51-1 JESD-51 G30-88 JESD-51-1 JESD51 JESD51-5 thermal resistance standards
1996 - BGA 64 PACKAGE thermal resistance

Abstract: G42-88 G38-87 492-Ball
Text: Devices Engineering Council ( JEDEC ), and they are documented in the JESD51 series. In addtion, Testing , SPECIFICATION G42- 88 : "Thermal Test Board Standardization for Measuring Junction-toAmbient Thermal Resistance


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PDF 320ball 432-ball 44-pin 68-pin 84-pin 133-pin 20-pin 24-pin 28-pin BGA 64 PACKAGE thermal resistance G42-88 G38-87 492-Ball
2000 - 202 ball bga

Abstract: No abstract text available
Text: Industries Association (EIA) and Joint Electronic Devices Engineering Council ( JEDEC ), and they are , thermal test board conforming to SEMI SPECIFICATION G42- 88 : "Thermal Test Board Standardization for


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PDF 320ball 432-ball G42-88: 44-pin 68-pin 84-pin 133-pin 20-pin 24-pin 28-pin 202 ball bga
1999 - G43-87

Abstract: DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 G38-96 PBGA-144 PGA240 QFP160 QFP208-P-2828-0
Text: 42 42 42 42 42 42 42 42 42 42 42 42 133 116 112 88 93 88 86 110 73 84 71 82 , 101 139 101 93 85 68 71 93 128 88 84 75 57 61 79 106 75 70 66 48 50 5 13 , 42 Cu Cu Cu 132 88 119 81 128 64 45 42 119 77 105 72 119 60 38 33 107 70


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PDF PC114 G42-96 P-BGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA560-3535-1 13x13x0 25x25x1 35x35x1 G43-87 DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 G38-96 PBGA-144 PGA240 QFP160 QFP208-P-2828-0
j4310

Abstract: 3355X
Text: 6.3 x 13 B13 17 88 TYAV1C476B13ML 16 100 107 6.3 x 13 B13 17 160


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PDF TYAV0J476A12ML TYAV0J107B13ML TYAV0J227B13ML TYAV0J337C16ML TYAV0J477C16ML TYAV0J108D17ML j4310 3355X
2000 - PP-069A

Abstract: A3958
Text: rating or a junction temperature of 150°C. B package, per SEMI G42- 88 Specification, TA= 25°C LB package, per SEMI G42- 88 Specification, TA= 25°C Range S Fault conditions that produce excessive junction , 6.35 ­0.25 A 1 2 For Reference Only (reference JEDEC MS-001 BE) Dimensions in millimeters Dimensions , millimeters (Reference JEDEC MS-013 AD) Dimensions exclusive of mold flash, gate burrs, and dambar protrusions


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PDF A3958 PP-069A
2000 - A3958SB

Abstract: A3958 A3958SB-T A3958SLB A3958SLBTR-T G42-88
Text: PD B package, per SEMI G42- 88 Specification, TA= 25°C 3.1 W Operating Ambient Temperature TA Maximum Junction Temperature TJ(max) Storage Temperature LB package, per SEMI G42- 88 , JEDEC MS-001 BE) Dimensions in millimeters 7.62 A 1 2 +0.51 3.30 ­0.38 1.27 MIN 2.54 , millimeters (Reference JEDEC MS-013 AD) Dimensions exclusive of mold flash, gate burrs, and dambar


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PDF A3958 A3958 A3958SB A3958SB-T A3958SLB A3958SLBTR-T G42-88
2003 - LQFP-48 thermal pad

Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad SOT23-6 1152 BGA 144 2-CQFP
Text: JEDEC standard boards. The SEMI boards are vertically mounted and comply with the SEMI standard G42- 88 , packaging of that device. The JEDEC boards are horizontally mounted. Each board is made of FR4, is 1.57 , low effect thermal conductivity test board. The JEDEC 4 layer boards are intended to give a near best-case thermal performance value. The JEDEC 4 layer board is made of FR4, is 1.60 mm thick, and consists , 58 8.5 JEDEC 2 (19 × 19 mm) BGA 225 23 1.7 SEMI 2 (23 × 23 mm


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PDF G38-87. LQFP-48 thermal pad exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad SOT23-6 1152 BGA 144 2-CQFP
2011 - 3g42

Abstract: No abstract text available
Text: No file text available


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PDF 625kHz 10kHz -147dBc/Hz 100kHz -152dBc/Hz -150dBc/Hz 25ppm 50ppm 100ppm 3G42B-80N-27 3g42
2012 - b g44

Abstract: No abstract text available
Text: No file text available


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PDF dsPIC33Â PIC24Â PIC32Â N1X10 BC846 220uF/35V/LESR RS-232 b g44
2010 - Not Available

Abstract: No abstract text available
Text: No file text available


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PDF 625MHz 12kHz 20MHz 20ppm 100Hz 10kHz -70dBc/Hz -105dBc/Hz -132dBc/Hz
Not Available

Abstract: No abstract text available
Text: No file text available


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PDF 3x3x16
2003 - Not Available

Abstract: No abstract text available
Text: Pb-free requirements of IPC/ JEDEC J STD-020. 1 1 CE VS 8 2 GND IOUT 7 3 RFRE GND 6 , Performance Curves (Continued) SEMI G42- 88 SINGLE LAYER TEST BOARD SEMI G42- 88 SINGLE LAYER TEST


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PDF EL6201 430MHz EL6201 OT-23, FN7216
RGP800

Abstract: RGP801 RGP802 RGP804 RGP806 A35 rcc
Text: single half sine wave superimposed on rated load ( JEDEC method) Ifsm 150 Amps Maximum Instantaneous , u 90 g co CCIU (OUI Il ; 60 Ë O u. * 3 'IL S.3 ms Single Half Sine Wave JEDEC Method Tj


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PDF 000017S FSDG-800-A T0-220 UL94V-0 MIL-STD-202E, O-220 61fl5J) 30qaS= RGP800 RGP801 RGP802 RGP804 RGP806 A35 rcc
2003 - CD laser pickup assembly

Abstract: fn7216 EL6201CYZ-T13 EL6201CYZ EL6201CY-T7 EL6201CY-T13 EL6201CY EL6201CW-T7A DVD laser pickup assembly EL6201
Text: temperatures that meet or exceed the Pb-free requirements of IPC/ JEDEC J STD-020. 1 1 CE VS 8 2 , Performance Curves (Continued) SEMI G42- 88 SINGLE LAYER TEST BOARD SEMI G42- 88 SINGLE LAYER TEST


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PDF EL6201 430MHz EL6201 OT-23, FN7216 CD laser pickup assembly EL6201CYZ-T13 EL6201CYZ EL6201CY-T7 EL6201CY-T13 EL6201CY EL6201CW-T7A DVD laser pickup assembly
2001 - 2001 heat sink catalog

Abstract: AN9207 G42-88
Text: the following references for further information. MIL STD 883 Method 1012.1; JEDEC ENG. Bulletin No. 20, January 1975; 1992 Semi Std. Vol. 4, Methods G30-86, G32-86, G42- 88 , G43-87 All Intersil


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PDF AN9207 175oC. 150oC 175oC 2001 heat sink catalog AN9207 G42-88
2013 - Not Available

Abstract: No abstract text available
Text: No file text available


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PDF 625kHz 10kHz -147dBc/Hz 100kHz -152dBc/Hz -150dBc/Hz 25ppm 50ppm 100ppm 3G42B-80N-27
2003 - DVD laser pickup assembly

Abstract: CD laser pickup assembly EL6201CYZ EL6201CY-T7 EL6201CY-T13 EL6201CY EL6201CW-T7A EL6201CW-T7 DVD optical pick-up assembly DVD laser head
Text: Pb-free requirements of IPC/ JEDEC J STD-020C. 1 IOUT RFREQ 5 RAMP 4 EL6201 (8 , (Continued) SEMI G42- 88 SINGLE LAYER TEST BOARD SEMI G42- 88 SINGLE LAYER TEST BOARD 0.50 0.60


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PDF EL6201 430MHz EL6201 OT-23, DVD laser pickup assembly CD laser pickup assembly EL6201CYZ EL6201CY-T7 EL6201CY-T13 EL6201CY EL6201CW-T7A EL6201CW-T7 DVD optical pick-up assembly DVD laser head
2003 - CD laser pickup assembly

Abstract: DVD laser pickup assembly CD Laser pickup HFM EL6201 EL6201CW-T7 EL6201CW-T7A EL6201CWZ-T7 EL6201CY MDP0038
Text: exceed the Pb-free requirements of IPC/ JEDEC J Std-020B. CAUTION: These devices are sensitive to , Typical Performance Curves (Continued) SEMI G42- 88 SINGLE LAYER TEST BOARD SEMI G42- 88 SINGLE


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PDF EL6201 430MHz EL6201 OT-23, CD laser pickup assembly DVD laser pickup assembly CD Laser pickup HFM EL6201CW-T7 EL6201CW-T7A EL6201CWZ-T7 EL6201CY MDP0038
1999 - AN9824

Abstract: n003620 Model 52K 9824 N0018 HC55182 HC55180 HC55184 N00300 N0035
Text: No file text available


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PDF RSLIC18TM AN9824 RSLIC18 RSLIC18 AN9824 n003620 Model 52K 9824 N0018 HC55182 HC55180 HC55184 N00300 N0035
1999 - N0044

Abstract: n003620 Model 52K N0008 N0034 N0018
Text: No file text available


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PDF RSLIC18TM AN9824 RSLIC18 N0044 n003620 Model 52K N0008 N0034 N0018
2002 - IN3313

Abstract: EL5001IRE-T7 EL5001IRE EL5001ILZ-T7 EL5001ILZ-T13 EL5001ILZ EL5001IL-T7 EL5001IL-T13 EL5001IL EL5001
Text: of IPC/ JEDEC J Std-020B. 1 CAUTION: These devices are sensitive to electrostatic discharge , JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - HTSSOP EXPOSED DIEPAD SOLDERED TO PCB , 75 85 100 125 150 FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE JEDEC JESD51-3 AND SEMI G42- 88 (SINGLE LAYER) TEST BOARD 0.7 50 AMBIENT TEMPERATURE (°C) POWER , TEMPERATURE 0 6 800mW 0.8 AMBIENT TEMPERATURE (°C) 0.8 5 JEDEC JESD51-3 LOW EFFECTIVE


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PDF EL5001 EL5001 500pF IN3313 EL5001IRE-T7 EL5001IRE EL5001ILZ-T7 EL5001ILZ-T13 EL5001ILZ EL5001IL-T7 EL5001IL-T13 EL5001IL
1994 - G43-87

Abstract: G42-88 AN9207 semi catalog G32-86
Text: the following references for further information. MIL STD 883 Method 1012.1; JEDEC ENG. Bulletin No. 20, January 1975; 1992 Semi Std. Vol. 4, Methods G30-86, G32-86, G42- 88 , G43-87 9-35 Harris


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PDF AN9207 G30-86, G32-86, G42-88, G43-87 G43-87 G42-88 AN9207 semi catalog G32-86
1999 - G43-87

Abstract: AN9207 G42-88
Text: the following references for further information. MIL STD 883 Method 1012.1; JEDEC ENG. Bulletin No. 20, January 1975; 1992 Semi Std. Vol. 4, Methods G30-86, G32-86, G42- 88 , G43-87 All Intersil


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PDF AN9207 G43-87 AN9207 G42-88
2000 - N0044

Abstract: N00160 N0033 A 4.00z HC55184 HC55183 HC55182 HC55181 HC55180 400Z
Text: No file text available


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PDF RSLIC18TM AN9824 RSLIC18 RSLIC18 N0044 N00160 N0033 A 4.00z HC55184 HC55183 HC55182 HC55181 HC55180 400Z
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