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G38-87 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Theta JB

Abstract: JC15-1 G30-88 G38-87
Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square Junction to Ambient Thermal Resistance or Theta JA (RJA) was measured per SEMI Test Method G38-87 at 1.5 watts in a horizontal configuration. The test board conforms


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PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 Theta JB JC15-1 G30-88
1997 - G30-88

Abstract: Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 G38-87 Theta-J JC JB jt 7304LC QFP PACKAGE thermal resistance
Text: Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square Junction to Ambient Thermal Resistance or Theta JA (RJA) was measured per SEMI Test Method G38-87 at 1.5 watts in a horizontal configuration. The test board conforms to EIA/JESD 51-3; it is a single layer 115x102 mm board designed to


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PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 G30-88 Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 Theta-J JC JB jt 7304LC QFP PACKAGE thermal resistance
2000 - 202 ball bga

Abstract: No abstract text available
Text: documented in the JESD51 series. In addtion, Testing was performed per SEMI TEST METHOD G38-87 : "Still and


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PDF 320ball 432-ball G42-88: 44-pin 68-pin 84-pin 133-pin 20-pin 24-pin 28-pin 202 ball bga
1996 - BGA 64 PACKAGE thermal resistance

Abstract: G42-88 G38-87 492-Ball
Text: was performed per SEMI TEST METHOD G38-87 : "Still and Forced-Air Junction-toAmbient Thermal


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PDF 320ball 432-ball 44-pin 68-pin 84-pin 133-pin 20-pin 24-pin 28-pin BGA 64 PACKAGE thermal resistance G42-88 G38-87 492-Ball
FP4451

Abstract: Theta JB hysol adhesive JC15-1 698-100AB hysol G38-87 304-TBGA Aavid Thermalloy cold plate 2332B
Text: Ambient Thermal Resistance or Theta JA (RqJA) was measured per SEMI Test Method G38-87 at 3 watts in a


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PDF E04480002-0-50 DCDA37480-M014-001) R1004 FP4451 G38-87 21426-ICB 35x35 FP4451 Theta JB hysol adhesive JC15-1 698-100AB hysol 304-TBGA Aavid Thermalloy cold plate 2332B
8D73

Abstract: a9da 73Q3 7N22
Text: 89! 6+7;. ,& 70 7&7:07&8708 F+ 2 9+ ,&&7 &-7 ,&D74! 7! 7&D8"74! 8"7 ! 8 , >+21+7+: <72+2+<2+3 <<2 "+<+2/2 3 2 %+6 *$N89!>+><53 )36+ + 87 + , "! 87 &D8"&D8 "E ' ") &&% 5555555 & ="5F+2 I &% 5555555 & ="5F+2+ , +,D<- < +' 8 ( µ& &+,/!3-7 22 8+ .K E; 3! /&)67! 87 ! %8,<5 >-,2<- 8+ .(K E; 7 7/4/7 %,+- 8+ @D ; 'K 3! /&)67! 87


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2000 - G43-87

Abstract: G3896
Text: STANDARDIZATION FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE OF SEMI CONDUCTOR PACKAGES G43- 87 TEST METHOD


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PDF G42-96 G38-96 G42-96 G43-87 G3896
Theta-JC QFP die down

Abstract: G30-88 Theta-J G38-87 Theta JB
Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square Junction to Ambient Thermal Resistance or Theta JA (RJA) was measured per SEMI Test Method G38-87 at 1.5 watts in a horizontal configuration. The test board conforms


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PDF 2500AN 7304LC G38-87 115x102 Theta-JC QFP die down G30-88 Theta-J Theta JB
1999 - JESD51-7

Abstract: JESD51-1 JESD-51 G30-88 JESD-51-1 JESD51 JESD51-5 TB379 thermal resistance standards
Text: ] SEMI G38-87 , Still and forced air junction-to-ambient thermal resistance measurements. [12] SEMI G42


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PDF TB379 JESD51-7 JESD51-1 JESD-51 G30-88 JESD-51-1 JESD51 JESD51-5 thermal resistance standards
2001 - mark EA SOT23-5

Abstract: rca sot23-5 thermal resistance standards G38-87 MARK RCA SOT23-5 sot23-8 thermal resistance TC1186 MSOP-10 TC105 DX SOT23-5
Text: resistance data that was collected using the 2-layer method described in the SEMI G38-87 standard , . SEMI G38-87 , Still and forced air junction-toambient thermal resistance measurements. 10. SEMI G42


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PDF AN792 SC70s, D-81739 D-82152 DS00792A-page mark EA SOT23-5 rca sot23-5 thermal resistance standards G38-87 MARK RCA SOT23-5 sot23-8 thermal resistance TC1186 MSOP-10 TC105 DX SOT23-5
Not Available

Abstract: No abstract text available
Text: population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance , population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance , Q cd D Q cd D Q cd nnnnnnnnnnnnnnnnnnnn 100999697969594 939291 90 89 88 87 86 65 84 S3 82 81 1 , ) (b) (o) (d) 98 SBx SET Input Input 97 92 88 SE2 SÊ3 S5W Input Input Input 87 SW


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PDF MCM69P737 MCM69P737 69P737 MCM69P737ZP4 MCM69P737ZP4R MCM69P737TQ4 MCM69P737TQ4R MCM69P737ZP3
Not Available

Abstract: No abstract text available
Text: Materials International) G38-87 in natural convection. 2. Junction-to-case thermal resistance is based on


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PDF
SPEC-883 cold plate method

Abstract: SPEC-883 G-38-87 5bw 78
Text: thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance between the die and , , board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal , 88 SE2 5E3 33w Input Input Input 87 sw Input 15, 41,65, 91 4,11,20, 27,54, 61, 70


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PDF MCM69F737 MCM69F737 69F737 MCM69F737ZP7 MCM69F737TQ7 MCM69F737ZP8 MCM69F737ZP8R MCM69F737TQ8 SPEC-883 cold plate method SPEC-883 G-38-87 5bw 78
SPEC-883 cold plate method

Abstract: vd 5205 MCM67Q709/MCM67B618
Text: , air flow, board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average , 94 93 92 91 90 89 88 87 88 85 84 83 82 81 1. 80 2 79 3 78 4 77 5 76 8 75 7 74 8 73 9 72 10 7 1 1 1 70 , Power Supply. Ground. Description 95 GY Input 96 86 87 88 89 1, 7,13, 19, 25, 41, 54, 60, 66


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PDF MCM69D618 MCM69D618 69D618 MCM69D618TQ6 MCM69D61BTQ6R MCM69D618TQ8 MCM690618TQ8R SPEC-883 cold plate method vd 5205 MCM67Q709/MCM67B618
Not Available

Abstract: No abstract text available
Text: thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance between the die and , board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance between the , SBx SET Input Input 97 92 88 SE2 SÈ3 SSW Input Input Input 87 SW Input 15, 41


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PDF MCM69P819 69P819 MCM69P819ZP4 MCM69P819ZP4R MCM69P819TQ4 MCM69P819TQ4R MCM69PB19ZP3 MCM69P819ZP3
Not Available

Abstract: No abstract text available
Text: Velocity (LFPM) ©rA measurement method: Semi-standard G38-87 , in a wind tunnel Semi-standard G42


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PDF 64x64 VSC6464 500Mb/s 250Mb/s 750ps 208PQFP VSC6464 G52219-0,
G38-87

Abstract: VSC6464
Text: : Semi-standard G38-87 , in a wind tunnel Semi-standard G42-88/JEDEC JC 15.1 #1 FR4 PCB 3"x4.5"x0.62" 0 Notice


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PDF 64x64 VSC6464 500Mb/s 250Mb/s 750ps 208PQFP VSC6464 G52219-0, G38-87
Not Available

Abstract: No abstract text available
Text: population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance , population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance , 93,94 (a) (b) 88 §Bx sSw Input Input 98 SET Input 97 92 87 SE2 §15 5W Input


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PDF MCM69F819 MCM69F819 69F819 MCM69F819ZP7 MCM69F819TQ7 MCM69F81 MCM69F819ZP8 MCM69F819ZP8R MCM69F819TQ8
G37 IC

Abstract: No abstract text available
Text: No file text available


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PDF SC3AS05FF SC3AS10FF SC3AS15FF G37 IC
Not Available

Abstract: No abstract text available
Text: ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38-87. , ,14,20, 26, 55, 61,67, 73, 79, 90 29, 31, 33, 35, 37,39, 43,45, 47,49, 51, 80, 82, 84, 87 , 89, 95, 97


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PDF MCM69Q618 MCM69Q618 A0-A15 69Q618 MCM69Q618TQ6 MCM69Q618TQ8 MCM69Q618TQ10 MCM69Q618TQ6R
G38-87

Abstract: MCM63Z736 MCM63Z818
Text: , ambient temperature, airflow, board population, and board thermal resistance. 2. Per SEMI G38-87. 3 , 100 99 9897 9695 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 • 80 ZlDQb DQc d 2 79 ZlDQb , IZ 100 99 9897 9695 94 93 92 91 90 89 8 8 87 8685 8483 82 81 1 • 80 NC IZ 2 79 NC d 3 78 VDDQ , : This signal registers the address, data in, and all control signals except G and LBO. 87 CKË Input , . 87 CKË Input Clock Enable: Disables the CK input when CKE is high. (a) 58, 59, 62, 63, 68, 69, 72


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PDF MCM63Z736/D MCM63Z736 MCM63Z818 MCM63Z736 G38-87 MCM63Z818
1998 - MCM69F819

Abstract: MCM69F819TQ8 MCM69F819TQ8R MCM69F819ZP11 MCM69F819ZP8 MCM69F819ZP8R
Text: DQb DQb DQb NC VSS VDDQ NC NC NC E AL SC 100 99 98 97 9695 94 93 92 91 90 89 88 87 86 , . 92 SE3 Input Synchronous Chip Enable: Active low for depth expansion. 87 SW Input , resistance. 2. Per SEMI G38­ 87 . 3. Indicates the average thermal resistance between the die and the printed , , board population, and board thermal resistance. 2. Per SEMI G38­ 87 . 3. Indicates the average thermal


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PDF MCM69F819/D MCM69F819 MCM69F819 MCM69F819TQ8 MCM69F819TQ8R MCM69F819ZP11 MCM69F819ZP8 MCM69F819ZP8R
1998 - MCM69P819ZP4

Abstract: MCM69P819ZP4R MCM69P819TQ4 MCM69P819TQ4R MCM69P819
Text: DQb NC VSS VDDQ NC NC NC 100 99 98 97 9695 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 , used, tie this pin high. 87 SW Input Synchronous Write: This signal writes only those bytes , ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­ 87 , , and board thermal resistance. 2. Per SEMI G38­ 87 . 3. Indicates the average thermal resistance


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PDF MCM69P819 MCM69P819 MCM69P819/D MCM69P819ZP4 MCM69P819ZP4R MCM69P819TQ4 MCM69P819TQ4R
1998 - MCM69P819

Abstract: MCM69P819TQ4 MCM69P819TQ4R MCM69P819ZP4 MCM69P819ZP4R
Text: NC VSS VDDQ NC NC NC 100 99 98 97 9695 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 , the SBx and SW signals. If only byte write signals SBx are being used, tie this pin high. 87 SW , temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­ 87 . 3. Indicates the , thermal resistance. 2. Per SEMI G38­ 87 . 3. Indicates the average thermal resistance between the die and


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PDF MCM69P819 MCM69P819 MCM69P819/D MCM69P819TQ4 MCM69P819TQ4R MCM69P819ZP4 MCM69P819ZP4R
SS75-Z

Abstract: No abstract text available
Text: , board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal , temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the , O NC O VDDQ o NC O DQb O Vd d q o NC O DQb O 100 99 9897 9695 94 93 92 91 90 89 88 87 86 85 84 83 , ) 88 SBx Input SGW Input 98 SIT Input 97 92 87 SE2 5Ë3 SW Input Input


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PDF MCM69F819/D MCM69F819 SS75-Z
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