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R7F7010094AFP
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Renesas Electronics Corporation
|
High-end In-vehicle Microcomputers for Body Applications |
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|
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IS0-1009EH-Q
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Renesas Electronics Corporation
|
Radiation Hardened 2.5V Reference |
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|
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R7F7010093AFP
|
|
Renesas Electronics Corporation
|
High-end In-vehicle Microcomputers for Body Applications |
|
|
|
IS0-1009EH/SAMPLE
|
|
Renesas Electronics Corporation
|
Radiation Hardened 2.5V Reference |
|
|
|
54121-820100900LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch. |
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59202-F30-10-099LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 20 Positions. |
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