The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC2208CUP-14#TRPBF Linear Technology LTC2208-14 - 14-Bit, 130Msps ADC; Package: QFN; Pins: 64; Temperature Range: 0°C to 70°C
LT1208CS8#TRPBF Linear Technology LT1208 - Dual and Quad 45MHz, 400V/µs Op Amps; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LTC2208CUP-14#PBF Linear Technology LTC2208-14 - 14-Bit, 130Msps ADC; Package: QFN; Pins: 64; Temperature Range: 0°C to 70°C
LT1208CS8#PBF Linear Technology LT1208 - Dual and Quad 45MHz, 400V/µs Op Amps; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LTC2208CUP#TRPBF Linear Technology LTC2208 - 16-Bit, 130Msps ADC; Package: QFN; Pins: 64; Temperature Range: 0°C to 70°C
LTC2208CUP#TR Linear Technology LTC2208 - 16-Bit, 130Msps ADC; Package: QFN; Pins: 64; Temperature Range: 0°C to 70°C

FPT-208C-C02 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1998 - FPT-208C-C02

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina ( FPT-208C-C02 ) 208-pin ceramic QFP ( FPT-208C-C02 ) 30.60 ± 0.20 SQ (1.205 ± .008) 3.30 (.130) MAX (Mounting height) 27.20 + 0.60 SQ ­ 0.30 (1.071 + .023 ) ­ .012


Original
PDF FPT-208C-C02 208-pin FPT-208C-C02) F208007S F208007SC-3-3 FPT-208C-C02
1995 - FPT-208C-C02

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C02 Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material 208-pin ceramic QFP Alumina ( FPT-208C-C02 ) 208-pin ceramic QFP ( FPT-208C-C02 ) 30.60 ± 0.20 SQ (1.205 ± .008) 3.30 (.130) MAX ( t fl ) (Mounting height) 27.20 + 0.60 SQ ­ 0.30 (1.071 + .023 ) ­ .012 Details of "A" part 0° ° 10 0~ "A" 0.05 (.002) MIN


Original
PDF FPT-208C-C02 208-pin FPT-208C-C02) F208007SC-3-3 FPT-208C-C02
1999 - FPT-208C-C02

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina ( FPT-208C-C02 ) 208-pin ceramic QFP ( FPT-208C-C02 ) 30.60 ± 0.20 SQ (1.205 ± .008) 3.30 (.130) MAX (Mounting height) 0.60 27.20 + 0.30 SQ ­ .023 (1.071 + .012 ) ­ Details of "A" part 0° 0~ "A" 10 ° 0.05


Original
PDF FPT-208C-C02 208-pin FPT-208C-C02) F208007SC-3-3 FPT-208C-C02
1999 - LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 smd code 38P YAMAICHI ic234 fpq-144-0.5-03 smd p08
Text: No file text available


Original
PDF
1997 - SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: No file text available


Original
PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 LGA 1155 Socket PIN diagram smd marking m05 L QUAD Aluminum nitride pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
2002 - LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram Wells-CTI 36 lead Flat Pack 216-LQFP smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 Enplas drawings BGA136
Text: No file text available


Original
PDF
2000 - MB89P195A-201P

Abstract: MB90F654APFV MB89P195A-201PF MB90V660A MB89P147V2P-SH MB89P147V2PF MB89P147V1P-SH MB89P147V1PF MB89140 MB8916xPF
Text: -401C-A02 X X X 0,5 PGA-135C-A02 FPT-100C-A02 FPT-100C-C01 0,65 X FPT-80C- C02 0,8 , 0,8 FPT-100P-M06 0,65 MDP-64C-P02 FPT-80P-M15 0,5 FPT-120C- C02 FPT-80P-M05 0 , X X X X 0,5 0,65 FPT-100C-A02 FPT-100C-C01 0,65 MQP-80C-P01 FPT-80C- C02 0,8 , -48C-P01 FPT-120P-M05 0,4 0,8 FPT-120P-M21 0,5 MDP-64C-P02 FPT-120P-M13 0,5 FPT-120C- C02 , -100P-M18 FPT-120P-M03 FPT-120P-M13 FPT-120P-M21 FPT-120P-M05 FPT-144P-M08 FPT-208P-M01 FPT-80C-A02 FPT-80C- C02


Original
PDF MB89120/A MB89150/A MB89160/A MB89W165-xxxCF MB89PV160-xxxCF MB8912xPFV/APFV MB8912xPFM/APFM MB89130/A MB89130ACF MB8913xPFM/APFM MB89P195A-201P MB90F654APFV MB89P195A-201PF MB90V660A MB89P147V2P-SH MB89P147V2PF MB89P147V1P-SH MB89P147V1PF MB89140 MB8916xPF
1998 - FPT-64P-M09

Abstract: FPT-144P-M08 MB89P165-xxxPF MB89P173-201PF MB89P147V1PF MB89140 MB89P147V2P-SH MB89P147V2PF MB89P147V1P-SH MB8916xPF
Text: -120P-M03 FPT-120P-M13 FPT-120P-M05 FPT-144P-M08 FPT-176P-M01 FPT-80C-A02 FPT-80C- C02 FPT-100C-A02 FPT-100C-C01 FPT-120C- C02 MDP-64C-P02 MQP-48C-P01 MQP-64C-P01 MQP-80C-P01 MQP-100C-P01 MQP-100C-P02 PGA , -100P-M05 FPT-120P-M03 FPT-120P-M13 FPT-120P-M05 FPT-144P-M08 FPT-176P-M01 FPT-80C-A02 FPT-80C- C02 FPT-100C-A02 FPT-100C-C01 FPT-120C- C02 MDP-64C-P02 MQP-48C-P01 MQP-64C-P01 MQP-80C-P01 MQP-100C-P01 MQP , -176P-M01 FPT-80C-A02 FPT-80C- C02 FPT-100C-A02 FPT-100C-C01 FPT-120C- C02 MDP-64C-P02 MQP-48C-P01 MQP


Original
PDF MB86830 MB89120/A MB89150/A DIP-28P-M05 DIP-28P-M03 DIP-48P-M01 DIP-64P-M01 DIP-64C-A06 FPT-28P-M17 FPT-48P-M13 FPT-64P-M09 FPT-144P-M08 MB89P165-xxxPF MB89P173-201PF MB89P147V1PF MB89140 MB89P147V2P-SH MB89P147V2PF MB89P147V1P-SH MB8916xPF
1999 - FPT-100P-M05

Abstract: MB89P165-xxxPF MB89P185-xxxPF FPT-208P-M01 DIP-64P-M01 MB86830 FPT-100P-M06 MB90630A
Text: -144P-M03 FPT-144P-M08 FPT-176P-M01 FPT-208P-M01 FPT-80C-A02 FPT-80C- C02 FPT-100C-A02 FPT-100C-C01 FPT-120C- C02 , -100C-A02 FPT-100C-C01 FPT-120C- C02 MQP-48C-P01 MQP-64C-P01 MQP-80C-P01 0,8 MDP-64C-P02 1,778 FPT-28P-M17 FPT , -80P-M05 FPT-80P-M15 DIP-28P-M05 DIP-28P-M03 DIP-48P-M01 DIP-64P-M01 FPT-80C-A02 FPT-80C- C02 DIP-64C-A06 1,778 , -120P-M13 FPT-120P-M05 FPT-144P-M03 FPT-144P-M08 FPT-176P-M01 FPT-208P-M01 FPT-80C-A02 FPT-80C- C02 FPT-100C-A02 FPT-100C-C01 FPT-120C- C02 MDP-64C-P02 MQP-48C-P01 MQP-64C-P01 MQP-80C-P01 MQP-100C-P01 MQP


Original
PDF MB86830 MB8694x MB86831-66/80/100PFV MB86832-66/80/100PFV MB86833-66PFV MB86941PFV MB86942PFV DIP-28P-M05 DIP-28P-M03 DIP-48P-M01 FPT-100P-M05 MB89P165-xxxPF MB89P185-xxxPF FPT-208P-M01 DIP-64P-M01 MB86830 FPT-100P-M06 MB90630A
1997 - nitride

Abstract: Aluminum nitride QFP C1995
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT- 208C -C04 Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Aluminum nitride 208-pin ceramic QFP (FPT- 208C -C04) 208-pin ceramic QFP (FPT- 208C -C04) 30.60±0.20 SQ (1.205±.008) +0.60 27.20 -0.30 SQ +.023 1.071-.012 25.50(1.004)REF Details of "A" part 9.80(.386)MAX (Mounting height) 1.80±0.20 (.071±.008) 0.05(.002)MIN STAND OFF


Original
PDF FPT-208C-C04 208-pin FPT-208C-C04) FFPT-208C-C04 nitride Aluminum nitride QFP C1995
1997 - nitride

Abstract: Aluminum nitride QFP method 208
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT- 208C -C03 Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material 208-pin ceramic QFP Aluminum nitride (FPT- 208C -C03) 208-pin ceramic QFP (FPT- 208C -C03) 30.60±0.20 SQ (1.205±.008) Details of "A" part +0.60 27.20 -0.30 SQ +.023 1.071-.012 25.50(1.004)REF 3.30(.130)MAX (Mounting height) 1.80±0.20 (.071±.008) 0.05(.002)MIN STAND OFF


Original
PDF FPT-208C-C03 208-pin FPT-208C-C03) F208013SC-2-3 nitride Aluminum nitride QFP method 208
1999 - Not Available

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT- 208C -C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina nitride (FPT- 208C -C03) 208-pin ceramic QFP (FPT- 208C -C03) 30.60±0.20 SQ (1.205±.008) Details of "A" part +0.60 27.20 ­0.30 SQ 1.071 3.30(.130)MAX (Mounting height) +.023 ­.012 1.80±0.20 (.071±.008


Original
PDF FPT-208C-C03 208-pin FPT-208C-C03) F208013SC-2-3
1999 - Not Available

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT- 208C -C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Alumina nitride (FPT- 208C -C04) 208-pin ceramic QFP (FPT- 208C -C04) 30.60±0.20 SQ (1.205±.008) +0.60 27.20 ­0.30 SQ Details of "A" part 9.80(.386)MAX (Mounting height) +.023 1.071 ­.012 25.50(1.004)REF


Original
PDF FPT-208C-C04 208-pin FPT-208C-C04) F208014SC-1-3
1999 - Not Available

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT- 208C -A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal (FPT- 208C -A01) 208-pin ceramic QFP (FPT- 208C -A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ (1.102±.012) 25.50(1.004) REF 1.65±0.20 (.065±.008) 0.50(.0197) "A" Details of "A" part 1.02±0.25 (.040±.010) 26.00(1.024) DIA 15.00(.591) DIA 0.50(.197) TYP 0.20±0.05 (.008±.002) INDEX AREA C


Original
PDF FPT-208C-A01 208-pin FPT-208C-A01) F208009SC-1-3
1997 - 208-PIN

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT- 208C -A01 Lead pitch 0.50mm Lead shape Gullwing Sealing method 208-pin ceramic QFP Metal seal (FPT- 208C -A01) 208-pin ceramic QFP (FPT- 208C -A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ (1.102±.012) 25.50(1.004) REF 1.65±0.20 (.065±.008) 0.50(.0197) "A" Details of "A" part 1.02±0.25 (.040±.010) 26.00(1.024) DIA 15.00(.591) DIA 0.50(.197) TYP 0.20±0.05 (.008±.002) INDEX AREA C 1995 FUJITSU LIMITED F208009SC


Original
PDF FPT-208C-A01 208-pin FPT-208C-A01) F208009SC-1-3
1998 - Not Available

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT- 208C -A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal (FPT- 208C -A01) 208-pin ceramic QFP (FPT- 208C -A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ (1.102±.012) 25.50(1.004) REF 1.65±0.20 (.065±.008) 0.50(.0197) "A" Details of "A" part 1.02±0.25 (.040±.010) 26.00(1.024) DIA 15.00(.591) DIA 0.50(.197


Original
PDF FPT-208C-A01 208-pin FPT-208C-A01) F208009SC-1-3
1998 - Not Available

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT- 208C -C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina nitride (FPT- 208C -C03) 208-pin ceramic QFP (FPT- 208C -C03) 30.60±0.20 SQ (1.205±.008) Details of "A" part +0.60 27.20 ­0.30 SQ 1.071 3.30(.130)MAX (Mounting height


Original
PDF FPT-208C-C03 208-pin FPT-208C-C03) F208013SC-2-3
1998 - 208-PIN

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT- 208C -C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Alumina nitride (FPT- 208C -C04) 208-pin ceramic QFP (FPT- 208C -C04) 30.60±0.20 SQ (1.205±.008) +0.60 27.20 ­0.30 SQ Details of "A" part 9.80(.386)MAX (Mounting height) +.023 1.071


Original
PDF FPT-208C-C04 208-pin FPT-208C-C04) F208014SC-1-3
fujitsu cg10

Abstract: transistor H6C cg10572 CG10692 CG10492 CG10272 LCC64 SQFP64 DIP-48P-MOI CG10342
Text: €”20 DIP—20P-M02 DIP-20C— C02 1 2 17 DIP—20U 1 1 18 DIP—22 DIP—22P—M02 DIP—22C- C02 2 2 18 , €”24U 1 1 22 DIP-28 DIP—28P—M02 DIP-28C— C02 2 2 24 DIP-28P-M03 DIP—28U 1 1 26 DIP , Series CMOS Gate Arrays PACKAGE DIMENSIONS (Continued) PGA— 208C -A02 208-LEAD CERAMIC (METAL SEAL) PIN GRID ARRAY PACKAGE (Case No.: PGA- 208C -A02) .1001 .010 (2.54 1 0.25) 1.693 t.020 SQ (43.00 Â


OCR Scan
PDF 208C-A02 208-LEAD PGA-208C-A02) 9999999999999i fujitsu cg10 transistor H6C cg10572 CG10692 CG10492 CG10272 LCC64 SQFP64 DIP-48P-MOI CG10342
1997 - 296-0025

Abstract: Aluminum nitride QFP
Text: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C- C02 Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material 256-pin ceramic QFP Aluminum nitride (FPT-256C- C02 ) 256-pin ceramic QFP (FPT-256C- C02 ) 42.60±0.20 (1.677±.008) +0.60 39.20 -0.30 +.023 1.543 -.012 37.50(1.476)REF 0.50(.0197) TYP 0.20±0.10 (.008±.004) 3.80(.150)MAX (Mounting height) 0.13(.005) 2.05±0.20 (.081±.008) M 0.10


Original
PDF FPT-256C-C02 256-pin FPT-256C-C02) F256012SC-3-3 296-0025 Aluminum nitride QFP
1999 - Not Available

Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC FPT-28C- C02 28-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Cerdip (FPT-28C- C02 ) 28-pin ceramic SOP (FPT-28C- C02 ) 0.05(.002) MIN 13.335(.525) TYP R0.51(.020) 11.40 .449 1.27±0.13 (.050±.005) +0.05 0.43 ­0.08 +.002 .017 ­.003 16.51(.650) REF +0.56 17.48 ­0.20 +0.48 ­0.15 +.019 ­.006 0.76(.030) MAX 12.01±0.20 (.473±.008) +0.076


Original
PDF FPT-28C-C02 28-pin FPT-28C-C02) F28006SC-4-3
1998 - 1201020

Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C- C02 28-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Cerdip (FPT-28C- C02 ) 28-pin ceramic SOP (FPT-28C- C02 ) 0.05(.002) MIN 13.335(.525) TYP R0.51(.020) 11.40 .449 1.27±0.13 (.050±.005) +0.05 0.43 ­0.08 +.002 .017 ­.003 16.51(.650) REF +0.56 17.48 ­0.20 +0.48 ­0.15 +.019 ­.006 0.76(.030) MAX


Original
PDF FPT-28C-C02 28-pin FPT-28C-C02) F28006SC-4-3 1201020
1998 - Not Available

Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index FPT-16C- C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip (FPT-16C- C02 ) 16-pin ceramic SOP (FPT-16C- C02 ) 0.43±0.05 (.0170±.002) 2.41(.095) MAX 0.05(.002) MIN 0.76(.030) MAX +0.31 5.30 ­0.16 7.29(.287) TYP +.012 .209 ­.006 0.38(.015)R 6.60±0.18 (.260±.007) 1.27(.050) TYP


Original
PDF FPT-16C-C02 16-pin FPT-16C-C02) F16016SC-1-2
1999 - Not Available

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN CERAMIC FPT-144C- C02 144-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Ceramic material Alumina Mounting height 2.0 mm MAX (FPT-144C- C02 ) 144-pin ceramic QFP (FPT-144C- C02 ) 2.00(.079) (Mounting height) MAX 22.60±0.20SQ (.890±.008) +0.40 20.20 ­0.20 SQ 1.00(.039) REF +.016 .795 ­.008 17.50(.689) REF


Original
PDF FPT-144C-C02 144-pin FPT-144C-C02) F144005SC-1-3
1997 - Not Available

Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 32 PIN CERAMIC FPT-32C- C02 Lead pitch 50mil Package width × package length 450 × 550mil Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm 32-pin ceramic QFP (FPT-32C- C02 ) 32-pin ceramic QFP (FPT-32C- C02 ) 16.97±0.25(.688±.010) +0.25 +.010 13.97 ­0.13 (.550 ­.005 ) 3.00(.118)MAX 10.16(.400)REF 1.15(.045)REF 1.27±0.15 (.050±.006) 0.15±0.10(.006±.004) (STAND OFF) EF +0.25 Ø 7. 50


Original
PDF FPT-32C-C02 50mil 550mil 32-pin FPT-32C-C02)
Supplyframe Tracking Pixel