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L177HDAG26S
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock |
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L77HDAG26SOL2RM5C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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L177HRAG26S
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Amphenol Communications Solutions
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Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell, 26 Socket, M3 Rear Nut |
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L77HDAG26SOL2C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock |
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L177HDAG26SOL2RM5
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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L77HDAG26SOL2RM5
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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