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Part ECAD Model Manufacturer Description Datasheet Download Buy Part
AC244044 AC244044 ECAD Model Microchip Technology Inc EXTENSION PAK PIC16LF1829
AC244027 AC244027 ECAD Model Microchip Technology Inc EXTENSION PAK PIC16LF727-ICE
AC244062 AC244062 ECAD Model Microchip Technology Inc EXTENSION PAK PIC16F570
AC244053 AC244053 ECAD Model Microchip Technology Inc EXTENSION PAK PIC16F1459-ICE
AC244061 AC244061 ECAD Model Microchip Technology Inc EXTENSION PAK PIC16F527
AC244023 AC244023 ECAD Model Microchip Technology Inc PROC EXTENS PAK PIC18F1XK50
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Fischer Elektronik GmbH & Co KG
FK 244 13 D3 PAK Heat Sink, For D2-Pak, TO-268, 19.5 C/W, 13 mm, 13 mm, 22.8 mm RoHS Compliant: Yes
FK 244 13 D3 PAK ECAD Model
Distributors Part Package Stock Lead Time Min Order Qty 1 10 100 1,000 10,000
Newark FK 244 13 D3 PAK Bulk 0 1 $2.96 $2.94 $2.62 $2.35 $2.35 More Info
Rutronik FK 244 13 D3 PAK Box 370 10 - $0.885 $0.8258 $0.8037 $0.8037 More Info
Avnet Europe FK 244 13 D3 PAK 0 7 Weeks, 3 Days 100 - - €1.09975 €0.73023 €0.62466 More Info
element14 Asia-Pacific FK 244 13 D3 PAK Each 0 1 $2.12 $2.12 $2 $1.87 $1.87 More Info
Farnell FK 244 13 D3 PAK Each 325 1 £1.54 £1.31 £1.04 £1.04 £1.04 More Info
Fischer Elektronik GmbH & Co KG
FK244 13 D3 PAK Heatsink, 19.5K/W, 31 x 13 x 10mm, Solder, PK
FK244 13 D3 PAK ECAD Model
Distributors Part Package Stock Lead Time Min Order Qty 1 10 100 1,000 10,000
RS Components FK244 13 D3 PAK Package 935 5 - $2.309 $2.124 $1.802 $1.802 More Info
Fischer Elektronik GmbH & Co KG
FK 244 13 D3 PAK TR SMD Heatsink Copper D-PAK 13x31x10
FK 244 13 D3 PAK TR ECAD Model
Distributors Part Package Stock Lead Time Min Order Qty 1 10 100 1,000 10,000
Schukat electronic FK 244 13 D3 PAK TR 110 10 - €1.4 €1.05 €0.8294 €0.8294 More Info
Avnet Europe FK 244 13 D3 PAK TR 0 7 Weeks, 3 Days 200 - - - €1.09892 €0.98638 More Info

FK 244 13 D3 PAK Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2013 - Not Available

Abstract: No abstract text available
Text: ,8 26 K/W 31 please indicate: 13 10 8 art. no. FK 244 13 D3 PAK . weight: 3.9g L 26 art. no. FK 244 08 D3 PAK . weight: 2.5g K 22,8 K/W 8 I 13 8 , 244 08 = 450, FK 244 13 = 200 FK 244 08 D PAK . weight: 2g 8 8 E 10 art. no. 10 14,8 23 31,5 K/W FK 244 13 D PAK . weight: 3.3g 13 8 F 10 art. no. 10 25 K/W 14,8 23 8 8 G 10 art. no. 13 FK 244 08 D2 PAK . weight


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PDF SO-10, SO-20, SO-36, SO-14, SO-16,
FK 244 13 D2 PAK

Abstract: Heatsinks IC A 244 D-PAK TO-268 sot 669 so-10 lf 244 FK 330 Heatsinks to-5
Text: , quantity: FK 244 08 = 325, FK 244 13 = 200 D art. no. E FK 244 08 D PAK . weight: 2 g art. no. F FK 244 13 D PAK . weight: 3.3 g art. no. G FK 244 08 D2 PAK . weight: 2.2 g art. no. H FK 244 13 D2 PAK . weight: 3.6 g art. no. I K FK 244 08 D3 PAK . weight: 2.5 g art. no. L FK 244 13 D3 PAK . weight: 3.9 g please indicate: . packing (option , suitable for SMD components of type D PAK (TO 252), D² PAK (TO 263), PAK (TO 268), SOT 669 LF PAK , SO


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PDF SO-10, SO-20, SO-36, SO-14, SO-16, FK 244 13 D2 PAK Heatsinks IC A 244 D-PAK TO-268 sot 669 so-10 lf 244 FK 330 Heatsinks to-5
SMD 54 fk

Abstract: FK 244 13 D2 PAK SO8 tray 54 fk SOT-23
Text: : 2,2 g 8 13 29,3 K/W 10 FK 244 08 D2 PAK . 17,8 13 17,8 26 Gewicht/weight/poids: 3,6 g 8 8 22,8 K/W 10 FK 244 13 D2 PAK . 18 31 Gewicht/weight/poids: 2,5 g 8 13 26 K/W 10 FK 244 08 D3 PAK . 22,8 18 31 FK 244 13 D3 PAK . , Gewicht/weight/poids: 2 g 13 FK 244 08 D PAK . 14,8 31,5 K/W 10 23 FK 244 13 D PAK , 244 13 = 200 ­ tape width: 44 mm ­ reel diameter: 330 mm ­ pieces: FK 244 08 = 325 FK 244 13 =


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PDF SO-14, SO-16, SO-10, SMD 54 fk FK 244 13 D2 PAK SO8 tray 54 fk SOT-23
FK 244 13 D2 PAK

Abstract: No abstract text available
Text: weight: 3 .3 g a rt. no. FK 2 4 4 08 D2 PAK weight: 2 .2 g a rt. no. F K 2 4 4 13 D 2 P A K weight: 3 .6 g a rt. no. FK 2 4 4 08 D3 PAK weight: 2 .5 g a rt. no. F K 2 4 4 13 D 3 P A K , customers specifications tape width: 44 mm, reel diam eter: 330 mm, quantity: FK 244 08 = 4 5 0 , FK 244 13 , (TO 25 2), D2 PAK (TO 26 3), D3 PAK (TO 26 8), SOT 669 LF PAK , SO IC-8 FL MP, Power S O -8, Power S O , Heatsinks for D PAK and others copper heatsinks with excellent heat conductivity direct mounting


OCR Scan
PDF C15-16 FK 244 13 D2 PAK
74 hc 59581

Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 LGA 1155 Socket PIN diagram LA9100 smd transistor w16 702 transistor smd code
Text: sterling & exclusive of VAT Sales: 08447 11 11 11 Customer Support: 08447 11 11 13 717 718 Find it , Sales: 08447 11 11 11 Customer Support: 08447 11 11 13 719 720 Find it fast online at , 100+ 0.65 0.89 1.62 2.65 500+ 0.55 0.82 1.56 2.44 1K+ 0.51 0.78 1.38 2.24 2K5+ 0.49 0.74 1.35 2.10 , 13 721 722 Find it fast online at www.farnell.co.uk Over 500,000 products with real-time stock , Price Each 100+ 1.62 2.65 500+ 1.56 2.44 1K+ 1.38 2.24 519-935 519-947 519-959 10 Way In-Line ZIP


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PDF element-14 74 hc 59581 b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 LGA 1155 Socket PIN diagram LA9100 smd transistor w16 702 transistor smd code
5-Lead Plastic DD Pak ltc Q

Abstract: ADI TI DN SOT-223 20 PIN LEADLESS CHIP CARRIER qfn 44 PACKAGE footprint 9mm 8 lead side brazed MS8 PACKAGE footprint 5 lead dd pak Cross Reference sot WO14
Text: /BURR-BROWN MAXIM E FN, FK L LS E E FN, FK L M S - - - 5-Lead DD Pak Q S - - - 7-Lead DD Pak R S - - - 8- and 10 , -Lead SOT-223 Small Outline Transistor ST MP - - UR 3-Lead SOT-23 DD PAK ADI E 3-Lead DD Pak MSOP NSC L 20-Pin Leadless Chip Carrier (Square 0.350, Hermetic) PDIP


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PDF 28-Lead 56-Lead 28-Lead 36-Lead 10-Lead 20-Lead O-220 5-Lead Plastic DD Pak ltc Q ADI TI DN SOT-223 20 PIN LEADLESS CHIP CARRIER qfn 44 PACKAGE footprint 9mm 8 lead side brazed MS8 PACKAGE footprint 5 lead dd pak Cross Reference sot WO14
TG 346

Abstract: HC151 SN54HC251 SN74HC251
Text: D1 L H L L D2 D2 L H H L D3 D3 H L L L D4 D4 H L H L D5 D5 H H L L D6 D6 H H H L D7 D7 SN54HC251 . J PACKAGE SN74HC251 . . . D OR N PACKAGE (TOP VIEW) D3 C 1 U,6 D vcc 02 C 2 15 H D4 D1 C 3 14 3 D5 DO C 4 13 D D6 v[ 5 12 :D7 W C 6 11 DA GC 7 10 DB GND C 8 9 De SN54HC251 . FK PACKAGE , ]« 16[ NC Y 15[ D7 W ]8 ,4[ A 9 1—1 10 1—1 11 12 nr-i 13 Î3_ lo o o o 00 z z o , > EN > 0 1101 (91 (41 (3) (2) 2 V 3 4 5 6 7 (11 (151 (14) ( 13 ) (12) (A 0) O â


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PDF SN54HC251, SN74HC251 D2684. 1982-REVISED HC151 300-mil SN54HC251 SN74HC251 TG 346 HC151
1982 - HC151

Abstract: SN54HC251 SN74HC251
Text: 95 4.5 V 8 15 22 19 6 13 19 ns 244 4.5 V ns 31 283 6V , Ceramic Flat (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs SN54HC251 . . . J OR W PACKAGE SN74HC251 . . . D OR N PACKAGE (TOP VIEW) D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE (TOP VIEW) The 3-state outputs can


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PDF SN54HC251, SN74HC251 SCLS132A HC151 300-mil SN54HC251 HC151 SN54HC251 SN74HC251
1982 - HC151

Abstract: SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
Text: Inverted Data D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE (TOP VIEW) D2 D3 NC VCC D4 description/ordering information These data selectors/multiplexers contain , D3 D4 TG 15 TG 6 D5 D6 D7 Y 1 14 W TG 13 TG 12 TG Pin , -state outputs. D1 D0 NC Y W 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13


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PDF SN54HC251, SN74HC251 SCLS132E HC151 SN54HC251 HC151 SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
1982 - HC151

Abstract: SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
Text: Inverted Data D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE (TOP VIEW) D2 D3 NC VCC D4 description/ordering information These data selectors/multiplexers contain , D3 D4 TG 15 TG 6 D5 D6 D7 Y 1 14 W TG 13 TG 12 TG Pin , -state outputs. D1 D0 NC Y W 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13


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PDF SN54HC251, SN74HC251 SCLS132E HC151 SN54HC251 HC151 SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
1982 - HC151

Abstract: SN54HC251 SN74HC251
Text: Ceramic Flat (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs SN54HC251 . . . J OR W PACKAGE SN74HC251 . . . D OR N PACKAGE (TOP VIEW) D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE (TOP VIEW) The 3-state outputs can , 7 15 8 14 9 10 11 12 13 D5 D6 NC D7 A OE GND NC C B These data selectors


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PDF SN54HC251, SN74HC251 SCLS132B HC151 300-mil SN54HC251 HC151 SN54HC251 SN74HC251
1982 - HC151

Abstract: SN54HC251 SN74HC251 C 72
Text: PACKAGE (TOP VIEW) D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE , TG 2 TG 5 D3 D4 TG 15 TG 6 D5 D6 D7 Y 1 14 W TG 13 TG , Small-Outline (D), Shrink Small-Outline (DB), and Ceramic Flat (W) Packages, Ceramic Chip Carriers ( FK ), and , 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 D5 D6 NC D7 A


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PDF SN54HC251, SN74HC251 SCLS132C HC151 SN54HC251 HC151 SN54HC251 SN74HC251 C 72
HC151

Abstract: SN54HC251 SN74HC251 D6512 JN1110 D7611
Text: PACKAGE SN74HC251 . . D OR N PACKAGE (TOP VIEW) D3 [ D2 [ D1[ DO [ Y[ W[ ÔË[ GND [ u ] vcc 1 16 2 15 ] D4 3 14 ] D5 4 13 ] D6 5 12 ]D7 6 11 ]A 7 10 ]B 8 9 ]c SN54HC251 . . FK PACKAGE (TOP , of the respective D input OE A B C DO D1 D2 D3 D4 D5 D6 D7 JN, 11 10 15 14 13 12 MUX > EN , ) ■M>- OE 11 10 DO D1 D2 D3 D4 D5 D6 D7 -j>H> -j>H> O9999999 15 14 13 > > > à , ) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description


OCR Scan
PDF SN54HC251, SN74HC251 SCLS132A- HC151 300-mil Hbl723 Dhl32 HC151 SN54HC251 D6512 JN1110 D7611
HC151

Abstract: SN54HC251 SN74HC251
Text: D2 D3 D4 D5 D6 D7 11 10 15 14 13 12 MUX > EN H 2) 0 1 V 2 V 3 4 5 6 , (positive logic) M>- OE 11 10 DO D1 D2 D3 D4 D5 D6 D7 15 14 13 12 1>H> gWgOOOO , (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs , PACKAGE SN74HC251 . . . D OR N PACKAGE (TOP VIEW) SN54HC251 . . . FK PACKAGE (TOP VIEW) CM CO O O Q Q Z > Q I_II_II_II_II_I 3 2 1 20 19 d1 ]4 do ]5 nc ]6 y ]7 w ]8 9 10 11 12 13 I—II—II—IIâ


OCR Scan
PDF SN54HC251, SN74HC251 SCLS132B HC151 300-mil SN54HC251
Not Available

Abstract: No abstract text available
Text: ), and Ceramic Flat (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) DIPs SN54HC251 . . . J OR W PACKAG E SN74HC251 . . . D, DB, OR N PACKAG E (TOP VIEW) D3 [ 1 D2 [ 2 D1 [ 3 DO [ 4 Y [ 5 w [ 6 OE [ 7 GND [ 8 u 16 ] V CC 15 ] D4 14 ] D5 13 j D6 12 ] D7 11 ] A , °C. SN54HC251 . . . FK PA CKAG E (TOP VIEW) CM CO O 0 o 1 II II II II I 18 [ 3 D1 ] 4 DO ] 5 NC ] 6 Y ]7 W ]8 2 1 20 19 D5 1 7 [ D6 1 6 [ NC 15 [ D7 A 9 10 11 12 13 z z C


OCR Scan
PDF SN54HC251, SN74HC251 SCLS132C HC151 SN54HC251 SN74HC251
Not Available

Abstract: No abstract text available
Text: PACKAGE (TOP VIEW) D3 [ 1 D2 [ 2 D1 [ 3 DO [ 4 Y [ 5 u · · · 16 ] V CC 15 ] D4 14 ] D5 13 j D6 , (D), Shrink Small-Outline (DB), and Ceramic Flat (W) Packages, Ceramic Chip Carriers ( FK ), and , characterized for operation from -40°C to 85 °C. SN54HC251 . . . FK PACKAGE (TOP VIEW) o C MC O O O o o z > O , 11 12 13 1 -1 1 -1 1 -1 1 -1 1 -1 IL U O o o m lo z z C 3 NC - No internal connection , L L OUTPUTS OE H L L L Z DO D1 D2 D3 D4 D5 D6 D7 B X L L H H A X L H L W z DO dT


OCR Scan
PDF SN54HC251, SN74HC251 HC151 SN54HC251 SN74HC251
SCLS11

Abstract: No abstract text available
Text: PACKAGE (TOP VIEW) D3 [ 1 U D2 [ 2 D1 [ 3 DO [ 4 Y[ 5 W [ 6 S [ 7 GND [ 8 16 15 14 13 12 1 1 10 9 ] VCC ] D4 ]D 5 ]D 6 ]D 7 ]A ]B ]c SN54HC151 . . . FK PACKAGE (TOP VIEW) Q O 2 > CM CO O o Q , Flat (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) 300-mll DIPs , [ 9 10 11 12 13 I- II- II- II- 'I - I \o a o o co D5 D6 NC D7 A z z o NC - No internal , H L L L L L L L L L DO D1 D2 D3 D4 05 D6 D7 OUTPUTS W H DO DT D2 D3 D4 D5 D6 D7 DO, D1 . . . 07 -


OCR Scan
PDF SN54HC151, SN74HC151 SCLS11 300-mll SN54HC151
Z155

Abstract: No abstract text available
Text: (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs SN54HC251 . . . J O R W PACKAGE SN74HC251 . . . D OR N PACKAGE (TOP VIEW) D3 [ 1 021 2 D1[ 3 DO [ 4 Y[ 5 W[ 6 m 7 GND [ 8 u 16 15 14 13 12 1 1 10 9 ] ] ] j vcc D4 D5 D6 ] D7 ] A } B ]c , 125°C. The SN74HC251 is characterized for operation from -40°C to 85 °C. SN54HC251 . . . FK PACKAGE , DO D1 02 03 D4 D5 D6 D7 OUTPUTS W z 155 ÜT 02 D3 04 05 D6 D7 DO, D1 . . . D7 the level of the


OCR Scan
PDF SN54HC251, SN74HC251 SCLS132A HC151 300-mil SN54HC251 SN74HC251 Z155
1994 - Not Available

Abstract: No abstract text available
Text: 7 14 8 13 9 12 10 11 VCC O7 D7 D6 O6 O5 D5 D4 O4 CP CY54FCT374T . . . L PACKAGE (TOP VIEW) D1 O1 O2 D2 D3 O7 D OE O0 D0 D1 O1 O2 D2 D3 O3 , 11 12 13 D7 D6 O6 O5 D5 O3 GND CP O4 D4 D description The ’FCT374T devices are , (4/5) 5962-9221802M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg , 5962-9221804M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125


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PDF CY54FCT374T, CY74FCT374T SCCS022A CY54FCT374T
1982 - Not Available

Abstract: No abstract text available
Text: 6 7 8 3 2 1 20 19 18 17 16 15 14 9 10 11 12 13 D2 D3 NC VCC D4 D5 D6 NC D7 A NC ­ No internal , input logic symbol OE A B C D0 D1 D2 D3 D4 D5 D6 D7 7 11 10 9 4 3 2 1 15 14 13 12 2 0 1 2 3 4 5 6 7 , 9 D0 D1 4 TG 3 TG D2 2 TG 5 D3 1 TG Y D4 15 TG 6 D5 14 13 TG TG , Small-Outline (DB), and Ceramic Flat (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) DIPs SN54HC251 . . . J OR W PACKAGE SN74HC251 . . . D, DB, OR N PACKAGE (TOP VIEW) D3 D2


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PDF SN54HC251, SN74HC251 SCLS132C HC151 SN54HC251 SN74HC251 selectors/mu251DR SN74HC251N SN74HC251NSR SN74HC251PWR
1982 - Not Available

Abstract: No abstract text available
Text: 6 7 8 3 2 1 20 19 18 17 16 15 14 9 10 11 12 13 D2 D3 NC VCC D4 D5 D6 NC D7 A NC ­ No internal , input logic symbol OE A B C D0 D1 D2 D3 D4 D5 D6 D7 7 11 10 9 4 3 2 1 15 14 13 12 2 0 1 2 3 4 5 6 7 , 9 D0 D1 4 TG 3 TG D2 2 TG 5 D3 1 TG Y D4 15 TG 6 D5 14 13 TG TG , Small-Outline (DB), and Ceramic Flat (W) Packages, Ceramic Chip Carriers ( FK ), and Standard Plastic (N) and Ceramic (J) DIPs SN54HC251 . . . J OR W PACKAGE SN74HC251 . . . D, DB, OR N PACKAGE (TOP VIEW) D3 D2


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PDF SN54HC251, SN74HC251 SCLS132C HC151 SN54HC251 SN74HC251 SN74HC251, SZZU001B, SDYU001N, SCET004,
1982 - HC151

Abstract: SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
Text: Inverted Data D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE (TOP VIEW) D2 D3 NC VCC D4 description/ordering information These data selectors/multiplexers contain , D3 D4 TG 15 TG 6 D5 D6 D7 Y 1 14 W TG 13 TG 12 TG Pin , -state outputs. D1 D0 NC Y W 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13


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PDF SN54HC251, SN74HC251 SCLS132E HC151 SN54HC251 HC151 SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
1982 - HC251

Abstract: SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 HC151
Text: Inverted Data D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE (TOP VIEW) D2 D3 NC VCC D4 description/ordering information These data selectors/multiplexers contain , D3 D4 TG 15 TG 6 D5 D6 D7 Y 1 14 W TG 13 TG 12 TG Pin , -state outputs. D1 D0 NC Y W 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13


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PDF SN54HC251, SN74HC251 SCLS132E HC151 SN54HC251 HC251 SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 HC151
1982 - HC151

Abstract: SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
Text: Inverted Data D3 D2 D1 D0 Y W OE GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C SN54HC251 . . . FK PACKAGE (TOP VIEW) D2 D3 NC VCC D4 description/ordering information These data selectors/multiplexers contain , D3 D4 TG 15 TG 6 D5 D6 D7 Y 1 14 W TG 13 TG 12 TG Pin , -state outputs. D1 D0 NC Y W 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13


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PDF SN54HC251, SN74HC251 SCLS132E HC151 SN54HC251 HC151 SN74HC251NSR SN74HC251N SN74HC251DT SN74HC251DR SN74HC251DBR SN74HC251D SN74HC251 SN54HC251 SN74HC251PW
1982 - Not Available

Abstract: No abstract text available
Text: 6 7 8 3 2 1 20 19 18 17 16 15 14 9 10 11 12 13 D2 D3 NC VCC D4 D5 D6 NC D7 A NC ­ No internal , 4 TG 3 TG D2 2 TG 5 D3 1 TG Y D4 15 TG 6 D5 14 13 TG TG W D6 , Data SN54HC251 . . . J OR W PACKAGE SN74HC251 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) D3 D2 D1 D0 Y W OE GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC D4 D5 D6 D7 A B C description , TSSOP ­ PW CDIP ­ J ­55°C to 125°C CFP ­ W LCCC ­ FK PACKAGE Tube Tube Tape and reel Tape and reel Tape


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PDF SN54HC251, SN74HC251 SCLS132D HC151 SN54HC251 SN74HC251
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