The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
SCAN921821TSM Texas Instruments DUAL LINE DRIVER, PBGA100, FBGA-100
DLPC200ZEWT Texas Instruments SPECIALTY CONSUMER CIRCUIT, PBGA780, PLASTIC, FBGA-780
DLPC200 Texas Instruments SPECIALTY MICROPROCESSOR CIRCUIT, PBGA780, PLASTIC, FBGA-780
SN74GTLPH3245GKF Texas Instruments GTLP SERIES, QUAD 8-BIT TRANSCEIVER, TRUE OUTPUT, PBGA114, PLASTIC, FBGA-114
SN74ALVCH16373GRDR Texas Instruments ALVC/VCX/A SERIES, DUAL 8-BIT DRIVER, TRUE OUTPUT, PBGA54, PLASTIC, FBGA-54
SN74ALVCH32244GKE Texas Instruments ALVC/VCX/A SERIES, OCTAL 4-BIT DRIVER, TRUE OUTPUT, PBGA96, PLASTIC, FBGA-96

FBGA 17X17 DRAWING Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2002 - NP351-064-148

Abstract: NP351-18464 NP351-080-128 NP351 NP35 NP351-180-139 400X400 20890 NP351-11230 14422
Text: NP351 Series (Open Top) Fine Ball Grid Array ( FBGA , 0.80mm Pitch) Specifications Part Number , type sockets for FBGA packages í Self contacting structure without upper pressing force (ZIF) í , NOTICE ­ DIMENSIONS IN MILLIMETER NP351 Series (Open Top) Fine Ball Grid Array ( FBGA , 0.80mm Pitch , Test & Burn-In D-45 NP351 Series (Open Top) Fine Ball Grid Array ( FBGA , 0.80mm Pitch , 16x16 16x16 13x13 14x14 14x14 14x14 14x14 14x14 14x14 13x13 15x15 15x15 15x15 15x15 17x17


Original
PDF NP351 10mA/20mV CP351-30413-* NP351-30431-* NP351-43216-* NP351-52009-* NP351-532-83-* NP351-064-148 NP351-18464 NP351-080-128 NP35 NP351-180-139 400X400 20890 NP351-11230 14422
2006 - JESD51-9

Abstract: VFBGA package tray AN 7823 tfBGA PACKAGE thermal resistance TRAY 15X15 lfbga Encapsulation thermal resistance WFBGA vFBGA* 96 bALL JESD51-2 tray vfbga
Text: FBGA Fine Pitch Ball Grid Array · Array molded, cost effective, space saving package solution · , Pitch Ball Grid Array ( FBGA ) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package's reduced outline and , sets are available. STATS ChipPAC's FBGA is available in a broad range of JEDEC standard body sizes , Analog · ASIC · Memory · Simple PLDs · Others www.statschippac.com FBGA Fine Pitch Ball Grid


Original
PDF
2002 - UBGA49

Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
Text: FBGA 100 256 18x18 30x30 12x12 16x16 22x22 23x17 31x31 30x30 27x27 11x11 17x17 UBGA 49 , Available Now 100-Pin QFP 164 68 100-Pin FBGA (1.0 mm) 49-Pin UBGA (0.8 mm) 176 164 , 164 104 212 84 100 256-Pin FBGA (1.0 mm) Ultra FineLine BGA (U) EPM7064AE 36


Original
PDF 100-Pin EPM3512A 160-Pin EPM3256A EPM3128A EPM7256S EPM7192S EPM7160S EPM7064S EPM7128S UBGA49 EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
2006 - S71WS256PC0HH3

Abstract: S71WS512PD0HH3 SWM032D spansion date code marking TRAY FBGA 11X13 S71WS256PD0HH3 S71WS256PC0HH3YR SWM064D133S1R S71WS256PC0HF3
Text: Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning , PACKAGE TYPE H = 1.2 mm MCP FBGA K = 1.2 mm POP FBGA J = 1.4 mm MCP FBGA CellularRAM DENSITY D0 = 128 Mb , 9 A B D F G K H J K L M 14x14 mm 15x15 mm 15x15 mm 17x17 mm 17x17 mm 152 160 160 192 192 0.50 mm , Physical Dimensions TSB084- 84-ball Fine Pitch Ball Grid Array ( FBGA ) 8 x 11.6 mm Package D 0.15 C (2X


Original
PDF S71WS-P S71WS256PC0HH3 S71WS512PD0HH3 SWM032D spansion date code marking TRAY FBGA 11X13 S71WS256PD0HH3 S71WS256PC0HH3YR SWM064D133S1R S71WS256PC0HF3
2006 - S29WS256P

Abstract: S29WS-P S73WS-P
Text: DRAM-based solutions. 3.1.0.1 Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged , & MATERIAL SET HF = 1.2mm MCP FBGA , Pb-free KF = 1.2mm POP FBGA , Pb-free JF = 1.4mm MCP FBGA , 14x14 mm 152 0.50 mm J 15x15 mm 160 0.45 mm K K 160 0.50 mm 17x17 mm 192 0.45 mm M 4.1 15x15 mm L 17x17 mm 192 0.50 mm Valid Combinations Valid


Original
PDF S73WS-P S29WS256P S29WS-P
2006 - S71WS128PB0

Abstract: S71WS256PC0HH3YR0 S71WS512PD0HF3 H-EE 32 S71WS512PD0HH3 S71WS256 TRAY FBGA 11X13
Text: Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning , . MATERIAL SET F = Pb-free H = Low-Halogen, Pb-free PACKAGE TYPE H = 1.2 mm MCP FBGA K = 1.2 mm POP FBGA J = 1.4 mm MCP FBGA CellularRAM DENSITY D0 = 128 Mb C0 = 64 Mb B0 = 32 Mb PROCESS TECHNOLOGY P = 90 nm , Character 12 Character 14 0 1 2 3 4 H or J 5 6 7 8 9 A B D F G K H J K L M 14x14 mm 15x15 mm 15x15 mm 17x17


Original
PDF S71WS-P S71WS128PB0 S71WS256PC0HH3YR0 S71WS512PD0HF3 H-EE 32 S71WS512PD0HH3 S71WS256 TRAY FBGA 11X13
2006 - S71WS-P

Abstract: 66 ball nor flash S71WS128PC0 BGA Package 14x14 S29WS256P tray bga 17x17 S29WS-P spansion top marking S71WS256PC0 S71WS512PC0
Text: Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning , . PACKAGE TYPE & MATERIAL SET HF = 1.2 mm MCP FBGA , Pb-free KF = 1.2 mm POP FBGA , Pb-free JF = 1.4 mm MCP FBGA , Pb-free CellularRAM DENSITY D0 = 128 Mb C0 = 64 Mb PROCESS TECHNOLOGY P = 90 nm, MirrorBitTM , 152 0.50 mm 15x15 mm 160 0.45 mm K 15x15 mm 160 0.50 mm L 17x17 mm


Original
PDF S71WS-P 66 ball nor flash S71WS128PC0 BGA Package 14x14 S29WS256P tray bga 17x17 S29WS-P spansion top marking S71WS256PC0 S71WS512PC0
2006 - Not Available

Abstract: No abstract text available
Text: Shared Addresses A22-A0 A21-A0 3.1 Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be , Character 12. For a more detailed description see Table 4.1. PACKAGE TYPE & MATERIAL SET HF = 1.2mm MCP FBGA , Pb-free KF = 1.2mm POP FBGA , Pb-free JF = 1.4mm MCP FBGA , Pb-free CellularRAM DENSITY D0 = 128 Mb PROCESS , K H J K L M 14x14 mm 15x15 mm 15x15 mm 17x17 mm 17x17 mm 152 160 160 192 192 0.50 mm 0.45 mm 0.50 mm


Original
PDF S71WS-P
2006 - S71WS512PD0

Abstract: S29WS512P S29WS-P S71WS512PC0 S71WS512PC0HF3 S71WS512PD0HF3 S71WS-P
Text: A24-A22 A21-A0 Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed , FBGA , Pb-free KF = 1.2mm POP FBGA , Pb-free JF = 1.4mm MCP FBGA , Pb-free CellularRAM DENSITY D0 = , 15x15 mm 160 0.45 mm K K 160 0.50 mm 17x17 mm 192 0.45 mm M 4.1 15x15 mm L 17x17 mm 192 0.50 mm Valid Combinations Valid Combinations list


Original
PDF S71WS-P S71WS512PD0 S29WS512P S29WS-P S71WS512PC0 S71WS512PC0HF3 S71WS512PD0HF3
2006 - TRAY FBGA 11X13

Abstract: MCP NAND sDR S72MS512PE0HF94V S72MS-P BGA 15X15 137-Ball Spansion NAND Flash S30MS-P MCP nand dram 130 nand sdram mcp
Text: D-VSS D-VCC D-A3 D-A4 RY/BY# D-DQS1 Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA , Table 4.1. PACKAGE TYPE & MATERIAL SET HF = 1.2 mm MCP FBGA , Pb-free DRAM DENSITY F0 = 512 Mb DRAM , 17x17 mm 192 0.45 mm M 17x17 mm 192 0.50 mm K 4.1 Valid Combinations Valid , (Adva nce In for m ation) Physical Dimensions TLK137-137-ball Fine-Pitch Ball Grid Array ( FBGA


Original
PDF S72MS-P TRAY FBGA 11X13 MCP NAND sDR S72MS512PE0HF94V BGA 15X15 137-Ball Spansion NAND Flash S30MS-P MCP nand dram 130 nand sdram mcp
2006 - S30MS-P

Abstract: AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF S75WS-P UtRAM Density Spansion NAND Flash DIE MS512P
Text: Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning , SET HF = 1.2mm MCP FBGA , Pb-free KF = 1.2mm POP FBGA , Pb-free JF = 1.4mm MCP FBGA , Pb-free , 0.45 mm K 15x15 mm 160 0.50 mm L 17x17 mm 192 0.45 mm M 17x17 mm 192


Original
PDF S75WS-P S30MS-P S30MS-P AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF UtRAM Density Spansion NAND Flash DIE MS512P
2006 - BGA 130 MCP NAND DDR

Abstract: JEP95 130 MCP NAND DDR 137-Ball S72WS512PEF N-ADQ12 DSA00272754 Flash MCp nand DRAM 137-ball Flash MCp nand DRAM 107-ball S29WS-P
Text: For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package , description see Table 4.1. PACKAGE TYPE & MATERIAL SET HF = 1.2mm MCP FBGA , Pb-free KF = 1.2mm POP FBGA , Pb-free JF = 1.4mm MCP FBGA , Pb-free DRAM & ORNAND FLASH DENSITY D0 = 128 Mb DRAM, No Data Flash EF = , 0.50 mm J 15x15 mm 160 0.45 mm K K 160 0.50 mm 17x17 mm 192 0.45 mm


Original
PDF S72WS-P BGA 130 MCP NAND DDR JEP95 130 MCP NAND DDR 137-Ball S72WS512PEF N-ADQ12 DSA00272754 Flash MCp nand DRAM 137-ball Flash MCp nand DRAM 107-ball S29WS-P
2006 - S72WS512PFFJF9GH

Abstract: BGA 15X15 BGA 130 MCP NAND DDR 12X12 POP PACKAGE TRAY 15x15 bta 137 S72WS512PFFKFKGH N-ADQ14 NAND01
Text: nce I nfo r ma ti on ) 3.2.1.1 Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may , MATERIAL SET HF = 1.2mm MCP FBGA , Pb-free KF = 1.2mm POP FBGA , Pb-free JF = 1.4mm MCP FBGA , Pb-free DRAM & , K H J K L M 14x14 mm 15x15 mm 15x15 mm 17x17 mm 17x17 mm 152 160 160 192 192 0.50 mm 0.45 mm 0.50 mm , TLD137-137-ball Fine-Pitch Ball Grid Array ( FBGA ) 9 x 12.0 mm Package D 0.15 C (2X) 10 9 8 7 6 5 4


Original
PDF S72WS-P S72WS512PFFJF9GH BGA 15X15 BGA 130 MCP NAND DDR 12X12 POP PACKAGE TRAY 15x15 bta 137 S72WS512PFFKFKGH N-ADQ14 NAND01
2004 - Not Available

Abstract: No abstract text available
Text: : XPressArray-II Package Options Pins 256 FBGA 456 FBGA 484 FBGA 575 PBGA 672 FBGA 672 PBGA 672 FFBGA 676 FBGA 724 PBGA 728 PBGA 780 FBGA 896 FFBGA 956 PBGA 957 BFBGA 1020 FBGA 1148 FFBGA 1152 FFBGA 1508 FBGA 1517 FFBGA 1696 FFBGA 1704 FFBGA Description 256 Fine Pitch Ball Grid Array 456 Fine , synthesis libraries for leading Size (mm) 17x17 23x23 23x23 31x31 27x27 35x35 27x27 27x27 35x35


Original
PDF 210MHz PCI33, PCI66, X2P680 X2P846
2004 - ra1613

Abstract: FB360 HSTL18 XC3S200-ft256 ra16 compiler PCI33 FG25 FB270 BGA 728 35x35 1.27 b956
Text: Package Options Pins 256 FBGA 456 FBGA 484 FBGA 575 PBGA 672 FBGA 672 PBGA 672 FFBGA 676 FBGA 724 PBGA 728 PBGA 780 FBGA 896 FFBGA 956 PBGA 957 BFBGA 1020 FBGA 1148 FFBGA 1152 FFBGA 1508 FBGA 1517 FFBGA 1696 FFBGA 1704 FFBGA Description 256 Fine Pitch Ball Grid Array 456 Fine Pitch , (mm) 17x17 23x23 23x23 31x31 27x27 35x35 27x27 27x27 35x35 35x35 29x29 31x31 40x40 40x40


Original
PDF 210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC3S200-ft256 ra16 compiler PCI33 FG25 FB270 BGA 728 35x35 1.27 b956
2010 - AGL125-QNG132

Abstract: FLASHPRO4 A2F500M3G A2F500M3G-FGG484 oled display 96x16 BGA A3P1000 144 VQ100 A2F500 A3PE jtag connector emmc socket
Text: QN48 QN68 QN132 VQ100 QN68 IGLOO VQFP FBGA 400,000 AGL600 M1AGL600 M1AGL250 , Pins QFN CS VQFP TQFP PQFP FBGA VQ100 CS121 VQ100 2 TQ144 FG144 2 PQ208 FG144 2 , (packaged device) Package Pins VQFP PQFP FBGA P ro A S I C 3 Note: * AES is not available for , 14x14 VQ100 0.50 14x14 VQ128 0.40 17x17 FG256 1.00 178/38 177/43 177/44 , Fusion1, 3, 4 p s 17x17 mm h 1.60 mm p 1.00 mm f 0.75 mm 0.50 mm QN132 f IGLOO ProASIC3 p


Original
PDF
2009 - emmc pcb layout

Abstract: flashpro3 schematic oled display 96x16 fpga JTAG Programmer Schematics microcontroller based temperature control fan avr M1A3PL-DEV-KIT actel smart fusion silicon sculptor 3 A3P060 96x16
Text: QN68 QN132 VQ100 QN68 VQFP FBGA IGLOO 384 Flash*Freeze Mode (typical, µW) Notes , Package Pins QFN P ro A S I C 3 CS VQFP TQFP PQFP FBGA VQ100 CS121 VQ100 2 TQ144 FG144 , 3 Package Pins VQFP PQFP FBGA Note: * AES is not available for Cortex-M1 ProASIC3L devices , 0.40 17x17 FG256 1.00 19x19 FG324 1.00 20x20 TQ144 0.50 20x20 VQ176 , ProASIC3E 2 ProASIC3L1 Fusion1, 3, 4 p s 17x17 mm h 1.60 mm p 1.00 mm f QN132 f IGLOO ProASIC3


Original
PDF
2010 - emmc pcb layout

Abstract: oled display 96x16 fpga JTAG Programmer Schematics FLASHPRO4 ACTEL flashpro A3PE1500-PQ208 A2F200M3F-FGG484 A3PE-BRD1500 A2F500 96x16 oled
Text: VQFP FBGA 400,000 AGL600 M1AGL600 M1AGL250 600,000 3,000,000 Notes: 1. AES is not , FG324 FG484 FG896 Package Pins QFN CS VQFP TQFP PQFP FBGA VQ100 CS121 VQ100 2 TQ144 , (packaged device) Package Pins VQFP PQFP FBGA P ro A S I C 3 Note: * AES is not available for , 0.80 14x14 VQ100 0.50 14x14 VQ128 0.40 17x17 FG256 1.00 178/38 177/43 , ProASIC3E 2 ProASIC3L1 SmartFusion Fusion1, 3, 4 p s 17x17 mm h 1.60 mm p 1.00 mm f QN132 f


Original
PDF
2000 - CY39100V484-125BBI

Abstract: "Single-Port RAM" delta39k
Text: Inputs Self-Boot Solution[3] 208-EQFP 144- FBGA 256- FBGA Device 39K15 39K30 39K50 39K100 39K165 39K200 39K250 39K350 28X28 mm 0.5-mm pitch 13x13 mm 1.0-mm pitch 17x17 mm 1.0-mm pitch 484- FBGA 676- FBGA 23x23 mm 1.0-mm pitch 27x27 mm 1.0-mm pitch 256- FBGA 17x17 mm 1.0-mm pitch 388-BGA 35x35 mm 1.27 , /pinout offering across all densities - 144 to 676 pins in PQFP, BGA and FBGA packages - Same pinout for , and FBGA packages ·In-System ReprogrammableTM (ISRTM) - JTAG-compliant on-board programming - Design


Original
PDF Delta39KTM CY39100V484-125BBI "Single-Port RAM" delta39k
2009 - fbga Substrate design guidelines

Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 pcb thermal Design guide pcb trace fbga PCB footprint fine BGA thermal profile CS81 UC81 thermal pcb guidelines
Text: Grid Array Package ( FBGA )". This application note provides general guidelines for proper board design , Lower Layer) EIA Standard Board Layout Drawing for BGA and CCGA Packages Figure 27 · Suggested , Perimeter Perimeter Full Pad Matrix 7x7 12x12 14x14 17x17 - 4 5 -


Original
PDF AC243 fbga Substrate design guidelines CS281 ACTEL FBGA PACKAGE DRAWING AC243 pcb thermal Design guide pcb trace fbga PCB footprint fine BGA thermal profile CS81 UC81 thermal pcb guidelines
2011 - RTAX2000S

Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing CQ352 to FG896 Adapter Socket Outline Drawing . . . . CQ256 to FG896 Adapter Socket Outline Drawing . . . . CQ352 , . . . . . . . . . . . . . CQFP to FBGA Adapter Pin Mapping List . . . . . . . . Prototyped Product


Original
PDF AC274 CQ352 FG484 23x23 FG896 CQ256 RTAX2000S RTAX2000 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
2012 - AX2000-CQ256

Abstract: RTAX2000S-CQ352
Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing CQ352 to FG896 Adapter Socket Outline Drawing . . . . CQ256 to FG896 Adapter Socket Outline Drawing . . . , FG484 (23x23) Adapter Socket Outline Drawing (unit: mm) 11 CQFP to FBGA Adapter Sockets CQ352


Original
PDF AC274 CQ352 FG484 23x23 FG896 CQ256 AX2000-CQ256 RTAX2000S-CQ352
2009 - RTAX2000S-CQ352

Abstract: RTAX2000S RTAX2000S-CQ256 RTAX2000 SK-AX2-CQ256-KITBTM RTAX2000SL-1 SK-AX2000-CQ352RTFG896 CQ352 FG896 RTAX1000S-CQ352
Text: Application Note AC274 CQFP to FBGA Adapter Sockets Introduction RTAX-S/SL is Actel's next , packaged in CQFP or CCGA, using the Axcelerator family Fine Pitch Ball Grid Array ( FBGA ) or Ceramic Land Grid Array (LGA) as a prototyping vehicle: · CQFP to FBGA adapter socket · CQFP to LGA adapter socket · CCGA to FBGA adapter socket · CCGA to LGA adapter socket This document , RTAX2000S also applies to RTAX2000S-1, RTAX2000SL, and RTAX2000SL-1. CQFP to FBGA Adapter Sockets The


Original
PDF AC274 RTAX2000S-CQ352 RTAX2000S RTAX2000S-CQ256 RTAX2000 SK-AX2-CQ256-KITBTM RTAX2000SL-1 SK-AX2000-CQ352RTFG896 CQ352 FG896 RTAX1000S-CQ352
2004 - actel FG484 package mechanical drawing

Abstract: RTAX2000S-CQ352 actel package mechanical drawing FG484 2-CQFP CQ352 SK-AX2000-CQ352RTFG896 SK-AX250-CQ352RTFG484S FG896 rtax2000* cqfp
Text: ) Figure 12: CQ352 to FG484 Adapter Socket Outline Drawing CQFP to FBGA Adapter Sockets 11 CQ352 , (Unit: mm) Figure 13: CQ352 to FG896 Adapter Socket Outline Drawing 12 CQFP to FBGA Adapter , . . . . . . . . . 3 CQFP to FBGA Adapter Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 CQFP to FBGA Adapter Socket Configurations , Adapter Socket Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Original
PDF CQ352 FG484 actel FG484 package mechanical drawing RTAX2000S-CQ352 actel package mechanical drawing 2-CQFP SK-AX2000-CQ352RTFG896 SK-AX250-CQ352RTFG484S FG896 rtax2000* cqfp
2000 - CY39200V

Abstract: No abstract text available
Text: Inputs Self-Boot Solution[3] 208-EQFP 144- FBGA 256- FBGA Device 39K15 39K30 39K50 39K100 39K165 39K200 39K250 39K350 28X28 mm 0.5-mm pitch 13x13 mm 1.0-mm pitch 17x17 mm 1.0-mm pitch 484- FBGA 676- FBGA 23x23 mm 1.0-mm pitch 27x27 mm 1.0-mm pitch 256- FBGA 17x17 mm 1.0-mm pitch 388-BGA 35x35 mm 1.27 , /pinout offering across all densities - 144 to 676 pins in PQFP, BGA and FBGA packages - Same pinout for , and FBGA packages ·In-System ReprogrammableTM (ISRTM) - JTAG-compliant on-board programming - Design


Original
PDF Delta39KTM NT208 51-85069-B 388-Lead MG388 256-Ball BB256/MB256 1-85108-A CY39200V
Supplyframe Tracking Pixel