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PCN0504

Abstract: EME-G700 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon
Text: PROCESS CHANGE NOTICE PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND FOR QFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound in Altera's quad flat , currently using Nitto's MP8000 series and Sumitomo's EME-6300HJ series will be standardized on the EME-G700 , affect the form, fit or function of the devices. Reason for Change: EME-G700 series mold compound is , implemented in the mid September 2005 timeframe. Customers may receive products molded with EME-G700 series


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PDF PCN0504 EME-G700 MP8000 EME-6300HJ EPF8452A, EPF8636A, EPF8820A, PCN0504 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon
PCN0414

Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
Text: PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera's Thin Quad Flat Pack (TQFP) packages. All TQFP packages assembled at Amkor Korea and , packages, the Sumikon EME-G700 series mold compound provides better yield and reliability performance , receive product molded with EME-G700 series mold compound beginning with top mark date code of 0507 or


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PDF PCN0414 EME-G700 PCN0414 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
2011 - Not Available

Abstract: No abstract text available
Text: to EME-G700 Dear Customer: This is an announcement of change(s) to products that are currently , Qualify Silan as an Additional FAB Source and consolidate the mold compound to EME-G700 (Green , compound for the AP1084D33L13 and AP1084K33L-13 to EME-G700 . AP1084D33G-13 and AP1084K33G-13 already use the EME-G700 mold compound. Full electrical characterization and high reliability testing have been


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PDF EME-G700 AP1084D33L-13 AP1084D33G-13 AP1084K33L-13 AP1084K33G-13 DIC-034
JEDEC JESD22-B116 free

Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
Text: Assembly Process Equipment IDT has qualified the TSOP package family using new mold compound EME-G700 , Change: Detail Of Change: To qualify new mold compound EME-G700 and die attach 3230 material. None , 7320CR Sumitomo EME-G700 series The list of the products effected are as follows: 71016S12PH , 3 of 8 EME-G700 SUMITOMO BAKELITE SUMIKON MULTI-AROMATIC RESIN Br/Sb FREE FOR Pb FREE PKG LOW WATER ABSORPTION EME-G700 TYPICAL PROPERTIES: ITEM TEST METHOD UNIT SPIRAL


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PDF SR-0212-02 EME-G700 JEDEC JESD22-B116 free SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
CRM1076

Abstract: BFG64 ablestik 8360 ICS8430EY EME-G700 Transistor BC 1078 IDT82V2058XDA Compound EME-G700 CRM1525D IDT75N43102S50BCG
Text: : EME-G700 7320/7351T Lead Frame: Copper Alloy Plating: Sn/Pb (standard) and matte 100% Sn (green products) Add ASAT-China Die Attach: Ablestik A2200 Same Mold Compound: EME-G700 Same Same , 84-1LMISR4, CRM1076, 8390, 8360 Wire: 1.0/1.3mil Au Mold Compound: EME-G700 /6600, MP800, 7320 Lead Frame , Attach: Ablestik A2200 Same Mold Compound: EME-G700 Same Same Integrated Device Technology, Inc


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PDF A0610-02 16-Oct-2006 16-Jan-2007 Waf39FA MPC92469AC MPC92469FA MPC930FA MPC9315AC MPC9315FA MPC9330AC CRM1076 BFG64 ablestik 8360 ICS8430EY EME-G700 Transistor BC 1078 IDT82V2058XDA Compound EME-G700 CRM1525D IDT75N43102S50BCG
EN4900GC

Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Text: 98.5Sn/1.0Ag/0.5Cu, 0.46mm QFN Mold Compound Hitachi CEL9220HF10 Sumikon EME-G700 QFN Die Attach


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PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
2004 - EME-G700

Abstract: EME-G700 datasheet G600 mold compound EME G600 G600 kb-04 7140P EMEG700 G9911-05 Compound EME-G700
Text: compound EME-G700 series 66 KB 03/20/2003 PCN# G-0206-08, Orientation of square PQFP & TQFP 151


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PDF 59628687509XA 59628687509YA G9911-05, 7140J 7140P 7140PF EME-G700 EME-G700 datasheet G600 mold compound EME G600 G600 kb-04 EMEG700 G9911-05 Compound EME-G700
2004 - EME-G700

Abstract: EME-G700 datasheet kb-04 A-0410-02 LCC 48 Compound EME-G700
Text: Ablestik 151 KB 03/20/2003 PCN#G-0302-05, New mold compound EME-G700 series 66 KB 03/20/2003


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PDF 59628687509YA 59628687510YA G9911-05, 7140J 7140P 7140PF EME-G700 EME-G700 datasheet kb-04 A-0410-02 LCC 48 Compound EME-G700
ablestik 8390

Abstract: SUMItomo EME-G700 JESD22-B107C EME-G700 SUMITOMO EME G700 IDT72V3672L15PQFI EME-G700 datasheet KMC-184 SUMITOMO G700 Sumitomo EME-G700 material
Text: , DZ128 PU208, PQ132 Shintsu KMC-184 series Sumitomo EME-G700 series Die Attach Material


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PDF PL15PQF IDT723672L12PQF IDT723672L15PQF IDT72V3611L12PQF IDT72V3611L15PQF IDT72V3611L20PQF IDT72V3612L12PQF IDT72V3612L15PQF IDT72V3612L20PQF IDT72V3613L12PQF ablestik 8390 SUMItomo EME-G700 JESD22-B107C EME-G700 SUMITOMO EME G700 IDT72V3672L15PQFI EME-G700 datasheet KMC-184 SUMITOMO G700 Sumitomo EME-G700 material
2004 - EME-G700

Abstract: EMEG700 7130PF 5962-8687508Xa 7130 EME G600 EME-G700 datasheet kb-04 G9911-05 7130P
Text: compound EME-G700 series 66 KB 03/20/2003 PCN# G-0206-08, Orientation of square PQFP & TQFP 151


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PDF 59628687501XA 59628687501YA n1/18/1999 7130TF 7130P 7130J 7130PF EME-G700 EMEG700 5962-8687508Xa 7130 EME G600 EME-G700 datasheet kb-04 G9911-05
ics633m

Abstract: ICS9112BM-17 EME-G700 EME-G600 ICS9155C-02CW20 ICS9170-01CS08 ics5342-3 EMEG700 qmi519 ICS405M
Text: Same Mold Compound: EME-G700 Plating: Sn/Pb Assembly Materials Die Attach: Ablestik A2200 , Die Attach: Ablestik A2200 Same Mold Compound: EME-G600 Mold Compound: EME-G700 Lead Frame


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PDF 29-Sep-2006 mil/300 29-Dec-2006 CHANGK3727S MPC962305D-1H MK2059-01SI MK3732-10S MPC962308D-1 MK2302S-01 MK3732-17S ics633m ICS9112BM-17 EME-G700 EME-G600 ICS9155C-02CW20 ICS9170-01CS08 ics5342-3 EMEG700 qmi519 ICS405M
IDT82V1671AJ

Abstract: EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b
Text: Au (Wire), Ablestik 8290 (DA), 1.0mil Au EMEG700 (green EMC), Copper (Wire), EME-G700 (EMC


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PDF 21-Mar-2006 19-Jun-2006 IDTCV169NLG IDTCV170PAG IDTCV171NLG IDTCV174PAG IDTCV175PAG IDTNW1506AL IDTQS3VH16210PA IDTQS3VH16210PAG IDT82V1671AJ EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b
IDT70V28L20PFGI

Abstract: IDT72V36110L7-5PFG idt5t93gl161pfi IDT7024L35PFI IDT7024L15PFGI IDT71321LA20PFG IDT71V321L55TFG IDT72V36110L15PFG IDT70V22L20PF IDT70V25L25PFGI
Text: Attach: Ablestik 2200 Wire: 1.0/1.3mil Au Mold Compound: EME-G700 Lead Frame: Copper Alloy Plating , Assembly Material Die Attach: Ablestik 2200 Wire: 1.0/1.3mil Au Mold Compound: EME-G700 Lead Frame


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PDF A0603-04 1L10TF IDT72V851L15PF IDT72V851L15PFI IDT72V851L15TF IDT72V851L15TFI IDT72V851L20PF IDT72V851L20TF IDT72V90823PF IDT72V90823PFG IDT70V28L20PFGI IDT72V36110L7-5PFG idt5t93gl161pfi IDT7024L35PFI IDT7024L15PFGI IDT71321LA20PFG IDT71V321L55TFG IDT72V36110L15PFG IDT70V22L20PF IDT70V25L25PFGI
en4900g

Abstract: EME-G600 71V3558X EN4900 EME-G700 7024S55PFG CRM1076 70261S55PFI 72v2111l15pfgi EN-4900
Text: wire Mold Compound: EME-G700 series, EME-S320CR Mold Compound: EME-G700 series, EME-G600


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PDF A0811-01 26-Mar-2009 26-Jun-2009 CHANG2P9731PFG8 82P9732PF 82P9732PF8 82P9732PFG 82P9732PFG8 82V1054APF 82V1054APF8 en4900g EME-G600 71V3558X EN4900 EME-G700 7024S55PFG CRM1076 70261S55PFI 72v2111l15pfgi EN-4900
2003 - marking "wx2"

Abstract: No abstract text available
Text: No file text available


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PDF 36-BIT IDT72V36100 IDT72V36110 IDT72V36100 d/a-2300 F0301-02: G-0302-05, EME-G700 G-0302-06, marking "wx2"
2005 - marking b28

Abstract: 72v3672l 72V3672
Text: No file text available


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PDF IDT72V3652 IDT72V3662 IDT72V3672 IDT72V3652 IDT72V3662 100MHz G9911-05, G-0302-06, G-0302-05, marking b28 72v3672l 72V3672
2007 - tle5010

Abstract: power factor correction circuit diagram for Olin EME-G700 EME-G700 datasheet sd 7402 Bz 5010 T-40 001H J1850 T150
Text: No file text available


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PDF TLE5010 HLGM1227 tle5010 power factor correction circuit diagram for Olin EME-G700 EME-G700 datasheet sd 7402 Bz 5010 T-40 001H J1850 T150
2007 - cordic calculator

Abstract: TLE5011
Text: No file text available


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PDF TLE5011 HLGM1227 cordic calculator TLE5011
2013 - EME-G700A

Abstract: No abstract text available
Text: Report on Green BGA Package Item Component Mold Compound Cd EME-G700A Cr+6 Hg Pb PBB PBDE Epoxy , Component Mold Compound Cd EME-G700A Cr+6 Hg Pb PBB PBDE Epoxy Cd Ablebond 2288A Cr+6 Hg Pb PBB


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PDF
8361J

Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
Text: Amkor, Korea Sumitomo EME-G700L Ablestik 3230 Cu 194 85/15 Sn/Pb 1.0 mil Au Ink Assembly SubCon


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PDF CX28392-25 CX28394-25 CX28342-11 CX28343-11 CX28344-11 R6786-24 28XXX-PCN-002-A 8361J mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
EME-G700LX

Abstract: eme-g700l Q14939 6600CGL
Text: ) Mold Compound from Sumitomo EME 6600CGL to Sumitomo EME-G700LX (Form) Die Attach from LMIS 84-1LMISR4


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PDF PCN1007 HI-3182, HI-3183, HI-8685, HI-8685-10 6600CGL EME-G700LX 84-1LMISR4 QMI-519 JESD46-C, EME-G700LX eme-g700l Q14939
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