The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
DMG7702SFG-7 Diodes Incorporated Small Signal Field-Effect Transistor, 9.5A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, POWERDI3333-8, 8 PIN
DMG7702SFG-13 Diodes Incorporated Small Signal Field-Effect Transistor, 9.5A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, POWERDI3333-8, 8 PIN
SG-770SCD 75.0000M-L3 Seiko Epson Corporation OSC XO 75.000MHZ LVPECL SMD
SG-770SCD 156.2500M-L3 Seiko Epson Corporation OSC XO 156.25MHZ LVPECL SMD
SG-770SCD 212.5000M-L3 Seiko Epson Corporation OSC XO 212.5MHZ LVPECL SMD
SG-770SCD 106.2500M-L3 Seiko Epson Corporation OSC XO 106.25MHZ LVPECL SMD

EME-G770 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
EME-G770

Abstract: KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX
Text: mil, 0.8 mil, 0.9 mil Mold Compound: EME-G770 , GE100LFCS, EME-G770 Substrate:BT Resin HL832NX


Original
PDF A0911-02R1 18-Dec-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG EME-G770 KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX
PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Text: Appendix 3 Material Properties for the Sumitomo EME-G770 series Mold Compound Material Properties Epoxy , Sumitomo EME-G770 series MAR/Low vis. MAR/Tough 88.5 100/0 55 13 Modified Modified Type B


Original
PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
AUS308

Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 AUS308 thermal PSR4000
Text: PSR-4000 AUS308 2100 2100 EME-G770 CEL9750HF10 The following tables detail the changes to each , Current Material Sumitomo EME-G770 Multiaromatic/ biphenyl Confidential Mult-aromatic/tough


Original
PDF CX2751x-12 CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. CX2751x-12, CX2751xG-12, 2751x-PCN-001-A AUS308 PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 AUS308 thermal PSR4000
KE-G1250

Abstract: AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG
Text: Compound: EME-G770 , KE-G1250 GE100LFCS Substrate:BT Resin HL832NX, BT Resin HL832NX, AUS308 AUS308


Original
PDF A0911-02 20-Nov-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG KE-G1250 AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG
IDT82V1671AJ

Abstract: EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 ablestik 8390 IDT7025S35JI JESD22-B100-b CRM1076
Text: AIT-Batam, Indonesia Assembly Material Ablestik 2200 (DA), 1.0mil Au (Wire), EME-G770 (EMC), Copper , ), 1.0mil Au (Wire), EME-G770 (EMC), Copper leadframe, Sn/Pb plating (standard package) and matte 100% Sn , ) Ablestik 2300 (DA), 1.0mil Au (Wire), EME-G770 (EMC), Sn/Pb solder balls for standard package and Sn/Ag


Original
PDF 21-Mar-2006 19-Jun-2006 IDTCV169NLG IDTCV170PAG IDTCV171NLG IDTCV174PAG IDTCV175PAG IDTNW1506AL IDTQS3VH16210PA IDTQS3VH16210PAG IDT82V1671AJ EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 ablestik 8390 IDT7025S35JI JESD22-B100-b CRM1076
KEG1250LKDS

Abstract: KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 2025D Ablestik EME-G770 eme-g770lc
Text: mil Assembly Materials Mold Compound: EME-G770 , Kyocera KE-G1250TC, GE100LFCS, EME-G770LC


Original
PDF A1004-02 3-Jun-2010 FPBGA-176 3-Sep-2010 JESD22-A118 JESD22-A104 JESD22-A103 JESD22-A113 SSTE32882HLBAKG KEG1250LKDS KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 2025D Ablestik EME-G770 eme-g770lc
sumitomo g760

Abstract: sumitomo EME G760 SUMITOMO EME G770 IDT75N43102S50BCG KMC-3580 IDT75N414S125BC EME-G770 IDT70T653MS12BCG IDT70V3599S133BCGI JESD22-B116
Text: -272/416 27x27mm Sample Availability: Existing Add Sumitomo EME-G770 /G760 series, Toshiba


Original
PDF 25-Aug-06 CABGA-256 17x17mm, CVBGA-52/56 FPBGA-96 FPBGA-208 15x15mm, PBGA-119 22x14mm, PBGA-272/416 sumitomo g760 sumitomo EME G760 SUMITOMO EME G770 IDT75N43102S50BCG KMC-3580 IDT75N414S125BC EME-G770 IDT70T653MS12BCG IDT70V3599S133BCGI JESD22-B116
CRM1076

Abstract: BFG64 ablestik 8360 ICS8430EY EME-G700 IDT82V2058XDA Transistor BC 1078 Compound EME-G700 CRM1525D IDT75N43102S50BCG
Text: : CRM1525D Wire: 1.0mil Au Same Mold Compound: EME-G770 /G760 Mold Compound: KMC2520AL Substrate: BT


Original
PDF A0610-02 16-Oct-2006 16-Jan-2007 Waf39FA MPC92469AC MPC92469FA MPC930FA MPC9315AC MPC9315FA MPC9330AC CRM1076 BFG64 ablestik 8360 ICS8430EY EME-G700 IDT82V2058XDA Transistor BC 1078 Compound EME-G700 CRM1525D IDT75N43102S50BCG
CV-8710

Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
Text: No file text available


Original
PDF JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
2009 - eme-g770h

Abstract: No abstract text available
Text: Compound (Sumitomo Bakelite GREEN EME-G770H ) Filler Epoxy Resin-1 Trade Secret 2-5 1.475


Original
PDF PS-ISZ-0650B-00-04 ISZ-650 ISZ-650TM eme-g770h
2009 - eme-g770h

Abstract: No abstract text available
Text: Compound (Sumitomo Bakelite GREEN EME-G770H ) Filler Epoxy Resin-1 Trade Secret 2-5 1.475


Original
PDF PS-ISZ-1215B-00-04 ISZ-1215 ISZ-1215TM eme-g770h
2009 - Compound EME-G770H

Abstract: eme-g770 EME-G770H ISZ50 Sumitomo EME-G770H 2025D mems gyroscope PS-ISZ-0500B-00-06 isz500 JEDEC J-STD-020d.01
Text: GREEN EME-G770H ) Filler Epoxy Resin-1 Trade Secret 2-5 1.475 Filler Epoxy Resin


Original
PDF PS-ISZ-0500B-00-06 ISZ-500 ISZ-500 Compound EME-G770H eme-g770 EME-G770H ISZ50 Sumitomo EME-G770H 2025D mems gyroscope PS-ISZ-0500B-00-06 isz500 JEDEC J-STD-020d.01
2009 - eme-g770

Abstract: No abstract text available
Text: Compound (Sumitomo Bakelite GREEN EME-G770H ) Filler Epoxy Resin-1 Trade Secret 2-5 1.475


Original
PDF PS-ISZ-0650B-00-03 ISZ-650 ISZ-650TM eme-g770
2009 - Sumitomo EME-G770H

Abstract: Compound EME-G770H eme-g770h
Text: Compound (Sumitomo Bakelite GREEN EME-G770H ) Filler Epoxy Resin-1 Trade Secret 2-5 1.475


Original
PDF PS-ISZ-0500B-00-04 ISZ-500 ISZ-500TM Sumitomo EME-G770H Compound EME-G770H eme-g770h
2013 - EME-G700A

Abstract: No abstract text available
Text: Epoxy Substrate Lead Finish PQFP Sumitomo EME-G770J Ablebond 2288A - 100% Sn BGA Sumitomo EME-G770J Ablebond 2100A BT Resin Sn-4%Ag-0.5%Cu LOGIC Devices


Original
PDF
2009 - Compound EME-G770H

Abstract: Sumitomo EME-G770H eme-g770h 2025D ablebond 2025D MEMS Gyroscope C7025AG EME-G770 Trimethylated silica JESD22A108
Text: 069013-23-6 1-5 0.023 Mold Compound (Sumitomo Bakelite GREEN EME-G770H ) Filler Epoxy Resin


Original
PDF PS-ISZ-1215B-00-05 ISZ-1215 ISZ-1215 Compound EME-G770H Sumitomo EME-G770H eme-g770h 2025D ablebond 2025D MEMS Gyroscope C7025AG EME-G770 Trimethylated silica JESD22A108
2012 - EnerChip Standards Compliance and Use Procedures

Abstract: PI-72-04 medical IEC62133
Text: Sumitomo Bakelite EME-G770H. The remainder is the bare die, gold wire. A lead frame made of nickel


Original
PDF PI-72-04 PI-72-04 EnerChip Standards Compliance and Use Procedures medical IEC62133
2009 - ISZ-650

Abstract: eme-g770h EME-G770 gyro isz650 JESD22-A104D ISZ 650 JESD22-A101C Compound EME-G770H Trimethylated silica
Text: GREEN EME-G770H ) Filler Epoxy Resin-1 Trade Secret 2-5 1.475 Filler Epoxy Resin


Original
PDF PS-ISZ-0650B-00-05 ISZ-650 ISZ-650 eme-g770h EME-G770 gyro isz650 JESD22-A104D ISZ 650 JESD22-A101C Compound EME-G770H Trimethylated silica
2009 - Not Available

Abstract: No abstract text available
Text: Compound (Sumitomo Bakelite GREEN EME-G770H ) Filler Epoxy Resin-1 Trade Secret 2-5 1.475


Original
PDF PS-ISZ-0500B-00-03 ISZ-500 ISZ-500
Compound EME-G770H

Abstract: EME-G770H QFN 8 CARSEM ICS85354AK ICS9LPR309AKLF ICS954226 ICS9LPR321BKLF QMI519 ICS9LPR311AKLF ICS954305EKLF
Text: Assembly Site: CARSEM Suzhou Mold Compound: Die Attach: Leadframe: Wire: Quantity: EME-G770H


Original
PDF ICS97ULP878BK ICS9LPRS228BKLF ICS954305DKLF ICS570BK ICS9FG110AK ICS97ULP878BKLF ICS9LPRS228CKLF ICS954305EKLF ICS8535AK-01 ICS853111BK Compound EME-G770H EME-G770H QFN 8 CARSEM ICS85354AK ICS9LPR309AKLF ICS954226 ICS9LPR321BKLF QMI519 ICS9LPR311AKLF ICS954305EKLF
Supplyframe Tracking Pixel