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Top Results (2)

Part ECAD Model Manufacturer Description Datasheet Download Buy Part
RJE01G6002 RJE01G6002 ECAD Model Amphenol Communications Solutions Modular Jack - Right Angle, Input Output Connectors 6P6C, Without Shield.
RJE01G6001 RJE01G6001 ECAD Model Amphenol Communications Solutions Modular Jack - Right Angle, Input Output Connectors 6P6C, Without Shield.

EME G600 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
SUMITOMO EME G600

Abstract: EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
Text: thickness from 1.4 mm, LQFP to 1.0 mm, TQFP (Fit) Mold Compound from Sumitomo EME 7351LS, LQFP to Sumitomo EME G600 , TQFP (Form) Ink marking to Laser Marking (Form) Moisture Sensitivity Level rating from 1 to


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PDF 64-Lead 32-Lead PCN0809 7351LS, JESD46-C, QR-8036 SUMITOMO EME G600 EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
ablebond 84-3J

Abstract: SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151
Text: Sumitomo EME 6600CGL 252 mils x 252 mils Q14939 Ablebond 84-3J Slug 205 mils x 290 mils Gold 1.20 mils Cu w , Sumitomo G600 225 mils x 310 mils NA Ablestik 8006NS Exposed Pad 205 mils x 290 mils Gold 1.20 mils Cu w/Ag


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PDF MIL-STD-1553 PCN1201 20L-SOIC ablebond 84-3J SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151
sumitomo

Abstract: en4065 SUMITOMO eme 5274A 50C24 hitachi trace code hitachi assembly date code Sumitomo 1000 SN74FB1650 SN74FB1651
Text: -4065 Hitachi EN-4065 Hitachi EN-4065 Hitachi EN-4065 Hitachi EN-4065 Hitachi EN-4065 Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Advanced System Logic 2 TEXAS INSTRUMENTS Notification , Assembly/Test Information Assembly Site HIJI Mold Sumitomo EME -7300G Mount Comp Hitachi EN-4065 Bond


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1996 - en4065

Abstract: EN-4065 SUMITOMO eme Sumitomo 1000 SN74FB1650 SN74FB1651 TNETA1611 TEXAS INSTRUMENTS, Mold Compound sumitomo hitachi en 4065
Text: -4065 Hitachi EN-4065 Hitachi EN-4065 Hitachi EN-4065 Hitachi EN-4065 Hitachi EN-4065 Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G TABLE 2: Test Device List PIN COUNT/ PACKAGE 100 Pin PCA 120


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EME 7320

Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
Text: Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, (TQFP) ASE Taiwan CYPRESS TECHNICAL , Compound: Sumitomo EME 7320 Assembly: ASE Taiwan TAIWN-G) QTP # 002403 V, 1.0 Page 2 of 8 January , Comp. 000303 Qualify EME 7320 Molding Compound, 160-lead TQFP Package at TAIWN-G for CPLD Feb 00 002403 Qualify EME 7320 Molding Compound, TQFP Package at TAIWN-G for DCD- Nov 00 Cypress Semiconductor Package: Thin Quad Flat Pack (TQFP) Molding Compound: Sumitomo EME 7320 Assembly


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PDF 160-lead CY7C375I-AC EME 7320 Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
2000 - Not Available

Abstract: No abstract text available
Text: . 9. Simple construction. EME -1061C EME -2061C EMF-2061C !SPECIFICATIONS Part Number EME , spectroscopy. residual gas analysis UV spectroscopy. NO EME -2061C YES EMF-2061C YES !DIMENSIONS 38 38 8.5 80 10 EME -1061C 30 H.V. (Output) 10 Collector F.P.+D.E. 33.0 50 max. ø10 Collector H.V. (Input) ø3.2 30 EME -2061C 10 ø10 10 38 , pressure) ¡Typical gain vs. voltage characteristics 106 EME , EMF-type Gain 105 104


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PDF S06E-2. S06E2 EME-1061C EME-2061C EMF-2061C
MTCP-122-20P

Abstract: CTA-0165 ES-61413 raychem ce-1605900 CTA-0166 MTCP-122-20 MTCP-116-05P1 MIL-C-39029 MTCP-122-20S1 D-602-0140
Text: rear-release contacts. Components MTC connectors are now available with quickdisconnect mating hardware, EME , user-defined keying combinations. Lightweight, low-profile EME backshells are also available for increased , -6114) *Some combinations of shells, mating hardware and EME shielding accessories are not available. Please , (connector performance per Raychem specification C-6115) EME shielding accessories for MTC connectors , website at www.tycoelectronics.com Low-profile EME backshells Lightweight rectangular EME backshells


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PDF CTA-0022 CTA-0023 MTCP-122-20P CTA-0165 ES-61413 raychem ce-1605900 CTA-0166 MTCP-122-20 MTCP-116-05P1 MIL-C-39029 MTCP-122-20S1 D-602-0140
AR5B91

Abstract: aspire MOTHERBOARD CIRCUIT diagram CNF7017 rt2700e wireless lan atheros AR5B91 atheros ar5b91 YEC YNV-W15 AD-7580S acer 5738 M780G
Text: No file text available


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PDF 5738G/5738ZG/5738Z/5738/5338 5536/5536G/5236 AR5B91 aspire MOTHERBOARD CIRCUIT diagram CNF7017 rt2700e wireless lan atheros AR5B91 atheros ar5b91 YEC YNV-W15 AD-7580S acer 5738 M780G
1996 - sumitomo crm

Abstract: CRM-501 SUMITOMO CDC2582 CDC2586 CDC582 CDC586 SN74ABT32316 SN74ABT32318 CEL-X-9000
Text: -501 Sumitomo CRM-501 Sumitomo CRM-501 Sumitomo CRM-501 Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Sumitomo EME -7300G Hitachi CEL-X-9000 Hitachi CEL-X-9000 Hitachi CEL-X-9000 Hitachi CEL-X-9000 Hitachi


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sumitomo epoxy

Abstract: 7C109A CY7C109 EME TI
Text: Qualification Report January 1997 QTP# 95483, Version 1.0 SUMITOMO EME -9300 (Low Alpha Molding , Semiconductor, Bloomington, MN Fab3/R28 CYPRESS SEMICONDUCTOR Sumitomo EME -9300 Low Alpha Molding, QTP , -mil SOJ (CY7C109) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME -9300HX Copper , SEMICONDUCTOR Sumitomo EME -9300 Low Alpha Molding, QTP 95483 V. 1.0 RELIABILITY TESTS PERFORMED Stress , Temperature Storage 165°C, no bias P Page 4 of 5 CYPRESS SEMICONDUCTOR Sumitomo EME -9300 Low


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PDF EME-9300 CY7C109 32-pin, 400-mil CY7C109) 7C109A PassivaY7C109-VC CY7C109-VC sumitomo epoxy 7C109A CY7C109 EME TI
sumitomo epoxy

Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
Text: to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT , Package: Up to 160 Lead Thin Quad Flat Pack Sumitomo, EME 7320 Mold Compound Assembly: ASE, Taiwan , Flat Pack (TQFP) EME 7320 Sumitomo 145 Deg C Lead Frame material: Lead Finish, composition: Die , , EME 7320 Mold Compound Assembly: ASE, Taiwan QTP# 000303, V. 1.0 Page3 of 5 March, 2000 , to 160 Lead Thin Quad Flat Pack Sumitomo, EME 7320 Mold Compound Assembly: ASE, Taiwan QTP


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PDF to160 CY7C375-AC sumitomo epoxy EME 7320 7320 8361H CY7C375-AC JESD22
2000 - HT 1000-4

Abstract: EMC for PCB Layout EMC APPLICATION note EN50140 electrical based microcontroller projects EMC design EMC APPLICATION EN50141 IEC 801 st9 technical
Text: performances are measured according to two different aspects: ­ Electromagnetic Emissions ( EME ), ­ , it will pass emissions tests, regardless of the types of test performed. Therefore, both EMS and EME , Emissions Tests There are two types of EME tests; conducted and radiated. Conducted EME tests are more reproducible because they do not overly depend on the PCB. 3.4.1.1 Radiated EME Tests To isolate the , EME Tests The noise radiated by the microcontroller is caused by the supply current and the output


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PDF AN901 HT 1000-4 EMC for PCB Layout EMC APPLICATION note EN50140 electrical based microcontroller projects EMC design EMC APPLICATION EN50141 IEC 801 st9 technical
cta-0165

Abstract: MIL-C-39029/57 ES-61413 CTA-0166 MTCP-122-20P MIL-C-39029/58 raychem ce-1605900 D-602-0140 MTCP-122-20S1 ce-1605900
Text: contacts. Components MTC connectors are now available with quickdisconnect mating hardware, EME , has 64 user-defined keying combinations. Lightweight, low-profile EME backshells are also available , combinations of shells, mating hardware and EME shielding accessories are not available. Contact Tyco , Modular Rectangular Connectors with Removable Contacts Accessories Low-Profile EME Backshells EME Backshell Adapters Lightweight rectangular EME backshells connect the overall bundle shield to the MTC


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PDF CHA-0301 CHA-0302 CHA-0303 CHA-0304 cta-0165 MIL-C-39029/57 ES-61413 CTA-0166 MTCP-122-20P MIL-C-39029/58 raychem ce-1605900 D-602-0140 MTCP-122-20S1 ce-1605900
2000 - EMC for PCB Layout

Abstract: EN50142 EN50140 AN898 AN901 EN50081-1 EN50081-2 EN50082-1 EN50082-2 EMC PCB Layout
Text: performances are measured according to two different aspects: ­ Electromagnetic Emissions ( EME ), ­ , it will pass emissions tests, regardless of the types of test performed. Therefore, both EMS and EME , Emissions Tests There are two types of EME tests; conducted and radiated. Conducted EME tests are more reproducible because they do not overly depend on the PCB. 3.4.1.1 Radiated EME Tests To isolate the , EME Tests The noise radiated by the microcontroller is caused by the supply current and the output


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PDF AN901 EMC for PCB Layout EN50142 EN50140 AN898 AN901 EN50081-1 EN50081-2 EN50082-1 EN50082-2 EMC PCB Layout
uPD70F3233GK

Abstract: uPD70F323 uPD703230 uPD703232 uPD70F3232 EEDT-CD-0106-2
Text: Programmer interface EME Software change Order Global Document No. U18410EE1V0IF00 (1st edition) 4 , possible. No. 10 EME The EME behaviour is different from mask to flash device. Refer to the EME , -2005 U17831EE1V0DS00 V850ES/FJ2 Data Sheet 6 Feb-2005 EEDT-CD-0144-1.1 EME of µPD70F3231GB 7 Jan-2005 EEDT-CD-0145-1.1 EME of µPD70F3233GK 8 Aug-2003 EEDT-CD-0113-1.0 EME of µPD70F3236GC 9 Feb-2004 EEDT-CD-0106-2.0 EME of µPD70F3239M2GJ 10 Feb-2005 EEDT-CD-0157-1.0 EME of


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PDF U17832EE1V0DS00 V850ES/FG2 Nov-2005 U17831EE1V0DS00 V850ES/FJ2 Feb-2005 EEDT-CD-0144-1 PD70F3231GB Jan-2005 EEDT-CD-0145-1 uPD70F3233GK uPD70F323 uPD703230 uPD703232 uPD70F3232 EEDT-CD-0106-2
EME-7351

Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
Text: Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME -7351/S351 Mold Compound QTP# 97351, V. 1.0 Page 2 of 4 January , Compound Name/Manufacturer: Lead Frame material: Sumitomo EME -7351 / S351 Copper Lead Finish , availability. Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME -7351/S351 Mold , : Anam, Korea Package: TSOP - Sumitomo EME -7351/S351 Mold Compound QTP# 97351, V. 1.0 Page 4 of 4


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PDF EME-7351/S351 EME-7351 30C/60 CY7C109-ZC Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
2009 - Not Available

Abstract: No abstract text available
Text: compound/die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME -6300H (being , that Diodes is currently in the process of qualifying EME -6300CSP mold compound. The mold compound supplier for the current mold compound is discontinuing manufacturing of EME -63000H. EME -6600CSP will replace EME -6300H. In addition, and to assure continuity of supply to our customers, Diodes, Inc is also


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PDF DCS/PCN-1134 EME-6300H EME6600CSP 84-1LMISR4. EME-6300CSP EME-63000H. EME-6600CSP EME-6300H. ad33K5L-13 AP1506-33K5L-U
2001 - tanaka wire

Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
Text: Process Add Shinetsu KMC184 and KMC184VA (low alpha version) family and Sumitomo Assembly Process EME -6730 and EME -9730 (low alpha version) family as qualified mold compound for Equipment all plastic packages , : : I. NEW ASSEMBLY TECHNIQUE QUALIFICATION OF LOW STRESS MOLD COMPOUNDS EME -6730UC QUAL DESCRIPTION , EME -6730UC (SUMITOMO) M3 1.3 mil Au (TANAKA) 8390 (ABLESTIK) n/a n/a 8390 (ABLESTIK) M3 1.3 mil Au (TANAKA) EME -6730UC (SUMITOMO) SnPb Plating IDT-Phils 275 x 235 mils 10 mils 10 mils 275 x 235 mils Olin


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PDF G9911-05 KMC184 KMC184VA EME-6730 EME-9730 Mil-Std-883, tanaka wire MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 tanaka wire 10 mils
2010 - sc5 relays

Abstract: sc5 dc 6v relay IH-001 SCI15 sc5 relay 12 V MQFP52 35845 DCH11 0b001 scf101
Text: , SELAD = '0b001' resp. '0b010', EME = 0 VBy 0.6 V VBy V 702 VR2 ADC - Measurement Range 2 Voltage measurement High at IO, SELAD = '0b010', EME = 1 VBy 5V VBy V 703 VR3 ADC - Measurement Range 3 Voltage measurement Low at IO, SELAD = '0b100', EME = 0 0 0.6 V , measurement SELAD = '0b101' or. '0b110', EME = 1 0 5 V 705 VR5 ADC - Measurement Range 5 , Range 6 Temperature measurement SELAD = '0b111' 707 Vbitlo Bit-Equivalent of voltage EME


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PDF 16-FOLD 10-bit MQFP52 D-55294 sc5 relays sc5 dc 6v relay IH-001 SCI15 sc5 relay 12 V MQFP52 35845 DCH11 0b001 scf101
2001 - JEDEC JESD22-B116

Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
Text: Fabrication Process Assembly Process Equipment IDT will be qualifying the new EME -7351LP and EME-S351LP mold , Sheet Change Mold compound materials, Sumitomo EME -7351LP and EME-S351LP. No Detail of Change , (TSOP) Expected Completion Date: 1/18/2002 EME -7351 mold compound material qual Test Methods Sample , EME -7351 mold compound material qual Test Methods Sample /# Fails 45/0 45/0 77/0 77/0 45/0 45/0 5/0 25 , Completion Date: 1/18/2002 EME -7351 mold compound material qual Test Methods Sample /# Fails 45/0 45/0 77


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PDF G-0110-06 EME-7351LP EME-S351LP 4-10h JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
2001 - philips ferrite 4b1

Abstract: philips ferrite core 4b1 ferrit* 3b1 ELECTRO MAGNETIC INTERFERENCE ferrite core philips ferrite bead
Text: equipment ( EME - Electro Magnetic Emission) and also the sensitivity of equipment for incoming interference , limit EMC margin EME limit EME level frequency EMC = Electro Magnetic Compatability EMS = Electro Magnetic Susceptability EME = Electro Magnetic Emission Fig.1 EMC principles safety margin supplier


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2006 - TJA1020

Abstract: automotive ecu lin uart protocol Automotive ECU IC ECU car TJA1020T lin bus application
Text: Electromagnetic Emission ( EME ) and high Electromagnetic Immunity (EMI) Ñ Low-slope mode further reduces EME Ñ , best-in-class EMC performance together with high EMI and extremely low EME , which can be further reduced by


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PDF TJA1020 TJA1020 automotive ecu lin uart protocol Automotive ECU IC ECU car TJA1020T lin bus application
sumitomo epoxy eme6300h

Abstract: eme6300h OP-128 130C JESD22 CY2292SC
Text: Lead Plastic Small Outline ICs Sumitomo, EME 66300 Mold Compound Assembly: OSE Philippines QTP , Package: 16 Lead Plastic Small Outline ICs Sumitomo, EME 66300 Mold Compound Assembly: OSE Philippines , Sumitomo, EME 66300 Mold Compound Assembly: OSE Philippines QTP# 000101, V. 1.1 Page4 of 5 June, 2000 , Small Outline ICs Sumitomo, EME 66300 Mold Compound Assembly: OSE Philippines QTP# 000101, V. 1.1


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PDF CY2292SC 85C/85 sumitomo epoxy eme6300h eme6300h OP-128 130C JESD22 CY2292SC
1998 - Q67100-H6278

Abstract: Q67100-H8645 SIPMOS 2120P
Text: determines the soft-start characteristic. 7 7 EME O Emergency A low input voltage at POL will activate the output EME . 8 8 POL I Polarity Detection POL is the input to a , via pin EME , which should shut down all activity except simple telephony functions to minimize power , TTL-compatible signals: EME and CO. The EME (Emergency-output) becomes active, if polarity reversal is detected , RDS (on) (VS ­ VCIN) Polarity Detection POL (pin 8), EME (pin 7) H-input voltage VIH


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PDF 2120-P P-DIP-22) P-DSO-24-1 P-DIP-22 2120-P Q67100-H8645 2120-T Q67100-H6278 P-DSO-24-5 Q67100-H6278 Q67100-H8645 SIPMOS 2120P
BYS 21-45

Abstract: No abstract text available
Text: 18 □ VEXT CSS c 6 17 □ GND EME □ 7 16 □ CP POL , COM P 4 EP In 5 EN In 6 CSS In 7 EME Out 8 POL In 9 , signaled to the microprocessor via pin EME , which should shut down all activity except simple telephony , microprocessor The PSB 2120 offers two TTL-compatible signals: EME and CO. filVIE (Emergency) becomes active , G A CO I T T1 0V 100 p N3 PSB2120 CN G N D CSS SYNC RC VREF VP CO M P VN ENA EME


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PDF PSB2120 Start-21-45 630nH BYS 21-45
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