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7n93

Abstract: 4000A hall effect current sensor Ohio Semitronics PER 215P 202HT 202H ctl-51 213H CTL-302EES ac current hall sensor signal conditioner
Text: 3/4 C 201PX5 201P 212P 201PA 213PX5 213P 215P 214P 1 1/8 D 212H 201HX5 201H 201HA 213HX5 213H 215H 214H 1 1/8 D 212P 201PX5 201P 201PA 213PX5 213P 215P 214P 1 1/8 D 201HX5 201H 212H 201HA 213HX5 213H 215H 214H 1 1/8 D 201PX5 201P 212P 201PA 213PX5 213P 215P 214P 2 or 2 , 1/2 x 1 1/2 Z 201PX5 201P 212P 201PA 213PX5 213P 215P 214P 4 1/4 EE 212P 201PX5 201P 201PA 213PX5 213P 215P 214P 4 1/2 x 2 2/5 ZZ 201PX5 201P 212P 201PA 213PX5 213P 215P 214P 2 or


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PDF CTL-202H/500 CTL-202H/1000 CTL-202ZZS/1000 CTL-202H/1500 CTL-202ZZS/1500 CTL-202H/2000 CTL-202ZZS/2000 CTL-502H/2000 CTL-302ZZS/2500 CTL-502H/2500 7n93 4000A hall effect current sensor Ohio Semitronics PER 215P 202HT 202H ctl-51 213H CTL-302EES ac current hall sensor signal conditioner
5a6j

Abstract: 2108 212P DI027
Text: , .030 J ('7® ■212P - .050 t (1.27) .215 "(5.46) 8 Volt AC/DC 4 Volt AC/DC 12 Volt AC/DC , 4 Volt AC/DC PARAMETERS (TA=25°C)/MODEL NUMBER 170S 170P 210S 210P 212P POWER DISSIPATION , 35 4 212P R-6/50 3.9 G-6/60 4.1 A-6/40 3.9 55 5 PEAK WAVELENGTH (nM): RED (630), GREEN (565


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PDF 0D0D31la 170S-170P 212P- R-i/25 G-4/30 R-6/50 G-6/60 5a6j 2108 212P DI027
2003 - 25P20

Abstract: 5150-5350MHz 325b 212P 2400-2500MHz
Text: 252B 2000 212P 3000 2 Tape Material 6 FTaped packaging (EIA) Thickness , ) 2000 212P 0.85typ.(0.033) 3000 3 Taping dimensions 8mm Embossed tapef0.315 inches wideg Type fEIAg 325B 252B 212P max Chip cavity Insertion Pitch Tape Thickness A B , ) Technical considerations Land pattern dimension examples · FI 325B 6 · FI 212P 2. Soldering


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PDF K30VJ85C K20J35C 60LRH 25P20 5150-5350MHz 325b 212P 2400-2500MHz
2009 - CSR BC5

Abstract: CSR BC4 FI168T BC5 CSR FI212B FI 212B245027 BC6rom FI212B190223 CSR BC4 bluetooth csr bc3
Text: FI 212C249566 FI 212C Type 2.00±0.15 mm FI 212P Type mm FI 105B/L Type FI 168T , GND Balanced pcs 212B 212L 212C 212P 168B 168L 168T 105B 105L 3000 , 157 212B 212L 212C 212P 168B 168L 168T 105B 105L [pcs] 3000 4000 , 1.55±0.2 2.3±0.2 4.0±0.1 1.6 0.3 212P 0.061±0.0080.091±0.0080.157±0.004 0.063 0.012 1.00±0.05 , 212B 212L 212C 212P 168B 168L 168T 105B 105L mm inch 0.90 typ. 0.035 0.45 typ. 0.018


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PDF 212B245021/FI 212B245025/FI 212B190223 212C245033/FI 212C245034 212C245072 168B/L 212C249566 105B/L 9095RH CSR BC5 CSR BC4 FI168T BC5 CSR FI212B FI 212B245027 BC6rom FI212B190223 CSR BC4 bluetooth csr bc3
CSR BC5

Abstract: CSR BC4 bluetooth BC5 CSR CSR BC4 BC3 csr fi168l FI 105B245024 BC6rom 212C FI212B190223
Text: FI 168B/L Type mm FI 212C249566 FI 212C Type 2.00±0.15 mm FI 212P Type mm FI , GND NC Balanced GND Balanced 212B 212L 212C 212P 168B 168L 168T 105B 105L , [pcs] 212B 212L 212C 212P 168B 168L 168T 105B 105L 3000 4000 10000 , 212P 0.061±0.0080.091±0.0080.157±0.004 0.063 0.012 1.00±0.05 1.80±0.05 4.0±0.1 0.55 0.55 168B , mm inch EIA 212B 212L 212C 212P 168B 168L 168T 105B 105L mm inch 0.90


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PDF 212B245021/FI 212B245025/FI 212B190223 212C245033/FI 212C245034 212C245072 168B/L 212C249566 105B/L 86106kPa CSR BC5 CSR BC4 bluetooth BC5 CSR CSR BC4 BC3 csr fi168l FI 105B245024 BC6rom 212C FI212B190223
2009 - CSR BC5

Abstract: CSR BC3 FI 212B245025 FI212B190223 CSR BC4 CSR BC4 bluetooth bluetooth module BC4 FI168B FI 212B245027 brf6150
Text: mm FI 212P Type FI 105B/L Type FI 168T Type 1.6±0.10 0.33 Max. 1.00±0.05 0.30±0.10 , FI 168T578717 Unbalance GND NC Balanced GND Balanced 212B 212L 212C 212P 168B , [pcs] 212B 212L 212C 212P 168B 168L 168T 105B 105L 3000 4000 10000 , 4.0±0.1 1.6 212C 0.061±0.0080.091±0.0080.157±0.004 0.063 1.55±0.2 2.3±0.2 4.0±0.1 1.6 212P , 0.45 0.018 mm inch EIA 212B 212L 212C 212P 168B 168L 168T 105B 105L


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PDF FI212B FI212B245021/FI212B190223 FI168T FI212L FI168B/L FI212C FI212P FI105B/L CSR BC5 CSR BC3 FI 212B245025 FI212B190223 CSR BC4 CSR BC4 bluetooth bluetooth module BC4 FI168B FI 212B245027 brf6150
2008 - brf6150

Abstract: CSR BC5 BC5 CSR 2400-2500MHz
Text: 212P Type 6 5 7 8 4 6 5 4 1 2 3 1 2 3 1 2 3 4 5 6 7 8 FI 212C2450XX Balanced GND , . 433 PACKAGING Minimum Quantity Type 212B 212L 212C 212P 168B 168L Tape Material !!!!Type pcs Embossed Tape 3000 3000 3000 3000 4000 4000 212P 168B 212C 212L 212B EIA Chip cavity A , Reel Size Taped Packaging EIA Type 212B 212L 212C 212P 168B 168L Standard quantity pcs , . 75 0.50 1.20 UNIT : mm UNIT : mm FI 212C !FI 212C Type 0.65 0.35 0. 90 FI 212P !FI 212P


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PDF 212B245021/ 212B190223 203560RH 60RH30 brf6150 CSR BC5 BC5 CSR 2400-2500MHz
CSR BC5

Abstract: CSR BC4 BRF6150 brf6300 212P089208 FI212P CSR BC4 bluetooth bluetooth module BC4 2300-2690MHz 212B
Text: 0.80±0.10 FI 212P Type Unit : mm Unit : mm 0.50±0.05 Unit : mm FI 212C245041 FI , IN Low Band OUT GND High Band OUT 212B 212L 212C 212P 168B 168L 168T 168D 105B 105L , . chipfilter01_e-01 1 1 167 PACKAGING Minimum Quantity Type 212B 212L 212C 212P 168B 168L 168T , 212P 0.061±0.0080.091±0.0080.157±0.004 0.063 0.012 1.00±0.05 1.80±0.05 4.0±0.1 0.55 0.55 168B , Type (EIA) 212B 212L 212C 212P 168B 168L 168T 168D 105B 105L Thickness mm (inch) 0.90


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2008 - 2300-2690MHz

Abstract: No abstract text available
Text: FI 168B / L Type FI 212C Type FI 212P Type 6 5 7 8 4 6 5 4 1 2 3 1 2 3 1 2 3 4 , Quantity @@@ Type 212B 212L 212C 212P 168B 168L @ Tape Material @ @ Card Board Carrier Tape @ pcs Embossed Tape 3000 3000 3000 3000 4000 4000 !! Type EIA 212B 212L 212C 212P 168B @@ Chip cavity A , 4000 4000 @ @ EIA Type 212B 212L 212C 212P 168B 168L @ Taping Dimensions @ 212B, 212C 8mm


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2003 - spice model solid state relay

Abstract: solid state relay spice model swhyste lambda schematic los-7-15 llc converter spice model NMOS MODEL PARAMETERS SPICE relay spice model
Text: -May-04 M3 28 11 S1 S1 DrivFETNh .MODEL DrivFETNh NMOS Level=1 CBD= 212p CBS=254p CGBO=428n + CGDO=260n CGSO , DrivFETPh2 .MODEL DrivFETPh2 PMOS Level=1 CBD= 212p CBS=254p CGBO=428n + CGDO=260n CGSO=312n GAMMA=0 IS , 11 13 13 DrivFETPh2 .MODEL DrivFETPh2 PMOS Level=1 CBD= 212p CBS=254p CGBO=428n + CGDO=260n CGSO , DrivFETNh .MODEL DrivFETNh NMOS Level=1 CBD= 212p CBS=254p CGBO=428n + CGDO=260n CGSO=312n GAMMA=0 IS


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PDF Si4768CY includ-May-04 12-May-04 spice model solid state relay solid state relay spice model swhyste lambda schematic los-7-15 llc converter spice model NMOS MODEL PARAMETERS SPICE relay spice model
2003 - swhyste

Abstract: mosfet 260n TC-165 llc converter spice model NMOS MODEL PARAMETERS SPICE 156n diode diode M7 Si4770CY Si4768CY Lambda Los
Text: DrivFETNh NMOS Level=1 CBD= 212p CBS=254p CGBO=428n www.vishay.com 2 + CGDO=260n CGSO=312n GAMMA=0 IS , .MODEL DrivFETPh2 PMOS Level=1 CBD= 212p CBS=254p CGBO=428n + CGDO=260n CGSO=312n GAMMA=0 IS=1.00p KP , G2 35p X3 D2 30 S2 70LSFET M3 28 11 S1 S1 DrivFETNh .MODEL DrivFETNh NMOS Level=1 CBD= 212p CBS , =84.0m VTO=3 V3 Boot 13 .MODEL DrivFETPh2 PMOS Level=1 CBD= 212p CBS=254p CGBO=428n + CGDO=260n CGSO


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PDF Si4770CY 18-Jul-08 swhyste mosfet 260n TC-165 llc converter spice model NMOS MODEL PARAMETERS SPICE 156n diode diode M7 Si4768CY Lambda Los
2010 - 212P089208

Abstract: FI212P0892XA08 FI212P Diplexer diplexer 900 FI212
Text: Frequency[MHz] Confidential Date: Feb/23/2010 The Example of a Land Pattern Diplexer (FI 212P


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PDF 212P089208 FI212P0892XA08) 1710-2170MHz 824-894MHz 960MHz 25deg-C) Feb/23/2010 50ohm 212P089208 FI212P0892XA08 FI212P Diplexer diplexer 900 FI212
2009 - CSR BC5

Abstract: CSR BC4 CSR BC4 bluetooth bc5 csr FI 212B245027 BRF6300 BC3 csr CSR BC4 external Bluetooth CSR BC5 CSR Bluetooth
Text: 212P Type FI 105B/L Type FI 168T Type 1.6±0.10 0.33 Max. 1.00±0.05 0.30±0.10 , Standard Quantitypcs Embossed Tape 212B 212L 212C 212P 168B 168L 168T 105B 105L 3000 4000 , Type 212B 212L 212C 212P 168B 168L 168T 105B 105L Embossed Tape [pcs] 3000 4000 , 1.55±0.2 2.3±0.2 4.0±0.1 1.6 0.3 212P 0.061±0.0080.091±0.0080.157±0.004 0.063 0.012 1.00±0.05 , 212C 212P 168B 168L 168T 105B 105L Thickness mm (inch) 0.90 typ. 0.035 0.45 typ. 0.018


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2011 - FI325P

Abstract: FI325P120057 168P245010 168P157519 212P089213 168p1 chipfilter01 212P085912 212P089208 FI212B
Text: FI 212C245075 FI 212P Type FI 212P 3960A4 0.4±0.10 FI 168T Type 1.6±0.10 0.5max. 0.80±0.10 , GND Type Standard Quantitypcs 325P 2000 212B 212L 3000 212C 212P 168B 168L 168T 4000 168D 168P 105B , 212L 212C 212P 168B 168L 168T 168D 168P 105B 105L Embossed Tape [pcs] 2000 Type EIA 325P 3000 212B 212L 4000 212C 212C-0.5 10000 212C-0.7 212P 168B 168L 168T 168D 168P 105B 105L Chip cavity A B Insertion , Taped package Type (EIA) 325P 212B 212L 212C 212P 212C-0.5 212C-0.7 168B 168L 168T 168D 168P 105B 105L


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Not Available

Abstract: No abstract text available
Text: :(510)979-2189 MODEL HIGH DENSITY D -S U B CONNECTOR H D B 212-P F 15G _-K 9


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PDF 5000MQ 17/MAR/08â 17/MAR/08' 212-P
Not Available

Abstract: No abstract text available
Text: Unit : mm FI 168T Type FI 212P Type FI 212C245075 Unit : mm Unit : mm 1.6±0.10 FI , 212L 3000∼ 6000 212C 212P 168B 168L 4000∼ 168T 8000 168D 168P 105B 10000 105L â , 212P 168B 168L 168T 168D 168P 105B 105L Embossed Tape [pcs] 2000 3000 4000 10000 , Chip ●Taped package Type (EIA) 325P 212B 212L 212C 212P 212C-0.5 212C-0.7 168B 168L , Type, 212B Type, 212C Type, 212C-0.7 Type, 212P Type) Type(EIA) 325P 212B 212C 212C-0.7


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PDF e-E02R01
2008 - BRF6300

Abstract: BC5 CSR CSR BC5 brf6150 P434 diplexer fi168l Bluetooth CSR BC5
Text: FI 168B / L Type FI 212C Type FI 212P Type 6 5 7 8 4 6 5 4 1 2 3 1 2 3 1 2 3 4 , catalog. 433 PACKAGING Minimum Quantity Type 212B 212L 212C 212P 168B 168L Tape Material pcs Embossed Tape 3000 3000 3000 3000 4000 4000 Type EIA 212B 212L 212C 212P 168B Chip , Taped Packaging EIA Type 212B 212L 212C 212P 168B 168L Thickness mm inch 0.90typ. 0.035 0.45typ. 0.018


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PDF 535458586106kPa 2657086106kPa 203560RH BRF6300 BC5 CSR CSR BC5 brf6150 P434 diplexer fi168l Bluetooth CSR BC5
2010 - Diplexer

Abstract: 212P089213 diplexer 900
Text: ] Confidential Date: Feb/23/2010 The Example of a Land Pattern Diplexer (FI 212P Series) Electrodes


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PDF 212P089213 1710-2170MHz 824-894MHz 960MHz 25deg-C) Feb/23/2010 50ohm Feb/22/2010 Diplexer 212P089213 diplexer 900
Portescap

Abstract: No abstract text available
Text: 16N78 Athlonix Precious metal commutation Ø16mm 6.9 mNm 16N78 * .1001 Electrical Data 135 212P 214E 212E 210E 1 Nominal Voltage V * 1.5 6 9 12 18 208E 24 Volt 2 No-Load Speed n0 9,475 8,350 8,275 8,380 9,270 8,200 rpm 3 No-Load Current I0 60.0 18.0 10.0 5.0 5.0 4.0 4 Terminal Resistance R 0.2 3.0 7.5 13.2 27.5 60.5 W W mA 5 Output Power P2max. 4.7


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PDF 16N78 16N78 16N98 Portescap
2012 - FI325P

Abstract: CSR BC4 external 168P245010 2300-2690MHz diplexer 2400-2500MHz
Text: : mm Unit : mm Unit : mm FI 212C245075 FI 212P Type FI 168T Type 1.6±0.10 0.5max. FI , Standard Quantitypcs 325P 2000 212B 212L 3000 6000 212C 212P 168B 168L 4000 168T 8000 168D 168P 105B 10000 , CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS) PACKAGING Minimum Quantity Type 325P 212B 212L 212C 212P , [pcs] 2000 3000 4000 10000 Taped package Type (EIA) 325P 212B 212L 212C 212P 212C-0.5 212-0.7 , 212C 212C-0.5 212C-0.7 212P 168B 168L 168T 168D 168P 105B 105L Chip cavity A B 2.75±0.2 3.55±0.2


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2008 - CSR BC5

Abstract: 5150-5350MHz BC5 CSR BRF6300 2300-2690MHz CSR BC4 bluetooth csr bc4 BRF6150 BC3 csr 212C
Text: Type HIGH FREQUENCY DIELECTRIC COMPONENT FI 212L Type FI 212P Type 6 7 5 6 4 5 4 , pcs Type Embossed Tape 212B 3000 212L 3000 212C 3000 212P 4000 168L 212B 212L 3000 168B EIA 4000 212C 212P Tape Material 168B Card Board , . 0.035 3000 212P 0.90typ. 0.035 3000 168B 0.45typ. 0.018 4000 168L


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2010 - Not Available

Abstract: No abstract text available
Text: -176P PC4-180P PC4-184P PC4-188P PC4-192P PC4-196P PC4-200P PC4-204P PC4-208P PC4- 212P PC4


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PDF PC4-040P PC4-044P PC4-048P PC4-052P PC4-056P PC4-060P PC4-064P PC4-068P PC4-072P PC4-076P
Not Available

Abstract: No abstract text available
Text: 1?£8£I0PS ( 'ON 0NIMVHQ) PIN INSERT T H E S E M A R K I N G S L E T T E R S IN DRAWING SHOW S O C K E T I N S E R T . FOR P I N I N S E R T MARK A S FOLLOWS._ SOCKET I NSERT P IN r- INSERT V POF-O- 212P (98. 0 2 ? v h - h S P E C I F I C A T I ON DIELECTRIC WITHSTANDING VOLTAGE INSULATION RESISITANCE APPLICA B LE WIRE : A. C. 2000Vr. m . s (1 MINUTE) : 5000M£2 MIN. (AT D. C. 5 00V ) : WV0 0. 75mm2X 50, 1.25mm2X 40 m SECT. A - A A. C. 2000Vr. m. s


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PDF POF-O-212P 2000Vr. 5000M 75mm2X 25mm2X 5000MQ T74-1 QE4501
MICROCONTROLLER 8031

Abstract: 8048 microcontroller APPLICATION philips 8031 microcontroller 8031 MICROCONTROLLER architecture mab8031ah 12p 8031 pin diagram 8051 UART Program Examples 8031AH 12P 8031AH N500
Text: ROMIess ROM MAF8031AH- 2-12P MAF8031A-2N MAF8051AH-2P SCN8031HACN40 SCN8051HACN40 -40 to+85, Plastic Dual In-Line Package 12 0415C MAB8031AH- 2-12P MAB8031A-2N MAB8051AH-2P SCN8031HCCN40 SCN8051HCCN40 0 to


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PDF AH/8051 16-bit MICROCONTROLLER 8031 8048 microcontroller APPLICATION philips 8031 microcontroller 8031 MICROCONTROLLER architecture mab8031ah 12p 8031 pin diagram 8051 UART Program Examples 8031AH 12P 8031AH N500
Not Available

Abstract: No abstract text available
Text: PHILIPS NORTH AMERICA PHILIPS ROMIess (MARKING NUMBER) ROMIess (ORDER NUMBER) MAF8031AH- 2-12P MAF8031A-2N MAB8031AH- 2-12P MAB8031A-2 N TEMPERATURE °C AND PACKAGE FREQ. MHz DRAWING


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PDF 8031AH/8051AH 8031AH/8051AH
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