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DS7409 datasheet (1)

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DS 7409 Samsung Electronics Original PDF

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HL832N

Abstract: ELC4785 E679 DS7409 MO-298 amkor flip DS820B MO-195 MO-192 HL832
Text: dielectric HL832N, ELC4785, DS7409 , E679, GT - Layer count (Laminate) 2-6 Die attach -


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cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP chiparray amkor CABGA 48 7x7 amkor cabga thermal resistance ELC4785 flip chip bga 0,8 mm
Text: Standard Materials Package substrate HL832N, ELC4785, DS7409 , e679, GT Bump Pb-Free


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HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound CABGA 6x6 amkor cabga thermal resistance cu pillar flip chip bga 0,8 mm amkor Cu pillar bga 9x9 Shipping Trays
Text: substrate HL832N, ELC4785, DS7409 , e679, GT Bump Pb-Free / Eutectic, Cu Pillar Encapsulant Epoxy mold


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2013 - E700G

Abstract: No abstract text available
Text: , NSF-LCA – E679: FG, FGB, FGBS, GT – E700G, E705G – DS7409HG , DS7409HGB (S), DS7409HGB (LE) â


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PDF DS577G E700G
2013 - DS7409HGB

Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Text: DS7409HG , DS7409HGB (S), DS7409HGB (LE), ELC4785GSB, ELC4785THB, ELC4785THG – Layer count (laminate


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PDF DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
EN4900GC

Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Text: % Au, AW66 Ø20.3um Cu/Pd, Ø25.4um BGA Substrate Mitsubishi HL832NXA Doosan Corp DS-7409HG B BGA


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PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
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