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DM6030HK Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2007 - DM6030HK

Abstract: AN3016 MAAP-008509-SMB004 MAAP-008509-PED000 MAAP-008509-MCH000 MA08509D DM4030LD MMIC X-band amplifier ic 10w power amplifier mmic AMPLIFIER x-band 10w
Text: silver loaded epoxy. Two epoxies are recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK , in attaching these IC assemblies. DM6030HK is recommended for use when the coefficient of thermal


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PDF MAAP-008509-PED000 MAAP-008509-PED000 10-mil DM6030HK AN3016 MAAP-008509-SMB004 MAAP-008509-MCH000 MA08509D DM4030LD MMIC X-band amplifier ic 10w power amplifier mmic AMPLIFIER x-band 10w
2003 - DM6030HK

Abstract: diemat MMA701A C601A
Text: epoxy type DM6030HK or equivalent. Wire Bonding 1) Thermocompression wedge bond 0.7 or 1 mil diameter


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PDF MMA601A C601A MMA601A A17022 DM6030HK diemat MMA701A
2003 - DM6030HK

Abstract: diemat MMA60 MMA601A
Text: epoxy type DM6030HK or equivalent. Wire Bonding 1) Thermocompression wedge bond 0.7 or 1 mil diameter


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PDF MMA601A C601A MMA601A DM6030HK diemat MMA60
2009 - Not Available

Abstract: No abstract text available
Text: may also be mounted with DieMat DM6030HK conductive epoxy or an equivalent high thermal conductivity


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PDF TGA4905-CP TGA4905-CP TGA4905 DM6030HK
2008 - XP1055-BD

Abstract: tanaka TS3332LD epoxy
Text: , recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 12-May-08 P1055-BD MIL-STD-883 parD-000V XP1055-BD-EV1 XP1055-BD tanaka TS3332LD epoxy
DM6030HK

Abstract: diemat SN63 TGA4513 TGA4513-CP ka-band amplifier
Text: TGA4513-CP may also be mounted with DieMat DM6030HK conductive epoxy. 3. The DC and RF interconnects may be


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PDF TGA4513-CP TGA4513-CP DM6030HK DM6030HK diemat SN63 TGA4513 ka-band amplifier
2008 - XP1071-BD-000V

Abstract: tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy
Text: , recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 28-Sep-08 P1071-BD MIL-STD-883 surfaD-000V XP1071-BD-EV1 XP1071-BD XP1071-BD-000V tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy
2008 - Not Available

Abstract: No abstract text available
Text: DM6030HK conductive epoxy. 3. The DC and RF interconnects may be gold bondwires or gold ribbons. The RF


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PDF TGA4513-CP TGA4513-CP DM6030HK
2010 - XP1072-BD

Abstract: XP1072-BD-000V ID232 DM6030HK 152.01 VD55
Text: performance requirements. MMIC, 4mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic , DM6030HK or an epoxy with >52 W/m ºK thermal conductivity cured in a nitrogen atmosphere per manufacturer


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PDF P1072-BD 16-Feb-10 MIL-STD-883 XP1072-BD XP1072-BD-000V ID232 DM6030HK 152.01 VD55
2009 - XP1071-BD-EV1

Abstract: No abstract text available
Text: Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic Solder MOLY Rib, 5mil, Au plated MOLY Carrier, 25mil Au , DM6030HK or an epoxy with >52 W/m ºK thermal conductivity cured in a nitrogen atmosphere per manufacturer


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PDF P1071-BD 06-Mar-09 MIL-STD-883 XP1071-BD-EV1 XP1071-BD XP1071-BD-EV1
2007 - DM6030HK

Abstract: MAAP-000077-SMB004 AN3016 DM4030LD MAAP-000077-PED000 MAAP-000077-PKG001 MAAP-000077-SMB001 MAAPGM0077-DIE
Text: recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with bulk thermal , recommended for use in attaching these IC assemblies. DM6030HK is recommended for use when the coefficient of


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PDF MAAP-000077-PED000 MAAPGM0077-PED000 10-mil DM6030HK MAAP-000077-SMB004 AN3016 DM4030LD MAAP-000077-PED000 MAAP-000077-PKG001 MAAP-000077-SMB001 MAAPGM0077-DIE
2009 - BD 879

Abstract: CMM0016 CMM0016-BD CMM0016-BD-000V DM6030HK PB-CMM0016-BD-0000
Text: availability and end application performance requirements. MMIC, 3mil Alumina Substrate Diemat DM6030HK , using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal


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PDF CMM0016-BD 14-Sep-09 MIL-STD-883 provM0016-BD-0000 CMM0016-BD BD 879 CMM0016 CMM0016-BD-000V DM6030HK PB-CMM0016-BD-0000
2007 - Not Available

Abstract: No abstract text available
Text: for this purpose, Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with bulk thermal conductivities , recommended for use in attaching these IC assemblies. DM6030HK is recommended for use when the coefficient of


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PDF MAAP-000079-PED000 MAAP-000079-PED000 10-mil
2009 - Not Available

Abstract: No abstract text available
Text: performance requirements. MMIC, 3mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic , . If using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK


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PDF P1059-BD 02-Feb-09 MIL-STD-883 XP1059-BD-EV1 XP1059-BD
2010 - transistor d 13009

Abstract: DM6030HK XP1015 XP1015-BD XP1015-BD-000V XP1015-BD-EV1
Text: requirements. MMIC, 4mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic Solder MOLY , using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal


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PDF P1015-BD 22-Jan-10 MIL-STD-883 XP1015-BD-EV1 XP1015 transistor d 13009 DM6030HK XP1015-BD XP1015-BD-000V XP1015-BD-EV1
2009 - Not Available

Abstract: No abstract text available
Text: availability and end application performance requirements. MMIC, 3mil Alumina Substrate Diemat DM6030HK , . If using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK


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PDF 14-Sep-09 CMM0016-BD MIL-STD-883 M0016-BD-0000 CMM0016-BD
2009 - TGA4915-CP

Abstract: DM6030HK SN63 50W-Pout IDQ42
Text: other Tin/Lead solder. The TGA4915-CP may also be mounted with DieMat DM6030HK conductive epoxy or


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PDF TGA4915-CP TGA4915-CP DM6030HK DM6030HK SN63 50W-Pout IDQ42
2005 - Not Available

Abstract: No abstract text available
Text: other Tin/Lead solder. The TGA4513-CP may also be mounted with DieMat DM6030HK conductive epoxy. 3. The


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PDF TGA4513-CP TGA4513-CP DM6030HK
2007 - tanaka TS3332LD epoxy

Abstract: tanaka TS3332LD tanaka epoxy dm6030hk TS3332LD tanaka gold wire data sheet tanaka gold wire CMM-2-BD CMM-2-BD-000X DM6030HK-Pt
Text: clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid


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PDF 06-Aug-07 CMM-2-BD-000X tanaka TS3332LD epoxy tanaka TS3332LD tanaka epoxy dm6030hk TS3332LD tanaka gold wire data sheet tanaka gold wire CMM-2-BD CMM-2-BD-000X DM6030HK-Pt
2009 - Not Available

Abstract: No abstract text available
Text: mounted with DieMat DM6030HK conductive epoxy or similar thermally and electrically conductive epoxy. 3


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PDF TGA4915-CP TGA4915-CP DM6030HK
2008 - tanaka gold wire

Abstract: tanaka au wire DM6030HK tanaka TS3332LD
Text: and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid


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PDF 16-Oct-08 P1070-BD MIL-STD-883 chipD-000V XP1070-BD-EV1 XP1070-BD tanaka gold wire tanaka au wire DM6030HK tanaka TS3332LD
2009 - TGA4513-CP

Abstract: DM6030HK SN63 TGA4513
Text: TGA4513-CP may also be mounted with DieMat DM6030HK conductive epoxy. 3. The DC and RF interconnects may be


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PDF TGA4513-CP TGA4513-CP TGA4513 DM6030HK DM6030HK SN63
Not Available

Abstract: No abstract text available
Text: using SN63 solder or any other Tin/Lead solder. The TGA4513-CP may also be mounted with DieMat DM6030HK


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PDF TGA4513-CP TGA4513-CP DM6030HK
2004 - Not Available

Abstract: No abstract text available
Text: may also be mounted with DieMat DM6030HK conductive epoxy. 3. The DC and RF interconnects may be gold


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PDF TGA4915-EPU-CP TGA4915-EPU-CP TGA4915 DM6030HK
2008 - tanaka wire

Abstract: dm6030hk tanaka epoxy
Text: , recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 12-May-08 P1058-BD MIL-STD-883 passivatiD-000V XP1058-BD-EV1 XP1058-BD tanaka wire dm6030hk tanaka epoxy
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