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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1130CNW Linear Technology 5V RS232 5 DRIVER/5 RCV 28-DIP
LM308AN8 Linear Technology IC OP-AMP, 500 uV OFFSET-MAX, PDIP8, PLASTIC, DIP-8, Operational Amplifier
LT1124MN8 Linear Technology IC DUAL OP-AMP, PDIP8, PLASTIC, DIP-8, Operational Amplifier
LT1128AMN8 Linear Technology IC OP-AMP, PDIP8, PLASTIC, DIP-8, Operational Amplifier
LT1194MN8 Linear Technology IC OP-AMP, PDIP8, PLASTIC, DIP-8, Operational Amplifier
LT1213MN8 Linear Technology IC DUAL OP-AMP, PDIP8, PLASTIC, DIP-8, Operational Amplifier

DIP-14/16 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
DPT100

Abstract: DPT-100 MODEL SA DP100 SA-9-E-115 SA9115 DP100 DIP absorber DP-140
Text: and include grounding lugs where appropriate. The kit consists of extractors EX-1 to 14-16 pin devices, and EX-2 for 24-40 pin chips, plus inserters MOS- 1416 , MOS 2428 and MOS-40 for 14-16 , 24-28 and 36-40 , . For use with DIP sockets. 827-1417. MOS- 1416 .EACH 20.91 For easy insertion of 24-28 pin ICs, same features as MOS- 1416 . For use with DIP sockets


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PDF DP-140. DPT-100. DP-100/140 8-to-24 DPT100 DPT-100 MODEL SA DP100 SA-9-E-115 SA9115 DP100 DIP absorber DP-140
1999 - 13107

Abstract: T13100 T-13109 QQ-A-225/6 T-13107 smd diode g6 13100 250 B 340 smd Transistor smd transistor t6 smd 2a 3 PIN
Text: a 75 ohm system. 1-5 1-5 1-3/9-11 14-16 /6-8 14-16 /6-8 Dimensions in Inches (mm) .315


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PDF 1500VRMS T7296 XR-T7296 78P236 78P7200 78P2361 78P2362 TXC-02050 TXC-02020 T-13100 13107 T13100 T-13109 QQ-A-225/6 T-13107 smd diode g6 13100 250 B 340 smd Transistor smd transistor t6 smd 2a 3 PIN
1999 - Not Available

Abstract: No abstract text available
Text: 15 16 Pin SMD C 14-16 /6-8 T-15102 1:2CT&1:1 19/40 0.14 15 16 Pin SMD D 14-16 /6-8 T6 : T-13108 & T-13109 NOTE: 3 dB Bandwidth is 200kHz - 280MHz typical, tested in a 75


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PDF T-13100 T-13101 T-13102 T-13103 1500VRMS T-13104 T-13105 T-13107 XR-T7296 78P236
2001 - Not Available

Abstract: No abstract text available
Text: a 75 ohm system. 1-5 1-5 1-3/9-11 14-16 /6-8 14-16 /6-8 Dimensions in Inches (mm) .315


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PDF 1500VRMS T7296 XR-T7296 78P236 78P7200 78P2361 78P2362 TXC-02050 TXC-02020 T-13100
9334 107

Abstract: AXC462101 AXC460101 AXC456101 AXC444101 AXC436101 AXC434201 AXC434101 AXC400101 AXC486101
Text: 115.82 130.43 123.82 106.68 111.82 111.62 100 133.6 148.21 141.6 124.46 , 123.82 106.68 111.82 133.6 148.21 141.6 124.46 129.6 0.51.5 0.91±0.1


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PDF 76m/Sn( 9334 107 AXC462101 AXC460101 AXC456101 AXC444101 AXC436101 AXC434201 AXC434101 AXC400101 AXC486101
Not Available

Abstract: No abstract text available
Text: Reel T6 : T-13108 & T-UIQ9 Schematic "G” T-13109 1-5 1-5 1-3/9-11 14-16 /6-8 14-16 /6-8


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PDF 1500VR T7296 XR-17296 78P236 78P7200 78P2361 78P2362 TXC-02050 TXC-02020 T-13100
mn373

Abstract: SHC76 Micro Networks mn373
Text: Track-Hold and Gain Amplifiers Micro Networks offers a com plete line of Track-Hold (T/H) am plifiers for application in low-resolution (7-9 Bit applications), medium-resolution (12-Bit applications) and high-resolution ( 14-16 Bit applications) systems. For example, the MN379 is a low-resolution, ultra-high speed device suitable for use w ith flash A/D converters; the MN376 is well suited for m oderately , to ± 0.003%) · Compatible with All DIP Packaged 14-16 Bit A/D's · 400psec Aperture Jitter · ± sec Max


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PDF 12-Bit MN379 MN376 MN373 MN374 500pF 30nsec 15nsec 00V/psec SHC76 Micro Networks mn373
Not Available

Abstract: No abstract text available
Text: 1-5 1-3/9-11 14-16 /6-8 14-16 /6-8 Dimensions in Inches (mm) •315 6-Pin DIP: T-13102 & T


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PDF 78P2361 78P2362 TXC-02050 1500VD 78P7200 78P236 TXC-02020 T7296 T-13100 T-13103
1996 - PDM41257SA15D

Abstract: Paradigm 41256 PDM41024-S20L32 PDM41024S20L32 MT5C1005C MT5C2564C-55/883C CY7C199-35DMB SRAM Cross Reference EDI84256LPS25TB 41256
Text: 1M organized as 128K X 8 (New U Die Revision: 141.6 x 432.9 mil) 4R024 1M organized as 128K X 8 (New U Die Revision: 141.6 x 432.9 mil) 4A028 1M organized as 256K X 4 (New U Die Revision: 141.6 , Size [X]: 432.9 mil Die Size [Y]: 141.6 mil Die Thickness: 20.5 mil Substrate Bias: Floating or Vcc , : PDM41028V Die Size [X]: 432.9 mil Die Size [Y]: 141.6 mil Die Thickness: 20.5 mil Substrate Bias , ]: 141.6 mil Die Thickness: 20.5 mil Substrate Bias: Floating or Vcc Backside Coating: None Bond Pad


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PDF MIL-STD-883 PDM41257SA15D Paradigm 41256 PDM41024-S20L32 PDM41024S20L32 MT5C1005C MT5C2564C-55/883C CY7C199-35DMB SRAM Cross Reference EDI84256LPS25TB 41256
ptx 1000

Abstract: MOS 3020 DP-140 ptx ex-0129 WSU-30 SA-91-E MOS-2428 SAF1 HW-UW-26SM
Text: 0.750 0.750 EACH EX-2 MOS- 1416 MOS-2428 MOS-40 EX-1 OPTOELECTRONICS WK-7, a kit of DIP IC , 70176404 70176403 70176420 Mfr.'s Type WK-7 EX-2 MOS- 1416 MOS-2428 MOS-40 EX-1 Description 5-Piece Insertion/Extraction Kit DIP Extraction Tool Insertion Tool, 14-16 Pins Insertion Tool, 24-28 Pins Insertion


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PDF DP-100 DP-200 DP-140 DPT-100 DPT-200 DP-140 DP-100/DP-140 WSU-2224 ptx 1000 MOS 3020 ptx ex-0129 WSU-30 SA-91-E MOS-2428 SAF1 HW-UW-26SM
ULN2003AM

Abstract: 1413B 1413BP C1413BD 1413BD 1416D MC1411P types of uln 1416BP
Text: ) All Types All Types All Types Symbol 'C E X All Types All Types M C 1412 M C 1416 .B v CE (sat , C 1413.B M C 1416 ,B M C 1416 .B 085 0.93 0.35 1.3 1.35 0.5 1.45 mA 1.0 V|(on) (VC E = 2.0 V , ) C lam p D iode F orw ard Voltage (Ip = 350 mA) M C 1412 M C 1413,B M C 1413.B M C 1413.B M C 1416 ,B M C 1416 ,B M C 141 6.B M C 1416 ,B All Types ·l


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PDF MC1411 MC1412 MC1413 MC1416 1/7MC1413 ULN2003AM 1413B 1413BP C1413BD 1413BD 1416D MC1411P types of uln 1416BP
1997 - S280W555

Abstract: S280W555-753 JANTX1N6818 S280W555-104 S280W555-102 burndy terminal module block RBTB20-8 S280W555-108 M39039 S280W555-203
Text: 14-16 : 112.2 N · Probe damage : in accordance with MIL-T-81714 para 4.6.2 · Endurance : 100 cycles of mating and unmating · Contact resistance : size 16-20 : 9 m size 14-16 : 5 m · Withstanding voltage : - , M39029/1 special pin contact - size 16-18 M39029/1-102 pin contact - size 14-16 M39039/1-103 pin contact


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PDF MIL-J-81714. M39029 S280W555-401 S280W555-402 S280W555 S280W555-753 JANTX1N6818 S280W555-104 S280W555-102 burndy terminal module block RBTB20-8 S280W555-108 M39039 S280W555-203
"leadframe material" DIP 20

Abstract: No abstract text available
Text: Thermal Data ® POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder ( tin / lead ) 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data POWER DIP 14,16


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PDF 063W/cm "leadframe material" DIP 20
1999 - 12THERMAL

Abstract: No abstract text available
Text: Thermal Data ® DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue ( silver filled) 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 14,16 Rth


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PDF 063W/cm 12THERMAL
toggle switch t80-t

Abstract: T80-T TS40-T Pushbutton Switches pushbutton pushbutton switch miniature T80-R miniature slide switch Sub-Miniature Slide Switches push-button
Text: series T80-T T80 Series INDEX Miniature Toggle Switches P.C.Mounted Toggle Switches Page 1 -5 6 -7 T80-R. T80 Series erMi^ Miniature Rocker & Paddle Switches P.C.Mounted Rocker & Paddle Switches SP86 JL_j_jd y4v DIP Pushbutton Switches 8 -n 12-13 T80-P A ^tij^ll ^QjDjj Snap-Acting Momentary Pushbutton Switches 14-16 17 TS40-T TS40 series Sub-Miniature Toggle Switches 18-20 TS40-T Sealed Sub-Miniature Toggle Switch Sealed Surface Mount Toggle Switch 21-23 24 TS40-R -^^oqj Sub-Miniature Rocker Switches


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PDF T80-T T80-R. T80-P TS40-T TS40-T TS40-R TS40-P TS40-P toggle switch t80-t Pushbutton Switches pushbutton pushbutton switch miniature T80-R miniature slide switch Sub-Miniature Slide Switches push-button
1999 - Not Available

Abstract: No abstract text available
Text: ® Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 3.9 W/cm°C 0.2 W/cm°C leadframe die attach copper soft solder ( tin / lead ) epoxy resin 0.4 mm 15-50 µm molding compound 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data POWER DIP 14,16 Rth(j-a) (ºC/W


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PDF 063W/cm
Not Available

Abstract: No abstract text available
Text: Datasheet (USA PATENT NO.:4,606,725 & D.299,253) Breadboard Type: WBU-501J Material: high class POM plastic steel, Dimension: 141.6 x 64.4 x 8.2mm Distribution strips: 1, Distribution holes: 85, Terminal strips: 1, Terminal holes: 800, Aluminum plate thick: 0.4 With paper box or skin packing. Features of WISHBOARD WBU-5XX series: 1. High-class acetal material allows insertion hole to withstand wear and tear without easily deforming, also ideal for high frequency and low static. 2. Horizontal


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PDF WBU-501J 20-29AWG
Not Available

Abstract: No abstract text available
Text: Thermal Data ® DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue ( silver filled) 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 14,16 Rth


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PDF 063W/cm
transistor K 1413

Abstract: 1412D 1411d D 1413 transistor C1413BD 1413B 1416P 1413BP MC 1413P 14-12P
Text: o te d ) S ym bol 'c e x AN T yp e s A il T yp e s M C 1412.B M C 1416 .B v CE(sat) A il T yp e s A il T yp e s A il T yp es *l{on) M C 1412,B M C 1413,B M C 1416 ,B M C 1416 ,B V |(o n) M C 1412,B M C 1413,B M C 1413,B M C 1413.B M C 1416 ,B MC 1416 ,B M C 1416 ,B M C 1416 ,B A il T yp es l|(o ff) - , k * -3.0 k -W v - j- o P in 9 1/7 M C 1413.B 1/7 M C 1416 .B 1- O Pin 9 1- O


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PDF MC1411 MC1412 MC1413 MC1416 transistor K 1413 1412D 1411d D 1413 transistor C1413BD 1413B 1416P 1413BP MC 1413P 14-12P
"leadframe material" DIP 20

Abstract: No abstract text available
Text: Thermal Data ® POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder ( tin / lead ) 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data POWER DIP 14,16


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PDF 063W/cm "leadframe material" DIP 20
m28748

Abstract: 107R1001 107-0903-2A MRAC m28748 winchester M39029/34-440 Winchester Electronics 100-51020S m39029/35-275 Crimp spec for mil-c-39029 socket 100-1020P
Text: 107-0981 5431-17 107-0961 107-0966 5431-14 100-1014S 100-0919S 14-16 MRAC, TMRAC, XAC , Contacts Watertown, Connecticut 06795-0500 100-1014P 100-0909P 14-16 Rack & Panel Reeled , Series 100-51014S 100-0981S 14-16 MRAC, TMRAC, XAC, TXAC 100-51016S 100-0982S 16-18-20 MRAC


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PDF 100-8001P 100-8000S 100-8000P RG178/U RG196/U RG161/U RG179/U RG187/U 100-8001S 100-8003P m28748 107R1001 107-0903-2A MRAC m28748 winchester M39029/34-440 Winchester Electronics 100-51020S m39029/35-275 Crimp spec for mil-c-39029 socket 100-1020P
2007 - WINCHESTER mrac

Abstract: m28748/9
Text: 14-16 100-1016P 100-0911P 16-18-20 100-1016S 100-0921S 16-18-20 100-1018P 100-0913P 18-20-22 , Conductor 2,000/Reel Sizes 100-1014P 100-0909P 14-16 Loose Contact Part Number 100 SERIES , , TXAC 100-51014S 100-0981S 14-16 100-51016S 100-0982S 16-18-20 100-51018S 100-0983S 18-20-22


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PDF 100-8000P 100-8000S 100-8001P 100-8001S 100-8003P 100-8003S RG178/U RG196/U RG161/U RG179/U WINCHESTER mrac m28748/9
T-42t11-05

Abstract: No abstract text available
Text: CHERRY SEMICONDUCTOR 2067556 CHERRY SEMICONDUCTOR CORP CORP as »Ë1 S0t,7S5b DODOIOfl 7 r ^ .„TT. 85D 00908 T-42t11-05 l2L DIGITAL GATE ARRAY ¡mmmmm 1200 semi-custom ic • CHIP SIZE: 97x119 mils • BONDING PADS: 30 • MAX OPERATING VOLTAGE: 12V • |2L GATES: 192 • I/O INTERFACES: 24 • BIAS SECTION NPN's: 2 RESISTORS: 33 • MAX TOGGLE FREQUENCY: 2MHz • PACKAGES AVAILABLE: PLASTIC DIP 14-16-18-20-22-24-28-40 FLATPACK 16-18-24 CERDIP 14-16 S-B CERAMIC 14-16-18-22-24-28-40


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PDF T-42t11-05 97x119 T-42t11-05
Not Available

Abstract: No abstract text available
Text: 1 -.500 12700 .035 889 - Material. Finish. I ,oor -!' ~. .440 2024 Aluminum Black Anodize or Equal ; 11176 I ~'Z .l'1T '-45° .030 (5)-IIL 762 ~1=- x .~~ '": Chamfer .060 '4) , .524 \ 020 1 2 POWEA(WAnS) FOR Press 7 -136 on FOR USE WITH TO-5 7 -120 CASE cooler. USE WITH TOS CASE 14.16 pin dip cooler is mounted with thermal epoxy .020 .508 R(3)-JIfU1U 7-139 .250~~ 6350 r


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PDF
MN7130

Abstract: MN373
Text: Yes (Note 2) 8-9 14-16 Bits ±0.003 MN374 400 ±0.1 390 14 Pin Yes


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PDF 35nsec 40nsec 160nsec 250nsec 75/isec MN379 MN2020 Mil-Std-883 MN7130 MN373
Supplyframe Tracking Pixel