10155552-B203KLF
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Amphenol Communications Solutions
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Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (postplated) |
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10155502-B208KLF
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Amphenol Communications Solutions
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Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 8 Position, STG, Top Latch, Tin (postplated); B Coding
(For product qualification latest status, please submit Product Enquiry) |
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95293-802B20LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,20 Positions, 2.54 mm (0.100in) Pitch. |
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10155502-B209KLF
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Amphenol Communications Solutions
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Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 9 Position, STG, Top Latch, Tin (postplated); B Coding
(For product qualification latest status, please submit Product Enquiry) |
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95278-402B20LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating |
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95278-802B20LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating |
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