The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1025ACJ8 Linear Technology T.C. COLD JUNCTION COMPENSATOR
LT1025CS8#PBF Linear Technology LT1025 - Micropower Thermocouple Cold Junction Compensator; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LT1025CN8 Linear Technology LT1025 - Micropower Thermocouple Cold Junction Compensator; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LT1025CN8#PBF Linear Technology LT1025 - Micropower Thermocouple Cold Junction Compensator; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LT1025CS8#TRPBF Linear Technology LT1025 - Micropower Thermocouple Cold Junction Compensator; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LT1786FCS#PBF Linear Technology LT1786F - SMBus Programmable CCFL Switching Regulator; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C

Cold solder joint Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
solder joint

Abstract: IPC-A-610C SAC305 VE-200 VI-J00 Kit-18151 Bag-19133 Cold solder joint
Text: a cold solder joint , a void in the barrel, or a cracked joint . 9. If it is necessary to re-solder , solder . A cold solder joint will typically exhibit a convex meniscus with possibly a dark spot around the barrel or pad. Also, a cold solder joint will not be shiny, but will typically have a "dirty" appearance. CAUTION: A cold solder joint is not necessarily an open connection electrically, and cannot be diagnosed by a simple continuity check. A cold solder joint is frequently an electrically intermittent


Original
PDF VE-200, VE-J00; Bag-19126 Bag-19128 Kit-18150 Kit-18151 Kit-18146 Kit-18147 solder joint IPC-A-610C SAC305 VE-200 VI-J00 Kit-18151 Bag-19133 Cold solder joint
Cold solder joint

Abstract: IPC-A-610C
Text: heated to the flow temperature of solder . A cold solder joint will typically exhibit a convex meniscus with possibly a dark spot around the barrel or pad. Also a cold solder joint will not be shiny, but will typically have a "dirty" appearance. CAUTION: A cold solder joint is not necessarily an open connection electrically, and cannot be diagnosed by a simple continuity check. A cold solder joint is , cold solder joint will likely become electrically open following a period of temperature cycling


Original
PDF
VE-200

Abstract: pcb thermal Design guide pcb trace SAC305 VI-J00 Kit-18151 Kit-18156 VE-J00
Text: cooling. This could result in a cold solder joint , a void in the barrel, or a cracked joint . 9. If it is , cold solder joint will typically exhibit a convex meniscus with possibly a dark spot around the barrel or pad. Also, a cold solder joint will not be shiny, but will typically have a "dirty" appearance. CAUTION: A cold solder joint is not necessarily an open connection electrically, and cannot be diagnosed by a simple continuity check. A cold solder joint is frequently an electrically intermittent


Original
PDF VI-200 VI-J00 VE-200, VE-J00; VE-200 pcb thermal Design guide pcb trace SAC305 Kit-18151 Kit-18156 VE-J00
IPC-A-610C

Abstract: Kit-18146 Kit-18156 SURFACE CLEANING SUPPLIES VI-J00
Text: jar the module or PCB while the solder is cooling. This could result in a cold solder joint , a void , solder . A cold solder joint will typically exhibit a convex meniscus with possibly a dark spot around the barrel or pad. Also a cold solder joint will not be shiny, but will typically have a "dirty"appearance. CAUTION: A cold solder joint is not necessarily an open connection electrically, and cannot be diagnosed by a simple continuity check. A cold solder joint is frequently an electrically intermittent


Original
PDF VI-200 VI-J00 VI-200, VI-J00; opti19122 Bag-19123 Bag-19122 Kit-18156 Kit-18157 Kit-18150 IPC-A-610C Kit-18146 Kit-18156 SURFACE CLEANING SUPPLIES
pcb thermal Design guide pcb trace

Abstract: vicor module VI-J00 Bag-19133 IPC-A-610C Kit-18150
Text: jar the module or PCB while the solder is cooling. This could result in a cold solder joint , a void , solder . A cold solder joint will typically exhibit a convex meniscus with possibly a dark spot around the barrel or pad. Also a cold solder joint will not be shiny, but will typically have a "dirty"appearance. CAUTION: A cold solder joint is not necessarily an open connection electrically, and cannot be diagnosed by a simple continuity check. A cold solder joint is frequently an electrically intermittent


Original
PDF VI-200, VI-J00; optim19122 Bag-19123 Bag-19122 Kit-18156 Kit-18157 Kit-18150 Kit-18152 pcb thermal Design guide pcb trace vicor module VI-J00 Bag-19133 IPC-A-610C Kit-18150
VE-200

Abstract: solder joint SAC305 Kit-18146
Text: the module or PCB while the solder is cooling. This could result in a cold solder joint , a void in , being heated to the flow temperature of solder . A cold solder joint will typically exhibit a convex meniscus with possibly a dark spot around the barrel or pad. Also, a cold solder joint will not be shiny, but will typically have a "dirty" appearance. CAUTION: A cold solder joint is not necessarily an , inspection. A cold solder joint will likely become electrically open following a period of temperature


Original
PDF VE-200, VE-J00; VE-200 solder joint SAC305 Kit-18146
module vicor

Abstract: SAC305 V300
Text: PCB while the solder is cooling. This could result in a cold solder joint , a void in the barrel, or , flow temperature of solder . A cold solder joint will typically exhibit a convex meniscus with possibly a dark spot around the barrel or pad. Also a cold solder joint will not be shiny, but will typically have a "dirty" appearance. CAUTION: A cold solder joint is not necessarily an open connection electrically, and cannot be diagnosed by a simple continuity check. A cold solder joint is frequently an


Original
PDF
Not Available

Abstract: No abstract text available
Text: a tab soldered with 60/40 type solder . A controlled temperature Iron (210°C) should be used to avoid internal damage to the device. Avoid trying to solder the tab closer than 1/32 inch from the body of the device since the "Heat Sinking" characteristics may produce a cold solder joint . 4. ELECTRICAL


OCR Scan
PDF
AN3025

Abstract: transistor working principle free transistor METCAL MX-500 circuit tinning GC Electronics 108109 SN63 SN62 transistor free metcal
Text: temperature is too low, a cold solder joint or other nonconformity may result. After soldering, remove excess , . Thus, pre-tinning reduces defects associated with cold solder joints when gold is mixed with Tin-Lead (Sn-Pb) solder . It has also been observed that excessive gold in a solder joint can cause solder embrittlement. After time, depending on the environmental stress applied to the solder joint , cracks and even an , achieve the gold free solder joint . Outside contract tinning facilities are also available. Mounting the


Original
PDF AN3025 AN3025 transistor working principle free transistor METCAL MX-500 circuit tinning GC Electronics 108109 SN63 SN62 transistor free metcal
transistor working principle

Abstract: weller tinning METCAL MX-500 circuit gold embrittlement Cold solder joint rf transistor 320 SN63 SN62 metcal iron
Text: the temperature is too low, a cold solder joint or other nonconformity may result. 2 , , pre-tinning reduces defects associated with cold solder joints when gold is mixed with Tin-Lead (Sn-Pb) solder . It has also been observed that excessive gold in a solder joint can cause solder embrittlement. After time, depending on the environmental stress applied to the solder joint , cracks and even an open , usually have a single solder pot working as a solder wave to achieve the gold free solder joint . Outside


Original
PDF AN3025 transistor working principle weller tinning METCAL MX-500 circuit gold embrittlement Cold solder joint rf transistor 320 SN63 SN62 metcal iron
pbga package weight

Abstract: mindspeed pbga Cold solder joint
Text: temperature, and is therefore the worst-case position for a cold solder joint . It is advantageous to also TC , reflow, it is not necessary to add solder volume to the joint with solder paste. The 30-mil diameter , joint reliability. However, applying larger amounts of solder paste using thicker stencils and/or , vapor phase. Care must obviously be taken that each solder joint is exposed to the solder liquidus , an actual solder joint . This requires using thinner TC wire (30- or 36-gauge recommended) than may


Original
PDF 500154B 225-pin pbga package weight mindspeed pbga Cold solder joint
2012 - Not Available

Abstract: No abstract text available
Text: materials like Lycra which stretch in multiple dimensions. Cold Soldering: Bare Paint works well as a cold solder joint . Whether used to solder a surface mount or through-hole component onto a circuit


Original
PDF 10mmx10mm 10x10 100mm 1250mm
1999 - TB370

Abstract: to252 footprint wave soldering TB334 stencil tension
Text: Related Issues CAUSES CORRECTIVE ACTIONS COLD SOLDER JOINT (DULL JOINT ) Solder connections which , , the root cause is often the solder joint . There are numerous variables affecting the microinches (10 , by molten solder . Solderability is a prime consideration when joint alone for mechanical support , Vahey Introduction Solder Plating of Surface Mount Packages Proper reflow soldering of surface , solder plate finish on the leads and tab [ /Title boards is crucial to producing a reliable, high


Original
PDF TB370 TB370 TB334 to252 footprint wave soldering stencil tension
AMD reflow soldering profile BGA

Abstract: ipc-SM-782 amd reflow profile 90 PATTERNS DUAL GRID BGA PROFILING
Text: the worst case position for a cold solder joint . For Ceramic Column Grid Array (CCGA) packages, AMD , solder coating on the component leads. This allows the required solder joint to form, electrically and , in the reflow temperature zone is the wetting time, the amount of time each solder joint is molten , : Figure 3.1 Packages are typically surface-mounted onto a printed circuit board using a solder reflow , hole barrel and component lead, and the underside of the board is exposed to a wave of molten solder


Original
PDF ANSI/IPC-SM-782 AMD reflow soldering profile BGA ipc-SM-782 amd reflow profile 90 PATTERNS DUAL GRID BGA PROFILING
2012 - cfl assembly manufacturing process

Abstract: Bridgelux
Text: secure connection to an electronic circuit. Successfully soldered designs still leave solder joints vulnerable to stress during handling. A cold solder joint can result in scrapping a high cost LED array. The , temperature and prevent potential failures due to cold or unreliable solder joints. Other standard features


Original
PDF USA/0k/SO/2012 cfl assembly manufacturing process Bridgelux
PTC 1k thermistor conversion table

Abstract: pcb diagram of mini ups system bussmann Fuse VICOR 30182 vicor 18373 optocoupler based isolated ac to dc converter diode 1N4006 specifications transorb derating Vicor 18372 bussmann semiconductor fuse
Text: P/N 20265 Ther mMate Ex. V300C12M75BL (Long Solder Pin, Slotted Baseplate) Ex. V300C12M75B (Shor t Solder Pin, Slotted Baseplate) P/N 18157 Standoff Kit Tapped #4­40 screw hole P/N


Original
PDF
2009 - HW-SPAR3AN-SK-UNI-G

Abstract: SPARTAN 6 ethernet SPARTAN 3an tcon mini-lvds CS484 AEC-Q100 1000BASE-X microblaze ethernet lite spi flash spartan 6 H.264 encoder ethernet
Text: cold solder joint failures, etc. MPM_195_S3_brochure_r1.indd 2 3/11/09 11:39:56 AM T


Original
PDF
2008 - xc3s400a DECOUPLING CAPACITORS

Abstract: microblaze ethernet lite HW-SPAR3AN-SK-UNI-G picoblaze CS484 SPARTAN 3an ISO 11898-1 tcon mini-lvds spi flash spartan 6 H.264 encoder ethernet
Text: cold solder joint failures, etc. MPM_195_S3_brochure_r5.indd 2 8/28/08 4:19:26 PM T


Original
PDF
IRML6401

Abstract: IEC384 14/2 inmate socket 18378 VICOR REGULATOR SCHEMATIC ACCI offline switcher vicor pn 30141 zvs flyback driver standoff 30141 MICRORAM
Text: P/N 20265 Ther mMate Ex. V300C12M75BL (Long Solder Pin, Slotted Baseplate) Ex. V300C12M75B (Shor t Solder Pin, Slotted Baseplate) P/N 18157 Standoff Kit Tapped #4­40 screw hole P/N


Original
PDF
Not Available

Abstract: No abstract text available
Text: #4–40 screw hole P/N 20265 Ther mMate Ex. V300C12M75BL (Long Solder Pin, Slotted Baseplate) Ex. V300C12M75B (Shor t Solder Pin, Slotted Baseplate) P/N 18157 Standoff Kit Tapped #4–40


Original
PDF
9a3 zener diode

Abstract: No abstract text available
Text: mMate Ex. V300C12M75BL (Long Solder Pin, Slotted


Original
PDF
IRML6401

Abstract: 04068 offline switcher VICOR REGULATOR SCHEMATIC 30076 m-fiam9 Vicor 18372 vicor pn 30141 ABC-10 ABC-12
Text: P/N 20265 Ther mMate Ex. V300C12M75BL (Long Solder Pin, Slotted Baseplate) Ex. V300C12M75B (Shor t Solder Pin, Slotted Baseplate) P/N 18157 Standoff Kit Tapped #4­40 screw hole P/N


Original
PDF
IRML6401

Abstract: offline switcher vicor pn 30141 ABC-12 ABC-10 Vicor 18372 transorb application note MIL-STD-704A 34717 30076
Text: P/N 20265 Ther mMate Ex. V300C12M75BL (Long Solder Pin, Slotted Baseplate) Ex. V300C12M75B (Shor t Solder Pin, Slotted Baseplate) P/N 18157 Standoff Kit Tapped #4­40 screw hole P/N


Original
PDF
VI-J00

Abstract: No abstract text available
Text: No file text available


Original
PDF VI-200 VI-J00 VI-/MI-200 VI-/MI-J00
VI-B60-CU

Abstract: VICOR REGULATOR SCHEMATIC J7X LASER DIODE Vicor VI-B60 opto triac angle phase control driver 30090 offline switcher induction heating Infant Radiant Warmer VICOR 31742
Text: No file text available


Original
PDF VI-200 VI-J00 VI-/MI-200 VI-/MI-J00 VI-B60-CU VICOR REGULATOR SCHEMATIC J7X LASER DIODE Vicor VI-B60 opto triac angle phase control driver 30090 offline switcher induction heating Infant Radiant Warmer VICOR 31742
Supplyframe Tracking Pixel