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Top Results (4)

Part Manufacturer Description Datasheet Download Buy Part
2084930-4 TE Connectivity (2084930-4) ELBC-824-3040-SC
REF3040AIDBZT Texas Instruments 4.096V 50ppm/Degrees C, 50uA in SOT23-3 Series (Bandgap) Voltage Reference 3-SOT-23 -40 to 125
TRF3040 Texas Instruments TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQFP48, PLASTIC, LQFP-48
REF3040AIDBZRG4 Texas Instruments 4.096V 50ppm/Degrees C, 50uA in SOT23-3 Series (Bandgap) Voltage Reference 3-SOT-23 -40 to 125

CO-HD-WI-3040-M Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2010 - Not Available

Abstract: No abstract text available
Text: STANDARD CO-HD-WI-3040-M USE SAMTEC TRAY TY-SMA001-1 AND TY-SMA001-2. 5. DELETED. 6. DELETED. 7


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2012 - Not Available

Abstract: No abstract text available
Text: [12.0 LB] MIN. 4. SEE CO-HD-WI-3040-M RF PACKAGING FOR PACKAGING INSTRUCTIONS. 5. RoHs COMPLIANT. 6. SEE PLATING STANDARD CO-PL-FRM-7001- M . 7. COMPONENT PLATING DESIGNATIONS: -G 0.000010" MIN. GOLD


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2010 - Not Available

Abstract: No abstract text available
Text: . SEE CO-HD-WI-3040-M RF PACKAGING STANDARD FOR PACKAGING INSTRUCTIONS. PRODUCT TO BE PACKAGED IN TRAY


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PDF 75OHM PARMAR10/21/2009
2011 - Not Available

Abstract: No abstract text available
Text: DIMENSION. 2. RoHs COMPLIANT. 3. SEE CO-HD-WI-3040-M RF PACKAGING STANDARD FOR PACKAGING INSTRUCTIONS


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PDF BTNC-NUT-003-N) BTNC-LWAS-001-N) BTNC-NUT-003-X BTNC-LWAS-001-X
2010 - Not Available

Abstract: No abstract text available
Text: [6.0 LB] MIN. 3. NOTE DELETED. 4. SEE CO-HD-WI-3040-M RF PACKAGING FOR PACKAGING INSTRUCTIONS. 5. RoHs COMPLIANT. 6. SEE PLATING STANDARD CO-PL-FRM-7001- M . D 7. COMPONENT PLATING DESIGNATIONS: -H: 0.000030" MIN. GOLD OVER 0.000050" MIN. NICKEL. - M 0.000010" MIN. GOLD OVER 0.000050" MIN. NICKEL. -N , (REMAINING METAL PARTS) -N -MN: (CENTER CONTACT)- M (OUTER CONTACT) -N (REMAINING METAL PARTS) -N 1.25


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2011 - Not Available

Abstract: No abstract text available
Text: ; SEE CO-HD-WI-3040-M RF PACKAGING FOR PACKAGING INSTRUCTIONS. 6. RoHs COMPLIANT. DETAIL 'B' SCALE


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PDF MMCX-CRNG-001-X MMCX-INS-006
2010 - Not Available

Abstract: No abstract text available
Text: CENTER CONTACT: 26.69 N [6.0 LB] MIN. 3. NOTE DELETED. 4. SEE CO-HD-WI-3040-M RF PACKAGING FOR PACKAGING INSTRUCTIONS. 5. RoHs COMPLIANT. 6. SEE PLATING STANDARD CO-PL-FRM-7001- M . E 7. COMPONENT


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PDF
2011 - Not Available

Abstract: No abstract text available
Text: . 4. PRODUCT TO BE PACKAGED PER PACKAGING STANDARD CO-HD-WI-3040-M USE SAMTEC TRAY TY-SMA001-1 AND


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2010 - CO-HD-WI-3040-M

Abstract: No abstract text available
Text: . PUSHOUT FORCE FOR INSULATOR: 20 N[4.5 LB] MIN. 3. PRODUCT TO BE PACKAGED PER PACKAGING STANDARD CO-HD-WI-3040-M.


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PDF MCX-SHL-002) MCX-INS-008) CO-HD-WI-3040-M
2012 - Not Available

Abstract: No abstract text available
Text: STEEL 1. C REPRESENTS A CRITICAL DIMENSION. 2. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M.


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PDF ADP7-04SP2-H4SP2 -04SP: CO-HD-WI-3040-M.
2012 - Not Available

Abstract: No abstract text available
Text: : MATERIAL: 1. C REPRESENTS A CRITICAL DIMENSION. 2. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M.


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PDF ADP7-76SJ2-7VSJ1 -76SJ: \DWG\MISC\MKTG\ADP7-76SJ2-7VSJ1-MKT
2012 - Not Available

Abstract: No abstract text available
Text: STANDARD CO-HD-WI-3040-M. TRAY: TY-BNC002-1 COVER: TY-BNC002-2 36 PARTS PER TRAY(ONE PART PER POCKET).


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PDF ADP5-06SJ2-V3SP1 -06SJ: \DWG\MISC\MKTG\ADP5-06SJ2-V3SP1-MKT
2011 - Not Available

Abstract: No abstract text available
Text: DIMENSION. 2. PUSHOUT FORCE FOR INSULATOR: 44.48 N[10 LB] MIN. 3. SEE CO-HD-WI-3040-M RF PACKAGING FOR


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PDF
2011 - Not Available

Abstract: No abstract text available
Text: : 53.38 N [12.0 LB] MIN. 4. SEE CO-HD-WI-3040-M RF PACKAGING FOR PACKAGING INSTRUCTIONS. 5. RoHs COMPLIANT. 6. SEE PLATING STANDARD CO-PL-FRM-7001- M . 7. COMPONENT PLATING DESIGNATIONS: -G 0.000010" MIN


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Not Available

Abstract: No abstract text available
Text: ] MIN. 3. SEE CO-HD-WI-3040-M RF PACKAGING FOR PACKAGING INSTRUCTIONS. USE SAMTEC TRAY TY-SMA001-1 AND


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2010 - Not Available

Abstract: No abstract text available
Text: CO-HD-WI-3040-M 6. RoHs COMPLIANT. 7. PLATING: -N: .000100'' MIN NICKEL. - M : .000010'' MIN GOLD OVER .000050'' MIN NICKEL. 8. ASSEMBLY PLATING DESIGNATIONS: -MN: (CENTER CONTACT)- M : (OUTER CONTACT) -N , -003-N) (TNC-INS-002) (TNC-SKT-002- M ) (SUB-TNC-P-C-N-ST-CR4) SUB-TNC-P-C-X-ST-CR4 TNC-SKT-002-X TNC-FER


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PDF RG058) TNC-FER-003-N) TNC-INS-002) TNC-SKT-002-M) TNC-SKT-002-X TNC-FER-003-X TNC-INS-002 CO-HD-WI-3040-M RG58-50
2010 - Not Available

Abstract: No abstract text available
Text: PER PACKAGING STANDARD CO-HD-WI-3040-M. 4. RoHs COMPLIANT. 5. PLATING: -H: .000030" MIN GOLD OVER


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PDF MCX-SHL-001)
2011 - Not Available

Abstract: No abstract text available
Text: TO BE PACKAGED PER PACKAGING STANDARD CO-HD-WI-3040-M USE SAMTEC TRAY TY-SMA001-1 AND TY-SMA001


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PDF
2012 - Not Available

Abstract: No abstract text available
Text: . NOTE DELETED. 3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA001


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PDF
2012 - Not Available

Abstract: No abstract text available
Text: . 2. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-BNC002-1 COVER: TY-BNC002


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PDF ADP5-06SP2-V3SJ1 -06SP: \DWG\MISC\MKTG\ADP5-06SP2-V3SJ1-MKT
2012 - Not Available

Abstract: No abstract text available
Text: CRITICAL DIMENSION. 2. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-BNC002


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PDF ADP5-06SP2-V3SP1 -06SP: 05ENT \DWG\MISC\MKTG\ADP5-06SP2-V3SP1-MKT
2011 - Not Available

Abstract: No abstract text available
Text: PACKAGING STANDARD CO-HD-WI-3040-M 6. NOTE DELETED 7. NOTE DELETED 8. NOTE DELETED UNLESS OTHERWISE


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PDF TNC-P-C-XX-SR-C10 CCA-058 \DWG\MISC\MKTG\TNC-P-C-XX-SR-C10-MKT CO-HD-WI-3040-M
2012 - Not Available

Abstract: No abstract text available
Text: . SEE CO-HD-WI-3040-M RF PACKAGING STANDARD FOR PACKAGING INSTRUCTIONS. PRODUCT TO BE PACKAGED IN TRAY


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PDF 75OHM PARMAR10/21/2009
2012 - Not Available

Abstract: No abstract text available
Text: DIRECTION AND MAINTAIN DIMENSION SHOWN. 6. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. , DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] REVISION A AFI-P-B-XX-ST-XXXXM M : MACHINED SHELL GENDER -P: PLUG DO NOT SCALE FROM THIS PRINT -0914: OVERALL LENGTH TYPE -B: BULLET ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION -HH: 30µ" GOLD CENTER CONTACT AND OUTER CONTACT -HG: 30µ" GOLD CENTER CONTACT, 10µ" GOLD OUTER CONTACT (SEE TABLE 1) 9.14 .360 REF 3 5.33 .210 REF


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PDF
2010 - Not Available

Abstract: No abstract text available
Text: FOR INSULATOR: 20 N[4.5 LB] MIN. B 3. PRODUCT TO BE PACKAGED PER PACKAGING STANDARD CO-HD-WI-3040-M.


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PDF MCX-SHL-002)
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