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2001 - pk040

Abstract: No abstract text available
Text: R Ceramic BGA ( CG1156 ) Package PK040 (v1.1) April 6, 2001 © 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. PK040 (v1.1) April 6, 2001 www.xilinx.com 1 Xilinx


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PDF CG1156) PK040 pk040
2000 - pk040

Abstract: No abstract text available
Text: R Ceramic BGA ( CG1156 ) Package PK040 (v1.0) June 1, 2000 © 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. PK040 (v1.0) June 1, 2000 www.xilinx.com 1 Xilinx


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PDF CG1156) PK040 pk040
2001 - g4aoo

Abstract: XCV1000E CG1156
Text: CS144 PQ240 HQ240 BG352 BG432 BG560 FG256 FG456 FG676 FG680 FG860 FG900 FG1156 CG1156 94 158 94


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PDF DS022-1 32/64-bit, 66-MHz DS022-1, DS022-3, DS022-2, DS022-4, DS022-4 g4aoo XCV1000E CG1156
2001 - A21n

Abstract: digital dice design VHDL k41 dob Quadrature Decoder Interface ICs
Text: No file text available


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PDF DS022 32/64-bit, 66-MHz FG860 XCV1000E XCV2000E XCV400E XCV600E A21n digital dice design VHDL k41 dob Quadrature Decoder Interface ICs
2000 - ao21

Abstract: XCV300E-6PQ240C
Text: No file text available


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PDF DS022 32/64-bit, 66-MHz F1156 ao21 XCV300E-6PQ240C
2000 - K363 equivalent

Abstract: n345 AF125 d30122 XCV1000E horizontal driver transistor D155 j281 pioneer amplifier an214 AY102 XCV100E
Text: No file text available


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PDF DS022 32/64-bit, 66-MHz XCV2600E XCV3200E XCV100E" XCV600E" XCV100E XCV1000E, K363 equivalent n345 AF125 d30122 XCV1000E horizontal driver transistor D155 j281 pioneer amplifier an214 AY102
2001 - GSR 10,8

Abstract: DLL5 BG432 ic 404 BB112 equivalent
Text: CS144 PQ240 HQ240 BG352 BG432 BG560 FG256 FG456 FG676 FG680 FG860 FG900 FG1156 CG1156 94 158 94


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PDF DS022-1 32/64-bit, 66-MHz DS022-1, DS022-3, DS022-2, DS022-4, DS022-4 GSR 10,8 DLL5 BG432 ic 404 BB112 equivalent
2000 - K2466

Abstract: H1342 AU61
Text: No file text available


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PDF DS022 32/64-bit, 66-MHz F1156 K2466 H1342 AU61
2002 - MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA MO-113-AA-AD BGA 31 x 31 mm MS026-ACD MS-034-AAU-1 MO-047 MO-151 AAL-1 MO-151-AAN-1
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel Reflow Soldering Process Sockets Component Mass (Weight) by Package Type Package BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 CB100 CB164 CB196 CB228 CG1156 CP56 CS48 CS144 CS280 DD8 FF896 FF1152 FF1517 FG256 FG324 FG456 FG556


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PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA MO-113-AA-AD BGA 31 x 31 mm MS026-ACD MS-034-AAU-1 MO-047 MO-151 AAL-1 MO-151-AAN-1
2002 - 1156-BALL

Abstract: bga 896 411PI BF957 132-ball package
Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns Glossary of Terms Literature Request Form Back to Start Page Packaging and Thermal Characteristics Thermal Packaging Management: Application Note XAPP415 Group Ceramic BGA Ceramic Brazed CQFP Package Symbol CG1156 CB100 CB164 CB196 CB228


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PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package
2002 - FG676

Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
Text: CB196 CB228 CG1156 CP56 CS48 CS144 CS280 °C/Watt 11.2 37 32 14 13 17.22 11.24 16.9 13.7 44 29 25 19 10.7


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PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
2000 - BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance BGA-1156 BGA and CSP cte table flip chip substrate BG560 fine BGA thermal profile FG676 35x35 bga
Text: (31mmx31mm) 260 I/O 660 724 FG1156 (35mmx35mm) 344 I/O 660 724 CG1156


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PDF 00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance BGA-1156 BGA and CSP cte table flip chip substrate BG560 fine BGA thermal profile FG676 35x35 bga
2001 - JEDS51-2

Abstract: xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
Text: (Max) Pkg-Code BG575 BG728 CB100 CB164 CB196 CB228 CC20 CC44 CD8 CD48 CG560 CG1156 CP56 CS48 CS144


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PDF XAPP415 JEDS51-2 xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
2001 - serial number of internet manager

Abstract: 3 bit right left shift register verilog vHDL prog F1156
Text: CS144 PQ240 HQ240 BG352 BG432 BG560 FG256 FG456 FG676 FG680 FG860 FG900 FG1156 CG1156 94 158 94


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PDF DS022-1 32/64-bit, 66-MHz DS022-1, DS022-3, DS022-2, DS022-4, DS022-2 serial number of internet manager 3 bit right left shift register verilog vHDL prog F1156
2004 - XILINX/part marking Hot

Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY XC2VP7 reflow profile TT 2076 qfn 3x3 tray dimension SPARTAN-II xc2s50 pq208 HQG160 sn63pb37 solder SPHERES
Text: No file text available


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PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY XC2VP7 reflow profile TT 2076 qfn 3x3 tray dimension SPARTAN-II xc2s50 pq208 HQG160 sn63pb37 solder SPHERES
2004 - xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 CF1752 smd code v36 reballing BGA reflow guide recommended layout CSG324 SMD MARKING CODE C1G XC2VP7 reflow profile
Text: No file text available


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PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 CF1752 smd code v36 reballing BGA reflow guide recommended layout CSG324 SMD MARKING CODE C1G XC2VP7 reflow profile
2004 - xilinx part marking

Abstract: xilinx topside marking UG112 HQG160 reballing FGG484 qfn 3x3 tray dimension FF1148 top marking 957 so8 xilinx XC2V6000-FF1152
Text: No file text available


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PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 HQG160 reballing FGG484 qfn 3x3 tray dimension FF1148 top marking 957 so8 xilinx XC2V6000-FF1152
2004 - qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I XC4VLX25 cmos 668 fcbga FFG676
Text: No file text available


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PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I XC4VLX25 cmos 668 fcbga FFG676
2004 - BFG95

Abstract: No abstract text available
Text: No file text available


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PDF UG112 UG072, UG075, XAPP427, BFG95
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