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    CG-BGA-5002 Search Results

    CG-BGA-5002 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    84500-202 Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    84500-292LF Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84500-292 Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    84500-202LF Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    TMS320C28344ZEPQ Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28345ZEPQ Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments

    CG-BGA-5002 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    CG-BGA-5002 Ironwood Electronics Clamshell GHz Sockets HD; Max Pincount: 225; Top Pitch (mm): 0.5; IC Array X: 15; IC Array Y: 15; Socket Lid: Clam shell; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 1; IC Size X (mm): 8; IC Size Y (mm): 8; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.18; IC Ball Height Max (mm): 0.28; IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA225; Part Description: GHz BGA Socket (ZIF) Original PDF