Clamshell GHz Sockets HD; Max Pincount: 225; Top Pitch (mm): 0.5; IC Array X: 15; IC Array Y: 15; Socket Lid: Clam shell; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 1; IC Size X (mm): 8; IC Size Y (mm): 8; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.18; IC Ball Height Max (mm): 0.28; IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA225; Part Description: GHz BGA Socket (ZIF)