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Part ECAD Model Manufacturer Description Datasheet Download Buy Part
TBAW56 TBAW56 ECAD Model Toshiba Electronic Devices & Storage Corporation Switching Diode, 80 V, 0.215 A, SOT23
DF2B6M4ASL DF2B6M4ASL ECAD Model Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-5.5 V, SOD-962 (SL2)
DF2B5M4ASL DF2B5M4ASL ECAD Model Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2)
DLP6500BFYE DLP6500BFYE ECAD Model Texas Instruments DLP® 0.65 1080p s600 DMD 350-CPGA
DLP5500FYAT DLP5500FYAT ECAD Model Texas Instruments 0.55 XGA DMD 149-CPGA
DLP660TEFYG DLP660TEFYG ECAD Model Texas Instruments DLP® 0.66 4K UHD DMD 350-CPGA

CERAMIC PIN GRID ARRAY CPGA lead frame 325 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
GI 312 diode

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964
Text: , Type, or Name: 144- Pin Ceramic Pin Grid Array Die to Package edge clearance: 80 mils per side , Flatpack Ceramic /Plastic Pin Grid Array ESD Voltage Rating (per MIL STD-008, Method 3018): >1,000V , : DEVICE RELIABILITY SUMMARY VIC064/VIC068A 144-pins Ceramic Pin Grid Array 144-pins Plastic Pin Grid , Wafer Fab: 144-pins Ceramic Pin Grid Array Assembly: 144-pins Plastic Pin Grid Array Fab3 , Plastic Pin Grid Array Die to Package edge clearance: 42 mils per side Mold Compound Name


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PDF VIC64 VIC068A VAC068A CY7C964 VIC64, VIC064/VIC068A 144-pins VIC64/VIC068A/VAC068A/7C964 GI 312 diode CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964
2000 - CERAMIC PIN GRID ARRAY 120 pins

Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
Text: Ceramic Pin Grid Array ( CPGA ) 44 Pin Ceramic Pin Grid Array , Cavity Up NS Package Number U44A © 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array ( CPGA ) August 1999 Ceramic Pin Grid Array ( CPGA ) 65 Pin Ceramic Pin Grid Array NS Package Number UA65A , Pin Grid Array ( CPGA ) 68 Pin Ceramic Pin Grid Array NS Package Number U68C 68 Pin Ceramic Pin Grid Array NS Package Number U68D 3 www.national.com Ceramic Pin Grid Array ( CPGA ) 68 Pin


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PDF MS101111 UA65A CERAMIC PIN GRID ARRAY 120 pins 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
GOERTZEL ALGORITHM SOURCE CODE

Abstract: 3x3 matrix goertzel XDS510 fixed point goertzel 4x4 bit multipliers 1/SPRA056 5962-9679101QYC SM320C80 SM320C80HFHM50
Text: HFH 305- pin C-PGA ( Ceramic Pin Grid Array ). This cavity down, heat slug up PGA RJA = 12.6°C/W weighs 41.5 grams. RJC = 0.3°C/W, 320- lead ceramic quad flat pack with 0.5 mm lead pitch. This cavity , Quad Flat Pack GF = Ceramic Pin Grid Array TOOLS SUPPORT Part Number TMDX3240680 TMDS00510 , ) 305- pin C-PGA 305- pin C-PGA 50 MHz 50 MHz 50 MHz 50 MHz n/a 5962-9679101QYC n/a , between external and internal SRAM Video controller with dual frame timers On-chip cache or data RAM is


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PDF SM320C80 SMJ320C80 SGYV006C 32-bit SPRA066 SPRA087 SPRA156 GOERTZEL ALGORITHM SOURCE CODE 3x3 matrix goertzel XDS510 fixed point goertzel 4x4 bit multipliers 1/SPRA056 5962-9679101QYC SM320C80HFHM50
1997 - PQFP 132 PACKAGE DIMENSION intel

Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Text: thin package, multilayer molded plastic quad flatpacks (PQFP), advanced ceramic pin grid array ( CPGA , compatible with the Intel ceramic Pin Grid Array package family. The package can be used as a direct replacement for ceramic pin grid arrays ( CPGA ) in socketed applications. 13.4. PPGA COMPONENT ASSEMBLY , INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING Table 13-9. jc [°C/W] for a PPGA CPGA Package with , B 13 An Introduction to Plastic Pin Grid Array (PPGA) Packaging 5/10/97 7:47 AM 97_13_1


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1997 - 88 lead cpga

Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Text: array ( CPGA ) package, and tape carrier package, (TCP) formats. The development of the plastic pin grid , compatible with the Intel ceramic Pin Grid Array package family. The package can be used as as direct replacement for ceramic pin grid arrays ( CPGA ) in socketed applications. 13.4. PPGA COMPONENT ASSEMBLY , INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING CPGA 2 PPGA Large Die T Small Die , INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING Table 13-9. jc [°C/W] for a PPGA CPGA Package with


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PDF CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
1998 - outline of the heat slug for JEDEC

Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Text: Pin Grid Array package family. The package can be used as a replacement for ceramic pin grid arrays , CPGA packages. 1999 Packaging Databook 13-9 Plastic Pin Grid Array (PPGA) Packaging Figure , Plastic Pin Grid Array (PPGA) Packaging 13.1 13 Introduction As Intel microprocessors , Pin Grid Array (PPGA) Packaging 13.2 Package Geometry And Materials 13.2.1 Package , . 13-2 1999 Packaging Databook Plastic Pin Grid Array (PPGA) Packaging Figure 13-2. Top View of


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1998 - ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Text: applications, using socket footprints which are compatible with the Intel ceramic Pin Grid Array package family. The package can be used as a replacement for ceramic pin grid arrays ( CPGA ) in socketed , detail the thermal resistance values for the components in ceramic pin grid array and plastic pin grid , Plastic Pin Grid Array (PPGA) Packaging 13.1 13 Introduction As Intel microprocessors , metal on the side of the package. 1998 Packaging Databook 13-1 Plastic Pin Grid Array (PPGA


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1996 - Robinson Nugent pga

Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
Text: available in either ceramic pin grid array ( CPGA ) package or tape carrier package (TCP) format to date , in ceramic pin grid array and plastic pin grid array packages. The benefit in thermal improvement , E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array (PPGA) Packaging , began the development of plastic pin grid array (PPGA) packages to alleviate potential , Figure 2. Plastic Pin Grid Array (PPGA) Package Dimensions 6 7/1/96 9:08 AM 243103_1.doc AP


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PDF AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
2002 - GOERTZEL ALGORITHM SOURCE CODE for dtmf in c

Abstract: fixed point goertzel GOERTZEL ALGORITHM SOURCE CODE spra069 XDS510 3x3 matrix c80 Master Processor architecture ti c80 architecture 320C80 TMDX3248855-07
Text: the property of their respective owners. PACKAGING GF HFH 305- pin C-PGA ( Ceramic Pin Grid Array ). This cavity down, heat slug up PGA RJA = 12.6°C/W weighs 41.5 grams. RJC = 0.3°C/W, 320- lead ceramic quad flat pack with 0.5 mm lead pitch. This cavity up, heat slug down package has a nonconductive , Quad Flat Pack GF = Ceramic Pin Grid Array TOOLS SUPPORT Part Number TMDX3240680 TMDS00510 , SM320C80GFM50 SMJ320C80GFM50 320- lead C-QFP (NCTB) 320- lead C-QFP (NCTB) 305- pin C-PGA 305- pin C-PGA


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PDF SM320C80 SMJ320C80 SGYV006C 32-bit GOERTZEL ALGORITHM SOURCE CODE for dtmf in c fixed point goertzel GOERTZEL ALGORITHM SOURCE CODE spra069 XDS510 3x3 matrix c80 Master Processor architecture ti c80 architecture 320C80 TMDX3248855-07
1996 - tucker

Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Text: in either ceramic pin grid array ( CPGA ) package or tape carrier package (TCP) format to date , Interference (EMI) levels from Intel's Pentium processors in ceramic pin grid array ( CPGA ) and PPGA packages , details the thermal resistance values for the Pentium processor in ceramic pin grid array and plastic , E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array (PPGA) Packaging , 1993, Intel engineers began the development of plastic pin grid array (PPGA) packages to alleviate


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PDF AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
1996 - Matthey

Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
Text: technology. The Pentium® microprocessor family has been available in either ceramic pin grid array ( CPGA , Interference (EMI) levels from Intel's Pentium processors in ceramic pin grid array ( CPGA ) and PPGA packages , details the thermal resistance values for the Pentium processor in ceramic pin grid array and plastic , E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array (PPGA) Packaging June , development of plastic pin grid array (PPGA) packages to alleviate potential performance-limiting package


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PDF AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
2009 - QFN108

Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84- Pin CPGA Top View 0.050" ± , Drawings Ceramic Pin Grid Array 100- Pin CPGA Top View 0.072" 0.88" Pin #1 ID 0.045" 0.055 , product is obsolete. 2 v11.1 Package Mechanical Drawings Ceramic Pin Grid Array 132- Pin CPGA , Package Mechanical Drawings Ceramic Pin Grid Array 175- Pin CPGA Top View Index Mark 0.100" BSC , Ceramic Pin Grid Array 176- Pin CPGA Top View Index Mark 0.105" ± 0.010" 0.100" BSC 0.018" ±


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PDF 84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
P/N146071

Abstract: No abstract text available
Text: 145- Pin Grid A m y (Cavity Up) 160- Lead Ceramic Cfg|& Flatpack (Cavity Up) 144- Pin Thin Quad Flat , G245 G345 A208 ■m .'e G245 A208 G245 G245 144- Pin Thin Quad Flat Pack 145- Pin Grid Array (Cavity Up) 144- Pin Thin Quad Flat Pack 145- Pin Grid Array (Cavity Up) 144- Pin Thin Quad Flat Pack 145- Pin Grid Array (Cavity Up) 144- Pin Thin Quad Flat Pack 145- Pin Grid Array (Cavity Up) 208- Pin Thin Quad Flat Pack 225- Pin Ball Grid Array ;^ 245- Pin Grid Array (Cavity Up) 208- Pin Thin Quad Flat


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PDF 16-bit P/N146071
TSGB01

Abstract: TSFL12 TSFL06 Thomson Linear Integrated Circuits TSGB 54080
Text: packages is offered: - LEADLESS AND LEADED CERAMIC CHIP CARRIER (LCCC, LDCC) ; - CERAMIC PIN GRID ARRAY ( CPGA ) ; - OPEN VIA CHIP-CARRIER (OVCC) ; - CERAMIC QUAD FLAT PACK . (CQFP). Also available in die form , , PLA, MULTIPLIER, ALU. · Compiled cells on customer request. · Full range of package, CPGA , LCCC, LDCC , , COMPATIBLE TTL, ECL 10 K, ECL 100 K TSFD35 448 120 CPGA 144 FULL CUSTOM SEVERAL BIPOLAR , POWER PADS PACKAGE OPTIONSPINS LCCC CPGA DILC TSGB SERIES - 2 MICRON DOUBLE LEVEL METAL HCMOS GATE


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PDF 00DDD3B 30x30 TSGB01 TSFL12 TSFL06 Thomson Linear Integrated Circuits TSGB 54080
1997 - CQ208

Abstract: CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84
Text: , Packaging CG84 CPGA , Ceramic Pin Grid Array 9 pASIC DEVICE PACKAGING SPECIFICATIONS PF100 TQFP , , Packaging CG144 CPGA , Ceramic Pin Grid Array 9 pASIC DEVICE PACKAGING SPECIFICATIONS PF144 TQFP , of 3.37 mm. Plastic Ball Grid Array package is being developed for the high pin count products , . The through-hole packages are ceramic PGA packages in 84 and 144 pin counts. The surface mount , , Plastic Ball Grid Array Notes: All dimensions are in millimeters. 9-48 QuickLogic


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PDF PF144 CF160 PQ208 CQ208 PB256 CQ208 CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84
1998 - CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Text: Socket Mount CQFP ( Ceramic Quad Flatpack) CPGA ( Ceramic Pin Grid Array ) (bottom view , Table 1-3. Ceramic Pin Grid Array Lead Count 68 68 68 88 88 88 132 168 208 , Ceramic Pin Grid Array ( CPGA ), 0.100" Pitch for 68L - 208L, 0.100/0.50" for 264L- 387L Socket or , package design, such as the Tape Carrier Package (TCP), the Plastic Pin Grid Array (PPGA), the Plastic , footprint integrated circuits. Chapter 13 Plastic Pin Grid Array (PPGA) Packaging: An overview of Plastic


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1993 - 1628-1

Abstract: TI320C40
Text: Hardware Packaging: ­ 325-Pin Ceramic Grid Array (GF Suffix) ­ 352- Lead Ceramic Quad Flatpack (HFH Suffix) ­ 324-Pad JEDEC-Standard TAB Frame Fabricated Using Enhanced Performance Implanted CMOS (EPIC , 30 32 34 9 11 13 15 17 19 21 23 25 27 29 31 33 35 325-PIN GF GRID ARRAY PACKAGE (BOTTOM VIEW) 1 264 88 177 Pin A1 89 176 TAB 325-LEAD OLB/ILB TAPE AUTOMATED BONDING (TAB) PACKAGE (TOP , One SMJ320C40 (Rev. 5) Inner Lead Bond (ILB) Information for TAB 325 Die Side Number 4 244 243 1


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PDF SMJ320C40, TMP320C40 SGUS017H C40-60: 33-ns C40-50: 40-ns C40-40: 50-ns 1628-1 TI320C40
1995 - Actel a1280

Abstract: VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet
Text: Ceramic Pin Grid Array ( CPGA ) Speed Grade Std = Standard Speed ­1 = Approximately 15% faster than , A1425A Device 132- pin Ceramic Quad Flatpack (CQFP) - 133- pin Ceramic Pin Grid Array ( CPGA ) - , Grid Array ( CPGA ) P P P - 256- pin Ceramic Quad Flatpack (CQFP) P P P - 257- pin Ceramic Pin Grid Array ( CPGA ) P P P - A14100A Device Speed Grade ACT 2 , ( CPGA ) - A1280A Device 172- pin Ceramic Quad Flatpack (CQFP) 176- pin Ceramic Pin Grid Array


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PDF 20-pin Actel a1280 VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet
2002 - smd transistor HX

Abstract: TRANSISTOR SMD MARKING CODE TK TRANSISTOR SMD MARKING CODE MP smd transistor HX 45 cdp68hc68 hc221 TRANSISTOR SMD MARKING CODE WM intersil standard part marking HIP SMD TRANSISTOR MARKING by 4p TRANSISTOR SMD MARKING CODES
Text: Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array ( CPGA ) R: Ceramic , : Plastic Leaded Chip Carrier (PLCC) G: Ceramic Pin Grid Array ( CPGA ) 35 /883 HIGH RELIABILITY , Side-Brazed (SBDIP) 8: Ceramic Pin Grid Array ( CPGA ) 9: Ceramic Flatpack 0: Die YE: SMD 0.5 9S: TO , DESIGNATOR D: Die G: Ceramic Pin Grid Array ( CPGA ) J: Plastic Leaded Chip Carrier (PLCC) P: Dual-In-Line , Grid Array ( CPGA ) H: Small Outline Transistor Plastic (SOT) J: Ceramic Dual-in-line Frit Seal (CERDIP


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PDF 82CXXX -25oC -40oC -55oC 125oC JM38510/ 1-888-INTERSIL smd transistor HX TRANSISTOR SMD MARKING CODE TK TRANSISTOR SMD MARKING CODE MP smd transistor HX 45 cdp68hc68 hc221 TRANSISTOR SMD MARKING CODE WM intersil standard part marking HIP SMD TRANSISTOR MARKING by 4p TRANSISTOR SMD MARKING CODES
A7647

Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Text: 13-5. 296 PPGA Package Dimensions and Tolerances Family: Plastic Pin Grid Array Package - 296 Lead , Dimensions and Tolerances Family: Plastic Pin Grid Array Package - 370 Lead Symbol Millimeters Inches , 13-18 detail the thermal resistance values for the components in ceramic pin grid array and plastic pin , innovative package designs. The development of the plastic pin grid array (PPGA) package, PPGA2, and Flip Chip Pin Grid Array (FC-PGA) have provided an improvement path for enhanced power distribution and


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1996 - CERAMIC QUAD FLATPACK CQFP 14 pin

Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
Text: pASIC DEVICE PACKAGING SPECIFICATIONS CG84 CPGA , Ceramic Pin Grid Array Notes: 1. All dimensions are in inches. 6-42 pASIC DEVICE PACKAGING SPECIFICATIONS CG144 CPGA , Ceramic Pin Grid Array , quad flatpack with a nominal thickness of 3.37 mm. Plastic Ball Grid Array package is being developed , and 144 pin counts. The surface mount hermetic packages are 100 CQFP with ceramic tie bar and 160 , millimeters. 6-47 pASIC DEVICE PACKAGING SPECIFICATIONS PB256 PBGA, Plastic Ball Grid Array Notes


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PDF CF160 PQ208 CQ208 PB256 CERAMIC QUAD FLATPACK CQFP 14 pin CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
2001 - transistor BC 458

Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Text: 1285 1490 J28BQ CPGA (Continued) 295 600 J28B Ceramic Pin Grid Array ( CPGA ) MO , -066-AC 48400 32 22 18 16 5 U84B Ceramic Pin Grid Array ( CPGA ) MO-067-AB 14762 43 , Spec Wide Nom. (mils) Long Nom. (mils) Lead Frame Mt'l Pitch (mils) Board Area , ) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long Nom. (mils) Lead Frame Mt'l Pitch (mils , (CQFP) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long Nom. (mils) Lead Frame Mt'l


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LM7603

Abstract: No abstract text available
Text: . LSI LOGIC L64760 Inter-Frame Processor Preliminary 100- Pin Plastic Pin Grid Array (PPGA) NG 100- Pin Ceramic Pin Grid Array ( CPGA ) FG N M L K J H G F E D C B A •®®®®®®® , © • 1 2 3 4 5 6 7 8 910111213 Plastic and Ceramic Pin Grid Arrays (PPGA/ CPGA ) DifflMsioM , Grid Array Dimensions 12 LSI LOGIC L64760 Inter-Frame Processor Preliminary 100- Pin , Up to 30/40 MHz clock rates Simple external control 100- pin CPGA ,PQFP or PPGA package PFO.Q:7


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PDF L64760 L64750) L64740) L64760 MIL-STD-883C 100-Pin LM7603
2000 - transistor BC 458

Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Text: J28B Ceramic Pin Grid Array ( CPGA ) MO-058-AA MO-103-AB J28AQ Ceramic Small Outline Package , Grid Array ( CPGA ) None 160000 19 14 11 10 1 Data Not Available at This Time , ) Lead Frame Mt'l Pitch (mils) Board Area Max. (mils) (X) Max. (mils) (Y) None 645 , (LCC) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long Nom. (mils) Lead Frame Mt'l , JEDEC Spec Wide Nom. (mils) Long Nom. (mils) Lead Frame Mt'l Pitch (mils) Board


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PDF MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Not Available

Abstract: No abstract text available
Text: available in a 68- pin CPGA or PPGA ( ceramic or plastic pin grid array ) or 80- pin PQFP (plastic quad flat pack) package L64751 is available in a 68- pin CPGA or PPGA ( ceramic or plastic pin grid array ) or 100- pin , Coder/Decoder 68- Pin Plastic Pin Grid Array (PPGA) NB 68- Pin Ceramic Pin Grid Array ( CPGA ) FB L , and Ceramic Pin Grid Arrays (PPGA/ CPGA ) 68- Pin Dimensions PPGA (NB) CPGA (FB) A , E1- L Plastic and Ceramic Pin Grid Array Dimensions Notes: 1. Ceramic Packages are


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PDF L64750/51 L64750 L64751 L64740 L64760
Supplyframe Tracking Pixel